CN211580303U - PCB circuit board - Google Patents

PCB circuit board Download PDF

Info

Publication number
CN211580303U
CN211580303U CN202020731763.4U CN202020731763U CN211580303U CN 211580303 U CN211580303 U CN 211580303U CN 202020731763 U CN202020731763 U CN 202020731763U CN 211580303 U CN211580303 U CN 211580303U
Authority
CN
China
Prior art keywords
circuit board
pcb circuit
board body
pcb
fixation clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020731763.4U
Other languages
Chinese (zh)
Inventor
何晖
李雪刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Li Jiang Technology Shenzhen Co ltd
Original Assignee
Li Jiang Technology Shenzhen Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Li Jiang Technology Shenzhen Co ltd filed Critical Li Jiang Technology Shenzhen Co ltd
Priority to CN202020731763.4U priority Critical patent/CN211580303U/en
Application granted granted Critical
Publication of CN211580303U publication Critical patent/CN211580303U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a PCB (printed circuit board), which relates to the technical field of PCB circuit boards, and comprises a PCB circuit board body, and a conductive copper foil layer, an adhesive layer and a substrate film layer which form the PCB circuit board body, wherein the PCB circuit board body consists of the conductive copper foil layer, the adhesive layer and the substrate film layer, the conductive copper foil layer and the substrate film layer are fixed by the adhesive layer, the top surface of the PCB circuit board body is provided with a circuit component, the bottom of the PCB circuit board body is provided with a bottom fixing plate, the side wall of the bottom fixing plate is provided with a circuit board fixing device, the PCB circuit board body is fixed at the top of the bottom fixing plate by the circuit board fixing device, the bottom fixing plate is arranged at the bottom of the PCB circuit board, the bottom fixing plate is arranged on related equipment, and the PCB is fixed on the bottom fixing plate by a first fixing clamp and a second, so as to be convenient for disassembly during maintenance and more convenient and faster to use.

Description

PCB circuit board
Technical Field
The utility model belongs to the technical field of the PCB circuit board, concretely relates to PCB circuit board.
Background
PCB boards, i.e., printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The present circuit board is mainly composed of a circuit and a drawing, the circuit is used as a tool for conducting between original components, a large copper surface is additionally designed on the design as a grounding and power supply layer, the circuit and the drawing are made simultaneously, an insulating plate is used as a base material, the insulating plate is cut into a certain size, at least one conductive pattern is attached to the insulating plate, holes (such as element holes, fastening holes, metalized holes and the like) are distributed on the insulating plate, the conductive pattern is used for replacing a chassis of the traditional electronic components, and the electronic components are connected with each other.
However, the existing PCB circuit boards have some disadvantages in the using process, for example, most of the circuit boards are directly mounted on the corresponding devices by screws and holes, and are complicated and troublesome when being removed for maintenance; in addition, the circuit board only adopts the radiating fins to radiate heat, no device for dissipating heat on the auxiliary radiating fins is arranged, and the circuit board only radiates heat by the radiating fins, so that the radiating is slow.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCB circuit board to when proposing the circuit board and demolising and overhaul among the above-mentioned background art of solution, comparatively complicated trouble and do not set up the device that the heat effluvium on the auxiliary cooling fin, the slow problem of heat dissipation.
In order to achieve the above object, the utility model provides a following technical scheme: a PCB circuit board comprises a PCB circuit board body, a conductive copper foil layer, an adhesive layer and a substrate film layer, the PCB circuit board body consists of a conductive copper foil layer, an adhesive layer and a substrate film layer, the conductive copper foil layer and the substrate film layer are fixedly adhered through the adhesive layer, the top surface of the PCB circuit board body is provided with a circuit component, the bottom of the PCB circuit board body is provided with a bottom fixing plate, the side wall of the bottom fixing plate is provided with a circuit board fixing device, the PCB circuit board body is fixed at the top end of the bottom fixing plate through the circuit board fixing device, the circuit board fixing device comprises a first fixing clamp and two second fixing clamps, the first fixing clamp is adjacent to the two second fixing clamps, and the two fixing clamps are symmetrically arranged, and a heat radiating device is arranged on one side wall of the bottom fixing plate, which is far away from the first fixing clamp.
Preferably, the mounting groove has all been seted up with the position department that the lateral wall of bottom fixed plate corresponds with fixation clamp one and two fixation clamps two, and is three all install the damping pivot in the mounting groove, and the both ends of damping pivot and the both sides wall fixed connection of mounting groove, fixation clamp one and two fixation clamp two passes through the damping pivot with the bottom fixed plate and rotates and be connected.
Preferably, two the inboard of fixation clamp II is provided with the fixture block, be provided with the draw-in groove that corresponds with the fixture block on the PCB circuit board body, the fixture block can block into in the draw-in groove for firmly fix PCB circuit board body.
Preferably, one side of the PCB body is provided with a heat sink, the heat sink and the heat dissipation device are located on the same side, and the heat sink is located on the inner side of the heat dissipation device.
Preferably, the four corners of the bottom fixing plate are provided with mounting screw holes, and the length and width of the bottom fixing plate are slightly larger than those of the PCB body.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses set up the bottom fixed plate bottom the PCB circuit board, installed the bottom fixed plate on relevant equipment, rethread fixation clamp one and fixation clamp two fix the PCB circuit board on the bottom fixed plate to dismantle when overhauing, it is more convenient to use, has solved most circuit boards and has adopted screw and hole direct mount on corresponding equipment, when demolising and overhaul, comparatively complicated and troublesome problem.
(2) The utility model discloses set up heat dissipation fan device in one side of fin, through the supplementary effluvium of fin heat with higher speed of heat dissipation fan, improve the radiating efficiency, solved the circuit board and only adopted the fin to dispel the heat, do not set up the device that the heat effluvium on the supplementary fin, only lean on the fin heat dissipation, the slower problem dispels the heat.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of area A of FIG. 1;
fig. 3 is a top view of the bottom fixing plate of the present invention;
fig. 4 is a top view of the PCB circuit board body of the present invention;
fig. 5 is a schematic structural view of the PCB body of the present invention;
in the figure: 1-PCB circuit board body; 11-conductive copper foil layer; 12-an adhesive layer; 13-substrate film layer; 2-a circuit board fixing device; 21-fixing a clamp I; 22-a second fixing clamp; 22-a damping spindle; 3-bottom fixing plate; 4-mounting screw holes; 5-a heat dissipation device; 6-a heat sink; 7-line assembly.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: a PCB circuit board comprises a PCB circuit board body 1, and a conductive copper foil layer 11, an adhesive layer 12 and a substrate film layer 13 which form the PCB circuit board body 1, wherein the PCB circuit board body 1 consists of the conductive copper foil layer 11, the adhesive layer 12 and the substrate film layer 13, the conductive copper foil layer 11 and the substrate film layer 13 are adhered and fixed through the adhesive layer 12, a circuit component 7 is arranged on the top surface of the PCB circuit board body 1, a bottom fixing plate 3 is arranged at the bottom of the PCB circuit board body 1, a circuit board fixing device 2 is arranged on the side wall of the bottom fixing plate 3, the PCB circuit board body 1 is fixed on the top end of the bottom fixing plate 3 through the circuit board fixing device 2, the circuit board fixing device 2 comprises a fixing clamp I21 and two fixing clamps II 22, the fixing clamp I21 is adjacent to the two fixing clamps II 22, the two fixing clamps II 22 are symmetrically arranged, and a heat dissipation device 5 is arranged on one side, the heat dissipation device 5 is composed of a heat dissipation motor and a heat dissipation fan and is electrically connected with a power supply on the circuit board.
Firstly, install bottom mounting plate 3 on relevant equipment through installation screw 4, then put PCB circuit board body 1 on bottom mounting plate 3, rotate fixation clamp one 21 and two fixation clamps two 22, block the card on two fixation clamps two 22 on the draw-in groove on PCB circuit board body 1, make it more firm, because the resistance of damping pivot 23, can firmly fix it.
Further, the mounting groove has all been seted up with the position department that first fixation clamp 21 and two fixation clamps two 22 correspond to the lateral wall of bottom mounting plate 3, all installs damping pivot 23 in the three mounting groove, and the both ends of damping pivot 23 and the both sides wall fixed connection of mounting groove, and first fixation clamp 21 and two fixation clamps two 22 are connected through the rotation of damping pivot 23 with bottom mounting plate 3.
The first fixing clip 21 and the second fixing clips 22 are both L-shaped structures, and the clamping parts are as high as the PCB body 1.
Furthermore, the inner sides of the two fixing clamps 22 are provided with clamping blocks, clamping grooves corresponding to the clamping blocks are formed in the PCB body 1, and the clamping blocks can be clamped into the clamping grooves and used for firmly fixing the PCB body 1.
Further, a heat sink 6 is disposed on one side of the PCB body 1, the heat sink 6 and the heat sink 5 are located on the same side, and the heat sink 6 is located inside the heat sink 5.
The heat dissipation device 5 is started by the heat dissipation sheet 6 used for guiding out the heat on the PCB body 1, and the heat dissipation fan accelerates the heat dissipation of the heat dissipation sheet 6, so that the heat dissipation effect is better.
Further, four corners of the bottom fixing plate 3 are provided with mounting screw holes 4, and the length and width of the bottom fixing plate 3 are slightly larger than those of the PCB circuit board body 1, so that the heat dissipation device 5 is mounted on the inner side of the heat dissipation fin 6.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides a PCB circuit board, includes PCB circuit board body (1) and constitutes electrically conductive copper foil layer (11), the adhesive layer (12) and the base plate film layer (13) of PCB circuit board body (1), PCB circuit board body (1) comprises electrically conductive copper foil layer (11), adhesive layer (12) and base plate film layer (13), it is fixed through adhesive layer (12) paste that adhere to electrically conductive copper foil layer (11) and base plate film layer (13), the top surface of PCB circuit board body (1) is provided with circuit assembly (7), its characterized in that: the bottom of PCB circuit board body (1) is provided with bottom fixing plate (3), the lateral wall of bottom fixing plate (3) is provided with circuit board fixing device (2), PCB circuit board body (1) is fixed on the top of bottom fixing plate (3) through circuit board fixing device (2), circuit board fixing device (2) are including fixation clamp one (21) and two fixation clamp two (22), fixation clamp one (21) and two fixation clamp two (22) are adjacent, and two fixation clamp two (22) symmetry set up, a lateral wall that fixation clamp one (21) was kept away from in bottom fixing plate (3) is provided with heat abstractor (5).
2. A PCB circuit board according to claim 1, wherein: the mounting groove has all been seted up with the position department that the lateral wall of bottom fixed plate (3) corresponds with fixation clamp (21) and two fixation clamps two (22), and is three all install damping pivot (23) in the mounting groove, and the both ends of damping pivot (23) and the both sides wall fixed connection of mounting groove, fixation clamp (21) and two fixation clamp two (22) are connected through damping pivot (23) rotation with bottom fixed plate (3).
3. A PCB circuit board according to claim 1, wherein: two the inboard of fixation clamp II (22) is provided with the fixture block, be provided with the draw-in groove that corresponds with the fixture block on PCB circuit board body (1), the fixture block can block into in the draw-in groove for firmly fixed PCB circuit board body (1).
4. A PCB circuit board according to claim 1, wherein: one side of the PCB body (1) is provided with a radiating fin (6), the radiating fin (6) and the radiating device (5) are positioned on the same side, and the radiating fin (6) is positioned on the inner side of the radiating device (5).
5. A PCB circuit board according to claim 1, wherein: installation screw (4) have all been seted up to four corners of bottom fixed plate (3), the length and the width of bottom fixed plate (3) slightly are greater than the length and the width of PCB circuit board body (1).
CN202020731763.4U 2020-05-07 2020-05-07 PCB circuit board Active CN211580303U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020731763.4U CN211580303U (en) 2020-05-07 2020-05-07 PCB circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020731763.4U CN211580303U (en) 2020-05-07 2020-05-07 PCB circuit board

