CN210444697U - Controller heat radiation structure - Google Patents
Controller heat radiation structure Download PDFInfo
- Publication number
- CN210444697U CN210444697U CN201920921631.5U CN201920921631U CN210444697U CN 210444697 U CN210444697 U CN 210444697U CN 201920921631 U CN201920921631 U CN 201920921631U CN 210444697 U CN210444697 U CN 210444697U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- controller
- ceramic
- dissipation plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 99
- 239000000919 ceramic Substances 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 239000000110 cooling liquid Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a controller heat radiation structure, including controller (8) and ceramic heating panel (9), ceramic heating panel (9) and controller (8) between fixed connection become laminated structure, controller (8) and ceramic heating panel (9) between form heat conduction structure. Furthermore, a laminated structure is formed between the ceramic heat dissipation plate (9) and the shell (2), and a heat conduction structure is formed between the ceramic heat dissipation plate (9) and the shell (2). The utility model discloses a set up ceramic heating panel and make and form heat conduction structure between controller and the ceramic heating panel, can make the produced heat of controller carry out the heat transfer through ceramic heating panel in time to improve the heat-sinking capability of controller, also reduced the short circuit risk of controller simultaneously, greatly improved the operational reliability and the life of controller.
Description
Technical Field
The utility model belongs to the technical field of the controller heat dissipation design and specifically relates to a controller heat radiation structure who is applied to electronic pump is related to.
Background
The controller has larger heat productivity in the working process, and the reliable and stable working of the controller has higher requirements on the ambient temperature, so the heat dissipation design of the controller is particularly important, and the controller is particularly applied to the controller of an electronic water pump and has higher requirements on heat dissipation.
The existing electronic water pump adopts a cooling liquid internal circulation heat dissipation mode, and because the outlet pressure of the water pump is greater than the inlet pressure, the cooling liquid can flow into an inlet through an inner hole of the hollow shaft so as to realize cooling liquid circulation. The heat dissipation design of the controller is mainly that heat dissipation silica gel is smeared at the bottom of the controller, and the controller and the heat dissipation shell are connected through the heat dissipation silica gel to conduct heat conduction and heat dissipation. The heat dissipation design mainly has the following two defects:
(1) because the heat dissipation coefficient of heat dissipation silica gel is low, and heat dissipation silica gel is the jelly, need paint in heat dissipation casing bottom earlier, then compress tightly through the control panel afterburning and make it distribute in the bottom. Because the pressure distribution is uneven in the pressing-in process, the heat dissipation silica gel is unevenly distributed at the bottom of the shell, even air holes exist, and the combination of the heat dissipation silica gel and the air holes easily causes the controller to be burnt due to poor heat dissipation.
(2) And because the linear expansion coefficient of the heat dissipation silica gel is higher, the controller is extruded due to expansion under the high-temperature working condition, so that the pins of components of the controller are easy to fall off, and the failure of the controller is caused.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: to the problems existing in the prior art, the controller heat dissipation structure is provided, and the heat dissipation performance of the controller is improved.
The to-be-solved technical problem of the utility model adopts following technical scheme to realize: a controller heat radiation structure comprises a controller and a ceramic heat radiation plate, wherein the ceramic heat radiation plate and the controller are fixedly connected to form a laminated structure, and a heat conduction structure is formed between the controller and the ceramic heat radiation plate.
Preferably, the ceramic heat dissipation plate further comprises a shell, a laminated structure is formed between the ceramic heat dissipation plate and the shell, and a heat conduction structure is formed between the ceramic heat dissipation plate and the shell.
Preferably, an upper heat conduction layer is arranged between the ceramic heat dissipation plate and the shell, and a heat conduction structure is formed among the ceramic heat dissipation plate, the upper heat conduction layer and the shell.
Preferably, the upper heat conduction layer is formed by coating a heat dissipation material with a certain thickness on the upper contact surface of the ceramic heat dissipation plate.
Preferably, a corrugated structure is formed on an upper contact surface of the ceramic heat dissipation plate.
