CN213073227U - Circuit board with heat dissipation function - Google Patents
Circuit board with heat dissipation function Download PDFInfo
- Publication number
- CN213073227U CN213073227U CN202022367090.1U CN202022367090U CN213073227U CN 213073227 U CN213073227 U CN 213073227U CN 202022367090 U CN202022367090 U CN 202022367090U CN 213073227 U CN213073227 U CN 213073227U
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- connecting plate
- heat
- dissipation function
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a circuit board technical field just discloses a circuit board with heat dissipation function, including the circuit board, its characterized in that, the both sides of circuit board all are provided with heat dissipation mechanism, heat dissipation mechanism comprises connecting plate and fin, the connecting plate joint is in the both sides of circuit board, the opposite side at the connecting plate is installed to the fin. The utility model discloses an at the both sides installation heat dissipation mechanism of circuit board, utilize the design of heat conduction silica gel pad for the produced heat of circuit board can be conducted fast to the connecting plate on, is conducted to the air by the fin again, with this improvement radiating effect, reduces the influence of heat to circuit board performance.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board with heat dissipation function.
Background
The circuit board is also called as a printed circuit board, is the basis of electronic products, is called as PCB, FPC circuit board for short in English, it is a medium as circuit conduction, is used in the transmission of circuit between different electronic components, its circuit board makes the circuit miniaturized, direct-viewing, play an important role in the batch production of fixed circuit and optimizing the layout of electrical apparatus, the main function of the circuit board is to provide the connecting circuit between every component, along with the more and more complicated of electronic equipment, the more and more components that need, the circuit and components on the surface of circuit board are also more and more intensive.
The circuit board is welded with a plurality of electronic elements, and can produce a large amount of heats when in operation, and present circuit board is traditional structural design mostly, and the radiating effect remains to be improved, and the performance of circuit board can be influenced to the heat excess, for this reason, we provide a circuit board with heat dissipation function.
SUMMERY OF THE UTILITY MODEL
In view of the above problems existing in the prior art, the present invention provides a circuit board with heat dissipation function.
In order to realize the above object, the utility model provides a pair of circuit board with heat dissipation function, including the circuit board, its characterized in that, the both sides of circuit board all are provided with heat dissipation mechanism, heat dissipation mechanism comprises connecting plate and fin, the connecting plate joint is in the both sides of circuit board, the opposite side at the connecting plate is installed to the fin.
Preferably, the connecting plate is a U-shaped frame, and the opening of the connecting plate is clamped with the side edge of the circuit board and is fastened through screws.
Preferably, the inner wall of the connecting plate is provided with a heat-conducting silica gel pad, and the heat-conducting silica gel pad is tightly attached to the side edge of the circuit board.
Preferably, the tip of the screw penetrates and extends to the inner part of the connecting plate and is in threaded connection with the circuit board.
Preferably, the connecting plate and the radiating fin are both made of copper.
Compared with the prior art, the utility model provides a circuit board with heat dissipation function has following beneficial effect:
the utility model discloses an at the both sides installation heat dissipation mechanism of circuit board, utilize the design of heat conduction silica gel pad for the produced heat of circuit board can be conducted fast to the connecting plate on, is conducted to the air by the fin again, with this improvement radiating effect, reduces the influence of heat to circuit board performance.
Drawings
Fig. 1 is a schematic front structural view of the present invention;
fig. 2 is a schematic view of the top view structure of the connection plate of the present invention.
In the figure: 1. a circuit board; 2. a connecting plate; 3. a heat sink; 4. a screw; 5. heat conduction silica gel pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be described below clearly and completely with reference to the accompanying drawings of the embodiments of the present disclosure.
Referring to fig. 1-2, a circuit board with heat dissipation function includes a circuit board 1, and is characterized in that heat dissipation mechanisms are disposed on both sides of the circuit board 1, each heat dissipation mechanism includes a connection board 2 and a heat dissipation plate 3, the connection board 2 is clamped on both sides of the circuit board 1, and the heat dissipation plate 3 is mounted on the other side of the connection board 2.
Connecting plate 2 is the U-shaped frame, and the opening of connecting plate 2 and the side joint of circuit board 1, and through the fastening of screw 4, the U-shaped inslot just is inserted to the side of circuit board 1 for connecting plate 2 can be pegged graft with circuit board 1 is supporting, and the fastening action of screw 4 is recombined, can improve the installation stability of connecting plate 2.
Heat conduction silica gel pad 5 is installed to the inner wall of connecting plate 2, and heat conduction silica gel pad 5 hugs closely mutually with circuit board 1's side, and heat conduction silica gel's design can accelerate circuit board 1 heat conduction to connecting plate 2, plays the effect that improves the radiating effect.
The tip of the screw 5 penetrates through and extends into the connecting plate 2, and is in threaded connection with the circuit board 1, so that the connecting plate 2 can be conveniently disassembled and assembled.
The connecting plate 2 and the radiating fins 3 are made of copper, so that the heat conduction effect can be improved, and the radiating effect is improved.
The utility model discloses an at the both sides installation heat dissipation mechanism of circuit board, utilize the design of heat conduction silica gel pad for the produced heat of circuit board can be conducted fast to the connecting plate on, is conducted to the air by the fin again, with this improvement radiating effect, reduces the influence of heat to circuit board performance.
The above description is only an exemplary embodiment of the present invention, and is not intended to limit the present invention, the scope of which is defined by the appended claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.
Claims (5)
1. The utility model provides a circuit board with heat dissipation function, includes circuit board (1), its characterized in that, the both sides of circuit board (1) all are provided with heat dissipation mechanism, heat dissipation mechanism comprises connecting plate (2) and fin (3), connecting plate (2) joint is in the both sides of circuit board (1), the opposite side at connecting plate (2) is installed in fin (3).
2. The circuit board with the heat dissipation function according to claim 1, wherein the connecting plate (2) is a U-shaped frame, and the opening of the connecting plate (2) is clamped with the side of the circuit board (1) and fastened by a screw (4).
3. The circuit board with the heat dissipation function according to claim 2, wherein the inner wall of the connecting plate (2) is provided with a heat-conducting silica gel pad (5), and the heat-conducting silica gel pad (5) is attached to the side edge of the circuit board (1).
4. A circuit board with heat dissipation function according to claim 2, characterized in that the tip of the screw (4) penetrates and extends to the inside of the connection board (2) and is in threaded connection with the circuit board (1).
5. A circuit board with heat dissipation function according to claim 1, wherein the connecting board (2) and the heat sink (3) are made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022367090.1U CN213073227U (en) | 2020-10-22 | 2020-10-22 | Circuit board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022367090.1U CN213073227U (en) | 2020-10-22 | 2020-10-22 | Circuit board with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213073227U true CN213073227U (en) | 2021-04-27 |
Family
ID=75563400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022367090.1U Expired - Fee Related CN213073227U (en) | 2020-10-22 | 2020-10-22 | Circuit board with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213073227U (en) |
-
2020
- 2020-10-22 CN CN202022367090.1U patent/CN213073227U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 365000 a, floor 3, building 26, Sanming Zhongguancun Science Park, No. 9, Yingbin Avenue, Qiujiang street, Shaxian District, Sanming City, Fujian Province Patentee after: Sanming youxunda Electronics Co.,Ltd. Address before: 365000 No.3, 15th floor, building 18, Qianlong new village, Meilie District, Sanming City, Fujian Province Patentee before: Sanming Meilie youxunda Electronics Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210427 Termination date: 20211022 |