CN216451593U - Composite heat-conducting PCB - Google Patents
Composite heat-conducting PCB Download PDFInfo
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- CN216451593U CN216451593U CN202123145379.XU CN202123145379U CN216451593U CN 216451593 U CN216451593 U CN 216451593U CN 202123145379 U CN202123145379 U CN 202123145379U CN 216451593 U CN216451593 U CN 216451593U
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Abstract
The utility model discloses a composite heat-conducting PCB circuit board which comprises a first rubber frame, wherein a second rubber frame is movably arranged on one side of the first rubber frame, a circuit board is movably arranged between the first rubber frame and the second rubber frame, an insulating heat-conducting plate is fixedly arranged on the inner side surfaces of the first rubber frame and the second rubber frame, close to the lower surfaces of the first rubber frame and the second rubber frame, a heat-radiating plate is movably arranged below the insulating heat-conducting plate, first threaded sleeves are fixedly arranged on the outer side surfaces of the first rubber frame, close to two ends of the first rubber frame, and second threaded sleeves are fixedly arranged on the outer side surfaces of the second rubber frame, close to two ends of the second rubber frame. The composite heat-conducting PCB circuit board can reduce the volume of a heat dissipation device, meanwhile, the circuit board is convenient to mount, the heat-conducting plate is attached to the circuit board, the rate of guiding heat of the circuit board into a heat dissipation plate is increased, the circuit board and the heat dissipation device are convenient to connect and fix, and meanwhile, the circuit board and the heat dissipation device are convenient to detach.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a composite heat-conducting PCB circuit board.
Background
The circuit board makes the circuit miniaturisation, it is direct-viewing, play an important role in the batch production of the fixed circuit and optimizing the electric apparatus overall arrangement, the birth and development of FPC and PCB, hasten the new product of the rigid-flexible board, therefore, the rigid-flexible board, namely flexible circuit board and rigid circuit board, through processes such as the lamination, etc., according to the relevant technological requirement to combine together, the circuit board with FPC characteristic and PCB characteristic formed, along with the development of science and technology, the circuit board has played more and more important role, and the application field of the circuit board is more and more extensive, the existing circuit board will appear the phenomenon of generating heat after the long-time work;
the notice number is: CN214481951U, discloses a "compound heat conduction PCB circuit board, including base, backup pad, fly leaf and circuit board body, the top of base is equipped with the backup pad, backup pad bottom fixed connection is in the base top, has seted up two bar recesses in the backup pad, fly leaf swing joint is in backup pad bar recess department, and fly leaf one side has seted up the recess, circuit board body swing joint is in the fly leaf, the utility model discloses, through the mutually supporting of first heating panel, second heating panel, ventilation square hole and air vent, make the inside temperature of circuit board can obtain effectual reduction, prolonged the life of circuit board, in addition, through the mutually supporting of bracing piece, rubber sleeve, sliding block, first spring and connecting device, make the impact force that the circuit board body received reduce, the electronic component in the circuit board can not be because of external force damage", still there is certain drawback when using, and the area occupied of base is big, the installation of the circuit board of being not convenient for, and leaves the space between heat-conducting plate and the circuit board, and the heat of circuit board need pass through the leading-in heating panel of air, and rate of heat dissipation is slow, and connecting device's distance is fixed, and the circuit board is not convenient for block into between two connecting device.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a composite heat-conducting PCB circuit board which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the utility model provides a compound heat conduction PCB circuit board, includes a rubber frame, No. one rubber frame one side movable mounting has No. two rubber frames, a rubber frame with movable mounting has the circuit board between No. two rubber frames, a rubber frame with No. two rubber frame inside surface is close lower surface department fixed mounting and has insulating heat-conducting plate, insulating heat-conducting plate below movable mounting has the heating panel.
Preferably, the outer side surface of a rubber frame is close to equal fixed mounting in both ends department and has a thread bush No. one, the outer side surface of No. two rubber frames is close to equal fixed mounting in both ends department and has a thread bush No. two, the equal fixed mounting in heating panel both sides surface has a thread bush No. three.
Preferably, a screw is movably embedded in the upper surface of the first threaded sleeve, and the first threaded sleeve, the second threaded sleeve and the third threaded sleeve are movably connected through the screw.
Preferably, the circuit board is movably connected with the inner side surfaces of the first rubber frame and the second rubber frame, and metal frameworks are fixedly mounted inside the first rubber frame and the second rubber frame.
Preferably, the lower surface of the insulating heat conducting plate is close to four corners and is fixedly provided with a connecting rod, the lower surface of the insulating heat conducting plate is provided with a clamping groove, the upper surface of the heat radiating plate is fixedly provided with a heat conducting block, and the lower surface of the heat radiating plate is fixedly provided with a heat radiating fin.
