CN211630493U - Extensible IO base plate - Google Patents

Extensible IO base plate Download PDF

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Publication number
CN211630493U
CN211630493U CN202020373560.2U CN202020373560U CN211630493U CN 211630493 U CN211630493 U CN 211630493U CN 202020373560 U CN202020373560 U CN 202020373560U CN 211630493 U CN211630493 U CN 211630493U
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CN
China
Prior art keywords
substrate
gasket
roof
base plate
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202020373560.2U
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Chinese (zh)
Inventor
郭涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Yaxuan Automation Technology Co ltd
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Suzhou Yaxuan Automation Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN202020373560.2U priority Critical patent/CN211630493U/en
Application granted granted Critical
Publication of CN211630493U publication Critical patent/CN211630493U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Roof Covering Using Slabs Or Stiff Sheets (AREA)

Abstract

The utility model discloses an extensible IO base plate, including base plate body and backing ring, the diagonal of base plate body all is provided with the backing ring, the top of backing ring is provided with the packing ring, and the upside of packing ring is provided with first fixed screw, the screw runs through packing ring and backing ring in proper order, the top of base plate body is provided with the component, and the top of component all is provided with the gasket, the top of gasket all is provided with the layer board, and the top of layer board all is provided with the radiating seat, the radiating groove has all been seted up at the top of radiating seat, the diagonal of layer board all is provided with the second fixed screw, and the second fixed screw from last to running through layer board, spring in proper order downwards and be connected with the base plate body, base plate body top left and right sides all is provided with the. The utility model discloses, the gasket cooperation radiating seat through setting up the silicone grease material has improved holistic radiating efficiency, and can select the roof that the top has different quantity connecting seats according to the demand, has improved the practicality.