Preferably, the bottom end contact surface of the housing is formed with a corrugated structure.
Preferably, a lower heat conduction layer is arranged between the ceramic heat dissipation plate and the controller, and a heat conduction structure is formed among the ceramic heat dissipation plate, the lower heat conduction layer and the controller.
Preferably, the lower heat conductive layer is formed by coating a certain thickness of heat dissipation material on the lower contact surface of the ceramic heat dissipation plate.
Preferably, a corrugated structure is formed on the lower contact surface of the ceramic heat dissipation plate.
Preferably, a detachable fixed connection structure is formed between the ceramic heat dissipation plate and the controller through a fixing screw.
Compared with the prior art, the beneficial effects of the utility model are that: through setting up ceramic heating panel and making it and fixed connection become laminated structure between the controller, and form heat conduction structure between controller and the ceramic heating panel to can make the produced heat of controller carry out the heat transfer through ceramic heating panel in time, improve the heat-sinking capability of controller, also can reduce the short circuit risk of controller simultaneously, consequently, greatly improved the operational reliability and the life of controller.
Drawings
Fig. 1 is the utility model relates to a controller heat radiation structure is applied to electronic pump's structure schematic diagram.
Fig. 2 is a cross-sectional view of the heat dissipation structure of the controller of the present invention.
Part label name in the figure: 1-capacitor, 2-shell, 3-stator, 4-rotating shaft, 5-rotor, 6-bearing, 7-fixing screw, 8-controller, 9-ceramic heat dissipation plate, 10-upper heat conduction layer, 11-lower heat conduction layer and 12-corrugated structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The controller heat dissipation structure shown in fig. 2 mainly includes a controller 8 and a ceramic heat dissipation plate 9, the ceramic heat dissipation plate 9 and the controller 8 are fixedly connected to form a laminated structure, and a heat conduction structure is formed between the controller 8 and the ceramic heat dissipation plate 9. Usually, the ceramic heat sink 9 and the controller 8 are detachably fixed and connected by fixing screws. Therefore, the heat generated by the controller 8 in the working process can be transferred through the ceramic heat dissipation plate 9 in time, so that the heat dissipation capability of the controller 8 is improved, and meanwhile, the short circuit risk of the controller 8 is reduced, and the working reliability and the service life of the controller 8 are improved.
In order to further improve the heat dissipation capability of the controller 8, a lower heat conduction layer 11 may be disposed between the ceramic heat dissipation plate 9 and the controller 8, and a heat conduction structure is formed among the ceramic heat dissipation plate 9, the lower heat conduction layer 11, and the controller 8. Generally, the lower heat conducting layer 11 can be a heat conducting pad, and can also be formed by coating a certain thickness of heat dissipation material on the lower contact surface of the ceramic heat dissipation plate 9, and the heat dissipation material generally includes heat dissipation silicone grease, heat dissipation silicone rubber, and the like. In addition, a corrugated structure 12 may be formed on the lower contact surface of the ceramic heat dissipation plate 9 to increase the contact area between the lower heat conduction layer 11 and the ceramic heat dissipation plate 9, which is beneficial to enhancing the heat dissipation performance of the controller 8.
When the controller heat dissipation structure is applied to an electronic water pump, as shown in fig. 1, a controller 8 and a ceramic heat dissipation plate 9 are fixed on a shell 2 through a fixing screw 7, a capacitor 1, a stator 3 and a rotor 5 are installed in an inner cavity of the shell 2, the stator 3 is fixedly connected with the shell 2, the rotor 5 is fixedly connected with a rotating shaft 4, the rotating shaft 4 is a hollow shaft, and the rotating shaft 4 is supported through a bearing 6; the capacitor 1 is arranged below the controller 8. A laminated structure is formed between the ceramic heat dissipation plate 9 and the housing 2, and a heat conduction structure is formed between the ceramic heat dissipation plate 9 and the housing 2. An upper heat conducting layer 10 can be additionally arranged between the ceramic heat radiating plate 9 and the shell 2, and a heat conducting structure is formed among the ceramic heat radiating plate 9, the upper heat conducting layer 10 and the shell 2. The upper heat conducting layer 10 may be a heat conducting pad, or may be formed by coating a certain thickness of heat dissipation material on the upper contact surface of the ceramic heat dissipation plate 9, where the heat dissipation material generally includes heat dissipation silicone grease, heat dissipation silicone rubber, and the like. A corrugated structure 12 may be formed on the bottom contact surface of the housing 2 and the upper contact surface of the ceramic heat dissipation plate 9, respectively.