Preferably, the heat conduction block passes through the draw-in groove with insulating heat-conducting plate swing joint, just the heat conduction block with the draw-in groove closely laminates, the mounting hole has all been seted up to the heating panel upper surface near four corners department, the rubber sleeve is installed to the inside equal activity embedding of mounting hole, the connecting rod activity alternate in inside the rubber sleeve, and the connecting rod outside surface with the inside surface of rubber sleeve closely laminates.
Compared with the prior art, the utility model has the following beneficial effects:
in the utility model, a first rubber frame and a second rubber frame are clamped on the outer side surface of a circuit board, the lower surface of the circuit board is attached to an insulating heat conducting plate, then a heat radiating plate is arranged on the lower surface of the insulating heat conducting plate, a heat conducting block is clamped into a clamping groove, a connecting rod is clamped into a rubber sleeve, the connecting rod is fixed through the elasticity of the rubber sleeve, so that the heat radiating plate is preliminarily fixed, then a screw is screwed into a first threaded sleeve, the screw penetrates through a second threaded sleeve and a third threaded sleeve, so that the heat radiating plate, the first rubber frame and the second rubber frame are fixed, meanwhile, the circuit board can be fixed at a mounting position through the screw, the heat generated during the work of the circuit board is transmitted to the heat radiating plate through the insulating heat conducting plate and then is discharged through a heat radiating fin, the contact area between the heat radiating block and the insulating heat conducting plate is enlarged, the heat transmission is accelerated, so that the circuit board is convenient to mount while the volume of a heat radiating device is reduced, and the insulating heat-conducting plate is attached to the circuit board, so that the rate of guiding heat of the circuit board into the heat dissipation plate is increased, the circuit board and the heat dissipation device are convenient to connect and fix, and the circuit board and the heat dissipation device are convenient to detach.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a composite heat-conducting PCB circuit board according to the present invention;
FIG. 2 is a disassembled view of the overall structure of a composite heat-conducting PCB circuit board of the present invention;
FIG. 3 is a cross-sectional view of a composite thermally conductive PCB circuit board of the present invention;
fig. 4 is a cross-sectional view of a heat sink and a rubber frame corner of a composite heat-conducting PCB of the present invention.
In the figure: 1. a first rubber frame; 101. a second rubber frame; 102. a first thread bush; 103. a second thread bush; 104. a screw; 2. an insulating heat-conducting plate; 201. a card slot; 202. a connecting rod; 3. a circuit board; 4. a heat dissipation plate; 401. a heat conducting block; 402. mounting holes; 403. a rubber sleeve; 404. a heat sink; 405. and a third thread bush.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1-4, a composite heat-conducting PCB circuit board comprises a first rubber frame 1, a second rubber frame 101 movably mounted on one side of the first rubber frame 1, a circuit board 3 movably mounted between the first rubber frame 1 and the second rubber frame 101, an insulating heat-conducting plate 2 fixedly mounted on the inner side surfaces of the first rubber frame 1 and the second rubber frame 101 near the lower surface, and a heat-dissipating plate 4 movably mounted below the insulating heat-conducting plate 2;
a first threaded sleeve 102 is fixedly arranged on the outer side surface of the first rubber frame 1 close to two ends, a second threaded sleeve 103 is fixedly arranged on the outer side surface of the second rubber frame 101 close to two ends, and a third threaded sleeve 405 is fixedly arranged on the two side surfaces of the heat dissipation plate 4; a screw 104 is movably embedded in the upper surface of the first threaded sleeve 102, and the first threaded sleeve 102, the second threaded sleeve 103 and the third threaded sleeve 405 are movably connected through the screw 104; the circuit board 3 is movably connected with the inner side surfaces of the first rubber frame 1 and the second rubber frame 101, and metal skeletons are fixedly arranged in the first rubber frame 1 and the second rubber frame 101; the connecting rods 202 are fixedly mounted on the lower surface of the insulating heat-conducting plate 2 close to the four corners, the clamping groove 201 is formed in the lower surface of the insulating heat-conducting plate 2, the heat-conducting block 401 is fixedly mounted on the upper surface of the heat-radiating plate 4, and the heat-radiating fins 404 are fixedly mounted on the lower surface of the heat-radiating plate 4; the heat conducting block 401 is movably connected with the insulating heat conducting plate 2 through the clamping groove 201, the heat conducting block 401 is tightly attached to the clamping groove 201, mounting holes 402 are formed in the upper surface of the heat radiating plate 4 close to four corners, rubber sleeves 403 are movably embedded in the mounting holes 402, the connecting rod 202 is movably inserted in the rubber sleeves 403, the outer side surface of the connecting rod 202 is tightly attached to the inner side surface of the rubber sleeve 403, the circuit board 3 can be fixed at a mounting position through screws 104, heat generated when the circuit board 3 works is transmitted to the heat radiating plate 4 through the insulating heat conducting plate 2 and then is discharged through the heat radiating fins 404, the heat conducting block 401 increases the contact area between the heat radiating plate 4 and the insulating heat conducting plate 2, and the heat transmission is accelerated, so that the circuit board 3 can be conveniently mounted while the size of the heat radiating device is reduced, the heat conducting plate 2 is attached to the circuit board 3, and the speed of guiding the heat of the circuit board 3 into the heat radiating plate 4 is accelerated, and the circuit board 3 and the heat dissipation device are convenient to connect and fix, and the circuit board is convenient to detach.
