CN101217856A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN101217856A CN101217856A CNA2007100012193A CN200710001219A CN101217856A CN 101217856 A CN101217856 A CN 101217856A CN A2007100012193 A CNA2007100012193 A CN A2007100012193A CN 200710001219 A CN200710001219 A CN 200710001219A CN 101217856 A CN101217856 A CN 101217856A
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- CN
- China
- Prior art keywords
- plate
- heat
- radiator
- substrate
- electronic building
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 239000011469 building brick Substances 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 37
- 229920000591 gum Polymers 0.000 claims description 11
- 230000000875 corresponding Effects 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Abstract
The invention provides a heat dissipation device used for arranging a baseplate. The baseplate is provided with a plurality of electronic components; the heat dissipation device comprises a bearing plate which is provided with a first plate body on which the baseplate is fixedly arranged; a second plate body extends upwards by at least one side end of the first plate body; furthermore, the top of the second plate body forms a combination part; the invention also provides a radiator which is provided with a heat conductive plate which is made of metal material and arranged above the baseplate correspondingly; furthermore, one edge of the heat conductive plate is fixedly connected with the combination part of the bearing plate; the bottom surface of the heat conductive plate is respectively contacted with the surfaces of all the electronic components on the baseplate correspondingly; the heat energy which is emitted when the electronic components work is absorbed by the heat conductive plate of the radiator and the heat energy is then transferred to the bearing plate through the combination part and exhausted through the surfaces of the first plate body and the second plate body of the bearing plate. The radiator of the invention can achieve the beneficial effects of convenient assembly, avoiding processing and saving manufacturing cost.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of cooling system of laying electronic building brick.
Background technology
All electronic product internal electrical components runnings all can produce heat, if hot type is not fallen, will cause electronic building brick because of crossing cause thermal damage.Especially integrated circuit (integratedcircuit) is to utilize microelectric technique with electronic building brick micro shaping one chip, is characterized in that volume is little, function is many, easy to use.Yet relative, the heat that produces during its running is also higher, can't discharge naturally against cross-ventilation merely simultaneously.
Fixing and the radiating mode that is used for electronic building brick at present on the industry, be that the substrate that the upper end is laid with some electronic building bricks is fixed on the loading plate, the upper surface that one radiator contacts these some electronic building bricks relatively is set above this substrate, the heat energy that is produced when making this each electronic building brick running sees through radiator row and sheds, avoid electronic building brick can't arrange diffusingly, cause working temperature to rise and damage because of heat energy.
Yet above-mentioned common features still has following shortcoming when reality is used:
1, loading plate commonly used at present only is used to provide base plate supports, radiator then is directly fixed on the electronic building brick upper surface, but owing to electronic building brick can be according to the different changes that size is arranged of product itself, and make radiator also must correspondingly synchronously change size, can guarantee that just it can correspondence be fixed on the electronic building brick, very inconvenient.And comparatively speaking, loading plate only has the effect of supporting substrates, supporting radiator initiatively, functional deficiency.
2, because the thickness difference of each electronic building brick, but especially be provided with the assembly of auto-radiatings such as resistance, electric capacity on the substrate usually in addition, if its height is than the electronic building brick height, then press down when contacting when radiator with the upper surface of electronic building brick, will certainly be subjected to the influence of those resistance, electric capacity on the substrate, and can't contact electronic building brick really, when causing the electronic building brick running, the heat that produces can't see through the heat transmission of radiator, reach cooling-down effect; Perhaps must radiator suitably be processed, cooperate electronic building brick, cause the construction trouble on being equipped with at the position of electronic building brick.
The inventor is in view of above-mentioned loading plate commonly used and the radiator shortcoming when the practical application, and the accumulation individual is engaged on the related industry exploitation practice experience for many years, studies intensively, and proposes a kind of reasonable in design and effectively improve the heat abstractor of the problems referred to above.
Summary of the invention
Main purpose of the present invention provides a kind of heat abstractor, mainly extends upward the support radiator by the loading plate side, makes the simple and easy assembling of radiator, and strong fix is saved cost of manufacture in the substrate top.
In order to achieve the above object, the invention provides a kind of heat abstractor, in order to a substrate to be set, be laid with some electronic building bricks on this substrate, this heat abstractor comprises: a loading plate, have one first plate body and be fixedly arranged on, extend upward one second plate body at least one side of this first plate body, and form a joint portion in this second plate body top for above-mentioned substrate; One radiator, its heat-conducting plate with a metal material are located at the aforesaid substrate top relatively, and this heat-conducting plate one edge system is fixing with the joint portion binding of this loading plate, respectively this electronic building brick surface on corresponding respectively this substrate of contact in this heat-conducting plate bottom surface.
