CN113825303B - Double-layer circuit board with buffer structure - Google Patents
Double-layer circuit board with buffer structure Download PDFInfo
- Publication number
- CN113825303B CN113825303B CN202111157586.9A CN202111157586A CN113825303B CN 113825303 B CN113825303 B CN 113825303B CN 202111157586 A CN202111157586 A CN 202111157586A CN 113825303 B CN113825303 B CN 113825303B
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- Prior art keywords
- buffer
- circuit board
- side wall
- positioning column
- base
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- 238000005096 rolling process Methods 0.000 claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 230000005484 gravity Effects 0.000 claims abstract description 7
- 238000007493 shaping process Methods 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 230000003139 buffering effect Effects 0.000 description 4
- 239000011435 rock Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Vibration Prevention Devices (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a double-layer circuit board with a buffer structure, wherein the bottom of the circuit board is provided with a base, the bottom of the circuit board is formed with a positioning column, the base is coaxially formed with a buffer groove, the side wall of the buffer groove is provided with a buffer sheet, a plurality of first rolling balls which are positioned at the periphery of the buffer groove and slide back and forth through gravity and inertia are placed in the base, and the buffer groove is provided with a first telescopic mechanism which drives the buffer sheet to extend out of the positioning column; when the vibration or the rocking, first rolling ball can move, wherein one or more first rolling balls move towards the direction of the outer side wall of the buffer slot, after the collision of the first rolling balls of the first telescopic mechanism, the buffer sheet is driven to be attached to the positioning column, the rocking amplitude of the positioning column connected with the circuit board and integrally formed in the buffer slot is greatly reduced, and when the positioning column collides with the buffer sheet, the resonance force can not be generated, so that the structural stability of the circuit board is effectively protected, the heat dissipation performance of the surface of the circuit board is not influenced, and the service life is prolonged.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a double-layer circuit board with a buffer structure.
Background
The PCB circuit board, also called as a printed circuit board or a printed circuit board, mainly comprises a bonding pad, a wire, a filling, a component, a connector and the like, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.
When an existing PCB shakes and vibrates, the PCB can generate resonance, the resonance can greatly affect the structural stability of a board body, the PCB can shift and crack after a long time, and the quality of the PCB is seriously affected, so that an elastic block is arranged inside the PCB to increase the buffering effect and reduce the influence caused by the resonance;
when setting up the elasticity piece, most cover the circuit board surface and enclose, and this kind of structure has solved the buffering problem, nevertheless to the circuit board cladding influence its heat dispersion too much, can influence the normal work of circuit board after the time is long.
Disclosure of Invention
The present invention is directed to a dual-layer circuit board having a buffer structure.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a double-layer circuit board with a buffer structure is provided, a support structure is arranged on the periphery of the circuit board and comprises a base which is in elastic contact with the bottom wall and the side wall of the circuit board, a positioning column is formed by extending the bottom of the circuit board to the base, a buffer slot which surrounds the positioning column is coaxially formed on the base, an elastic material layer is arranged on the inner side wall of the buffer slot, a buffer sheet is installed on the side wall of the buffer slot, a plurality of first rolling balls which are positioned on the periphery of the buffer slot are placed in the base, the first rolling balls slide back and forth between the base and the outer side wall of the buffer slot through gravity and inertia, a first telescopic mechanism which drives the buffer sheet to extend to the positioning column is arranged on the buffer slot, one end of the first telescopic mechanism is in elastic contact with the first rolling balls, the first telescopic mechanism is driven by the first rolling balls to move, so that the buffer sheet extends to the inner side wall of the positioning column to surround the positioning column; the positioning column and the buffer slot are polygonal or circular, and an installation cavity for installing the first telescopic mechanism and the buffer sheet is formed in the side wall of the buffer slot; a driving sleeve is arranged in the mounting cavity, the first telescopic mechanism comprises a driving rod which horizontally slides in the driving sleeve, one end of the driving rod extends out of the outer side wall of the buffer slot along the driving sleeve, and the other end of the driving rod is connected with the buffer sheet; spring parts are nested at the outer ends of the driving rods, annular convex blocks used for stopping the spring parts are formed at the middle ends of the inner walls of the driving sleeves, and stopping blocks matched with the annular convex blocks in a stopping mode are formed at the middle ends of the driving rods.
And further: the buffer slot side wall is provided with four first telescopic mechanisms, the outer side of each first telescopic mechanism is correspondingly provided with a slide way, more than one first rolling ball is placed on one slide way, and each slide way is provided with two elastic ropes which elastically connect the first rolling ball with the inner side wall of the base.