By adopting the structural design, the heat generated by the controller 8 is directly transferred to the shell 2 through the ceramic heat dissipation plate 9 and finally taken away by the cooling liquid, so that the heat dissipation capacity of the controller 8 can be greatly improved, the short circuit risk is reduced, the working reliability of the electronic water pump is further ensured, and the electronic water pump is particularly suitable for high-power electronic water pumps. It should be noted that: the contact surface of the shell 2 and the contact surface of the ceramic heat dissipation plate 9 are not limited to form the corrugated structure 12, the contact surface of the shell 2 and the contact surface of the ceramic heat dissipation plate 9 can be respectively formed with a peak-valley unevenness by machining, and the distance between two adjacent peaks or two adjacent valleys is less than 1mm, so that the heat conduction contact area between the ceramic heat dissipation plate 9 and the controller 8 and between the ceramic heat dissipation plate 9 and the shell 2 is increased, and further the heat dissipation performance of the controller 8 and the electronic water pump is improved.
The above description is only exemplary of the present invention and should not be taken as limiting, and all changes, equivalents, and improvements made within the spirit and principles of the present invention should be understood as being included in the scope of the present invention.
Claims (10)
1. A controller heat radiation structure, includes controller (8), its characterized in that: the heat dissipation structure is characterized by further comprising a ceramic heat dissipation plate (9), the ceramic heat dissipation plate (9) and the controller (8) are fixedly connected to form a laminated structure, and a heat conduction structure is formed between the controller (8) and the ceramic heat dissipation plate (9).
2. The heat dissipation structure of claim 1, wherein: the ceramic heat dissipation plate is characterized by further comprising a shell (2), a laminated structure is formed between the ceramic heat dissipation plate (9) and the shell (2), and a heat conduction structure is formed between the ceramic heat dissipation plate (9) and the shell (2).
3. The heat dissipation structure of claim 2, wherein: an upper heat conduction layer (10) is arranged between the ceramic heat dissipation plate (9) and the shell (2), and a heat conduction structure is formed among the ceramic heat dissipation plate (9), the upper heat conduction layer (10) and the shell (2).
4. The heat dissipation structure of claim 3, wherein: the upper heat conduction layer (10) is formed by coating a certain thickness of heat dissipation material on the upper contact surface of the ceramic heat dissipation plate (9).
5. The heat dissipation structure of claim 4, wherein: the upper contact surface of the ceramic heat dissipation plate (9) is provided with a corrugated structure (12).
6. The heat dissipation structure of claim 2, wherein: and a corrugated structure (12) is formed on the bottom end contact surface of the shell (2).
7. The controller heat dissipation structure according to any one of claims 1 to 6, wherein: a lower heat conduction layer (11) is arranged between the ceramic heat dissipation plate (9) and the controller (8), and a heat conduction structure is formed among the ceramic heat dissipation plate (9), the lower heat conduction layer (11) and the controller (8).
8. The heat dissipation structure of claim 7, wherein: the lower heat conducting layer (11) is formed by coating a certain thickness of heat dissipation material on the lower contact surface of the ceramic heat dissipation plate (9).
9. The heat dissipation structure of claim 8, wherein: the lower contact surface of the ceramic heat dissipation plate (9) is provided with a corrugated structure (12).
