CN214901425U - Hard circuit board with good heat dissipation performance - Google Patents
Hard circuit board with good heat dissipation performance Download PDFInfo
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- CN214901425U CN214901425U CN202120934363.8U CN202120934363U CN214901425U CN 214901425 U CN214901425 U CN 214901425U CN 202120934363 U CN202120934363 U CN 202120934363U CN 214901425 U CN214901425 U CN 214901425U
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- circuit board
- heat dissipation
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- heat
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Abstract
The utility model discloses a stereoplasm circuit board that heat dispersion is good, including the protective frame body, both ends run through about the protective frame body and seted up first cell body, first cell body inner wall fixed paste is connected with stereoplasm circuit board body, protective frame body lower extreme fixed mounting has the first supporting shoe of symmetry, first supporting shoe lower extreme fixed mounting has the heating panel, heating panel lower extreme four corners edge fixed mounting has the second supporting shoe, both ends run through about the stereoplasm circuit board body and have seted up first louvre, both ends run through about the first supporting shoe and have seted up the second cell body, second cell body inner wall activity is provided with the movable block, heating panel lower extreme activity is provided with the mounting panel. This stereoplasm circuit board that heat dispersion is good through setting up the protective frame body, has improved the protection effect to stereoplasm circuit board body, through setting up endothermic copper sheet and heat conduction piece, has improved the radiating effect of stereoplasm circuit board, has prolonged the life of stereoplasm circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a stereoplasm circuit board that heat dispersion is good.
Background
The circuit board makes the circuit miniaturized, direct-viewing, plays important role to fixed circuit's batch production and optimization electrical apparatus overall arrangement, and the circuit board has already taken an important position in the electronic industry at present, and the name of circuit board has: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc.
Electronic parts generate large heat, the requirement on the heat dissipation performance of a circuit board is higher and higher, the existing hard circuit board does not have a heat dissipation structure, the heat of the electronic parts cannot be dissipated quickly, and the service life of the circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a stereoplasm circuit board that heat dispersion is good to propose the thermal problem of unable rapid diffusion electronic part in solving above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a stereoplasm circuit board that heat dispersion is good, includes the protective frame body, both ends run through and have seted up first cell body about the protective frame body, first cell body inner wall fixed paste is connected with stereoplasm circuit board body, protective frame body lower extreme fixed mounting has the first supporting shoe of symmetry, first supporting shoe lower extreme fixed mounting has the heating panel, heating panel lower extreme four corners edge fixed mounting has the second supporting shoe, both ends run through and have seted up first louvre about the stereoplasm circuit board body, both ends run through and have seted up the second cell body about the first supporting shoe, second cell body inner wall activity is provided with the movable block, heating panel lower extreme activity is provided with the mounting panel, mounting panel lower extreme fixed mounting has the motor, the output shaft upper end of motor runs through mounting panel fixedly connected with flabellum.
Preferably, both ends evenly distributed about the stereoplasm circuit board body are in first louvre, both ends evenly distributed about first supporting block are in the second cell body, the activity of mounting panel lower extreme is provided with the bolt, the bolt upper end runs through the mounting panel and extends to in the wall layer of heating panel.
Preferably, ventilation grooves are formed in the upper end and the lower end of the heat dissipation plate in a penetrating mode, the movable block is of a hollow structure, second heat dissipation holes are formed in the upper end and the lower end of the movable block in a penetrating mode, and the second heat dissipation holes are evenly distributed in the upper end and the lower end of the movable block.
Preferably, the lower end of the hard circuit board body is fixedly adhered with a heat absorption copper sheet, the lower end of the heat absorption copper sheet is fixedly provided with heat conduction blocks, and the heat conduction blocks are uniformly distributed at the lower end of the heat absorption copper sheet.
Preferably, the lower end face of the heat conducting block is attached to the upper end face of the movable block, the heat conducting block is of a cuboid structure, and the front end face and the rear end face of the heat conducting block and the front end face and the rear end face of the movable block are located on the same plane.