And further: the number of the positioning columns is two, the two buffer grooves are connected through the slide way, one end of a first elastic rope in the slide way is fixed at the central point of the base, the other end of the first elastic rope is connected with the first rolling ball, horizontally slides on the slide way through gravity and inertia, and is in contact fit with the first telescopic mechanisms on the left side and the right side respectively.
Further: the bottom of the buffer tank is provided with a bottom elastic sheet, the bottom of the buffer tank is provided with a second telescopic mechanism which drives the bottom elastic sheet to lift, and the second telescopic mechanism is arranged at the bottom layer of the first telescopic mechanism at intervals.
Further: the vertical downwardly extending of dashpot to the shaping has vertical mounting groove, and second telescopic machanism includes the elevator slide of slidable mounting at vertical mounting groove, and elevator slide bottom lateral wall shaping has a plurality of first inclined planes, and the peripheral horizontal slidable mounting of vertical mounting groove has with elevator slide sliding fit's ejector pad, the inner shaping of ejector pad have with first inclined plane sliding fit's second inclined plane.
Further: the periphery of buffer slot bottom is provided with many tracks, places more than one second roll ball on every track, still is provided with the second stretch cord that is connected second roll ball and base inside wall.
Further: the bottom of the vertical mounting groove is provided with a bottom supporting block for supporting the lifting slide block, and the side wall of the bottom supporting block is provided with a compression spring elastically connected with the inner side wall of the push block.
The invention has the beneficial effects that: according to the double-layer circuit board with the buffer structure, when shaking or vibration occurs, the first rolling balls move, one or more rolling balls move towards the outer side wall of the buffer groove, the buffer sheet is driven to be attached to the positioning column after the first rolling balls of the first telescopic mechanism collide, the shaking amplitude of the positioning column which is connected with the circuit board and integrally formed in the buffer groove is greatly reduced, and when the positioning column collides with the buffer sheet, a resonance force cannot be generated, so that the structural stability of the circuit board is effectively protected, the heat dissipation performance of the surface of the circuit board is not influenced, and the service life is prolonged.
Drawings
Fig. 1 is a schematic structural view of connection between a circuit board and a base.
Fig. 2 is a schematic view of a buffer structure inside the base.
Fig. 3 is a schematic view of the base in a top view.
Fig. 4 is a schematic structural view illustrating a connection between a positioning column and a first telescopic mechanism.
Fig. 5 is a schematic structural view illustrating a connection between a positioning column and a second telescopic mechanism.
The reference numerals include:
1-Circuit Board 101-base
10-positioning column 11-buffer groove 12-buffer sheet 13-first rolling ball
14-slideway 15-first elastic rope 16-upper layer 17-clapboard
2-first telescoping mechanism
20-mounting chamber 21-drive sleeve 22-drive rod 23-spring element
24-annular projection 25-stop
3-second telescoping mechanism
30-bottom elastic sheet 31-vertical mounting groove 32-lifting slide block 33-first inclined plane
34-push block 35-second inclined plane 36-second rolling ball 37-second elastic rope
38-track 39-lower layer 40-bottom support block 41-compression spring.
Detailed Description
The present invention is described in detail below with reference to the attached drawings.
As shown in fig. 1-5, a double-layer circuit board with a buffer structure is provided, a support structure is provided at the bottom of a circuit board 1, the support structure includes a base 101 that elastically surrounds the bottom wall and the side wall of the circuit board 1, a positioning column 10 is formed by extending the bottom of the circuit board 1 toward the base 101, a buffer slot 11 that surrounds the positioning column 10 is coaxially formed at the base 101, the inner side wall of the buffer slot 11 is an elastic material layer, a buffer sheet 12 is installed at the side wall of the buffer slot 11, a plurality of first rolling balls 13 located at the periphery of the buffer slot 11 are placed in the base 101, the first rolling balls 13 slide back and forth between the base 101 and the outer side wall of the buffer slot 11 through gravity and inertia, a first telescopic mechanism 2 that drives the buffer sheet 12 to extend toward the positioning column 10 is provided on the buffer slot 11, one end of the first telescopic mechanism 2 is elastically contacted with the first rolling balls 13, the first telescopic mechanism 2 is driven by the first rolling balls 13 to move, so that the buffer sheet 12 extends toward the inner side wall of the positioning column 10 to surround the positioning column 10; when taking place to rock or vibrate, first rolling ball 13 can move, wherein one or more first rolling ball 13 moves towards the direction of dashpot 11 lateral wall, can take place the contact with first telescopic machanism 2, first telescopic machanism 2 receives the collision back of first rolling ball 13, drive buffer plate 12 and laminate to reference column 10, the range greatly reduced that rocks of reference column 10 in dashpot 11 that is connected integrated into one piece with circuit board 1, and when colliding buffer plate 12, can not produce resonance force yet, thereby effectively protected circuit board 1's structural stability, and do not influence the heat dispersion on circuit board 1 surface, service life has been prolonged.
