CN219741105U - Vehicle-mounted patch power amplifier radiating and PCB fixing structure - Google Patents
Vehicle-mounted patch power amplifier radiating and PCB fixing structure Download PDFInfo
- Publication number
- CN219741105U CN219741105U CN202321101230.8U CN202321101230U CN219741105U CN 219741105 U CN219741105 U CN 219741105U CN 202321101230 U CN202321101230 U CN 202321101230U CN 219741105 U CN219741105 U CN 219741105U
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- China
- Prior art keywords
- middle frame
- power amplifier
- radiator
- heat dissipation
- heat
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a vehicle-mounted patch power amplifier radiating and PCB fixing structure in the technical field of automobile electronics, which comprises the following components: a middle frame; the circuit board is arranged at the top of the middle frame through screws; the radiator is movably arranged in the inner wall of the middle frame; the heat dissipation substrate is integrally formed with the middle frame and is the lower end face of the middle frame; the bottom laminating active patch power amplifier of circuit board, and the laminating of patch power amplifier is in the top of radiator has realized the inside and the heat source cooperation of radiator, and the outside dispels the heat through middle frame and the radiator that exposes, and it is more even and more high-efficient to dispel the heat.
Description
Technical Field
The utility model relates to the technical field of automobile electronics, in particular to a vehicle-mounted patch power amplifier radiating and PCB fixing structure.
Background
The vehicle-mounted power amplifier is commonly called as a loudspeaker, and has the function of amplifying weak signals from a sound source or a front-stage amplifier to drive a sound box to sound. Along with gradual upgrading of automobile electronics, the vehicle-mounted power amplifier is gradually developed to the patch power amplifier, and the vehicle-mounted power amplifier inevitably generates heat in the running process, so that certain requirements are also met for heat dissipation of the power amplifier.
The traditional and existing most of the structures for power amplifier heat dissipation of the side heat dissipation plate in the Chinese patent CN201921932034.9 are provided with heat dissipation holes or heat dissipation fins in the frame so as to achieve the effect of heat dissipation of the power amplifier.
However, this kind of structure is used for the power amplifier heat dissipation, generally transmits to the radiator after the power amplifier heat conduction, and the radiator is installed in the frame, and rethread frame conduction heat leads to the radiating area insufficient, and the radiating effect is slower.
Therefore, we propose a vehicle-mounted patch power amplifier heat dissipation and PCB fixing structure.
Disclosure of Invention
The utility model aims to provide a vehicle-mounted patch power amplifier radiating and PCB fixing structure so as to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a vehicle-mounted patch power amplifier radiating and PCB fixing structure comprises:
a middle frame;
the circuit board is arranged at the top of the middle frame through screws;
the radiator is movably arranged in the inner wall of the middle frame;
the heat dissipation substrate is integrally formed with the middle frame and is the lower end face of the middle frame;
the bottom of the circuit board is attached with the patch power amplifier, and the patch power amplifier is attached to the top of the radiator.
Further, a through groove is formed in the bottom of the middle frame, an inner groove is formed in the bottom of the heat dissipation substrate, and the radiator penetrates through the through groove and is installed inside the inner groove.
Further, a heat conducting medium mounting area matched with the patch power amplifier is arranged at the top of the radiator, and a heat conducting layer is arranged in an interlayer of the patch power amplifier and the heat conducting medium mounting area, and is made of heat conducting silica gel or heat conducting silicone grease.
Further, the radiator is attached to the end face of the inner wall of the middle frame and is uniformly provided with diamond-type micro foundation pits, and the outer wall of the middle frame is uniformly provided with radiating holes.
Further, the right end face and the bottom of the radiator are respectively provided with a threaded hole, the right end of the middle frame and the bottom of the radiating substrate are provided with positioning holes matched with the threaded holes, and the radiator is installed on the middle frame and the radiating substrate through screws.
Compared with the prior art, the utility model has the beneficial effects that: the circuit board is mounted on the middle frame in a limiting manner and fixed through the screws, the power amplifier on the circuit board is in limiting fit with the radiator through the heat conducting layer, and the radiator passes through the through groove and turns over again to realize the mounting of the inner and outer structures during assembly, so that the cooperation between the inside of the radiator and the heat source is realized, the heat dissipation is performed through the middle frame and the exposed radiator, and the heat dissipation is more uniform and efficient.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram showing a heat sink and middle frame assembly according to the present utility model;
FIG. 3 is a diagram showing the assembly and disassembly of the radiator and the middle frame of the present utility model;
FIG. 4 is a top view of the assembled heat sink and middle frame of the present utility model;
FIG. 5 is a schematic diagram of the assembly of a heat sink with a middle frame in accordance with the present utility model;
fig. 6 is a schematic diagram of the assembly of the radiator and the middle frame of the present utility model.
In the figure: 1. a middle frame; 2. a circuit board; 3. a heat sink; 4. a heat-dissipating substrate; 5. a patch power amplifier; 6. a heat-conducting medium mounting area; 7. and (5) through grooves.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, the present utility model provides a technical solution: a vehicle-mounted patch power amplifier radiating and PCB fixing structure comprises: the middle frame 1, middle frame 1 adopts panel beating integrated into one piece, have good stability and heat conductivity, circuit board 2 passes through the screw to be installed at the top of middle frame 1, be provided with spacing bed frame at the top of middle frame 1, spacing bed frame and middle frame 1 integrated into one piece and level setting, circuit board 2 then place on the top of spacing bed frame and pass through the fix with screw, radiator 3 on the middle frame 1, radiator 3 movable mounting is in the inner wall of middle frame 1, radiating base plate 4 and middle frame 1 integrated into one piece, and radiating base plate 4 is the lower terminal surface of middle frame 1, patch power amplifier 5 has been laminated to the bottom of circuit board 2, and patch power amplifier 5 laminating is at the top of radiator 3, radiator 3 spacing installation, then closely laminate at middle frame 1 and circuit board 2, the heat that the accessible radiator 3 will produce when circuit board 2 operates is conducted to on the middle frame 1 and is dispelled the heat fast, radiator 3 can be according to patch power amplifier 5's thermal power dissipation different, select different materials, optional aluminum plate or processing preparation.
