CN210381687U

CN210381687U - High radiating double-deck PCB board subassembly

Info

Publication number: CN210381687U
Application number: CN201921493785.5U
Authority: CN
Inventors: 顾雪荣
Original assignee: Kunshan Huirenshi Electronics Co ltd
Current assignee: Kunshan Huirenshi Electronics Co ltd
Priority date: 2019-09-09
Filing date: 2019-09-09
Publication date: 2020-04-21
Anticipated expiration: 2029-09-09

Abstract

The utility model provides a high radiating double-deck PCB board subassembly, includes the carriage, the top of carriage is through the double-deck PCB board body of first screw fixedly connected with, the inner chamber at the carriage is inlayed in the bottom of double-deck PCB board body, the equal integrative electric welding in both sides at double-deck PCB board body top has the chip, the top of chip bonds and has the conducting strip, the integrative welding in one side of conducting strip has the heat-conducting plate, one side that the conducting strip was kept away from to the heat-conducting plate has the elastic clamping piece through second screw fixed connection, the integrative welding in one side that the conducting strip was kept away from to the elastic clamping piece has radiating fin. The utility model discloses a conducting strip, heat-conducting plate and elasticity clamping piece, with the heat conduction that double-deck PCB board body produced on the radiating fin, then drive the fan piece through driving motor, blow away the heat to improved PCB board thermal diffusivity, solved current PCB board and had the not enough problem of thermal diffusivity, made the PCB board obtain timely heat dissipation, thereby prolonged the life of PCB board.

Description

High radiating double-deck PCB board subassembly

Technical Field

The utility model relates to a PCB board technical field specifically is a high radiating double-deck PCB board subassembly.

Background

The printed circuit board, also known as PCB board, printed circuit board, regard insulating board as the substrate, cut into certain size, at least attach a conductive pattern on it, and distribute (such as component hole, fastening hole, metallized hole, etc.), used for replacing chassis of the electronic components of the past device, and realize the interconnection between the electronic components, at present, the existing printed circuit board is most spontaneous heat dissipation, there is insufficient heat dissipation defect, the PCB board can't get the timely heat dissipation, thus has reduced the life time of PCB board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high radiating double-deck PCB board subassembly possesses the advantage that improves the thermal diffusivity, has solved current PCB board and has had the not enough problem of thermal diffusivity.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high radiating double-deck PCB board subassembly, includes the carriage, the top of carriage is through the double-deck PCB board body of first screw fixedly connected with, the inner chamber at the carriage is inlayed in the bottom of double-deck PCB board body, the equal integrative electric welding in both sides at double-deck PCB board body top has the chip, the top of chip bonds and has the conducting strip, the integrative welding in one side of conducting strip has the heat-conducting plate, one side that the conducting strip was kept away from to the heat-conducting plate has the elastic clamping piece through second screw fixed connection, the integrative welding in one side that the conducting strip was kept away from to the elastic clamping piece has radiating fin, the equal fixed mounting in both sides at the carriage back has driving motor, driving motor's output shaft runs through the carriage and extends to the inner chamber fixedly connected.

Preferably, the radiating fins are formed by welding heat conducting strips in a net-shaped staggered manner.

Preferably, first through-hole has been seted up on the surface of heat-conducting plate, the second through-hole has been seted up to the inner chamber of elasticity clamping piece and the position that corresponds with first through-hole, the bottom of second screw runs through first through-hole and second through-hole in proper order and extends to the bottom of elasticity clamping piece.

Preferably, the front surface of the supporting frame is provided with heat dissipation holes, and the number of the heat dissipation holes is not less than four.

Preferably, the joint of the bottom of the heat conducting sheet and the chip is bonded through silica gel.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a heat conduction piece, heat-conducting plate and elasticity clamping piece conduct the heat that double-deck PCB board body produced on the radiating fin, then drive the fan piece through driving motor, blow away the heat to improve PCB board thermal diffusivity, solved current PCB board and had the not enough problem of thermal diffusivity, made the PCB board obtain timely heat dissipation, thereby prolonged the life of PCB board.

The heat-radiating fins are formed by welding the heat-conducting strips in a net-shaped staggered manner, so that the heat conduction area is increased, and heat conduction is facilitated;

through the arrangement of the first through hole and the second through hole, a second screw can be conveniently inserted, so that the heat dissipation fin can be conveniently disassembled and assembled;

through the arrangement of the heat dissipation holes, the heat can be blown out conveniently, and the heat dissipation speed is improved;

through setting up silica gel, improved the thermal diffusivity between chip and the conducting strip to help the thermal diffusivity of double-deck PCB board body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the heat dissipation fin of the present invention;

fig. 3 is a schematic view of the top view structure of the heat dissipation fin of the present invention.