More preferred scheme, reference column 10 and dashpot 11 are polygon or circular, and dashpot 11 lateral wall shaping has the installation cavity 20 that is used for installing first telescopic machanism 2 and buffering piece 12, and the buffer piece 12 evenly arranges at the inside wall according to the shape of dashpot 11, and buffer piece 12 more than one of them buffer piece 12 receives the collision back of first roll ball 13 and stretches out simultaneously, and cooperation elastic dashpot 11 can carry out elasticity with reference column 10 and surround.
Specifically, a driving sleeve 21 is installed in the installation cavity 20, the first telescoping mechanism 2 comprises a driving rod 22 which horizontally slides in the driving sleeve 21, one end of the driving rod 22 extends out of the outer side wall of the buffer slot 11 along the driving sleeve 21, the other end of the driving rod 22 is connected with the buffer sheet 12, a spring piece 23 is nested at the outer end of the driving rod 22, an annular convex block 24 for stopping the spring piece 23 is formed at the middle end of the inner wall of the driving sleeve 21, and a stopping block 25 which is in stopping fit with the annular convex block 24 is formed at the middle end of the driving rod 22;
the first rolling ball 13 collides with the driving rod 22 of the first telescopic mechanism 2 according to the shaking direction, and the driving rod 22 extends into the buffer slot 11 to drive the buffer sheet 12 to surround the outer side wall of the positioning column 10, so that buffering is realized; when the first rolling ball 13 leaves, the driving rod 22 will be driven by the elastic force of the spring element 23 to retract the buffer sheet 12 into the mounting cavity 20, and when retracting, the stop block 25 on the driving rod 22 will stop with the annular protrusion 24 located at the middle end of the driving sleeve 21, so as to prevent the driving rod 22 from popping out of the driving sleeve 21 due to the elastic force of the spring, thereby slidably mounting the driving rod 22.
In order to enable the first rolling ball 13 to move on the given track 38, the side wall of the buffer slot 11 is provided with four first telescopic mechanisms 2, the number of the positioning columns 10 is two, the outer side of each first telescopic mechanism 2 is correspondingly provided with a slideway 14, more than one first rolling ball 13 is placed on one slideway 14, and each slideway 14 is provided with a first elastic rope 15 which elastically connects the first rolling ball 13 with the inner side wall of the base 101; the two buffer grooves 11 are connected through one slide way 14, one end of a first elastic rope 15 in the slide way 14 is fixed at the central point of the base 101, the other end of the first elastic rope 15 is connected with a first rolling ball 13, horizontally slides on the slide way 14 through gravity and inertia, and is respectively in contact fit with the first telescopic mechanisms 2 on the left side and the right side; during shaking, only one or two first rolling balls 13 move towards the buffer slot 11 at the same time, the first rolling balls 13 reciprocate on the slide way 14, collide with the driving rod 22, and after the shaking of the circuit board 1 is reduced, the first rolling balls 13 gradually slide back towards the tail end of the first elastic rope 15 under the elastic force of the first elastic rope 15, so as to be far away from the buffer slot 11, and the buffer sheet 12 in the buffer slot 11 retracts.
In order to further increase the anti-seismic performance of the circuit board 1, the bottom elastic sheet 30 is arranged at the bottom of the buffer groove 11, the second telescopic mechanism 3 for driving the bottom elastic sheet 30 to ascend and descend is arranged at the bottom of the first telescopic mechanism 2, the base 101 is provided with a double-layer structure formed by partition plates 17, the buffer groove 11 penetrates through the partition plates 17 and is formed in the upper layer 16 and the lower layer 39, the first telescopic mechanism 2 and the first rolling balls 13 are located in the upper layer 16, and the second telescopic mechanism 3 and the second rolling balls 36 are located in the lower layer 39 and do not interfere with each other. The cooperation of end flexure strip 30 and second telescopic machanism 3 can reduce the ascending resonance of circuit board 1 vertical direction, effectively improves the shock-absorbing capacity of circuit board 1 vertical direction.