Description

Extensible IO base plate
Technical Field
The utility model relates to a relevant technical field of base plate specifically is an extensible IO base plate.
Background
The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the substrate material-copper clad laminate to obtain a required circuit pattern, and have the functions of electric conduction, insulation and support, and the performance, quality, processability in manufacturing, manufacturing cost, manufacturing level and the like of the printed boards depend on the substrate material to a great extent.
The existing IO substrate usually has the expansion connection socket directly fixed on the surface of the substrate, so the area of the substrate needs to be properly enlarged, and the connection sockets with fixed number make the overall expansibility worse, and at the same time, the overall heat dissipation performance worse.
To this end, an expandable IO substrate is proposed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an extensible IO base plate has improved holistic radiating efficiency through the gasket cooperation radiating seat that sets up the silicone grease material, and can select the roof that the top has different quantity connecting seats according to the demand, has improved the practicality to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an expandable IO substrate comprises a shell and a fixed bin, and comprises a substrate body and backing rings, wherein the backing rings are arranged at the diagonal positions of the substrate body;
the top of the backing ring is provided with a gasket, a first fixing screw is arranged on the upper side of the gasket, the screws sequentially penetrate through the gasket and the backing ring, elements are arranged on the top of the substrate body, gaskets are arranged on the tops of the elements, supporting plates are arranged on the tops of the gaskets, radiating seats are arranged on the tops of the supporting plates, and radiating grooves are formed in the tops of the radiating seats;
the diagonal angle department of layer board all is provided with the second fixed screw, and the second fixed screw from the top down runs through layer board, spring in proper order and is connected with the base plate body, the base plate body top left and right sides all is provided with the dead lever, and the dead lever sets up respectively between backing ring and component, the top of dead lever is connected with the left and right sides of roof bottom respectively, and the left and right sides at roof top all is provided with the locating part, the top that the locating part runs through roof and dead lever respectively is connected, both sides all are provided with the connecting seat around the roof top.
Be provided with the backing ring, packing ring and first fixed screw, the material of packing ring is the rubber material, the cooperation backing ring is convenient for effectively avoid taking place excessive friction between first fixed screw and the base plate body, practical security has been improved, be provided with the component, the gasket, the layer board, the radiating seat, the radiating groove, second fixed screw and spring, the gasket through the silicone grease material is convenient for improve the heat transfer efficiency between component and the layer board, and the radiating seat cooperation radiating groove at layer board top has improved the radiating efficiency, the spring can provide effectual buffering effect simultaneously, holistic safety in utilization has further been improved, be provided with the dead lever, the roof, locating part and connecting seat, be convenient for fix the upside at the base plate body with the roof through locating part cooperation dead lever, the dismouting convenience of roof and connecting seat has been improved, consequently, holistic practicality has been improved.
Preferably, the backing ring is connected with the first fixing screw in a threaded manner, and the first fixing screw is connected with the gasket in a sliding manner.
Excessive friction can be effectively avoided taking place between base plate body and the first fixed screw through backing ring cooperation packing ring, when using the device, practical convenience has been improved.
Preferably, the number of the elements is 4, and the area of the elements is smaller than that of the supporting plate.
The supporting plate is convenient for absorbing heat generated by the element in the working process, and the heat dissipation efficiency is improved when the device is used.
Preferably, the top of radiating seat all is equidistant and has seted up 7 radiating grooves, and radiating seat, layer board and spring constitution elevation structure.
The spring can provide a certain buffering effect for the heat dissipation seat, and the use safety is improved when the device is used.
Preferably, the second fixing screw is connected with the substrate body in a threaded manner, and the second fixing screw is connected with the spring in a sliding manner.
The convenience of layer board and radiating seat when the dismouting has been improved through the second set screw, when using the device, has improved the use convenience.
Preferably, the central axis of the top plate and the central axis of the substrate body are on the same vertical straight line, and the middle of the surface of the substrate body is of an opening structure.
The connecting seat is convenient to fix through the top plate, and the use convenience is improved when the device is used.
Preferably, the connecting seat is provided with 2 groups for the axis of roof is the symmetry formula, and every roof of group all is equidistant and is provided with 3.
The overall expansion effect of the device is improved through the connecting seat, and the practicability is improved when the device is used.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is provided with the backing ring, the gasket and the first fixing screw, the gasket is made of rubber, and the first fixing screw and the substrate body are effectively prevented from excessive friction by matching with the backing ring, so that the practical safety is improved;