Preferably, both ends face is in the coplanar with the protection framework about both ends face about first supporting block, the size of protection framework is less than the size of radiator plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. according to the hard circuit board with good heat dissipation performance, the protection effect on the hard circuit board body is improved by arranging the protection frame body, the heat dissipation effect of the hard circuit board is improved by arranging the heat absorption copper sheet and the heat conduction block, and the service life of the hard circuit board is prolonged;
2. according to the hard circuit board with good heat dissipation performance, the lower end of the hard circuit board body is arranged in a suspended mode through the arrangement of the first supporting block, so that the contact area of the hard circuit board body and air is increased, the heat dissipation effect of the hard circuit board body is improved, and the heat dissipation effect of the hard circuit board body is improved through the arrangement of the first heat dissipation holes;
3. this stereoplasm circuit board that heat dispersion is good through setting up the second louvre to and the movable block is hollow structure's setting, has improved the radiating effect of movable block, through setting up mounting panel and bolt, does benefit to the quick installation of mounting panel, through setting up motor and flabellum, has improved the radiating effect to stereoplasm circuit board body.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the internal cross-sectional structure of the protection frame of the present invention;
fig. 3 is a schematic view of the movable block structure of the present invention.
In the figure: 1. a protective frame body; 2. a first tank body; 3. a rigid circuit board body; 4. a first support block; 5. a heat dissipation plate; 6. a second support block; 7. a first heat dissipation hole; 8. a second tank body; 9. a movable block; 10. mounting a plate; 11. a motor; 12. a fan blade; 13. a ventilation slot; 14. a second heat dissipation hole; 15. a heat conducting block; 16. a heat absorbing copper sheet; 17. and (4) bolts.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a stereoplasm circuit board that heat dispersion is good, includes protection framework 1, its characterized in that: the upper end and the lower end of the protection frame body 1 are penetrated and provided with a first groove body 2, the inner wall of the first groove body 2 is fixedly pasted and connected with a hard circuit board body 3, the lower end of the protection frame body 1 is fixedly provided with symmetrical first supporting blocks 4, the lower end of the first supporting blocks 4 is fixedly provided with a heat dissipation plate 5, the lower end of the heat dissipation plate 5 is fixedly provided with a second supporting block 6, the upper end and the lower end of the hard circuit board body 3 are penetrated and provided with first heat dissipation holes 7, the left end and the right end of the first supporting blocks 4 are penetrated and provided with second groove bodies 8, the inner wall of the second groove bodies 8 is movably provided with movable blocks 9, the lower end of the heat dissipation plate 5 is movably provided with a mounting plate 10, the lower end of the mounting plate 10 is fixedly provided with a motor 11, the upper end of an output shaft of the motor 11 is penetrated and fixedly connected with fan blades 12, the left end face and the right end face of the first supporting blocks 4 and the left end face and the right end face of the protection frame body 1 are in the same plane, and the size of the protection frame body 1 is smaller than the size of the heat dissipation plate 5.
Referring to fig. 2 and 3, the first heat dissipation holes 7 are uniformly distributed at the upper and lower ends of the rigid circuit board body 3, the second groove body 8 is uniformly distributed at the left and right ends of the first support block 4, the lower end of the mounting plate 10 is movably provided with a bolt 17, the upper end of the bolt 17 penetrates through the mounting plate 10 and extends into the wall layer of the heat dissipation plate 5, the upper and lower ends of the heat dissipation plate 5 are penetrated and provided with ventilation grooves 13, the movable block 9 is of a hollow structure, the upper and lower ends of the movable block 9 are penetrated and provided with second heat dissipation holes 14, the second heat dissipation holes 14 are uniformly distributed at the upper and lower ends of the movable block 9, the lower end of the rigid circuit board body 3 is fixedly adhered and connected with a heat absorption copper sheet 16, the lower end of the heat absorption copper sheet 16 is fixedly provided with a heat conduction block 15, the heat conduction block 15 is uniformly distributed at the lower end of the heat absorption copper sheet 16, the lower end face of the heat conduction block 15 is adhered to the upper end face of the movable block 9, the heat conduction block 15 is of a rectangular parallelepiped structure, and the front and rear end faces of the heat conduction block 15 are in the same plane as the front and rear end faces of the movable block 9.