The structure is specific, the buffer slot 11 extends vertically and downwards and is formed with a vertical mounting slot 31, the second telescopic mechanism 3 comprises a lifting slider 32 which is slidably mounted in the vertical mounting slot 31, a plurality of first inclined planes 33 are formed on the side wall of the bottom of the lifting slider 32, a push block 34 which is slidably fitted with the lifting slider 32 is horizontally slidably mounted on the periphery of the vertical mounting slot 31, a second inclined plane 35 which is slidably fitted with the first inclined planes 33 is formed at the inner end of the push block 34, four rails 38 are arranged on the periphery of the bottom layer of the buffer slot 11, more than one second rolling ball 36 is placed on each rail 38, and a second elastic rope 37 which connects the second rolling ball 36 with the inner side wall of the base 101 is further arranged;
the principle with first telescopic machanism 2 is the same, when circuit board 1 takes place to rock, one or more second rolling ball 36 can be according to the direction of rocking to second telescopic machanism 3 motion along track 38, collide with ejector pad 34, thereby ejector pad 34 is inside to slide, sliding fit takes place for its terminal second inclined plane 35 and lift slider 32's first inclined plane 33, convert the power of horizontal direction into the power of vertical direction, drive lift slider 32 jack-up, the bottom flexure strip 30 that is located lift slider 32 top is upwards jack-up, further improve the laminating compactness with reference column 10 bottom surface, thereby improve the cushion performance of circuit board 1 vertical direction, reduce the resonance that vertical direction produced.
In addition, when the second rolling ball 36 is rebounded by the second elastic cord 37, the second rolling ball 36 is far away from the push block 34, the bottom of the vertical mounting groove 31 is provided with a bottom supporting block 40 for supporting the lifting slider 32, the side wall of the bottom supporting block 40 is provided with a compression spring 41 elastically connected with the inner side wall of the push block 34, and the compression spring 41 pushes the push block 34 outwards, so that the lifting slider 32 can slowly descend to return to the initial position.
In conclusion, the present invention has the above-mentioned excellent characteristics, so that it can be used to enhance the performance of the prior art and has practicability, and becomes a product with practical value. The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (7)
1. The utility model provides a double-deck circuit board with buffer structure, circuit board periphery is provided with bearing structure, its characterized in that: the supporting structure comprises a base which is in elastic contact with the bottom wall and the side wall of the circuit board, a positioning column is formed by extending the bottom of the circuit board to the base, a buffer groove which surrounds the positioning column is coaxially formed on the base, the inner side wall of the buffer groove is an elastic material layer, a buffer sheet is arranged on the side wall of the buffer groove, a plurality of first rolling balls which are positioned at the periphery of the buffer groove are arranged in the base, the first rolling balls slide back and forth between the base and the outer side wall of the buffer groove through gravity and inertia, a first telescopic mechanism which drives the buffer sheet to extend out of the positioning column is arranged on the buffer groove, one end of the first telescopic mechanism is in elastic contact with the first rolling balls, the first telescopic mechanism is driven to move through the first rolling balls, and the buffer sheet extends out of the inner side wall of the positioning column to surround the positioning column;
the positioning column and the buffer slot are polygonal or circular, an installation cavity for installing a first telescopic mechanism and a buffer sheet is formed in the side wall of the buffer slot, a driving sleeve is installed in the installation cavity, the first telescopic mechanism comprises a driving rod which horizontally slides in the driving sleeve, one end of the driving rod extends out of the outer side wall of the buffer slot along the driving sleeve, and the other end of the driving rod is connected with the buffer sheet;
the spring part has been nested to the actuating lever outer end, and the shaping of drive sleeve inner wall middle-end has the annular lug that is used for backstop spring part, and the shaping of actuating lever middle-end has with annular lug backstop complex backstop piece.
2. The double-layer circuit board with the buffer structure as claimed in claim 1, wherein: the buffer slot lateral wall is provided with four first telescopic machanisms, and every first telescopic machanism outside corresponds and is provided with a slide, and more than one has been placed to a slide first roll ball, every slide is provided with the second stretch cord with first roll ball and base inside wall elastic connection.
3. The double-layer circuit board with the buffer structure as claimed in claim 2, wherein: the number of the positioning columns is two, the two buffer grooves are connected through one slide way, one end of a first elastic rope in the slide way is fixed at the central point of the base, the other end of the first elastic rope is connected with the first rolling ball, and the first elastic rope horizontally slides on the slide way through gravity and inertia and is respectively in contact fit with the first telescopic mechanisms on the left side and the right side.
4. The double-layer circuit board with the buffer structure as claimed in claim 1, wherein: the bottom of the buffer slot is provided with a bottom elastic sheet, the bottom of the buffer slot is provided with a second telescopic mechanism which drives the bottom elastic sheet to lift, and the second telescopic mechanism is arranged at the bottom of the first telescopic mechanism at intervals.
5. The double-layer circuit board with the buffer structure as claimed in claim 2, wherein: the vertical downwardly extending of dashpot to the shaping has vertical mounting groove, and second telescopic machanism includes the elevator slide of slidable mounting at vertical mounting groove, and elevator slide bottom lateral wall shaping has a plurality of first inclined planes, and the peripheral horizontal slidable mounting of vertical mounting groove has the ejector pad with elevator slide sliding fit, and the inner shaping of ejector pad has the second inclined plane with first inclined plane sliding fit.
6. The double-layer circuit board with the buffer structure as claimed in claim 5, wherein: the periphery of the bottom layer of the buffer tank is provided with a plurality of tracks, each track is provided with more than one second rolling ball, and a second elastic rope connecting the second rolling balls with the inner side wall of the base is further arranged.
7. The double-layer circuit board with the buffer structure as claimed in claim 6, wherein: the bottom of the vertical mounting groove is provided with a bottom supporting block for supporting the lifting slide block, and the side wall of the bottom supporting block is provided with a compression spring elastically connected with the inner side wall of the push block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111157586.9A CN113825303B (en) | 2021-09-30 | 2021-09-30 | Double-layer circuit board with buffer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111157586.9A CN113825303B (en) | 2021-09-30 | 2021-09-30 | Double-layer circuit board with buffer structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113825303A CN113825303A (en) | 2021-12-21 |
| CN113825303B true CN113825303B (en) | 2023-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111157586.9A Active CN113825303B (en) | 2021-09-30 | 2021-09-30 | Double-layer circuit board with buffer structure |
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| Country | Link |
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| CN (1) | CN113825303B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114438937B (en) * | 2022-01-19 | 2023-08-04 | 山东冠县恒良交通设施有限公司 | Road rail guard that security is strong |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208411644U (en) * | 2018-06-29 | 2019-01-22 | 温州德力汽摩部件有限公司 | Vehicle central electric equipment control box |
| CN208590148U (en) * | 2018-07-04 | 2019-03-08 | 深圳市卓创通电子有限公司 | It is a kind of with subtracting the PCB circuit board for hitting structure |
| CN208850099U (en) * | 2018-07-04 | 2019-05-10 | 深圳市卓创通电子有限公司 | A kind of PCB circuit board with stress release function |
| CN210671155U (en) * | 2019-11-01 | 2020-06-02 | 东莞市镭源电子科技有限公司 | Circuit board convenient to heat dissipation |
| CN212344362U (en) * | 2020-07-30 | 2021-01-12 | 陈秀珍 | Chip mounter anchor clamps |
-
2021
- 2021-09-30 CN CN202111157586.9A patent/CN113825303B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208411644U (en) * | 2018-06-29 | 2019-01-22 | 温州德力汽摩部件有限公司 | Vehicle central electric equipment control box |
| CN208590148U (en) * | 2018-07-04 | 2019-03-08 | 深圳市卓创通电子有限公司 | It is a kind of with subtracting the PCB circuit board for hitting structure |
| CN208850099U (en) * | 2018-07-04 | 2019-05-10 | 深圳市卓创通电子有限公司 | A kind of PCB circuit board with stress release function |
| CN210671155U (en) * | 2019-11-01 | 2020-06-02 | 东莞市镭源电子科技有限公司 | Circuit board convenient to heat dissipation |
| CN212344362U (en) * | 2020-07-30 | 2021-01-12 | 陈秀珍 | Chip mounter anchor clamps |
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| Publication number | Publication date |
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| CN113825303A (en) | 2021-12-21 |
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Application publication date: 20211221 Assignee: Xinfeng Jun Da Electronic Technology Co.,Ltd. Assignor: Jiangxi Jiyan Xinyang Electronics Co.,Ltd. Contract record no.: X2023980054688 Denomination of invention: A double-layer circuit board with buffer structure Granted publication date: 20230210 License type: Common License Record date: 20231228 |
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