Referring to fig. 2 and 3, a through groove 7 is formed in the bottom of the middle frame 1, an inner groove is formed in the bottom of the heat dissipation substrate 4, the radiator 3 passes through the through groove 7 and is installed in the inner groove, the bottom of the radiator 3 firstly passes through the through groove 7 and is provided with a rounded corner which can be turned and clamped in the inner groove, so that the contact ratio is ensured, and then the radiator 3 is fixedly connected with the middle frame 1 through a screw;
referring to fig. 1, a heat-conducting medium mounting area 6 matched with a patch power amplifier 5 is arranged at the top of a radiator 3, a heat-conducting layer is arranged in an interlayer between the patch power amplifier 5 and the heat-conducting medium mounting area 6, the heat-conducting layer is made of heat-conducting silica gel or heat-conducting silicone grease, and the heat-conducting layer is limited and attached to the radiator 3, so that the patch power amplifier 5 and the heat-conducting layer are limited and attached to the radiator 3, and good heat dissipation effect is ensured by adopting the heat-conducting silica gel or the heat-conducting silicone grease;
referring to fig. 4, the radiator 3 is attached to an end surface of an inner wall of the middle frame 1, and is uniformly provided with diamond-type micro pits, and the outer wall of the middle frame 1 is uniformly provided with heat dissipation holes, so that the heat dissipation area is increased in cooperation with the heat dissipation holes on the middle frame 1, and the heat dissipation effect is effectively achieved.
Examples: when the radiator 3 is used, the radiator 3 is firstly arranged in the inner wall of the middle frame 1, the bottom of the radiator 3 passes through the through groove 7 and then is turned over to be attached to the inner groove, then the radiator 3 is fixed on the inner wall of the middle frame 1 and the radiating substrate 4 through screws, then a heat conducting layer is attached to the heat conducting medium attaching area 6 at the top of the radiator 3, then the patch power amplifier 5 is arranged at the bottom of the circuit board 2, the patch power amplifier 5 and the heat conducting layer are attached together, and finally the circuit board 2 is arranged on the top of the middle frame 1 in a limiting mode and is fixed through screws, and heat generated by the circuit board 2 during operation is conducted to the middle frame 1 and the radiating substrate 4.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. Vehicle-mounted patch power amplifier radiating and PCB fixing structure is characterized by comprising:
a middle frame (1);
the circuit board (2) is arranged at the top of the middle frame (1) through screws;
the radiator (3) is movably arranged in the inner wall of the middle frame (1);
the heat dissipation substrate (4), the heat dissipation substrate (4) and the middle frame (1) are integrally formed, and the heat dissipation substrate (4) is the lower end surface of the middle frame (1);
the patch power amplifier (5) is attached to the bottom of the circuit board (2), and the patch power amplifier (5) is attached to the top of the radiator (3).
2. The vehicle-mounted patch power amplifier heat dissipation and PCB fixing structure as set forth in claim 1, wherein: the bottom of well frame (1) is provided with logical groove (7), the bottom of radiating base plate (4) is provided with the inner groovedly, and radiator (3) pass logical groove (7) and install inside the inner groovedly.
3. The vehicle-mounted patch power amplifier heat dissipation and PCB fixing structure as set forth in claim 1, wherein: the top of radiator (3) sets up heat conduction medium dress district (6) with paster power amplifier (5) matching, and is provided with the heat conduction layer in paster power amplifier (5) and heat conduction medium dress district (6) intermediate layer, and the heat conduction layer is heat conduction silica gel or heat conduction silicone grease.
4. The vehicle-mounted patch power amplifier heat dissipation and PCB fixing structure as set forth in claim 1, wherein: the radiator (3) is attached to the end face of the inner wall of the middle frame (1) and is uniformly provided with diamond-type micro foundation pits, and the outer wall of the middle frame (1) is uniformly provided with radiating holes.
5. The vehicle-mounted patch power amplifier heat dissipation and PCB fixing structure as set forth in claim 1, wherein: the right end face and the bottom of the radiator (3) are respectively provided with a threaded hole, the right end of the middle frame (1) and the bottom of the radiating substrate (4) are provided with positioning holes matched with the threaded holes, and the radiator (3) is installed on the middle frame (1) and the radiating substrate (4) through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321101230.8U CN219741105U (en) | 2023-05-09 | 2023-05-09 | Vehicle-mounted patch power amplifier radiating and PCB fixing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321101230.8U CN219741105U (en) | 2023-05-09 | 2023-05-09 | Vehicle-mounted patch power amplifier radiating and PCB fixing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219741105U true CN219741105U (en) | 2023-09-22 |
Family
ID=88052547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321101230.8U Active CN219741105U (en) | 2023-05-09 | 2023-05-09 | Vehicle-mounted patch power amplifier radiating and PCB fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219741105U (en) |
-
2023
- 2023-05-09 CN CN202321101230.8U patent/CN219741105U/en active Active
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