CN217563796U - Heating plate assembly structure - Google Patents
Heating plate assembly structure Download PDFInfo
- Publication number
- CN217563796U CN217563796U CN202220333614.1U CN202220333614U CN217563796U CN 217563796 U CN217563796 U CN 217563796U CN 202220333614 U CN202220333614 U CN 202220333614U CN 217563796 U CN217563796 U CN 217563796U
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- heating
- chip loading
- cover plate
- plate assembly
- end surface
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Abstract
The utility model discloses a heating plate assembly body structure, which comprises a heating shell, a heating cover plate, a heat conducting pad, chip loading grooves and a heating plate body, wherein the heating plate body is installed on the top end surface of the heating shell in a laminating way, the heating cover plate is fixedly installed on the top end surface of the heating plate body, and a plurality of chip loading grooves are formed in the end surface of the heating cover plate; a heat conducting pad is arranged between the chip loading grooves; chamfers are formed on the periphery of the end face of the top of the chip loading groove; mounting clamping grooves are formed in two sides of the end face of the top of the heating cover plate, and carrying handles are fixedly mounted on the end faces of the mounting clamping grooves; a plurality of positioning screws are inserted and installed on the end face of the top of the carrying handle, and one ends of the positioning screws penetrate through the carrying handle and are fixedly connected with the end face of the heating cover plate; the heating plate assembly has a simple structure, and is convenient to carry and move; when in use, the heating is uniform, and the heating effect is good.
Description
Technical Field
The utility model relates to a chip processing technology field especially relates to a hot plate assembly structure.
Background
The chip testing technology is an important technical key for ensuring the production quality and accelerating the production flow in the electronic industry; before the chip is taken out of the field, an electrical test needs to be carried out at a preset temperature so as to know the stability of the chip; in the electrical test, a heating plate is used.
The heating plate structure in the prior art has a small area, and the heating quantity of chips is small when heating is carried out; meanwhile, when heating, the heating is not uniform, and the heating effect is not good, so that it is necessary to design a heating plate assembly structure.
SUMMERY OF THE UTILITY MODEL
The utility model solves the problem of providing a heating plate assembly body structure which is simple in structure and convenient for carrying and moving; when the heating cover plate is used, a large number of positioning loading grooves are formed in the end face of the heating cover plate, so that a large number of chips can be placed, and the heating rate is improved; simultaneously, through the inside at the heating apron that sets up the heat conduction pad to make the chip be heated evenly, can have good heating effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a hot plate assembly body structure, includes heating shell, heating apron, heat conduction pad, chip loading groove and hot plate body, the hot plate body is installed in the laminating of the top terminal surface of heating shell, the top terminal surface fixed mounting of hot plate body has the heating apron, a plurality of chip loading groove has been seted up to the terminal surface of heating apron.
As a further aspect of the present invention: and a heat conducting pad is arranged between the chip loading grooves.
As a further aspect of the present invention: chamfers are formed on the periphery of the end face of the top of the chip loading groove.
As a further aspect of the present invention: installation clamping grooves are formed in two sides of the end face of the top of the heating cover plate, and carrying handles are fixedly installed on the end faces of the installation clamping grooves.
As a further aspect of the present invention: the top end face of the carrying handle is provided with a plurality of positioning screws in an inserted connection mode, and one ends of the positioning screws penetrate through the carrying handle to be fixedly connected with the end face of the heating cover plate.
As a further aspect of the present invention: the periphery of the end face of the bottom of the heating shell is fixedly provided with bearing brackets, and the end faces of the bottoms of the four bearing brackets are fixedly provided with heat insulation plates.
The utility model has the advantages that: the heating plate assembly has a simple structure, and is convenient to carry and move; when the heating cover plate is used, a large number of positioning loading grooves are formed in the end face of the heating cover plate, so that a large number of chips can be placed, and the heating rate is improved; simultaneously, through the inside at the heating apron setting up the heat conduction pad to make the chip be heated evenly, can have good heating effect.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an overall sectional view of the present invention;
fig. 3 is an overall plan view of the present invention;
illustration of the drawings: 1. heating the housing; 2. heating the cover plate; 3. a thermally conductive pad; 4. a chip loading slot; 5. a heating plate body; 6. installing a clamping groove; 7. carrying handles; 8. a set screw; 9. a load bearing bracket; 10. an insulating panel.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Specific examples are given below.
Referring to fig. 1-3, a heating plate assembly structure, includes heating casing 1, heating apron 2, heat conduction pad 3, chip loading groove 4 and heating plate body 5, and heating plate body 5 is installed in the laminating of the top terminal surface of heating casing 1, and heating apron 2 is installed to the top terminal surface fixed mounting of heating plate body 5, and a plurality of chip loading groove 4 has been seted up to the terminal surface of heating apron 2.
And a heat conducting pad 3 is arranged between the chip loading grooves 4, so that the heat conducting effect is improved.
The top end face of the chip loading groove 4 is provided with chamfers all around, and chips are conveniently stored.
Mounting clamping grooves 6 are formed in the two sides of the top end face of the heating cover plate 2, and carrying handles 7 are fixedly mounted on the end faces of the mounting clamping grooves 6; the heating shell 1 and the heating cover plate 2 are convenient to be carried through the carrying handle 7.
A plurality of positioning screws 8 are inserted and installed on the end face of the top of the carrying handle 7, and one ends of the positioning screws 8 penetrate through the carrying handle 7 and are fixedly connected with the end face of the heating cover plate 2; the carrying handle 7 is fixedly mounted on the end face of the heating cover plate 2 by a set screw 8.
All fixed mounting has bearing bracket 9 around the bottom terminal surface of heating casing 1, and the bottom terminal surface fixed mounting of four bearing brackets 9 has heat insulating board 10, can support heating casing 1 through bearing bracket 9 and heat insulating board 10.
The utility model discloses a theory of operation: when in use, the carrying handle 7 is fixedly arranged inside the mounting clamping groove 6 through the positioning screw 8, the heating shell 1 can be carried through the carrying handle 7, and the heating shell 1 can be supported through the bearing bracket 9 and the heat insulation plate 10, so that the heating shell 1 has good structural stability; because a large number of chip loading grooves 4 are formed in the surface of the heating cover plate 2, a plurality of chips can be placed, and the heating efficiency of the chips can be greatly improved; the chip that will need the heating is placed inside chip loading groove 4 of 2 terminal surfaces of heating apron, and the inside hot plate body 5 work of heating casing 1 can heat heating apron 2, and the chip of placing in chip loading groove 4 inside heats through heat conduction pad 3 to it is more even to make heating apron 2 be heated through heat conduction pad 3.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a hot plate assembly body structure, its characterized in that, includes heating casing (1), heating apron (2), heat conduction pad (3), chip loading groove (4) and hot plate body (5), hot plate body (5) are installed in the laminating of the top terminal surface of heating casing (1), the top terminal surface fixed mounting of hot plate body (5) has heating apron (2), a plurality of chip loading groove (4) have been seted up to the terminal surface of heating apron (2).
2. The heating plate assembly structure according to claim 1, wherein a heat conductive pad (3) is disposed between the chip loading slots (4).
3. The heating plate assembly structure according to claim 1, wherein the top end surface of the chip loading groove (4) is chamfered at all sides.
4. The heating plate assembly structure according to claim 1, wherein mounting slots (6) are formed in both sides of the top end surface of the heating cover plate (2), and a carrying handle (7) is fixedly mounted on the end surface of each mounting slot (6).
5. The heating plate assembly structure according to claim 4, wherein a plurality of positioning screws (8) are inserted into the top end surface of the carrying handle (7), and one end of each positioning screw (8) penetrates through the carrying handle (7) to be fixedly connected with the end surface of the heating cover plate (2).
6. The heating panel assembly structure according to claim 1, wherein the bottom end surfaces of the heating case (1) are all fixedly provided with a bearing bracket (9) around, and the bottom end surfaces of the four bearing brackets (9) are fixedly provided with a heat insulation plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333614.1U CN217563796U (en) | 2022-02-18 | 2022-02-18 | Heating plate assembly structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333614.1U CN217563796U (en) | 2022-02-18 | 2022-02-18 | Heating plate assembly structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217563796U true CN217563796U (en) | 2022-10-11 |
Family
ID=83467974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220333614.1U Active CN217563796U (en) | 2022-02-18 | 2022-02-18 | Heating plate assembly structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217563796U (en) |
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2022
- 2022-02-18 CN CN202220333614.1U patent/CN217563796U/en active Active
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