CN220629648U - Heat dissipation type circuit board - Google Patents
Heat dissipation type circuit board Download PDFInfo
- Publication number
- CN220629648U CN220629648U CN202322250478.7U CN202322250478U CN220629648U CN 220629648 U CN220629648 U CN 220629648U CN 202322250478 U CN202322250478 U CN 202322250478U CN 220629648 U CN220629648 U CN 220629648U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- fixing
- buffer
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000013016 damping Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 238000002791 soaking Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation type circuit board which comprises a fixing frame and a heat dissipation assembly, wherein a mounting groove is formed in the fixing frame, a circuit board main body is fixedly arranged in the mounting groove, a vapor chamber is fixedly arranged at the bottom of the circuit board main body, the heat dissipation assembly for improving the heat dissipation efficiency of the circuit board main body is arranged below the fixing frame, the heat dissipation assembly comprises a metal frame, heat dissipation fins, mounting holes, a fixing support and a turbofan, the heat dissipation fins are paved below the metal frame, the mounting holes are formed in four corners of the metal frame, the fixing support is fixedly arranged in the middle of the heat dissipation fins, the turbofan is fixedly arranged in the middle of the fixing support, fixing screws are inserted in the mounting holes, and the metal frame is fixed with the fixing frame through the fixing screws. The heat dissipation circuit board not only can improve the overall heat dissipation capacity of the circuit board main body, but also can improve the compression resistance of the circuit board main body.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a heat dissipation circuit board.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances.
The patent document with the application number of CN202022068037.1 discloses a double-sided circuit board, which is characterized in that the same kind of wires penetrate through the inner cavity of a wire through ring, and then other different kinds of wires penetrate into the circuit board through connecting holes, so that the wires are prevented from being mixed and wound, later maintenance and replacement are convenient, time and labor are saved, but the double-sided circuit board dissipates heat through the heat dissipation holes formed in the shell of the device, the heat dissipation method is low in efficiency, the heat dissipation effect is poor, and the normal operation of the circuit board is affected due to the poor heat dissipation effect.
Accordingly, in view of the above, a heat dissipation circuit board has been proposed to solve the problems of the conventional structure.
Disclosure of Invention
The present utility model is directed to a heat dissipation type circuit board, which solves the problems set forth in the above-mentioned background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat dissipation circuit board, includes mount and radiator unit, the mounting groove has been seted up to the inside of mount, and the inside fixed mounting of mounting groove has the circuit board main part, the bottom fixed mounting of circuit board main part has the vapor chamber for improve circuit board main part radiating efficiency radiator unit installs in the below of mount, radiator unit includes metal frame, radiator fin, mounting hole, fixed bolster and turbofan, radiator fin has been laid to metal frame's below, and the four corners of metal frame has seted up the mounting hole, radiator fin's middle part fixed mounting has the fixed bolster, and the middle part fixed mounting of fixed bolster has turbofan.
Preferably, a fixing screw is inserted in the mounting hole, and the metal frame is fixed with the fixing frame through the fixing screw.
Preferably, the outside of the fixing frame is provided with a threaded hole, and the inside of the threaded hole is inserted with a mounting screw.
Preferably, a fixed base is fixedly arranged at the top of the fixed frame, and a damping rod is fixedly arranged at the top of the fixed base.
Preferably, the outer wall of the damping rod is sleeved with a buffer spring, and the top of the buffer spring is fixedly provided with a buffer block.
Preferably, the rear end of the buffer block is fixedly provided with a buffer bracket, and the buffer bracket and the buffer block are arranged in a shape like a Chinese character 'hui'.
Preferably, the bottom of the buffer block is elastically connected with the fixing frame through a buffer spring, and the fixing frame is L-shaped.
Compared with the prior art, the utility model has the beneficial effects that: the heat dissipation circuit board not only can improve the overall heat dissipation capacity of the circuit board main body, but also can improve the compression resistance of the circuit board main body.
1. According to the utility model, through the arrangement of the heat radiating component, the heat is transferred into the heat radiating fins arranged at the bottom of the metal frame by the soaking plate, and then the turbine fan arranged at the middle part of the heat radiating fins rotates, so that external wind is led into the heat radiating fins to the other side through one side of the heat radiating fins, the heat on the surfaces of the heat radiating fins is reduced, and when the temperature of the heat radiating fins is reduced, the heat generated by the soaking plate is conducted and sucked, so that the temperature of the circuit board main body contacted with the top of the soaking plate is reduced, and the aim of improving the integral heat radiating capacity of the circuit board main body is fulfilled;
2. according to the circuit board, the buffer springs are matched with the damping rods, so that the buffer support and the buffer blocks are extruded when being extruded, the buffer springs are used for counteracting impact force of the buffer blocks, and the damping rods arranged in the buffer springs are used for counteracting reciprocating impact force of the buffer springs when resetting, so that the impact on the circuit board main body is reduced when the buffer blocks are extruded, and the compression resistance of the circuit board main body is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of a heat dissipation circuit board according to the present utility model;
FIG. 2 is a schematic top perspective view of a heat dissipating assembly of a heat dissipating circuit board according to the present utility model;
FIG. 3 is a schematic diagram showing a connection structure between a buffer block and a buffer bracket of a heat dissipation circuit board according to the present utility model;
fig. 4 is an enlarged schematic view of the heat dissipation circuit board of fig. 2 at a position a.
In the figure: 1. a fixing frame; 2. a mounting groove; 3. a circuit board main body; 4. a soaking plate; 5. a heat dissipation assembly; 501. a metal frame; 502. a heat radiation fin; 503. a mounting hole; 504. a fixed bracket; 505. a turbo fan; 6. a set screw; 7. a threaded hole; 8. installing a screw; 9. a fixed base; 10. a damping rod; 11. a buffer spring; 12. a buffer block; 13. and a buffer bracket.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-2, a heat dissipation circuit board comprises a fixing frame 1 and a heat dissipation component 5, wherein a mounting groove 2 is formed in the fixing frame 1, a circuit board main body 3 is fixedly arranged in the mounting groove 2, a soaking plate 4 is fixedly arranged at the bottom of the circuit board main body 3, the heat dissipation component 5 for improving the heat dissipation efficiency of the circuit board main body 3 is arranged below the fixing frame 1, the heat dissipation component 5 comprises a metal frame 501, heat dissipation fins 502, mounting holes 503, a fixing bracket 504 and a turbofan 505, heat dissipation fins 502 are paved below the metal frame 501, mounting holes 503 are formed in four corners of the metal frame 501, the fixing bracket 504 is fixedly arranged in the middle of the heat dissipation fins 502, a turbofan 505 is fixedly arranged in the middle of the fixing bracket 504, heat is transferred into the heat dissipation fins 502 arranged at the bottom of the metal frame 501 by the fixing bracket 4, external wind is led into the other side of the heat dissipation fins 502 by one side of the heat dissipation fins 502, the heat of the surface of the heat dissipation fins 502 is reduced, and when the temperature of the fins 502 is reduced, the heat generated by the heat dissipation plate 4 is sucked into the heat dissipation fins 4, and the heat dissipation plate 3 is enabled to reach the purpose of reducing the heat dissipation performance of the whole body 3.
As shown in fig. 3-4, the fixing screws 6 are inserted into the mounting holes 503, and the metal frame 501 is fixed to the fixing frame 1 by the fixing screws 6, and the fixing screws 6 facilitate the disassembly and the assembly of the metal frame 501.
Further, offer with screw hole 7 in the outside of mount 1, and the inside interlude of screw hole 7 is equipped with mounting screw 8, and mounting screw 8 is convenient for mount 1 and shell to install fixedly.
Further, the top of the fixing frame 1 is fixedly provided with a fixing base 9, the top of the fixing base 9 is fixedly provided with a damping rod 10, and the damping rod 10 counteracts the reciprocating impact force generated when the buffer spring 11 is reset.
Further, the outer wall of the damping rod 10 is sleeved with a buffer spring 11, and a buffer block 12 is fixedly arranged at the top of the buffer spring 11 to prevent external force from directly acting on the circuit board main body 3.
