CN212034441U - Circuit board convenient to heat dissipation - Google Patents
Circuit board convenient to heat dissipation Download PDFInfo
- Publication number
- CN212034441U CN212034441U CN202021082614.6U CN202021082614U CN212034441U CN 212034441 U CN212034441 U CN 212034441U CN 202021082614 U CN202021082614 U CN 202021082614U CN 212034441 U CN212034441 U CN 212034441U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- backplate
- board main
- heat dissipation
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000741 silica gel Substances 0.000 claims abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 4
- 230000008676 import Effects 0.000 claims abstract description 3
- 238000003825 pressing Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a circuit board convenient to heat dissipation, including the circuit board main part, the bottom of circuit board main part is provided with heat conduction insulating gasket, and heat conduction insulating gasket's bottom is provided with the backplate, and the centre of backplate is provided with the bar passageway, and the bar passageway is back the shape and distributes, and the one end of bar passageway is connected with the import of circulating pump, and the exit linkage of circulating pump has the other end of bar passageway, the perpendicular evenly distributed in bottom of backplate has protruding fin, protruding fin and backplate structure as an organic whole, heat conduction insulating gasket adopts the silica gel material, the top both sides of backplate are provided with protruding edge respectively, and the height that highly equals circuit board main part on this protruding edge, and circuit board main part clamp locate between the protruding edge of backplate both sides. This circuit board convenient to heat dissipation adopts the structural design that backplate and circuit board main part combined together for the heat of this circuit board can the even transmission, gives off fast, thereby has stronger heat dispersion, lets the operation that relevant equipment can be more stable.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board convenient to heat dissipation.
Background
The circuit board is also called as a circuit board, and the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. Circuit boards are classified into three major categories, single-sided boards, double-sided boards, and multilayer circuit boards, depending on the number of layers. Single panel, on the most basic PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Such PCBs are called single-sided circuit boards because the conductors are present on only one side thereof. The single panel is generally simple to manufacture and low in cost, but has the disadvantage that the single panel cannot be applied to a complex product. The double-sided board is an extension of a single-sided board, and is used when a single-layer wiring cannot meet the requirements of an electronic product. Copper is coated on both sides of the circuit board, so that wires are arranged between the two layers, and the wires can be connected through the through holes to form required network connection. The multilayer board refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multifunction, large capacity, small volume, thinning and light weight.
The traditional circuit board has poor heat dissipation effect, and the operation in high-temperature weather easily causes the slow and insufficient clamping of related equipment.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board convenient to heat dissipation to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board convenient to heat dissipation, includes the circuit board main part, the bottom of circuit board main part is provided with heat conduction insulating gasket, and heat conduction insulating gasket's bottom is provided with the backplate, and the centre of backplate is provided with the bar passageway, and the bar passageway is back shape distribution, and the one end of bar passageway is connected with the import of circulating pump, and the exit linkage of circulating pump has the other end of bar passageway, the perpendicular evenly distributed in bottom of backplate has protruding fin, protruding fin and backplate structure as an organic whole.
Preferably, the back plate is made of copper.
Preferably, the heat-conducting insulating gasket is made of a silica gel material.
Preferably, the two sides of the top of the back plate are respectively provided with a convex edge, the height of the convex edge is equal to that of the circuit board main body, and the circuit board main body is clamped between the convex edges at the two sides of the back plate.
Preferably, the tops of the two sides of the circuit board main body are respectively provided with a pressing strip, the pressing strips are connected with the circuit board main body through screws, and the circuit board main body is pressed and held at the bottom of the pressing strips.
Preferably, round holes are formed in four corners of the back plate respectively, cylinders are arranged at the bottoms of two ends of the pressing strip respectively, and the structures of the cylinders are matched with those of the round holes.
Compared with the prior art, the beneficial effects of the utility model are that: this circuit board convenient to heat dissipation adopts the structural design that backplate and circuit board main part combined together for the heat of this circuit board can the even transmission, gives off fast, thereby has stronger heat dispersion, lets the operation that relevant equipment can be more stable.
Drawings
Fig. 1 is a front view of a circuit board convenient for heat dissipation according to the present invention;
FIG. 2 is a top view of the strip-shaped channel of the circuit board for facilitating heat dissipation of the present invention;
fig. 3 is the utility model relates to a circuit board top view convenient to heat dissipation.