Example two:
it should be noted that, the utility model is a composite heat-conducting PCB circuit board, when in use, the first rubber frame 1 and the second rubber frame 101 are clamped on the outer side surface of the circuit board 3, so that the lower surface of the circuit board 3 is jointed with the insulating heat-conducting plate 2, then the heat-radiating plate 4 is arranged on the lower surface of the insulating heat-conducting plate 2, so that the heat-conducting block 401 is clamped in the clamping groove 201, and simultaneously the connecting rod 202 is clamped in the rubber sleeve 403, the connecting rod 202 is fixed by the self-elasticity of the rubber sleeve 403, so that the heat-radiating plate 4 is primarily fixed, then the screw 104 is screwed into the first thread sleeve 102, so that the screw 104 passes through the second thread sleeve 103 and the third thread sleeve 405, so that the heat-radiating plate 4, the first rubber frame 1 and the second rubber frame 101 are fixed, meanwhile, the circuit board 3 can be fixed at the installation position by the screw 104, the heat of the circuit board 3 during operation is transferred to the heat-radiating plate 4 by the insulating heat-conducting plate 2, then through the discharge of fin 404, heat conduction piece 401 increases the area of contact between heating panel 4 and the insulating heat-conducting plate 2, the transmission of the heat of acceleration to can make circuit board 3 be convenient for install when reducing the heat abstractor volume, and will laminate between insulating heat-conducting plate 2 and the circuit board 3, accelerate the speed of leading-in heating panel 4 of heat of circuit board 3, and make between circuit board 3 and the heat abstractor be convenient for connect fixedly, also make its convenient to detach simultaneously.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, and such changes and modifications are within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a compound heat conduction PCB circuit board which characterized in that: including a rubber frame (1), No. one rubber frame (1) one side movable mounting has No. two rubber frames (101), a rubber frame (1) with movable mounting has circuit board (3) between No. two rubber frames (101), a rubber frame (1) with No. two rubber frame (101) inboard surface is close lower surface department fixed mounting and has insulating heat-conducting plate (2), insulating heat-conducting plate (2) below movable mounting has heating panel (4).
2. The composite heat-conducting PCB circuit board of claim 1, wherein: the outer side surface of the first rubber frame (1) is close to both ends and is fixedly provided with a first threaded sleeve (102), the outer side surface of the second rubber frame (101) is close to both ends and is fixedly provided with a second threaded sleeve (103), and the surfaces of both sides of the heat dissipation plate (4) are fixedly provided with a third threaded sleeve (405).
3. The composite heat-conducting PCB circuit board of claim 2, wherein: a screw (104) is movably embedded in the upper surface of the first threaded sleeve (102), and the first threaded sleeve (102), the second threaded sleeve (103) and the third threaded sleeve (405) are movably connected through the screw (104).
4. The composite heat-conducting PCB circuit board of claim 3, wherein: the circuit board (3) is movably connected with the inner side surfaces of the first rubber frame (1) and the second rubber frame (101), and metal frameworks are fixedly arranged in the first rubber frame (1) and the second rubber frame (101).
5. The composite heat-conducting PCB circuit board of claim 4, wherein: the lower surface of the insulating heat-conducting plate (2) is close to the equal fixed mounting of four corners department and is provided with a connecting rod (202), the lower surface of the insulating heat-conducting plate (2) is provided with a clamping groove (201), the upper surface of the heat-radiating plate (4) is fixedly provided with a heat-conducting block (401), and the lower surface of the heat-radiating plate (4) is fixedly provided with a heat-radiating fin (404).
6. The composite heat-conducting PCB circuit board of claim 5, wherein: heat conduction piece (401) pass through draw-in groove (201) with insulating heat-conducting plate (2) swing joint, just heat conduction piece (401) with draw-in groove (201) closely laminates, mounting hole (402) have all been seted up to heating panel (4) upper surface nearly four corners department, rubber sleeve (403) have been installed to the inside equal activity embedding of mounting hole (402), connecting rod (202) activity alternate in inside rubber sleeve (403), and connecting rod (202) outside surface with the inside surface of rubber sleeve (403) closely laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123145379.XU CN216451593U (en) | 2021-12-15 | 2021-12-15 | Composite heat-conducting PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123145379.XU CN216451593U (en) | 2021-12-15 | 2021-12-15 | Composite heat-conducting PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216451593U true CN216451593U (en) | 2022-05-06 |
Family
ID=81375776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123145379.XU Active CN216451593U (en) | 2021-12-15 | 2021-12-15 | Composite heat-conducting PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216451593U (en) |
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2021
- 2021-12-15 CN CN202123145379.XU patent/CN216451593U/en active Active
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