Further, a buffer bracket 13 is fixedly arranged at the rear end of the buffer block 12, and the buffer bracket 13 and the buffer block 12 are arranged in a shape like a Chinese character 'hui'.
Further, the bottom of the buffer block 12 is elastically connected with the fixing frame 1 through a buffer spring 11, and the fixing frame 1 is in an L-shaped arrangement.
Working principle: when the heat dissipation type circuit board is used, firstly, heat is transferred into the heat dissipation fins 502 arranged at the bottom of the metal frame 501 through the soaking plate 4, then the turbofan 505 arranged in the middle of the heat dissipation fins 502 rotates, external wind is led into the heat dissipation fins 502 to the other side through one side of the heat dissipation fins 502, so that the heat on the surface of the heat dissipation fins 502 is reduced, when the temperature of the heat dissipation fins 502 is reduced, the heat generated by the soaking plate 4 is conducted and sucked, the temperature of the circuit board main body 3 contacted with the top of the soaking plate 4 is reduced, then the buffer spring 11 arranged at the bottom of the buffer block 12 is extruded when the buffer bracket 13 and the buffer block 12 are extruded, the impact force of the buffer block 12 is counteracted by the buffer spring 11, and then the reciprocating impact force of the buffer spring 11 is counteracted by the damping rod 10 arranged in the buffer spring 11, so that the influence on the circuit board main body 3 is reduced when the buffer block 12 is extruded, and the pressure resistance of the circuit board main body 3 is improved, and the working principle of the heat dissipation type circuit board is achieved.
Claims (7)
1. The utility model provides a heat dissipation circuit board, includes mount (1) and radiator unit (5), its characterized in that, mounting groove (2) have been seted up to the inside of mount (1), and the inside fixed mounting of mounting groove (2) has circuit board main part (3), the bottom fixed mounting of circuit board main part (3) has vapor chamber (4) for improve circuit board main part (3) radiating efficiency radiator unit (5) install in the below of mount (1), radiator unit (5) include metal frame (501), radiator fin (502), mounting hole (503), fixed bolster (504) and turbofan (505), radiator fin (502) have been laid to the below of metal frame (501), and mounting hole (503) have been seted up in the four corners of metal frame (501), the middle part fixed mounting of radiator fin (502) has fixed bolster (504), and the middle part fixed mounting of fixed bolster (504) has turbofan (505).
2. A heat dissipation circuit board according to claim 1, wherein the mounting hole (503) is internally inserted with a fixing screw (6), and the metal frame (501) is fixed to the fixing frame (1) by the fixing screw (6).
3. A heat dissipation circuit board according to claim 1, wherein the outer side of the fixing frame (1) is provided with a threaded hole (7), and a mounting screw (8) is inserted into the threaded hole (7).
4. A heat dissipation circuit board according to claim 1, characterized in that the top of the fixing frame (1) is fixedly provided with a fixing base (9), and the top of the fixing base (9) is fixedly provided with a damping rod (10).
5. The heat dissipation circuit board according to claim 4, wherein the damping rod (10) is sleeved with a buffer spring (11), and a buffer block (12) is fixedly installed at the top of the buffer spring (11).
6. The heat dissipation circuit board according to claim 5, wherein a buffer bracket (13) is fixed at the rear end of the buffer block (12), and the buffer bracket (13) is arranged in a shape of a Chinese character 'hui' with the buffer block (12).
7. A heat dissipation circuit board according to claim 5, wherein the bottom of the buffer block (12) is elastically connected with the fixing frame (1) through a buffer spring (11), and the fixing frame (1) is in an L-shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322250478.7U CN220629648U (en) | 2023-08-22 | 2023-08-22 | Heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322250478.7U CN220629648U (en) | 2023-08-22 | 2023-08-22 | Heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220629648U true CN220629648U (en) | 2024-03-19 |
Family
ID=90226803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322250478.7U Active CN220629648U (en) | 2023-08-22 | 2023-08-22 | Heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220629648U (en) |
-
2023
- 2023-08-22 CN CN202322250478.7U patent/CN220629648U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |