CN103384442A - Heat conducting structure with electronic power element adhered on circuit board - Google Patents
Heat conducting structure with electronic power element adhered on circuit board Download PDFInfo
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- CN103384442A CN103384442A CN2013100810358A CN201310081035A CN103384442A CN 103384442 A CN103384442 A CN 103384442A CN 2013100810358 A CN2013100810358 A CN 2013100810358A CN 201310081035 A CN201310081035 A CN 201310081035A CN 103384442 A CN103384442 A CN 103384442A
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Abstract
The invention belongs to the technical field of radiation of electronic product power elements, and relates to a heat conducting structure with an electronic power element adhered on a circuit board. The heat conducting structure comprises the circuit board and the electronic power element adhered on the circuit board, a through hole is formed in the circuit board covered by the bottom plane of the electronic power element, a heat conducting column is arranged on the circuit board, and one end of the heat conducting column penetrates through the through hole to be in contact with the bottom plane of the electronic power element. The heat conducting structure with the electronic power element adhered on the circuit board has the advantages that after electronic product power elements of various models are connected with the circuit board, heat produced when the power elements work can be well conducted outside the casing, and a good normal working environment of the power element is ensured. The heat conducting structure with the electronic power element adhered on the circuit board is applied to connection of the electronic power elements of various models, the circuit board and the casing.
Description
Technical field
The invention belongs to the technical field of electronic product power component heat radiation, refer in particular to a kind of electronic power components and parts and mount in the circuit board conductive structure.
Background technology:
The work of power-type electronic product the time all can produce certain heat, and the power component of the product that power is larger need to add radiator (heat carrier) auxiliary heat dissipation (the electronic product power component heat radiation described of this patent all refers to add radiator and carries out auxiliary heat dissipation).
The electronic product power component is divided into two kinds of straight cutting and surface mount (SMT) by installation form.Referring to Fig. 7-Figure 10: pin 51 direct insertion power component 5(TO-220) is that the pad eyelet welding that will pass wiring board 4 connects, usually the straight cutting power component main body outside pin 51 will be separated with wiring board 4, be close to heat radiation by connecting portion 52 and various Heat Conduction Materials 6 again, straight cutting power component packing forms has TO-220, T0-247, TO-3P etc.
The packing forms of SMD power components and parts has TO-252, TO-263, TO-266AA etc.TO252 and TO263 use at present many surface mount encapsulation (referring to Fig. 3-Fig. 5).Wherein TO-252 is referred to as again D-PAK, and TO-263 is referred to as again D2PAK.The MOSFET of D-PAK encapsulation has 3 electrodes: grid (G) 13, drain electrode (D) and source electrode (S) 14.Wherein the pin of drain electrode (D) cut off need not, but use the heating panel 12 on baseplane 19 to do drain electrode (D), directly be welded on wiring board 4a, be used for exporting on the one hand large electric current, on the one hand by wiring board 4a heat radiation.So the D-PAK pad of wiring board has three places (A, B, C), the pad A of drain electrode (D) is larger.SO-8 adopts Plastic Package, there is no radiating bottom plate, dispels the heat bad, generally is used for small-power MOSFET.SO-8 is that at first PHILIP company develops, and derives gradually later on TSOP (thin little outline packages), VSOP (very little outline packages), the standard specifications such as SSOP (scaled-down version SOP), TSSOP (thin scaled-down version SOP).In several encapsulation specifications of these derivations, TSOP and TSSOP are usually used in the MOSFET encapsulation.
