CN220629651U - Small-size heat dissipation circuit board - Google Patents
Small-size heat dissipation circuit board Download PDFInfo
- Publication number
- CN220629651U CN220629651U CN202322299866.4U CN202322299866U CN220629651U CN 220629651 U CN220629651 U CN 220629651U CN 202322299866 U CN202322299866 U CN 202322299866U CN 220629651 U CN220629651 U CN 220629651U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- heat dissipation
- substrate
- carbon fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 16
- 239000004917 carbon fiber Substances 0.000 claims abstract description 16
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000741 silica gel Substances 0.000 claims abstract description 13
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000003990 capacitor Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims 2
- 239000010439 graphite Substances 0.000 claims 2
- -1 graphite alkene Chemical class 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 10
- 229910021389 graphene Inorganic materials 0.000 abstract description 10
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a small-sized heat dissipation circuit board, which relates to the technical field of circuit boards and comprises a substrate, wherein the substrate consists of a graphene layer, a carbon fiber layer, a copper aluminum plate layer and a silica gel sheet layer, the carbon fiber layer is adhered to the bottom end of the graphene layer, the copper aluminum plate layer is adhered to the bottom end of the carbon fiber layer, the silica gel sheet layer is adhered to the bottom end of the copper aluminum plate layer, a heat dissipation plate is arranged on the bottom end surface of the substrate through a heat conduction assembly, and a plurality of heat dissipation fins are arranged on the surface of the heat dissipation plate.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a small-sized heat dissipation circuit board.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc., which make circuits miniaturized, visualized, play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and may be referred to as printed circuit boards or printed circuit boards.
Based on the above, the present inventors found that the following problems exist: the heat dissipation of the circuit board is poor, the heat dissipation of the circuit board can be optimized by means of heat dissipation, the auxiliary part of the circuit board in the prior art is complex in structure, the heat dissipation is general, and the heat dissipation of the circuit board is difficult to optimize.
Accordingly, the present utility model has been made in view of the above circumstances, and an object of the present utility model is to provide a small-sized heat dissipating circuit board which has a higher practical value.
Disclosure of Invention
The utility model discloses a small-sized heat dissipation circuit board, which is realized by the following specific technical means:
the utility model provides a small-size heat dissipation circuit board, includes the base plate, the base plate comprises graphene layer, carbon fiber layer, copper aluminium sheet layer and silica gel sheet layer, carbon fiber layer has been bonded to the bottom on graphene layer, copper aluminium sheet layer has been bonded to the bottom on carbon fiber layer, just copper aluminium sheet layer's bottom has been bonded to the bottom, the heating panel is installed through heat conduction subassembly to the bottom face of base plate, just the surface of heating panel is equipped with a plurality of heat radiation fins.
Furthermore, a fixing frame is arranged between the heat dissipation plate and the substrate, and a heat dissipation fan is embedded and arranged on the surface of the fixing frame.
Further, a capacitor is mounted on the surface of the other side of the substrate, a high-frequency chip is mounted on one side of the capacitor, a wiring terminal is mounted on the edge of one side of the substrate, and an interface row is mounted on one side of the wiring terminal.
Further, the bottom end face of the heat dissipation plate is provided with a groove, a driving motor is arranged in the groove, a cutting rod is sleeved on the output end of the driving motor, a hairbrush is arranged on the surface of the cutting rod, and the hairbrush is attached to the bottom end face of the heat dissipation plate.
Further, vibration reduction feet are mounted at four corners of the bottom end of the base plate, and silica gel mats are adhered to the surfaces of the vibration reduction feet.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the substrate body has higher heat dissipation effect through the graphene layer, the carbon fiber layer, the copper aluminum plate layer and the silica gel sheet layer, and meanwhile, the heat generated by the circuit board is further dissipated through the heat dissipation plate and the heat dissipation fins through the heat conduction assembly, so that the overall heat dissipation effect is improved; through the design of the cooling fan, the air fluidity between the cooling plate and the substrate can be accelerated, and then the heat dissipation between the cooling plate and the substrate can be accelerated, so that the overall heat dissipation is improved; through the design of motor cooperation brush and cutting the pole, when the bottom of heating panel attached dust, can start the motor and work, when the motor under operating condition, can drive and cut the pole and rotate to clean the dust that will attach in the heating panel bottom, and then improve holistic heat dispersion.
Drawings
Fig. 1 is a schematic perspective view of a small heat dissipating circuit board according to the present utility model.
Fig. 2 is a schematic view of the back side of a small heat dissipating circuit board according to the present utility model.
Fig. 3 is a schematic view of the internal structure of a small heat dissipating circuit board substrate according to the present utility model.
Fig. 4 is a schematic plan view of a small heat dissipating circuit board according to the present utility model.
In the figure, the correspondence between the component names and the drawing numbers is:
1. a substrate; 2. a high frequency chip; 3. a capacitor; 4. a connection terminal; 5. an interface row; 6. a heat conducting component; 7. a heat dissipation plate; 8. a heat radiation fin; 9. a fixing frame; 10. a heat radiation fan; 11. a driving motor; 12. cutting the rod; 13. a brush; 101. a graphene layer; 102. a carbon fiber layer; 103. a copper aluminum plate layer; 104. a silicone sheet layer.
Detailed Description
Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.
In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Examples:
as shown in fig. 1 to 4:
the utility model provides a small-sized heat dissipation circuit board, which comprises a substrate 1, wherein the substrate 1 consists of a graphene layer 101, a carbon fiber layer 102, a copper aluminum plate layer 103 and a silica gel sheet layer 104, the bottom end of the graphene layer 101 is adhered with the carbon fiber layer 102, the bottom end of the carbon fiber layer 102 is adhered with the copper aluminum plate layer 103, the bottom end of the copper aluminum plate layer 103 is adhered with the silica gel sheet layer 104, the bottom end surface of the substrate 1 is provided with a heat dissipation plate 7 through a heat conduction assembly 6, the surface of the heat dissipation plate 7 is provided with a plurality of heat dissipation fins 8, the substrate 1 body has higher heat dissipation effect through the graphene layer 101, the carbon fiber layer 102, the copper aluminum plate layer 103 and the silica gel sheet layer 104, and meanwhile, heat generated by the circuit board is further dissipated through the heat dissipation plate 7 and the heat dissipation fins 8 through the heat conduction assembly, so that the overall heat dissipation effect is improved.
Wherein, install mount 9 between heating panel 7 and the base plate 1, just the surface of mount 9 inlays and establishes and install radiator fan 10, through radiator fan 10's design, can accelerate the air flowability between heating panel 7 and the base plate 1, and then can accelerate the heat evacuation between the two, makes holistic thermal diffusivity to improving.
The capacitor 3 is mounted on the other side surface of the substrate 1, the high-frequency chip 2 is mounted on one side of the capacitor 3, the wiring terminal 4 is mounted at the edge of one side of the substrate 1, and the interface row 5 is mounted on one side of the wiring terminal 4.
Wherein, the bottom face of heating panel 7 is equipped with the recess, be equipped with driving motor 11 in the recess, the cover is equipped with on driving motor 11's the output and cuts the pole 12, cut the surface of pole 12 and be equipped with brush 13, just brush 13 is laminated mutually with the bottom face of heating panel 7, cooperates brush 13 and cuts the design of pole 12 through motor 11, when the bottom of heating panel 7 adheres to the dust, can start motor 11 and work, under the operating condition, can drive and cut pole 12 and rotate to clean the dust that will adhere to the heating panel 7 bottom, and then improve holistic heat dispersion.
The vibration reduction feet are arranged at four corners of the bottom end of the base plate 1, the silica gel pad is adhered to the surface of the vibration reduction feet, and the shaking performance between the circuit board and the machine body can be reduced through the design of the vibration reduction feet.
Specific use and action of the embodiment:
before the circuit board is installed, the whole integrity is detected by electrifying, after the circuit board is assembled at a required position through the vibration reduction foundation, the graphene layer 101, the carbon fiber layer 102, the copper aluminum plate layer 103 and the silica gel sheet layer 104 enable the substrate 1 body to have a higher heat dissipation effect, meanwhile, the heat generated by the circuit board is further dissipated through the heat dissipation plate 7 and the heat dissipation fins 8 through the heat conduction assembly, the whole heat dissipation effect is improved, and the air flowability between the heat dissipation plate 7 and the substrate 1 can be accelerated through the design of the heat dissipation fan 10, so that the heat dissipation between the heat dissipation plate 7 and the substrate 1 can be accelerated, and the whole heat dissipation performance is improved; finally, through the design of motor 11 cooperation brush 13 and cut the pole 12, when the bottom attached dust of heating panel 7, can start motor 11 and work, when motor 11 under operating condition, can drive and cut the pole 12 and rotate to clean the dust that will attach in the heating panel 7 bottom, and then improve holistic heat dispersion.
The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (5)
1. A small-sized heat dissipation circuit board comprising a substrate (1), characterized in that: base plate (1) comprises graphite alkene layer (101), carbon fiber layer (102), copper aluminum plate layer (103) and silica gel sheet layer (104), carbon fiber layer (102) have been bonded to the bottom of graphite alkene layer (101), copper aluminum plate layer (103) have been bonded to the bottom of carbon fiber layer (102), just the bottom of copper aluminum plate layer (103) has bonded silica gel sheet layer (104), heating panel (7) are installed through heat conduction subassembly (6) to the bottom face of base plate (1), just the surface of heating panel (7) is equipped with a plurality of radiator fins (8).
2. A miniature heat dissipating circuit board as set forth in claim 1, wherein: a fixing frame (9) is arranged between the heat radiation plate (7) and the substrate (1), and a heat radiation fan (10) is embedded on the surface of the fixing frame (9).
3. A miniature heat dissipating circuit board as set forth in claim 1, wherein: the capacitor (3) is installed on the surface of the other side of the substrate (1), the high-frequency chip (2) is installed on one side of the capacitor (3), the wiring terminal (4) is installed at the edge of one side of the substrate (1), and the interface row (5) is installed on one side of the wiring terminal (4).
4. A miniature heat dissipating circuit board as set forth in claim 1, wherein: the bottom end face of heating panel (7) is equipped with the recess, be equipped with driving motor (11) in the recess, the cover is equipped with on driving motor's (11) the output and cuts pole (12), the surface of cutting pole (12) is equipped with brush (13), just brush (13) are laminated mutually with the bottom end face of heating panel (7).
5. A miniature heat dissipating circuit board as set forth in claim 1, wherein: vibration reduction feet are mounted at four corners of the bottom end of the base plate (1), and silica gel mats are adhered to the surfaces of the vibration reduction feet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322299866.4U CN220629651U (en) | 2023-08-25 | 2023-08-25 | Small-size heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322299866.4U CN220629651U (en) | 2023-08-25 | 2023-08-25 | Small-size heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220629651U true CN220629651U (en) | 2024-03-19 |
Family
ID=90211852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322299866.4U Active CN220629651U (en) | 2023-08-25 | 2023-08-25 | Small-size heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220629651U (en) |
-
2023
- 2023-08-25 CN CN202322299866.4U patent/CN220629651U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |