CN220108516U - Mainboard heat dissipation mechanism for intelligent voice interaction equipment - Google Patents
Mainboard heat dissipation mechanism for intelligent voice interaction equipment Download PDFInfo
- Publication number
- CN220108516U CN220108516U CN202320656833.8U CN202320656833U CN220108516U CN 220108516 U CN220108516 U CN 220108516U CN 202320656833 U CN202320656833 U CN 202320656833U CN 220108516 U CN220108516 U CN 220108516U
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- CN
- China
- Prior art keywords
- heat dissipation
- contact piece
- main board
- voice interaction
- frame
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 230000003993 interaction Effects 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 title claims abstract description 17
- 238000009434 installation Methods 0.000 claims abstract description 11
- 239000000428 dust Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a main board radiating mechanism for intelligent voice interaction equipment, which comprises a main board and an installation frame, wherein clamping blocks are arranged at four corners of the main board, clamping grooves matched with the clamping blocks are arranged at four corners of the installation frame, a heat conducting strip and a first contact piece are arranged on the back surface of the main board, the heat conducting strip is connected with the first contact piece, a fan is arranged on a bottom plate of the installation frame, a radiating frame is arranged above the fan, a plurality of radiating fins are arranged at the bottom end of the radiating frame and are in contact with the fan, a second contact piece is arranged at the top end of the radiating frame, and the first contact piece is in fit with the second contact piece; according to the utility model, through the arrangement of the integral structure, the heat dissipation effect on the main board is improved, and the situation of performance reduction caused by overhigh temperature is avoided.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a main board radiating mechanism for intelligent voice interaction equipment.
Background
The voice interaction refers to the process of information transmission among people and equipment through natural voice, the voice interaction can liberate both hands and eyes, the safety is higher in driving by navigation, and meanwhile, the instruction issuing is more convenient through the voice interaction mode.
The mainboard of the existing intelligent voice interaction equipment is required to be integrated with a voice acquisition module, a voice processing module and the like, so that a large amount of heat can be generated during working, heat dissipation treatment is required to be carried out on the mainboard, the patent with the application number of CN202121735079.4 discloses an intelligent voice interaction printed circuit board, the effect of heat dissipation on the printed circuit board is achieved through the cooperation of a heat dissipation fan and a heat dissipation hole, but the heat dissipation effect of the heat dissipation mode is not good enough, and the mainboard can also have the condition that the performance is reduced due to overhigh temperature.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a main board radiating mechanism for intelligent voice interaction equipment.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model relates to a main board radiating mechanism for intelligent voice interaction equipment, which comprises a main board and an installation frame, wherein clamping blocks are arranged at four corners of the main board, clamping grooves matched with the clamping blocks are arranged at four corners of the installation frame, a heat conducting strip and a first contact piece are arranged on the back surface of the main board, the heat conducting strip is connected with the first contact piece, a fan is arranged on a bottom plate of the installation frame, a radiating frame is arranged above the fan, a plurality of radiating fins are arranged at the bottom end of the radiating frame and are in contact with the fan, a second contact piece is arranged at the top end of the radiating frame, and the first contact piece is in fit with the second contact piece.
As a preferable technical scheme of the utility model, a plurality of heat conducting strips are arranged, and the plurality of heat conducting strips are arranged in a meshed and staggered mode.
As a preferable technical scheme of the utility model, the bottom plate of the mounting frame is provided with a plurality of heat dissipation holes.
As a preferable technical scheme of the utility model, a dustproof net is arranged in the radiating hole.
As a preferable technical scheme of the utility model, the middle parts of the plurality of radiating fins are provided with radiating channels, and the radiating channels are perpendicular to the radiating fins.
As a preferable technical scheme of the utility model, a silica gel heat conduction layer is arranged between the first contact piece and the second contact piece.
The beneficial effects of the utility model are as follows: according to the mainboard radiating mechanism for the intelligent voice interaction equipment, the heat conducting strip and the first contact piece are arranged on the back surface of the mainboard, and the heat conducting strip is connected with the first contact piece to conduct heat generated by the mainboard to the first contact piece; through being equipped with the fan on the bottom plate of installing frame, the top of fan is equipped with the heat dissipation frame, the bottom of heat dissipation frame is equipped with a plurality of heat dissipation fins, heat dissipation fins and fan contact, the top of heat dissipation frame is equipped with the second contact piece, first contact piece and second contact piece laminating set up, the heat that the mainboard produced is conducted to the second contact piece from first contact piece, the reconversion is on the heat dissipation fins, the fan starts the heat dissipation to the heat dissipation fins for heat dissipation efficiency improves, has improved the radiating effect to the mainboard, avoids appearing the condition that the high temperature leads to the performance to reduce.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of a motherboard heat dissipation mechanism for intelligent voice interaction equipment according to the present utility model;
FIG. 2 is a schematic diagram of the structure of the back surface of a motherboard heat dissipation mechanism for intelligent voice interaction equipment;
fig. 3 is a schematic structural diagram of a motherboard heat dissipation mechanism mounting frame for an intelligent voice interaction device according to the present utility model.