In the figure: 1. a support frame; 2. a first screw; 3. a double-layer PCB body; 4. a chip; 5. a heat conductive sheet; 6. a heat conducting plate; 7. a second screw; 8. an elastic clip; 9. a heat dissipating fin; 10. a drive motor; 11. a fan blade; 12. a heat conducting strip; 13. a first through hole; 14. a second through hole; 15. heat dissipation holes; 16. silica gel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-3, a high heat dissipation double-layer PCB assembly includes a support frame 1, a double-layer PCB body 3 is fixedly connected to the top of the support frame 1 through a first screw 2, the bottom of the double-layer PCB body 3 is embedded in the inner cavity of the support frame 1, wherein the bottom is 0.5 cm lower than the bottom edge of the support frame 1, which facilitates the electrical connection of the bottom chip set, chips 4 are integrally and electrically welded to both sides of the top of the double-layer PCB body 3, a heat-conducting fin 5 is bonded to the top of each chip 4, a heat-conducting plate 6 is integrally welded to one side of each heat-conducting fin 5, an elastic clamping piece 8 is fixedly connected to one side of each heat-conducting plate 6 away from the heat-conducting fin 5 through a second screw 7, a heat-dissipating fin 9 is integrally welded to one side of each elastic clamping piece 8 away from the heat-conducting fin 5, and the heat-dissipating plate 6, the heat conduction is improved, the equal fixed mounting in both sides at the 1 back of carriage has driving motor 10, driving motor 10's quantity is two, two driving motor 10 establish ties each other through the wire, driving motor 10's output shaft runs through carriage 1 and extends to carriage 1's inner chamber fixedly connected with fan 11, through conducting strip 5, heat-conducting plate 6 and elastic clamping piece 8, conduct the heat that double-deck PCB board body 3 produced on radiating fin 9, then drive fan 11 through driving motor 10, blow away the heat, thereby the PCB board thermal diffusivity has been improved, the problem that current PCB board has the thermal diffusivity not enough is solved, make the PCB board obtain timely heat dissipation, thereby the life of PCB board has been prolonged.

In this embodiment, specifically, the heat dissipating fins 9 are formed by welding the heat conducting strips 12 in a mesh-like staggered manner, and the heat dissipating fins 9 are formed by welding the heat conducting strips 12 in a mesh-like staggered manner, so that the area of heat conduction is increased, and heat conduction is facilitated.

In this embodiment, specifically, first through-hole 13 has been seted up on the surface of heat-conducting plate 6, and second through-hole 14 has been seted up to the inner chamber of elastic clamping piece 8 and the position that corresponds with first through-hole 13, and first through-hole 13 and second through-hole 14 and the bottom that extends to elastic clamping piece 8 are run through in proper order to the bottom of second screw 7, through setting up first through-hole 13 and second through-hole 14, make things convenient for penetrating of second screw 7 to make things convenient for radiating fin 9's dismouting.

In this embodiment, specifically, the front surface of the supporting frame 1 is provided with the heat dissipation holes 15, the number of the heat dissipation holes 15 is not less than four, and the heat dissipation holes 15 are arranged to facilitate blowing out of heat and improve the heat dissipation speed.

In this embodiment, specifically, the bottom of the heat conducting strip 5 is bonded to the joint of the chip 4 through the silica gel 16, and by providing the silica gel 16, the heat dissipation performance between the chip 4 and the heat conducting strip 5 is improved, so that the heat dissipation performance of the double-layer PCB body 3 is facilitated, and the silica gel 16 is made of heat dissipation resin.

During the use, double-deck PCB board body 3 can produce the heat, conduct the heat on heat-conducting plate 6 through conducting strip 5, conducting strip 5 conducts the heat on radiating fin 9, heat-conducting plate 6, the material of conducting strip 5 and elasticity clamping piece 8 is copper, metal material that heat dispersion such as aluminium or nickel is good, the thermal conduction has been improved, driving motor 10 drives fan piece 11 and rotates, blow away the heat on radiating fin 9, thereby the heat dispersion has been improved, first screw 2 makes things convenient for the dismouting between double-deck PCB board body 3 and the carriage 1, second screw 7 penetrates in first through-hole 13 and second through-hole 14, and threaded connection between the nut, radiating fin 9 dismouting has been made things convenient for.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high radiating double-deck PCB board subassembly, includes carriage (1), its characterized in that: the top of the supporting frame (1) is fixedly connected with a double-layer PCB body (3) through a first screw (2), both sides of the top of the double-layer PCB body (3) are integrally and electrically welded with a chip (4), the bottom of the double-layer PCB body (3) is embedded in the inner cavity of the supporting frame (1), the top of the chip (4) is bonded with a heat conducting fin (5), one side of the heat conducting fin (5) is integrally welded with a heat conducting plate (6), one side of the heat conducting plate (6) far away from the heat conducting fin (5) is fixedly connected with an elastic clamping piece (8) through a second screw (7), radiating fins (9) are integrally welded on one side of the elastic clamping piece (8) far away from the heat conducting strip (5), the two sides of the back surface of the supporting frame (1) are fixedly provided with driving motors (10), an output shaft of the driving motor (10) penetrates through the supporting frame (1) and extends to an inner cavity of the supporting frame (1) to be fixedly connected with the fan blade (11).

2. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the radiating fins (9) are formed by welding heat conducting strips (12) in a net shape in a staggered mode.

3. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: first through-hole (13) have been seted up on the surface of heat-conducting plate (6), second through-hole (14) have been seted up to the inner chamber of elasticity clamping piece (8) and the position that corresponds with first through-hole (13), the bottom of second screw (7) runs through first through-hole (13) and second through-hole (14) in proper order and extends to the bottom of elasticity clamping piece (8).

4. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the front surface of the supporting frame (1) is provided with heat dissipation holes (15), and the number of the heat dissipation holes (15) is not less than four.

5. The high heat dissipation double-layer PCB board assembly of claim 1, wherein: the bottom of the heat conducting fin (5) is bonded with the joint of the chip (4) through silica gel (16).