Novel electronic product adopts SMD components and parts (SMD) and surface mount (SMT) mostly, and SMD device size is little, can two-sidedly mount, packing density is large, and high frequency performance is good, lightweight, easily be automated, enhance productivity, reduce costs.But it has a shortcoming: because its package dimension is little, radiating condition is poor for some power devices or the large device of dissipation power.Two kinds of radiating modes are arranged at present: the one, utilize the copper that covers on wiring board 4 to dispel the heat, but the radiating condition that covers copper on wiring board 4 is very poor, can only be for the very little device of power.Another kind is to dispel the heat with metal substrate (as aluminium base and copper base) or ceramic substrate, single-side metal-based plate or ceramic substrate can not two-sided mount components, packing density diminishes, and the reasonable single-side metal-based plate of heat conduction or ceramic substrate price comparison are high, double-sided metal substrate or ceramic substrate processing technology are complicated, substrate can not with other heat sink material thermal contact conductance such as shell.
Summary of the invention
The purpose of this invention is to provide a kind of heat transfer efficiency high, be applicable to the electronic power components and parts and mount in the circuit board conductive structure.
The object of the present invention is achieved like this:
The electronic power components and parts mount conductive structure in the circuit board, comprise wiring board and mount in the circuit board electronic power components and parts, be provided with through hole on the wiring board that the baseplane of electronic power components and parts covers, be provided with heating column, an end of heating column passes through hole and contacts with the baseplane of described electronic power components and parts.
Above-mentioned heating column is provided with insulation film with the end surfaces that the baseplane of described electronic power components and parts contacts.
The form that above-mentioned insulation film is arranged to cap or cover is enclosed within the outer surface that described heating column passes described throughhole portions.
Above-mentioned heating column is that metal or nonmetallic Heat Conduction Material with excellent heat conductivity are made.
The length of above-mentioned heating column is greater than the thickness of described wiring board.
The other end of above-mentioned heating column stretches out outside described through hole and is connected or close contact with shell.
Above-mentioned through-hole wall is board substrate body insulating material.
Above-mentioned through hole is circular port or slotted eye or polygonal hole or faces the hole that is combined into arcwall face directly.
The area of above-mentioned through hole is less than the surface area of the baseplane of electronic power components and parts.
Above-mentioned electronic power components and parts have three pads and wiring board welding at least.
Above-mentioned wiring board is common insulated substrate.
The surrounding of the baseplane of above-mentioned electronic power components and parts is provided with three or four strong points on the wiring board that is supported on the through hole side at least.
Above-mentioned electronic power components and parts have corresponding welding between relative two and wiring board at least.
The present invention's outstanding and useful technique effect compared to existing technology is:
1, with after wiring board is connected, the heat that produces in the time of all preferably the electronic power components and parts being worked is delivered to outside housing, guarantee that the normal operation circumstances of power device is good, and cost is low with the electronic power components and parts in the present invention, and assembling is simple, and thermal conductivity is good.
2, of the present invention simple in structure, be convenient to realize, be applicable to the syndeton of electronic power components and parts and wiring board and the housing of various models.
Description of drawings
Fig. 1 is structure principle chart of the present invention.
Fig. 2 is the partial structurtes enlarged drawing after punching on wiring board of the present invention.
Fig. 3 is the schematic perspective view of electronic power components and parts of the present invention.
Fig. 4 is the front view of electronic power components and parts of the present invention.
Fig. 5 is the layout of the pad on the wiring board of the electronic power components and parts in background technology.
Fig. 6 is the pad of electronic power components and parts of the present invention and wiring board and the schematic diagram of the strong point.
Fig. 7 is the front view of the TO220 encapsulation of electronic power components and parts in background technology.
Fig. 8 is the back side schematic perspective view of the TO220 encapsulation of electronic power components and parts in background technology.
Fig. 9 is the schematic perspective view that in background technology, electronic power components and parts 5 are connected with wiring board 4 and Heat Conduction Material 6: the horizontally-mounted mounting means of this straight cutting, in fact require the main body of electronic power components and parts 5 to expose wiring board, mounting process is complicated, and production cost is high.
Figure 10 is the schematic perspective view that in background technology, electronic power components and parts 5 are connected with wiring board 4 and Heat Conduction Material 6: the electronic power components and parts 5 of the vertical installation of this straight cutting require to stand on wiring board, take up room large, and radiating effect is bad.