In the figure: 1. a main board; 2. a mounting frame; 3. a clamping block; 4. a clamping groove; 5. a heat conducting strip; 6. a first contact piece; 7. a fan; 8. a heat dissipation frame; 9. radiating fins; 10. a second contact piece; 11. a heat radiation hole; 12. a dust screen; 13. and a heat dissipation channel.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Examples: as shown in fig. 1, the main board radiating mechanism for the intelligent voice interaction equipment comprises a main board 1 and an installation frame 2, clamping blocks 3 are arranged at four corners of the main board 1, clamping grooves 4 matched with the clamping blocks 3 are arranged at four corners of the installation frame 2, and installation and disassembly of the main board 1 and the installation frame 2 are facilitated. The back of mainboard 1 is equipped with heat conduction strip 5 and first contact piece 6, and heat conduction strip 5 is provided with a plurality of, and a plurality of heat conduction strips 5 are netted crisscross setting, conveniently conduct the heat of everywhere on the mainboard 1, and heat conduction strip 5 adopts copper material to make, guarantees that the heat conduction effect is better, and heat conduction strip 5 is connected with first contact piece 6, and heat conduction is to first contact piece 6. Be equipped with fan 7 on the bottom plate of mounting frame 2, the top of fan 7 is equipped with heat dissipation frame 8, the bottom of heat dissipation frame 8 is equipped with a plurality of heat dissipation fins 9, heat dissipation fins 9 and fan 7 contact, the top of heat dissipation frame 8 is equipped with second contact piece 10, first contact piece 6 and the laminating of second contact piece 10 set up, be equipped with the silica gel heat conduction layer between first contact piece 6 and the second contact piece 10, guarantee the heat conduction between first contact piece 6 and the second contact piece 10, the heat transfer second contact piece 10 of mainboard 1 production, give off through heat dissipation fins 9 and fan 7 effect. Through the structure setting, the radiating effect to mainboard 1 has been improved, the condition that the high temperature leads to the performance to reduce appears in the avoidance.
Wherein, be equipped with a plurality of louvres 11 on the bottom plate of mounting frame 2, increase the radiating effect of mainboard 1, be equipped with dust screen 12 in the louvre 11, prevent that the dust from entering mounting frame 2 through louvre 11 in, influence the work of mainboard 1 electric device.
The middle parts of the heat dissipation fins 9 are provided with heat dissipation channels 13, and the heat dissipation channels 13 are perpendicular to the heat dissipation fins 9, so that air can circulate in the direction perpendicular to the heat dissipation fins 9, and the heat dissipation effect of the heat dissipation fins 9 is improved.
Working principle: when the heat dissipation device works, the fan 7 is started, the components on the main board 1 work to generate heat, the heat is transferred to the first contact piece 6 through the heat conduction strip 5, then is transferred to the second contact piece 7 from the first contact piece 6 and then is transferred to the heat dissipation fin 9, and the fan 7 dissipates heat of the heat dissipation fin 9, so that the heat dissipation efficiency is improved, the heat dissipation effect on the main board 1 is improved, and the situation that the performance is reduced due to overhigh temperature is avoided. The arrangement of the heat dissipation holes 11 can increase the air flow flux in the mounting frame 2 and increase the heat dissipation effect of the main board 1.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides an intelligent voice interaction is mainboard cooling mechanism for equipment, includes mainboard (1) and installing frame (2), and the four corners department of mainboard (1) all is equipped with fixture block (3), and the four corners department of installing frame (2) all is equipped with draw-in groove (4) with fixture block (3), a serial communication port, the back of mainboard (1) is equipped with heat conduction strip (5) and first contact piece (6), and heat conduction strip (5) are connected with first contact piece (6), are equipped with fan (7) on the bottom plate of installing frame (2), and the top of fan (7) is equipped with heat dissipation frame (8), and the bottom of heat dissipation frame (8) is equipped with a plurality of heat dissipation wings (9), and heat dissipation wings (9) contact with fan (7), and the top of heat dissipation frame (8) is equipped with second contact piece (10), and first contact piece (6) are laminated with second contact piece (10).
2. The main board heat dissipation mechanism for intelligent voice interaction equipment according to claim 1, wherein a plurality of heat conducting strips (5) are arranged, and the plurality of heat conducting strips (5) are arranged in a meshed and staggered mode.
3. The main board heat dissipation mechanism for intelligent voice interaction equipment according to claim 1, wherein a plurality of heat dissipation holes (11) are formed in a bottom board of the installation frame (2).
4. A motherboard heat dissipation mechanism for an intelligent voice interaction device according to claim 3, wherein a dust screen (12) is arranged in the heat dissipation hole (11).
5. The main board radiating mechanism for intelligent voice interaction equipment according to claim 1, wherein the middle parts of the radiating fins (9) are provided with radiating channels (13), and the radiating channels (13) are perpendicular to the radiating fins (9).
6. The main board heat dissipation mechanism for intelligent voice interaction equipment according to claim 1, wherein a silica gel heat conduction layer is arranged between the first contact piece (6) and the second contact piece (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320656833.8U CN220108516U (en) | 2023-03-29 | 2023-03-29 | Mainboard heat dissipation mechanism for intelligent voice interaction equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320656833.8U CN220108516U (en) | 2023-03-29 | 2023-03-29 | Mainboard heat dissipation mechanism for intelligent voice interaction equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220108516U true CN220108516U (en) | 2023-11-28 |
Family
ID=88869090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320656833.8U Active CN220108516U (en) | 2023-03-29 | 2023-03-29 | Mainboard heat dissipation mechanism for intelligent voice interaction equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220108516U (en) |
-
2023
- 2023-03-29 CN CN202320656833.8U patent/CN220108516U/en active Active
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