In the figure: 1. backplate, 2, protruding fin, 3, bar passageway, 4, circuit board main part, 5, heat conduction insulating pad, 6, screw, 7, layering, 8, circulating pump, 9, round hole, 10, cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a circuit board convenient for heat dissipation comprises a circuit board main body 4, a heat conduction insulating gasket 5 is arranged at the bottom of the circuit board main body 4, a backboard 1 is arranged at the bottom of the heat conduction insulating gasket 5, the heat conduction insulating gasket 5 can prevent current from communicating, and the circuit board main body 4 and the backboard 1 are connected more tightly, so that the heat transfer efficiency can be improved, the heat conduction insulating gasket 5 is made of silica gel, the material has a soft hot point and has better heat conductivity, a strip-shaped channel 3 is arranged in the middle of the backboard 1, the strip-shaped channel 3 is distributed in a shape of a Chinese character 'hui', one end of the strip-shaped channel 3 is connected with an inlet of a circulating pump 8, an outlet of the circulating pump 8 is connected with the other end of the strip-shaped channel 3, the strip-shaped channel 3 can be filled with cooling liquid such as pure water, the cooling liquid can absorb heat, then, the heat dissipation efficiency is improved, the bottom of the back plate 1 is vertically and uniformly distributed with the raised fins 2, the raised fins 2 and the back plate 1 are of an integral structure, the structure enables the back plate 1 to have a larger surface area, so that the heat dissipation efficiency can be improved, the back plate 1 is made of copper materials, the heat transfer efficiency of the materials is higher, two sides of the top of the back plate 1 are respectively provided with a raised edge, the height of the raised edge is equal to the height of the circuit board main body 4, the circuit board main body 4 is clamped between the raised edges at two sides of the back plate 1, the structure enables the circuit board main body 4 and the back plate 1 to be stably connected, the tops at two sides of the circuit board main body 4 are respectively provided with a pressing strip 7, the pressing strip 7 is connected with the circuit board main body 4 through a screw 6, the circuit board main body 4 is pressed at the bottom of the pressing strip 7, round holes 9 have been seted up respectively in the four corners of backplate 1, and the bottom at layering 7 both ends is provided with cylinder 10 respectively, and the structure of cylinder 10 and the structure phase-match of round hole 9, and cylinder 10 can insert in round hole 9, and this structure makes things convenient for backplate 1 and layering 7 to align.
The working principle is as follows: when the circuit board convenient for heat dissipation is used, whether the device has the condition of part damage or unfirm connection is checked firstly, the circuit board is used after the check is correct, the circuit board main body 4 and the back plate 1 are combined into a whole and are tightly connected through a heat conduction insulating gasket 5, so that the heat generated by the components on the circuit board main body 4 can be transferred to the back plate 1, the surface of the back plate 1 and the raised fins 2 are used for high-efficiency heat dissipation, meanwhile, the strip-shaped channel 3 is arranged in the back plate 1, the cooling liquid in the strip-shaped channel 3 can circulate under the drive of the circulating pump 8, so that the heat can be uniformly dispersed on the back plate 1, the uneven heating generated by the components on the circuit board main body 4 can be uniformly diffused, the heat of the circuit board can be uniformly transferred and rapidly dissipated, therefore, the circuit board has stronger heat dissipation performance, which is the working principle of the circuit board convenient for heat dissipation.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a circuit board convenient to heat dissipation, includes circuit board main part (4), its characterized in that: the bottom of circuit board main part (4) is provided with heat conduction insulating gasket (5), and the bottom of heat conduction insulating gasket (5) is provided with backplate (1), and the centre of backplate (1) is provided with bar passageway (3), and bar passageway (3) are back shape and distribute, and the one end of bar passageway (3) is connected with the import of circulating pump (8), and the exit linkage of circulating pump (8) has the other end of bar passageway (3), the perpendicular evenly distributed in bottom of backplate (1) has protruding fin (2), protruding fin (2) and backplate (1) structure as an organic whole.
2. A circuit board for facilitating heat dissipation according to claim 1, wherein: the back plate (1) is made of copper.
3. A circuit board for facilitating heat dissipation according to claim 1, wherein: and the heat-conducting insulating gasket (5) is made of a silica gel material.
4. A circuit board for facilitating heat dissipation according to claim 1, wherein: the circuit board is characterized in that convex edges are respectively arranged on two sides of the top of the back plate (1), the height of each convex edge is equal to that of the circuit board main body (4), and the circuit board main body (4) is clamped between the convex edges on two sides of the back plate (1).
5. A circuit board for facilitating heat dissipation according to claim 1, wherein: the top of circuit board main part (4) both sides is provided with layering (7) respectively, is connected through screw (6) between layering (7) and circuit board main part (4), and circuit board main part (4) are pressed and are held in the bottom of layering (7).
6. A circuit board facilitating heat dissipation according to claim 5, wherein: round holes (9) are respectively formed in four corners of the back plate (1), cylinders (10) are respectively arranged at the bottoms of two ends of the pressing strip (7), and the structures of the cylinders (10) are matched with those of the round holes (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021082614.6U CN212034441U (en) | 2020-06-12 | 2020-06-12 | Circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021082614.6U CN212034441U (en) | 2020-06-12 | 2020-06-12 | Circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212034441U true CN212034441U (en) | 2020-11-27 |
Family
ID=73477261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021082614.6U Expired - Fee Related CN212034441U (en) | 2020-06-12 | 2020-06-12 | Circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212034441U (en) |
-
2020
- 2020-06-12 CN CN202021082614.6U patent/CN212034441U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201127 |