10. The controller heat dissipation structure according to any one of claims 1 to 6, wherein: the ceramic heat dissipation plate (9) and the controller (8) form a detachable fixed connection structure through a fixing screw (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920921631.5U CN210444697U (en) | 2019-06-19 | 2019-06-19 | Controller heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920921631.5U CN210444697U (en) | 2019-06-19 | 2019-06-19 | Controller heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210444697U true CN210444697U (en) | 2020-05-01 |
Family
ID=70403623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920921631.5U Active CN210444697U (en) | 2019-06-19 | 2019-06-19 | Controller heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210444697U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225692A (en) * | 2019-06-19 | 2019-09-10 | 绵阳富临精工机械股份有限公司 | A kind of controller radiator structure and electronic water pump heat dissipating method |
-
2019
- 2019-06-19 CN CN201920921631.5U patent/CN210444697U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225692A (en) * | 2019-06-19 | 2019-09-10 | 绵阳富临精工机械股份有限公司 | A kind of controller radiator structure and electronic water pump heat dissipating method |
| CN110225692B (en) * | 2019-06-19 | 2024-09-20 | 四川芯智热控技术有限公司 | Controller heat dissipation structure and electronic water pump heat dissipation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113236576B (en) | electric pump | |
| CN210444697U (en) | Controller heat radiation structure | |
| CN210443641U (en) | Battery pack cooling system | |
| CN215611090U (en) | Magnetic stirrer | |
| CN217283820U (en) | Power supply with air cooling and liquid cooling device | |
| CN110225692B (en) | Controller heat dissipation structure and electronic water pump heat dissipation method | |
| CN209861447U (en) | Heat radiation structure of motor controller | |
| CN221151622U (en) | Porous heat dissipation circuit board structure | |
| CN219068755U (en) | Heat radiation structure and terminal applying same | |
| CN221381548U (en) | Driving plate for display equipment | |
| CN214316034U (en) | Heat radiation structure and machine controller of female arranging | |
| CN212486871U (en) | Energy-efficient printed board subassembly | |
| CN219248445U (en) | Kong Dianlu board in disc for industrial control software | |
| CN218939872U (en) | Battery module | |
| CN214188820U (en) | Laminated electric heating plate of laminating machine | |
| CN214627815U (en) | Novel heat dissipation supporting device of power element for controller | |
| CN219801056U (en) | Liquid cooling energy storage battery optimizer heat radiation structure | |
| CN219802920U (en) | Efficient heat dissipation type industrial power supply | |
| CN218386841U (en) | Charger with good heat dissipation performance | |
| CN218996532U (en) | Novel heat dissipation paster electric capacity | |
| CN215420913U (en) | High-efficient heat dissipation type PCB | |
| CN217334068U (en) | Power semiconductor module with heat-conducting silica gel sheet | |
| CN214901425U (en) | Hard circuit board with good heat dissipation performance | |
| CN221299499U (en) | Horizontal compressor controller | |
| CN221531958U (en) | Domain controller with condensation prevention structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 37 Fenghuang Middle Road, High end Equipment Manufacturing Industrial Park, Mianyang City, Sichuan Province, 621000 Patentee after: Fulin Precision Co.,Ltd. Address before: No. 37 Fenghuang Middle Road, High end Equipment Manufacturing Industrial Park, Mianyang City, Sichuan Province, 621000 Patentee before: Mianyang Fulin Jinggong Co.,Ltd. Address after: No. 37 Fenghuang Middle Road, High end Equipment Manufacturing Industrial Park, Mianyang City, Sichuan Province, 621000 Patentee after: Mianyang Fulin Jinggong Co.,Ltd. Address before: No. 37 Fenghuang Middle Road, High end Equipment Manufacturing Industrial Park, Mianyang City, Sichuan Province, 621000 Patentee before: MIANYANG FULIN PRECISION MACHINING Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231108 Address after: 621000 No. 27, longhui Road, Guangfu village, Wujia Town, Fucheng District, Mianyang City, Sichuan Province Patentee after: Sichuan Xinzhi Thermal Control Technology Co.,Ltd. Address before: No. 37 Fenghuang Middle Road, High end Equipment Manufacturing Industrial Park, Mianyang City, Sichuan Province, 621000 Patentee before: Fulin Precision Co.,Ltd. |