As above-mentioned structure, when working by the heat-conducting plate absorption electronic building brick of this radiator, the heat energy that is distributed is passed on the loading plate by the joint portion, and first plate body and second plate body surface row by this loading plate sheds again.
Another main purpose of the present invention provides a kind of radiator, and the bottom has contact-making surface in order to contact electronic building brick surface, thereby reaches easy to assembly, contacts the electronic building brick surface really and carries out heat transmission, the processing when avoiding assembling, thereby save cost of manufacture.
In order to achieve the above object, in the heat abstractor of the present invention, the heat-conducting plate end face of this radiator is recessed to form some contact-making surfaces downwards, respectively this electronic building brick surface on corresponding just respectively this substrate of contact in this contact-making surface bottom.
As above-mentioned structure, be recessed to form some contact-making surfaces downwards by this heat-conducting plate end face, in order to contact this electronic building brick surface, because this heat-conducting plate only contact-making surface goes to contact the electronic building brick surface, therefore can not be subjected to the influence of set other resistance, electric capacity on the substrate, and can contact the electronic building brick surface really, in order to heat transfer effect.
Heat abstractor of the present invention, extend upward the support radiator by the loading plate side, make the radiator strong fix, and radiator is provided with recessed contact-making surface in order to contact electronic building brick surface in the substrate top, thereby reach easy to assembly, avoid processing, save cost of manufacture.
For enabling further to understand feature of the present invention and technology contents, can consult following about accompanying drawing of the present invention and embodiment.Yet appended accompanying drawing is only for referencial use and explanation usefulness, is not to be used to limit the present invention.
Description of drawings
Fig. 1 three-dimensional exploded view of the present invention.
The schematic perspective view of Fig. 2 radiator of the present invention.
Another visual angle schematic perspective view of Fig. 3 radiator of the present invention.
Fig. 4 is of the present invention to analyse and observe decomposing schematic representation.
Fig. 5 is of the present invention to analyse and observe the combination schematic diagram.
The cross-sectional schematic of Fig. 6 embodiment of the invention 2.
The cross-sectional schematic of Fig. 7 embodiment of the invention 3.
The cross-sectional schematic of Fig. 8 embodiment of the invention 4.
Wherein, description of reference numerals is as follows:
1-loading plate 5-radiator
The 11-first plate body 51-heat-conducting plate
The 12-first supporting barrel mast 511-second through hole
The 13-second plate body 512-contact-making surface
The 14-joint portion 513-second supporting barrel mast
The 141-first through hole 52-Extendible flake
15-the 3rd supporting barrel mast 6-lock cell
2-substrate 7-heat conduction gum
21-holds hole 8-shell body
3-electronic building brick 81-inner bottom surface
31-top surface 82-inner surface
The 4-spare part
Embodiment
Embodiment 1
As Fig. 1, Fig. 2, Fig. 3, Fig. 4 and shown in Figure 5, the present invention comprises: loading plate 1 and radiator 5; Wherein,
Loading plate 1, has first plate body 11, these first plate body, 11 end faces upwards are provided with some first supporting barrel masts 12, extend upward one second plate body 13 at these first plate body, 11 at least one sides, and form a joint portion 14 in these second plate body, 13 top horizontal-extendings, offer two first through holes 141 on 14 surfaces, joint portion of this loading plate 1.
Substrate 2, be laid with spare parts 4 such as some electronic building bricks 3 and some resistance, electric capacity on this substrate 2, on this substrate 2, offer some appearances hole 21 in addition, wherein above-mentioned some first supporting barrel masts 12 lay respectively at this just and partly hold 21 belows, hole, and run through this appearance hole 21 from these substrate 2 tops respectively with some lock cells 6, be locked in this first supporting barrel mast 12, this substrate 2 is fixed on above-mentioned first plate body 11.
Described radiator 5, its heat-conducting plate 51 that has a metal material at least is located at aforesaid substrate 2 tops relatively, one edge of this heat-conducting plate 51 is arranged on the joint portion 14 of this loading plate 1 relatively, and the edge of this heat-conducting plate 51 is to being provided with two second through holes 511 by two first through holes 141, and it is sealed with two lock cells 6 respectively, it is fixing that this radiator 5 is combined with this loading plate 1, form some contact-making surfaces 512 in the downward punching out of these heat-conducting plate 51 end faces, the top surface 31 of respectively this electronic building brick 3 on corresponding respectively just this substrate 2 of contact in these contact-making surface 512 bottoms, and be coated with heat conduction gum 7 between the top surface 31 of this contact-making surface 512 and this electronic building brick 3, when making these electronic building brick 3 runnings, the heat that is produced can see through heat conduction gum 7 quicker this contact-making surfaces 512 that conduct to.