Embodiment
The invention will be further described with specific embodiment below in conjunction with accompanying drawing, referring to Fig. 1-Fig. 4, Fig. 6:
The electronic power components and parts mount conductive structure in the circuit board, comprise wiring board 4 and be mounted on electronic power components and parts 1 on wiring board 4, be provided with through hole 41 on the wiring board 4 that the baseplane 19 of electronic power components and parts 1 covers, be provided with heating column 2, an end of heating column 2 passes through hole 41 and contacts with the baseplane 19 of described electronic power components and parts 1.
Above-mentioned heating column 2 is provided with insulation film 3 with the end surfaces that the baseplane 19 of described electronic power components and parts 1 contacts.
The form that above-mentioned insulation film 3 is arranged to cap or cover is enclosed within the outer surface that described heating column 2 passes described through hole 41 parts.
Above-mentioned heating column 2 is that metal or nonmetallic Heat Conduction Material with excellent heat conductivity are made.
The length of above-mentioned heating column 2 is greater than the thickness of described wiring board 4.
The other end of above-mentioned heating column 2 stretches out outside described through hole 41 and is connected or close contact with shell 6.
Above-mentioned through hole 41 inwalls are board substrate body insulating material.
Above-mentioned through hole 41 is for circular port or slotted eye or polygonal hole or face the hole that is combined into arcwall face directly, and described polygonal hole is such as triangle, quadrilateral hole, pentagon hole, hexagonal hole etc. are arranged.
The area of above-mentioned through hole 41 is less than the surface area of the baseplane 19 of electronic power components and parts 1.
Above-mentioned electronic power components and parts 1 have the welding of three pads and wiring board at least, and for example the pad on weld part 11, grid (G) 13,14 3 pads of source electrode (S) and the wiring board of heating panel 12 extend outwards at electronic power components and parts 1 drain electrode (D) back side welds.
Above-mentioned wiring board 4 is common insulated substrate.
The surrounding of the baseplane 19 of above-mentioned electronic power components and parts 1 is provided with three or four strong points (15,16,17,18) on the wiring board 4 that is supported on through hole 41 sides at least.
Above-mentioned electronic power components and parts 1 have corresponding welding between relative two (11 and 13 and 14) and wiring board 4 at least.
Above-described embodiment is only preferred embodiment of the present invention, is not to limit according to this protection scope of the present invention, therefore: all equivalences of doing according to structure of the present invention, shape, principle change, within all should being covered by protection scope of the present invention.
Claims (13)
1. the electronic power components and parts mount conductive structure in the circuit board, comprise wiring board and mount in the circuit board electronic power components and parts, it is characterized in that: be provided with through hole on the wiring board that the baseplane of electronic power components and parts covers, be provided with heating column, an end of heating column passes through hole and contacts with the baseplane of described electronic power components and parts.
2. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described heating column is provided with insulation film with the end surfaces that the baseplane of described electronic power components and parts contacts.
3. electronic power components and parts according to claim 2 mount conductive structure in the circuit board, it is characterized in that: the form that described insulation film is arranged to cap or cover is enclosed within the outer surface that described heating column passes described throughhole portions.
4. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described heating column is that metal or nonmetallic Heat Conduction Material with excellent heat conductivity are made.
5. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: the length of described heating column is greater than the thickness of described wiring board.
6. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: the other end of described heating column stretches out outside described through hole and is connected or close contact with shell.
7. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described through-hole wall is board substrate body insulating material.
8. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described through hole is circular port or slotted eye or polygonal hole or faces the hole that is combined into arcwall face directly.
9. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: the area of described through hole is less than the surface area of the baseplane of electronic power components and parts.
10. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described electronic power components and parts have three pads and wiring board welding at least.
11. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described wiring board is common insulated substrate.
12. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: the surrounding of the baseplane of described electronic power components and parts is provided with three or four strong points on the wiring board that is supported on the through hole side at least.
13. electronic power components and parts according to claim 1 mount conductive structure in the circuit board, it is characterized in that: described electronic power components and parts have corresponding welding between relative two and wiring board at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100810358A CN103384442A (en) | 2013-03-13 | 2013-03-13 | Heat conducting structure with electronic power element adhered on circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100810358A CN103384442A (en) | 2013-03-13 | 2013-03-13 | Heat conducting structure with electronic power element adhered on circuit board |
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| CN103384442A true CN103384442A (en) | 2013-11-06 |
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| CN2013100810358A Pending CN103384442A (en) | 2013-03-13 | 2013-03-13 | Heat conducting structure with electronic power element adhered on circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101613A (en) * | 2014-11-19 | 2015-11-25 | 芜湖蓝宙电子科技有限公司 | Method for improving heat conduction capability of printed board of surface-mounted device |
| CN109803483A (en) * | 2017-11-16 | 2019-05-24 | 大陆汽车有限公司 | Electronic module |
| CN113784590A (en) * | 2021-09-06 | 2021-12-10 | 无锡华测电子系统有限公司 | Tile type TR assembly device, external heat dissipation structure and rework structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
| CN201758491U (en) * | 2010-05-12 | 2011-03-09 | 珠海市荣盈电子科技有限公司 | High heat-conducting circuit board manufactured by oil printing method |
| CN201916765U (en) * | 2011-01-06 | 2011-08-03 | 黄柱联 | Lamp with multiple independent LED luminous unit systems |
| CN203251500U (en) * | 2013-03-13 | 2013-10-23 | 陈夏新 | Heat conduction structure of mounting electronic power element on circuit board |
-
2013
- 2013-03-13 CN CN2013100810358A patent/CN103384442A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1913763A (en) * | 2006-08-04 | 2007-02-14 | 华为技术有限公司 | Thermal rubber heat sink and its manufacturing method and circuit board and its manufacturing method |
| CN201758491U (en) * | 2010-05-12 | 2011-03-09 | 珠海市荣盈电子科技有限公司 | High heat-conducting circuit board manufactured by oil printing method |
| CN201916765U (en) * | 2011-01-06 | 2011-08-03 | 黄柱联 | Lamp with multiple independent LED luminous unit systems |
| CN203251500U (en) * | 2013-03-13 | 2013-10-23 | 陈夏新 | Heat conduction structure of mounting electronic power element on circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101613A (en) * | 2014-11-19 | 2015-11-25 | 芜湖蓝宙电子科技有限公司 | Method for improving heat conduction capability of printed board of surface-mounted device |
| CN109803483A (en) * | 2017-11-16 | 2019-05-24 | 大陆汽车有限公司 | Electronic module |
| CN109803483B (en) * | 2017-11-16 | 2022-05-10 | 大陆汽车有限公司 | Electronic module |
| CN113784590A (en) * | 2021-09-06 | 2021-12-10 | 无锡华测电子系统有限公司 | Tile type TR assembly device, external heat dissipation structure and rework structure |
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| ASS | Succession or assignment of patent right |
Owner name: WENZHOU SANLI ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHEN XIAXIN Effective date: 20140825 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 317500 TAIZHOU, ZHEJIANG PROVINCE TO: 325025 WENZHOU, ZHEJIANG PROVINCE |
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Effective date of registration: 20140825 Address after: 325025, D3 building, No. three, No. 311, Jinhai Road, Wenzhou economic and Technological Development Zone, Zhejiang, five Applicant after: Wenzhou Sanli Electronic Technology Co., Ltd. Address before: 317500, Zhejiang Province, Taizhou city Wenling city pine door town No. 499 cross door Applicant before: Chen Xiaxin |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20131106 |
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| RJ01 | Rejection of invention patent application after publication |