The effect of mounting panel 10 quick installation at heating panel 5 lower extreme has been realized in setting up of mounting panel 10 and bolt 17, and the equipment is convenient, and the setting of motor 11 and flabellum 12 has improved the radiating effect to stereoplasm circuit board body 3, and the setting of endothermic copper sheet 16 and heat conduction piece 15 can be with stereoplasm circuit board body 3 on produced partial heat conduction to movable block 9 at the during operation, and the setting of movable block 9 and second louvre 14 has improved the radiating effect of stereoplasm circuit board body 3.
The working principle is as follows: firstly, the movable block 9 is installed in the second groove 8, the heat absorbing copper sheet 16 is pasted and installed on the lower end face of the hard circuit board body 3, the heat conducting blocks 15 are pasted and installed at the lower end of the heat absorbing copper sheet 16, the hard circuit board body 3 is pasted and installed on the inner wall of the protective frame body 1, the lower end of the heat conducting block 15 is attached to the upper end of the movable block 9, the fan blade 12 is rotated by starting the motor 11, heat can be dissipated to the hard circuit board body 3, when the hard circuit board body 3 generates heat, partial heat is transferred to the movable block 9 through the heat absorbing copper sheet 16 and the heat conducting block 15, and heat dissipation of the hard circuit board body 3 is accelerated.
It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. The utility model provides a stereoplasm circuit board that heat dispersion is good, includes the protection framework, its characterized in that: the utility model discloses a protection framework, including protection framework, first cell body inner wall fixed pasting and be connected with stereoplasm circuit board body, protection framework lower extreme fixed mounting has the first supporting shoe of symmetry, first supporting shoe lower extreme fixed mounting has the heating panel, heating panel lower extreme four corners edge fixed mounting has the second supporting shoe, the first louvre has been seted up in both ends running through about the stereoplasm circuit board body, the second cell body has been seted up in both ends running through about first supporting shoe, second cell body inner wall activity is provided with the movable block, heating panel lower extreme activity is provided with the mounting panel, mounting panel lower extreme fixed mounting has the motor, the output shaft upper end of motor runs through mounting panel fixedly connected with flabellum.
2. The hard circuit board with good heat dissipation performance according to claim 1, wherein: first louvre both ends evenly distributed about the stereoplasm circuit board body, both ends evenly distributed about first supporting block is controlled to the second cell body, the activity of mounting panel lower extreme is provided with the bolt, the bolt upper end runs through in the mounting panel extends to the wall layer of heating panel.
3. The hard circuit board with good heat dissipation performance according to claim 1, wherein: the upper end and the lower end of the heat dissipation plate are provided with ventilation grooves in a penetrating mode, the movable block is of a hollow structure, the upper end and the lower end of the movable block are provided with second heat dissipation holes in a penetrating mode, and the second heat dissipation holes are evenly distributed in the upper end and the lower end of the movable block.
4. The hard circuit board with good heat dissipation performance according to claim 1, wherein: the heat absorption circuit board is characterized in that a heat absorption copper sheet is fixedly bonded to the lower end of the hard circuit board body, heat conduction blocks are fixedly mounted at the lower end of the heat absorption copper sheet, and the heat conduction blocks are uniformly distributed at the lower end of the heat absorption copper sheet.
5. The hard circuit board with good heat dissipation performance according to claim 4, wherein: the lower end face of the heat conducting block is attached to the upper end face of the movable block, the heat conducting block is of a cuboid structure, and the front end face and the rear end face of the heat conducting block and the front end face and the rear end face of the movable block are located on the same plane.
6. The hard circuit board with good heat dissipation performance according to claim 1, wherein: both ends face is in the coplanar with the protection framework about both ends face about first bracer, the size of protection framework is less than the size of radiator plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120934363.8U CN214901425U (en) | 2021-05-03 | 2021-05-03 | Hard circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120934363.8U CN214901425U (en) | 2021-05-03 | 2021-05-03 | Hard circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214901425U true CN214901425U (en) | 2021-11-26 |
Family
ID=78889593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120934363.8U Active CN214901425U (en) | 2021-05-03 | 2021-05-03 | Hard circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214901425U (en) |
-
2021
- 2021-05-03 CN CN202120934363.8U patent/CN214901425U/en active Active
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