2. the utility model discloses, be provided with component, gasket, layer board, radiating seat, radiating groove, second set screw and spring, be convenient for improve the heat transfer efficiency between component and the layer board through the gasket of silicone grease material, and the radiating seat at layer board top cooperates the radiating groove to improve the radiating efficiency, and the spring can provide effectual buffering effect simultaneously, has further improved holistic safety in utilization;
3. the utility model discloses, be provided with dead lever, roof, locating part and connecting seat, be convenient for fix the roof at the upside of base plate body through locating part cooperation dead lever, improved the dismouting convenience of roof and connecting seat, consequently improved holistic practicality.
Drawings
Fig. 1 is a schematic side view of the present invention;
fig. 2 is a schematic front view of the structure of the present invention;
fig. 3 is a schematic top view of the present invention;
fig. 4 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.
In the figure: 1. a substrate body; 2. a backing ring; 3. a gasket; 4. a first fixing screw; 5. an element; 6. a gasket; 7. a support plate; 8. a heat dissipation base; 9. a heat sink; 10. a second fixing screw; 11. a spring; 12. fixing the rod; 13. a top plate; 14. a limiting member; 15. a connecting seat.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: an expandable IO substrate, as shown in fig. 1, 2 and 3, includes a substrate body 1 and a pad ring 2, wherein the pad ring 2 is disposed at opposite corners of the substrate body 1;
as shown in fig. 1, 2, 3 and 4, a gasket 3 is arranged on the top of a backing ring 2, a first fixing screw 4 is arranged on the upper side of the gasket 3, the first fixing screw 4 sequentially penetrates through the gasket 3 and the backing ring 2, an element 5 is arranged on the top of a substrate body 1, gaskets 6 are arranged on the tops of the elements 5, supporting plates 7 are arranged on the tops of the gaskets 6, heat dissipation seats 8 are arranged on the tops of the supporting plates 7, and heat dissipation grooves 9 are formed in the tops of the heat dissipation seats 8;
as shown in fig. 1, 2, 3 and 4, the diagonal of the supporting plate 7 is provided with a second fixing screw 10, the second fixing screw 10 sequentially penetrates through the supporting plate 7 from top to bottom, the spring 11 is connected with the substrate body 1, the left and right sides of the top of the substrate body 1 are provided with fixing rods 12, the fixing rods 12 are respectively arranged between the backing ring 2 and the element 5, the top ends of the fixing rods 12 are respectively connected with the left and right sides of the bottom of the top plate 13, the left and right sides of the top plate 13 are provided with limit pieces 14, the limit pieces 14 respectively penetrate through the top plate 13 and are connected with the top ends of the fixing rods 12, and the front and back sides of the top of.
By adopting the scheme, the cushion ring 2, the cushion ring 3 and the first fixing screw 4 are arranged, the cushion ring 3 is made of rubber, the cushion ring 2 is matched to effectively avoid excessive friction between the first fixing screw 4 and the substrate body 1, the practical safety is improved, the element 5, the gasket 6, the supporting plate 7, the radiating seat 8, the radiating groove 9, the second fixing screw 10 and the spring 11 are arranged, the heat transfer efficiency between the element 5 and the supporting plate 7 is improved by the gasket made of silicone grease, the radiating seat 8 at the top of the supporting plate 7 is matched with the radiating groove 9 to improve the radiating efficiency, meanwhile, the spring 11 can provide effective buffering effect, the whole use safety is further improved, the fixing rod 12, the top plate 13, the limiting part 14 and the connecting seat 15 are arranged, the top plate 13 is conveniently fixed on the upper side of the substrate body 1 by matching the limiting part 14 with the fixing rod 12, the convenience of dismounting the top plate 13 and the connecting seat 15 is improved, and therefore the overall practicability is improved.
Specifically, as shown in fig. 1, 2 and 3, the backing ring 2 is connected to the first fixing screw 4 in a threaded manner, and the first fixing screw 4 is connected to the washer 3 in a sliding manner.
Through adopting above-mentioned scheme, can effectively avoid taking place excessive friction between base plate body 1 and the first set screw 4 through backing ring 2 cooperation packing ring 3, when using the device, improve practical convenience.
Specifically, as shown in fig. 1, 2 and 3, 4 elements 5 are symmetrically arranged, and the area of the elements 5 is smaller than that of the supporting plate 7.
By adopting the scheme, the supporting plate 7 is convenient for absorbing heat generated by the element 5 in the working process, and the heat dissipation efficiency is improved when the device is used.
Specifically, as shown in fig. 1, 2 and 3, 7 heat dissipation grooves 9 are formed in the top of the heat dissipation seat 8 at equal intervals, and the heat dissipation seat 8, the support plate 7 and the spring 11 form a lifting structure.
Through adopting above-mentioned scheme, can provide certain buffering effect to radiating seat 8 through spring 11, when using the device, improve the safety in utilization.
Specifically, as shown in fig. 1, 2 and 3, the second fixing screw 10 is connected to the substrate body 1 in a threaded manner, and the second fixing screw 10 is connected to the spring 11 in a sliding manner.
Through adopting above-mentioned scheme, improved the convenience of layer board 7 and radiating seat 8 when the dismouting through second set screw 10, when using the device, improved the use convenience.