Publications (1)

Publication Number Publication Date
CN211580303U true CN211580303U (en) 2020-09-25

Family

ID=72528463

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020731763.4U Active CN211580303U (en) 2020-05-07 2020-05-07 PCB circuit board

Country Status (1)

Country Link
CN (1) CN211580303U (en)

Similar Documents

Publication Publication Date Title
CN211580303U (en) PCB circuit board
CN209402925U (en) A kind of two-side radiation device of pcb board
CN215935429U (en) Composite copper substrate structure
CN212436010U (en) Single-sided printed circuit board with good heat dissipation
CN210381687U (en) High radiating double-deck PCB board subassembly
CN210986573U (en) High heat dissipation printed wiring board
CN219421150U (en) Heat dissipation type circuit board
CN210042381U (en) PCB circuit board of high-efficient heat dissipation multilayer
CN213462477U (en) High-stability PCB
CN216565727U (en) High-efficient heat dissipation type PCB control panel
JPS63266898A (en) Cooling structure of printed-circuit board
CN213426720U (en) Double-sided circuit board of easily installing
CN219181962U (en) Circuit device for improving heating
CN217283539U (en) Rigid circuit board with good heat dissipation effect
CN110809362A (en) High-heat-dissipation printed circuit board and manufacturing method thereof
CN218976912U (en) Capacitor circuit board with ladder structure
CN216357454U (en) High temperature resistant PCB circuit board
CN211481741U (en) Circuit board mounting structure for electrical equipment
CN213403617U (en) Multilayer printed PCB circuit board capable of rapidly radiating
CN220733091U (en) Double-sided radiating PCB circuit board
CN219269148U (en) Spliced PCB circuit board
CN217088241U (en) High-heat-conduction spliced aluminum substrate
CN216087096U (en) High-density interconnection set top box printed circuit board
CN220021110U (en) Power semiconductor module
CN213485231U (en) Cosmetic appearance PCB board that 3D electric wave was drawn and is carried

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant