CN219269165U - Double-layer circuit board - Google Patents

Abstract

The utility model provides a double-layer circuit board, which relates to the technical field of circuit boards and solves the problem that the existing heat dissipation effect is poor, and the long-term high-temperature environment accelerates the damage of the circuit board, including the circuit board body; the heat dissipation component is installed on the Between the two circuit board bodies; there are two sets of drive mechanisms, and the two sets of drive mechanisms are installed inside the cooling assembly; there are four sets of connection assemblies, and the four sets of connection assemblies are installed on the two circuit boards. on the board body; the upper and lower sides of the heat dissipation cover are in contact with the two circuit board bodies; there are twenty heat dissipation holes in total, and the twenty heat dissipation holes are arranged on the heat dissipation cover; the double-layer circuit board, Because the impeller is fixedly installed on the motor, when the motor is working, the external air enters the heat dissipation cover, and then is discharged from the twenty heat dissipation holes, which speeds up the air flow inside the heat dissipation cover and facilitates rapid heat dissipation of the two circuit board bodies .

Description

A double-layer circuit board

technical field

The utility model belongs to the technical field of circuit boards, and more specifically relates to a double-layer circuit board.

Background technique

The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed circuit boards, etc.; the current circuit boards will generate a lot of heat when they work, and the existing circuit boards have poor heat dissipation effect, and the long-term high-temperature environment accelerates the damage of the circuit boards.

Utility model content

In order to solve the above-mentioned technical problems, the utility model provides a double-layer circuit board to solve the problem of poor heat dissipation and the damage of the circuit board accelerated by the long-term high-temperature environment.

The purpose and effect of the double-layer circuit board of the present invention are achieved by the following specific technical means:

A double-layer circuit board, including a circuit board body, a heat dissipation component, a driving mechanism and a connecting component;

There are two circuit board bodies, and the two circuit board bodies are symmetrically arranged, and the corners of the two circuit board bodies are provided with mounting holes; the heat dissipation assembly is installed between the two circuit board bodies; There are two sets of driving mechanisms, and the two sets of driving mechanisms are installed inside the heat dissipation assembly; there are four sets of connecting assemblies, and the four sets of connecting assemblies are installed on the two circuit board bodies;

The heat dissipation assembly includes: a heat dissipation cover and a heat dissipation hole; the upper and lower sides of the heat dissipation cover are in contact with two circuit board bodies; the heat dissipation holes are provided with a total of twenty, and the twenty heat dissipation holes are arranged on the heat dissipation cover .

Further, the driving mechanism further includes: an impeller; the impeller is fixedly installed on the motor.

Further, four L-shaped limiting strips are fixedly installed on the inner sides of the two circuit board bodies, and the eight L-shaped limiting strips are in contact with the heat dissipation cover.

Further, the connection assembly includes: a connection base and a connection block; the connection base is fixedly connected to the lower circuit board body; the connection block is fixedly connected to the upper circuit board body.

Further, the driving mechanism includes: a mounting frame and a motor; the mounting frame is fixedly installed inside the heat dissipation cover; the motor is fixedly mounted inside the mounting frame.

Further, the connection assembly further includes: a magnet; the magnet is fixedly installed inside the connection seat, and the top of the magnet is in contact with the connection block.

Compared with the prior art, the utility model has the following beneficial effects:

1. The double-layer circuit board is fixedly connected to the lower circuit board body by the connection seat, and the connection block is fixedly connected to the upper circuit board body, and the connection block is inserted into the connection seat, so that it is convenient for the staff to connect the two circuits The board body is fixedly installed inside the connection seat because of the magnet, and the top of the magnet is in contact with the connection block, so that the connection of the two circuit board bodies is more stable.

2. The double-layer circuit board, because the impeller is fixedly installed on the motor, so when the motor is working, the external air enters the heat dissipation cover, and then is discharged from the twenty heat dissipation holes, which speeds up the air flow rate inside the heat dissipation cover , to facilitate rapid heat dissipation of the two circuit board bodies.

3. The double-layer circuit board, because the eight L-shaped limit strips are in contact with the heat dissipation cover, makes the heat dissipation cover more stable after installation.

Description of drawings

Fig. 1 is the three-dimensional structure schematic diagram of the present utility model.

Fig. 2 is a schematic view of the top view of Fig. 1 of the utility model.

Fig. 3 is a schematic diagram of a cutaway structure in the direction A-A in Fig. 2 of the present invention.

Fig. 4 is a schematic diagram of a cut-away structure in the B-B direction in Fig. 2 of the present invention.

Fig. 5 is a structural schematic diagram of the heat dissipation assembly, the L-shaped limit bar and the driving mechanism of the present invention.

Fig. 6 is a schematic diagram of a partially enlarged structure of area C in Fig. 3 of the present invention.

Fig. 7 is a partial enlarged structural schematic diagram of area D in Fig. 4 of the present invention.

In the figure, the corresponding relationship between component names and drawing numbers is:

1. Circuit board body; 101. Mounting hole; 2. Heat dissipation component; 201. Heat dissipation cover; 202. Heat dissipation hole; 3. L-shaped limit bar; 4. Driving mechanism; 401. Mounting frame; 402. Motor; 403. impeller; 5, connection assembly; 501, connection seat; 502, connection block; 503, magnet.

Detailed ways

The implementation of the present utility model will be further described in detail below in conjunction with the accompanying drawings and examples.

Example:

As shown in accompanying drawing 1 to accompanying drawing 7:

The utility model provides a double-layer circuit board, which includes a circuit board body 1, a heat dissipation component 2, a driving mechanism 4 and a connecting component 5;

There are two circuit board bodies 1 in total, and the two circuit board bodies 1 are symmetrically arranged, and the corners of the two circuit board bodies 1 are provided with mounting holes 101; the heat dissipation assembly 2 is installed between the two circuit board bodies 1; There are two sets of driving mechanisms 4, and two sets of driving mechanisms 4 are installed inside the cooling assembly 2; there are four sets of connecting assemblies 5, and four sets of connecting assemblies 5 are installed on two circuit board bodies 1.

As shown in Figure 7, the connection assembly 5 includes: a connection base 501 and a connection block 502; the connection base 501 is fixedly connected to the circuit board body 1 below; the connection block 502 is fixedly connected to the circuit board body 1 above; the connection assembly 5 also includes : magnet 503; the magnet 503 is fixedly installed in the inside of the connecting seat 501, and the top of the magnet 503 is in contact with the connecting block 502. The upper circuit board body 1 is fixedly connected, and the connection block 502 is inserted into the connection seat 501, so that it is convenient for the staff to connect the two circuit board bodies 1, and because the magnet 503 is fixedly installed inside the connection seat 501, and the top of the magnet 503 Contact with the connection block 502, thereby making the connection of the two circuit board bodies 1 more stable.

As shown in Figures 5 and 6, the heat dissipation assembly 2 includes: a heat dissipation cover 201 and a heat dissipation hole 202; the upper and lower sides of the heat dissipation cover 201 are in contact with the two circuit board bodies 1; there are twenty heat dissipation holes 202, and two Ten cooling holes 202 are arranged on the cooling cover 201, and the driving mechanism 4 includes: a mounting frame 401 and a motor 402; the mounting frame 401 is fixedly installed inside the cooling cover 201; the motor 402 is fixedly mounted inside the mounting frame 401; the driving mechanism 4 Also includes: impeller 403; impeller 403 is fixedly installed on the motor 402, and its specific function is: because the impeller 403 is fixedly installed on the motor 402, so when the motor 402 works, the external air enters the cooling cover 201, and then from twenty The two circuit board bodies 1 are discharged through the heat dissipation holes 202, which speeds up the air flow rate inside the heat dissipation cover 201, and facilitates the rapid heat dissipation of the two circuit board bodies 1.

As shown in Figure 5, four L-shaped limit strips 3 are fixedly installed on the inner sides of the two circuit board bodies 1, and eight L-shaped limit strips 3 are in contact with the heat dissipation cover 201. The L-shaped limiting bar 3 is in contact with the heat dissipation cover 201, so that the heat dissipation cover 201 is more stable after installation.

The specific usage and function of this embodiment:

When the utility model is used, the staff first places the heat dissipation cover 201 on the eight L-shaped limit bars 3, and then inserts the four connection blocks 502 into the four connection seats 501, so that the staff can connect two circuit board bodies 1. Because the magnet 503 is fixedly installed inside the connection base 501, and the top of the magnet 503 is in contact with the connection block 502, the two circuit board bodies 1 are connected more stably; then the staff starts the motor 402, and at this time the external air Entering into the heat dissipation cover 201, and then discharged from the twenty heat dissipation holes 202, the air flow speed inside the heat dissipation cover 201 is accelerated, and the two circuit board bodies 1 are convenient for rapid heat dissipation.

The parts of the utility model that are not described in detail are the known techniques of those skilled in the art.

Claims (6)

1. A double-layer circuit board, characterized in that: comprises a circuit board body (1), a heat radiation component (2), a driving mechanism (4) and a connecting component (5);

the circuit board comprises two circuit board bodies (1), wherein the two circuit board bodies (1) are symmetrically arranged, and mounting holes (101) are formed in corners of the two circuit board bodies (1); the heat dissipation assembly (2) is arranged between the two circuit board bodies (1); the driving mechanisms (4) are provided with two groups in total, and the two groups of driving mechanisms (4) are arranged in the heat dissipation assembly (2); the four groups of connecting assemblies (5) are arranged in total, and the four groups of connecting assemblies (5) are arranged on the two circuit board bodies (1);

the heat dissipation assembly (2) includes: a heat radiation cover (201) and a heat radiation hole (202); the upper side and the lower side of the heat dissipation cover (201) are contacted with the two circuit board bodies (1); twenty heat dissipation holes (202) are formed in total, and the twenty heat dissipation holes (202) are formed in the heat dissipation cover (201).

2. A dual-layer circuit board as defined in claim 1, wherein: four L-shaped limit strips (3) are fixedly arranged on the inner sides of the two circuit board bodies (1) respectively, and the eight L-shaped limit strips (3) are in contact with the heat dissipation cover (201).

3. A dual-layer circuit board as defined in claim 1, wherein: the drive mechanism (4) includes: a mounting frame (401) and a motor (402); the mounting frame (401) is fixedly arranged in the heat dissipation cover (201); the motor (402) is fixedly arranged in the mounting frame (401).

4. A dual-layer circuit board as claimed in claim 3, wherein: the drive mechanism (4) further comprises: an impeller (403); the impeller (403) is fixedly mounted on the motor (402).

5. A dual-layer circuit board as defined in claim 1, wherein: the connection assembly (5) comprises: a connecting seat (501) and a connecting block (502); the connecting seat (501) is fixedly connected with the circuit board body (1) below; the connecting block (502) is fixedly connected with the circuit board body (1) above.

6. The dual-layer circuit board of claim 5, wherein: the connection assembly (5) further comprises: a magnet (503); the magnet (503) is fixedly arranged in the connecting seat (501), and the top of the magnet (503) is in contact with the connecting block (502).

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