Specifically, as shown in fig. 1, fig. 2 and fig. 3, the central axis of the top plate 13 and the central axis of the substrate body 1 are on the same vertical straight line, and the middle of the surface of the substrate body 1 is an opening structure.
Through adopting above-mentioned scheme, be convenient for fix connecting seat 15 through roof 13, when using the device, improved the use convenience.
Specifically, as shown in fig. 1, 2 and 3, the connecting seat 15 is provided with 2 sets symmetrically about the central axis of the top plate 13, and each set of top plate 13 is provided with 3 sets at equal intervals.
Through adopting above-mentioned scheme, improved the holistic extension effect of device through connecting seat 15, when using the device, improved the practicality.
The working principle is as follows: the expandable IO substrate is characterized in that a substrate body 1 is fixed at a designated position through a first fixing screw 4, in the rotating process of the first fixing screw 4, a backing ring 2 can effectively prevent excessive friction between the first fixing screw 4 and the substrate body 1, a gasket 3 can provide a certain buffering effect, when expansion is needed, a top plate 13 can be fixed at the top of a fixing rod 12 through a limiting part 14, wherein the connecting mode of the limiting part 14 and the top plate 13 is sliding connection, the connecting mode of the limiting part 14 and the fixing rod 12 is threaded connection, then the whole device is in expansion connection with the outside through a connecting seat 15, the connecting seat 15 and the substrate body 1 is in electrical connection, in the using process, heat generated by an element 5 can be quickly transmitted to a supporting plate 7 and a radiating seat 8 through a gasket 6, and the surface area of the whole radiating seat 8 is effectively increased through a radiating groove 9 formed in the top of the radiating seat 8, the overall heat dissipation efficiency of the heat sink 8 is improved, wherein the component 5 is an existing device, and therefore the component 5 is only illustrated in the patent and is not a novel point and a protection point of the patent.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. An expandable IO substrate, comprising: the substrate comprises a substrate body (1) and backing rings (2), wherein the backing rings (2) are arranged at the opposite corners of the substrate body (1);
the heat dissipation device is characterized in that a gasket (3) is arranged at the top of the backing ring (2), a first fixing screw (4) is arranged on the upper side of the gasket (3), the first fixing screw (4) sequentially penetrates through the gasket (3) and the backing ring (2), an element (5) is arranged at the top of the substrate body (1), gaskets (6) are arranged at the tops of the elements (5), supporting plates (7) are arranged at the tops of the gaskets (6), heat dissipation seats (8) are arranged at the tops of the supporting plates (7), and heat dissipation grooves (9) are formed at the tops of the heat dissipation seats (8);
the diagonal of layer board (7) all is provided with second fixed screw (10), and second fixed screw (10) from the top down run through layer board (7), spring (11) in proper order and be connected with base plate body (1), base plate body (1) top left and right sides all is provided with dead lever (12), and dead lever (12) set up respectively between backing ring (2) and component (5), the top of dead lever (12) is connected with the left and right sides of roof (13) bottom respectively, and the left and right sides at roof (13) top all is provided with locating part (14), the top that roof (13) and dead lever (12) are run through respectively in locating part (14) is connected, both sides all are provided with connecting seat (15) around roof (13) top.
2. The expandable IO substrate of claim 1, wherein: the backing ring (2) is connected with the first fixing screw (4) in a threaded manner, and the first fixing screw (4) is connected with the gasket (3) in a sliding manner.
3. The expandable IO substrate of claim 1, wherein: the number of the elements (5) is 4, and the area of the elements (5) is smaller than that of the supporting plate (7).
4. The expandable IO substrate of claim 1, wherein: the top of the heat dissipation seat (8) is provided with 7 heat dissipation grooves (9) at equal intervals, and the heat dissipation seat (8), the supporting plate (7) and the spring (11) form a lifting structure.
5. The expandable IO substrate of claim 1, wherein: the second fixing screws (10) are connected with the substrate body (1) in a threaded manner, and the second fixing screws (10) are connected with the springs (11) in a sliding manner.
6. The expandable IO substrate of claim 1, wherein: the central axis of the top plate (13) and the central axis of the substrate body (1) are on the same vertical straight line, and the middle of the surface of the substrate body (1) is of an opening structure.
7. The expandable IO substrate of claim 1, wherein: connecting seat (15) are the symmetry formula about the axis of roof (13) and are provided with 2 groups, and every roof (13) of group all are equidistant and are provided with 3.
CN202020373560.2U 2020-03-23 2020-03-23 Extensible IO base plate Expired - Fee Related CN211630493U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020373560.2U CN211630493U (en) 2020-03-23 2020-03-23 Extensible IO base plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020373560.2U CN211630493U (en) 2020-03-23 2020-03-23 Extensible IO base plate

Publications (1)

Publication Number Publication Date
CN211630493U true CN211630493U (en) 2020-10-02

Family

ID=72621819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020373560.2U Expired - Fee Related CN211630493U (en) 2020-03-23 2020-03-23 Extensible IO base plate

Country Status (1)

Country Link
CN (1) CN211630493U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20201002

CF01 Termination of patent right due to non-payment of annual fee