Be provided with some second supporting barrel masts 513 in addition in heat-conducting plate 51 bottom surfaces of this radiator 5, corresponding respectively above-mentioned part is held hole 21, and run through this appearance hole 21 from these substrate 2 belows respectively with some lock cells 6, be locked in this second supporting barrel mast 513, this heat-conducting plate 51 be enhanced be fixed on the aforesaid substrate 2.
When implementing as this structure, according to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and shown in Figure 5, in the above-mentioned structure, heat-conducting plate 51 by this radiator 5 is fixed on the joint portion 14 of this loading plate 1, and each contact-making surface 512 of this heat-conducting plate 51 contacts the top surface 31 of this each electronic building brick 3 respectively, and therebetween be coated with this heat conduction gum 7, and increasing heat transference efficiency, this radiator 5 more can increase heat dissipation equipments such as fan and increase radiating efficiency on this heat-conducting plate 51.When these each electronic building brick 3 runnings, the heat that is distributed is passed on this heat-conducting plate 51 by this contact-making surface 512, and is passed on this loading plate 1 by this joint portion 14, and first plate body 11 and second plate body, the 13 surface rows by this loading plate 1 shed again.
Embodiment 2
As shown in Figure 6, this structure further comprises shell body 8, and be provided with the inner bottom surface 81 that some the 3rd supporting barrel masts 15 mount this shell body 8 in this loading plate 1 bottom surface, and combine fixing with this shell body 8, this loading plate 1 is placed on the inner bottom surface 81 of this shell body 8, and second plate body 13 of this loading plate 1 is to contact with an inner surface 82 of this shell body 8.
As above-mentioned structure, when the heat-conducting plate 51 that the heat penetration that described each electronic building brick 3 operations are produced is crossed this radiator 5 is passed on this loading plate 1, second plate body 13 by loading plate 1 contacts with the inner surface 82 of this shell body 8, make heat transferred to this shell body 8, enlarge with outside air and carry out heat exchange, reduce the temperature of electronic building brick 3 operations.
Embodiment 3
Enforcement 3 of the present invention as shown in Figure 7, in this structure, second plate body 13 of loading plate 1 is and 82 of the inner surfaces of this shell body 8 are coated with heat conduction gum 7.
As above-mentioned structure, the heat conduction gum 7 of 82 coatings of inner surface by second plate body 13 and shell body 8 increases heat transference efficiency.
Embodiment 4
As shown in Figure 8, in this structure, an edge of heat-conducting plate 51 is provided with an Extendible flake 52, and its surface contacts with the inner surface 82 of shell body 8, and is coated with heat conduction gum 7 between the inner surface 82 of this Extendible flake 52 and this shell body 8.
As above-mentioned structure, contact with the inner surface 82 of shell body 8 by Extendible flake 52, and be coated with heat conduction gum 7 betwixt, make radiator 5 because the heat that each electronic building brick 3 operation receives, can directly be passed to this shell body 8, enlarge with outside air and carry out heat exchange, reduce the temperature of electronic building brick 3 operations.
From the foregoing description as can be known, the present invention has following advantage:
1, the present invention makes loading plate 1 energy supporting radiator 5, make this radiator 5 fixing, and then make the module design of this radiator 5, can consider the change of each electronic building brick 3 on this substrate 2 when therefore assembling, reach simple and easy and firm assembling, thereby save cost of manufacture.
2, the contact-making surface 512 that has of heat-conducting plate 51 bottoms of the present invention by this radiator 5 is in order to the top surface 31 of contact electronic building brick 3, when avoiding assembling for the top surface 31 of corresponding electronic building brick 3, and must carry out complicated processing, reduce the problem that is subjected to spare parts such as set other resistance, electric capacity 4 influences on the substrate 2, thereby save cost of manufacture and construction trouble, and make this radiator 5 can bring into play its heat transmission and cool effect.
The above only is preferred embodiment of the present invention, and the equivalence techniques that not claim that therefore limits, so all utilizations specification of the present invention and diagramatic content are done changes, all within the scope of the present invention.
Claims (15)
1. a heat abstractor in order to a substrate to be set, is laid with some electronic building bricks on this substrate, and this heat abstractor is characterised in that it comprises:
Loading plate has one first plate body and is fixedly arranged on for above-mentioned substrate, extends upward one second plate body at least one side of this first plate body, and forms a joint portion in this second plate body top;
Radiator, the heat-conducting plate with a metal material is located at the aforesaid substrate top relatively, and the binding of the joint portion of this heat-conducting plate one edge and this loading plate is fixing, respectively this electronic building brick surface on corresponding respectively this substrate of contact in this heat-conducting plate bottom surface;
When working by the heat-conducting plate absorption electronic building brick of this radiator, the heat energy that is distributed is passed on the loading plate by the joint portion, and first plate body and second plate body surface row by this loading plate sheds again.
2. heat abstractor as claimed in claim 1, it is characterized in that, wherein the surface, joint portion of this loading plate offers some first through holes, and corresponding this first through hole in heat-conducting plate one edge of this radiator is provided with some second through holes, and sealed with some lock cells, it is fixing that this radiator is combined with this loading plate.
3. heat abstractor as claimed in claim 1 is characterized in that, wherein the edge of this heat-conducting plate is to be set in relatively on the joint portion of this loading plate.
4. heat abstractor as claimed in claim 1 is characterized in that, wherein this joint portion is to extend horizontally on this second plate body top.
5. heat abstractor as claimed in claim 1 is characterized in that, comprises shell body, and this loading plate is to mount at this shell body inner bottom surface.
6. heat abstractor as claimed in claim 5 is characterized in that, wherein second plate body of this loading plate contacts with an inner surface of this shell body.
7. heat abstractor as claimed in claim 6 is characterized in that, wherein is coated with the heat conduction gum between the inner surface of second plate body of this loading plate and this shell body.
8. heat abstractor as claimed in claim 6 is characterized in that, wherein this heat-conducting plate one edge is provided with an Extendible flake, and its surface contacts with an inner surface of this shell body.
9. heat abstractor as claimed in claim 8 is characterized in that, wherein is coated with the heat conduction gum between the inner surface of this Extendible flake and this shell body.
10. heat abstractor as claimed in claim 1 is characterized in that, wherein offers some appearances hole on this substrate.
11. heat abstractor as claimed in claim 10, it is characterized in that, wherein the first plate body end face of this loading plate is provided with some first supporting barrel masts, it is respectively to holding the hole, and see through some lock cells and run through this appearances hole and lock in this first supporting barrel mast, this loading plate is fixed on above this first plate body.
12. radiator, contact some electronic building bricks of being laid on the substrate in order to correspondence, this radiator is characterised in that, comprise: the heat-conducting plate of metal material is located at the aforesaid substrate top relatively, be recessed to form some contact-making surfaces downwards in this heat-conducting plate end face, respectively this electronic building brick surface on corresponding respectively just this substrate of contact in this contact-making surface bottom.
13. heat abstractor as claimed in claim 12, it is characterized in that, the heat-conducting plate bottom surface that wherein offers some appearances hole and this radiator on this substrate is provided with some second supporting barrel masts respectively to holding the hole, and see through some lock cells and run through this appearances hole and lock in this second supporting barrel mast, this heat-conducting plate is fixed in above this substrate.
14. heat abstractor as claimed in claim 12 is characterized in that, wherein is coated with the heat conduction gum between this contact-making surface and this electronic building brick surface.
15. heat abstractor as claimed in claim 12 is characterized in that, wherein these some contact-making surfaces are to form from the downward punching out of this heat-conducting plate end face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100012193A CN101217856A (en) | 2007-01-04 | 2007-01-04 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100012193A CN101217856A (en) | 2007-01-04 | 2007-01-04 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101217856A true CN101217856A (en) | 2008-07-09 |
Family
ID=39624192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100012193A Pending CN101217856A (en) | 2007-01-04 | 2007-01-04 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101217856A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613556A (en) * | 2013-11-04 | 2015-05-13 | 珠海格力电器股份有限公司 | Cooling device of electrical apparatus element and air conditioner having same |
| CN106231836A (en) * | 2016-08-05 | 2016-12-14 | 京东方科技集团股份有限公司 | Closed display device and assemble method thereof |
-
2007
- 2007-01-04 CN CNA2007100012193A patent/CN101217856A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613556A (en) * | 2013-11-04 | 2015-05-13 | 珠海格力电器股份有限公司 | Cooling device of electrical apparatus element and air conditioner having same |
| CN106231836A (en) * | 2016-08-05 | 2016-12-14 | 京东方科技集团股份有限公司 | Closed display device and assemble method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080709 |