CN210671155U - Circuit board convenient to heat dissipation - Google Patents
Circuit board convenient to heat dissipation Download PDFInfo
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- CN210671155U CN210671155U CN201921878278.3U CN201921878278U CN210671155U CN 210671155 U CN210671155 U CN 210671155U CN 201921878278 U CN201921878278 U CN 201921878278U CN 210671155 U CN210671155 U CN 210671155U
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- heat dissipation
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Abstract
The utility model relates to a circuit board field especially relates to a circuit board convenient to heat dissipation, including circuit board body, heat dissipation buffering base, the mounting groove has been seted up to heat dissipation buffering base, mounting groove connection is in the circuit board body, circuit board body side has all coated heat dissipation coating, buffering subassembly is all installed to circuit board body side, heat dissipation buffering base side all install with buffering subassembly assorted recess, heat dissipation buffering base is provided with radiator fan, circuit board body still from up including installing layer, articulamentum, heat dissipation layer, base plate layer down in proper order, the installing layer bottom is connected with a plurality of spliced pole, the spliced pole cover is equipped with first buffer spring, the heat dissipation layer sinters in the articulamentum top. The utility model provides a radiating circuit board of being convenient for of radiating effect is good, long service life.
Description
Technical Field
The utility model relates to a circuit board field especially relates to a circuit board convenient to heat dissipation.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The existing circuit board can generate certain heat when in work, so that the temperature inside the equipment rises rapidly, if the heat is not distributed out in time, the circuit board can continuously rise, the device can lose efficacy due to overheating, the reliability of the electronic equipment can be reduced, the service life is short, and the practicability is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a radiating circuit board of being convenient for of radiating effect is good, long service life.
The utility model adopts the following technical scheme:
the utility model provides a circuit board convenient to heat dissipation, includes circuit board body, heat dissipation buffering base, the mounting groove has been seted up to heat dissipation buffering base, mounting groove connection is in the circuit board body, circuit board body side has all coated and has the heat dissipation coating, buffering subassembly is all installed to circuit board body side, heat dissipation buffering base side all install with buffering subassembly assorted recess, heat dissipation buffering base is provided with radiator fan, circuit board body still from up including installation layer, articulamentum, heat dissipation layer, base plate layer down in proper order, the installation layer bottom is connected with a plurality of spliced pole, the spliced pole cover is equipped with first buffer spring, the sintering of heat dissipation layer is in the articulamentum top.
The technical scheme is further improved in that the heat dissipation coating is one of a nano ceramic coating or a graphene coating.
The further improvement of the technical scheme is that the buffer assembly comprises a support base, a support connected to the support base and second buffer springs respectively connected to three sides of the support, and the support base is arranged on the side edge of the circuit board body through gluing.
In a further improvement of the above technical solution, the connection layer is made of copper or silver.
The technical proposal is further improved in that the heat dissipation layer is a ceramic layer.
The utility model has the advantages that:
1. the utility model comprises a circuit board body and a heat dissipation buffer base, wherein the heat dissipation buffer base is provided with a mounting groove, the mounting groove is connected with the circuit board body, the side edge of the circuit board body is coated with heat dissipation coating, the side edge of the circuit board body is provided with a buffer component, the side edge of the heat dissipation buffer base is provided with a groove matched with the buffer component, the heat dissipation buffer base is provided with a heat dissipation fan, the circuit board body sequentially comprises a mounting layer, a connecting layer, a heat dissipation layer and a substrate layer from bottom to top, the bottom of the mounting layer is connected with a plurality of connecting columns, the connecting columns are sleeved with first buffer springs, the heat dissipation layer is sintered above the connecting layer, the heat dissipation fan and the first buffer springs are arranged on the heat dissipation buffer base, the heat dissipation fan can be externally connected with a power supply, the radiating effect of circuit board body is further improved, and the ability of bearing the impact has been improved moreover, has further improved life, simultaneously to the heat dissipation layer sintering in the back of articulamentum, the operation process of sintering technology is simple, makes heat dissipation layer and articulamentum more firm fixed together, and the heat dissipation layer of addding has strengthened the thermal diffusivity and the heat dissipation volume of base plate, makes the better radiating away of heat, improves the radiating effect of circuit board body, improves life.
2. The heat dissipation coating is one of nano ceramic coating or graphene coating, so that the heat dissipation effect of the circuit board body is further improved, and the service life is effectively prolonged.
3. Buffering subassembly is including supporting the base, connecting support on supporting the base, connecting respectively in the second buffer spring of the three side of support, supports the base and passes through the rubber coating and set up in circuit board body side, effectively alleviates vertical and horizontal impact force, realizes buffering shock attenuation effect, has avoided causing the circuit board damage because of vibrations, further improves the utility model discloses a life.
4. The tie layer is made by copper or silver, makes heat dissipation layer and tie layer more firm fixed together, and the heat dissipation layer of addding has strengthened the thermal diffusivity and the heat dissipation volume of base plate, makes the better sending out of heat, further improves life.
5. The heat dissipation layer is the ceramic layer, further does benefit to thermal giving off, effectively improves the utility model discloses a radiating effect, the practicality is strong.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a partial enlarged view of the present invention.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention.
As shown in fig. 1-2, a circuit board convenient to heat dissipation, including circuit board body, heat dissipation buffering base 110, mounting groove 115 has been seted up to heat dissipation buffering base 110, mounting groove 115 is connected in the circuit board body, circuit board body side all coats and has heat dissipation coating 120, buffering subassembly 130 is all installed to circuit board body side, heat dissipation buffering base 110 side all installs and cushions subassembly 130 assorted recess 111, heat dissipation buffering base 110 is provided with radiator fan 112, the circuit board body still from up including installing layer 140, articulamentum 150, heat dissipation layer 160, base plate layer 170 down in proper order, installing layer 140 bottom is connected with a plurality of spliced pole 113, the spliced pole 113 cover is equipped with first buffer spring 114, heat dissipation layer 160 sinters in the articulamentum 150 top.
The heat dissipation coating 120 is one of a nano ceramic coating or a graphene coating, so that the heat dissipation effect of the circuit board body is further improved, and the service life is effectively prolonged.
The connecting layer 150 is made of copper or silver, so that the heat dissipation layer 160 and the connecting layer 150 are fixed more firmly, and the added heat dissipation layer 160 enhances the heat dissipation performance and the heat dissipation volume of the substrate, so that heat is better dissipated, and the service life is further prolonged.
The heat dissipation layer 160 is the ceramic layer, further does benefit to thermal giving off, effectively improves the utility model discloses a radiating effect, the practicality is strong.
The utility model comprises a circuit board body, a heat dissipation buffer base 110, the heat dissipation buffer base 110 is provided with a mounting groove 115, the mounting groove 115 is connected with the circuit board body, the side of the circuit board body is coated with heat dissipation coating 120, the side of the circuit board body is provided with a buffer component 130, the side of the heat dissipation buffer base 110 is provided with a groove 111 matched with the buffer component 130, the heat dissipation buffer base 110 is provided with a heat dissipation fan 112, the circuit board body sequentially comprises a mounting layer 140, a connecting layer 150, a heat dissipation layer 160 and a substrate layer 170 from bottom to top, the bottom of the mounting layer 140 is connected with a plurality of connecting columns 113, the connecting columns 113 are sleeved with a first buffer spring 114, the heat dissipation layer 160 is sintered above the connecting layer 150, the heat dissipation fan 112 and the first buffer spring 114 are arranged by the heat dissipation buffer base 110, wherein the heat dissipation fan 112, the circuit board body is connected with heat dissipation buffer base 110 and is formed the heat dissipation hole, further improve the radiating effect of circuit board body, and improved the ability of bearing the impact, further prolonged service life, simultaneously to heat dissipation layer 160 sintering in the upper portion of articulamentum 150, sintering process's operation process is simple, make heat dissipation layer 160 and articulamentum 150 more firm fixed together, the heat dissipation layer 160 of addding has strengthened the thermal diffusivity and the heat dissipation volume of base plate, make better the giving off of heat, improve the radiating effect of circuit board body, prolonged service life.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the invention. It should be noted that those skilled in the art will recognize that the invention may be practiced without departing from its spirit or scope. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The utility model provides a circuit board convenient to heat dissipation which characterized in that: including circuit board body, heat dissipation buffering base, the mounting groove has been seted up to heat dissipation buffering base, the mounting groove is connected in the circuit board body, circuit board body side has all been coated with heat dissipation coating, the buffering subassembly is all installed to circuit board body side, heat dissipation buffering base side all install with buffering subassembly assorted recess, heat dissipation buffering base is provided with radiator fan, circuit board body still from up including installation layer, articulamentum, heat dissipation layer, base plate layer down in proper order, the installation layer bottom is connected with a plurality of spliced pole, the spliced pole cover is equipped with first buffer spring, the heat dissipation layer sinters in the articulamentum top.
2. A circuit board for facilitating heat dissipation according to claim 1, wherein: the heat dissipation coating is one of a nano ceramic coating or a graphene coating.
3. A circuit board for facilitating heat dissipation according to claim 1, wherein: the buffer assembly comprises a support base, a support connected to the support base and second buffer springs connected to three sides of the support respectively, and the support base is arranged on the side edge of the circuit board body through gluing.
4. A circuit board for facilitating heat dissipation according to claim 1, wherein: the connection layer is made of copper or silver.
5. A circuit board for facilitating heat dissipation according to claim 1, wherein: the heat dissipation layer is a ceramic layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921878278.3U CN210671155U (en) | 2019-11-01 | 2019-11-01 | Circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921878278.3U CN210671155U (en) | 2019-11-01 | 2019-11-01 | Circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210671155U true CN210671155U (en) | 2020-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921878278.3U Active CN210671155U (en) | 2019-11-01 | 2019-11-01 | Circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210671155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825303A (en) * | 2021-09-30 | 2021-12-21 | 江西技研新阳电子有限公司 | Double-layer circuit board with buffer structure |
-
2019
- 2019-11-01 CN CN201921878278.3U patent/CN210671155U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825303A (en) * | 2021-09-30 | 2021-12-21 | 江西技研新阳电子有限公司 | Double-layer circuit board with buffer structure |
| CN113825303B (en) * | 2021-09-30 | 2023-02-10 | 江西技研新阳电子有限公司 | Double-layer circuit board with buffer structure |
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