CN219437213U

CN219437213U - Multilayer lug lamination circuit board

Info

Publication number: CN219437213U
Application number: CN202223072606.5U
Authority: CN
Inventors: 李文翔; 李建刚
Original assignee: Shenzhen Yuweixing Electronics Co ltd
Current assignee: Shenzhen Yuweixing Electronics Co ltd
Priority date: 2022-11-18
Filing date: 2022-11-18
Publication date: 2023-07-28
Anticipated expiration: 2032-11-18

Abstract

The utility model discloses a multilayer bump laminated circuit board which comprises a base, wherein the lower part of the left end and the lower part of the right end of the base are fixedly provided with fixing plates, the front parts of the upper ends and the rear parts of the upper ends of the two fixing plates are respectively provided with a group of perforations, the two groups of perforations are symmetrically distributed in the front-back direction, each group of perforations is two, and the middle part of the rear end of the base is fixedly provided with a heat dissipation assembly. According to the multilayer bump laminated circuit board, the heat dissipation assembly and the connecting assembly are arranged, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the mounting frame from the air inlet, the wind power is conveyed forwards under the action of the motor and the fan blades, the heat dissipation effect of the main body board can be improved through the cooperation of the heat dissipation fins, the sliding block and the connecting plates are connected to the base in a sliding mode, the main body board is clamped between the two connecting plates, and the limiting bolts penetrate through the connecting holes and are connected to the sliding block in a threaded penetrating mode, so that the main body board is convenient to fix.

Description

Multilayer lug lamination circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multilayer bump laminated circuit board.

Background

The circuit board PCB is an English (Printed Circuie Board) printed PCB, and is short for circuit board. The conductive pattern formed by forming a printed wiring, a printed element, or a combination of both on an insulating material according to a predetermined design is generally called a printed circuit. And conductive patterns, called printed wiring, on the insulating substrate that provide electrical connection between components. The printed circuit or finished board of printed wiring is thus called a printed wiring board, also called a printed board or printed circuit board.

The existing multilayer bump laminated circuit board has the following defects that a large amount of heat can be generated when the existing circuit board is operated, but the heat dissipation effect can be influenced only by the heat dissipation fins, the existing circuit board is fixed by screws in the installation mode, but the screws are frequently detached and installed to cause a slipping phenomenon, so that the service efficiency is influenced, and therefore, a novel multilayer bump laminated circuit board is provided.

Disclosure of Invention

The utility model mainly aims to provide a multilayer bump laminated circuit board which can effectively solve the problems of heat dissipation and convenience in installation of the multilayer circuit board.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a multilayer lug lamination circuit board, includes the base, the equal fixed mounting of base left end lower part and right-hand member lower part has the fixed plate, two a set of perforation has all been seted up to fixed plate upper end front portion and upper end rear portion, two sets of the perforation is front and back symmetric distribution and every group set up to two, base rear end middle part fixed mounting has radiator unit, inside left side of base and inside right side sliding are installed coupling assembling, two joint has the main part board jointly between the coupling assembling.

Preferably, a plurality of radiating grooves are formed in the upper end face inside the base, sliding grooves are formed in the left side and the right side inside the base, mounting grooves penetrating through the base in the front-back direction are formed in the middle of the rear end of the base, connecting holes penetrating through the base in the left-side direction and the right-side direction are formed in the upper portion of the left end of the base, and radiating fins are fixedly connected to the lower end of the main body plate.

Preferably, the radiating assembly comprises a mounting frame, a plurality of front and back through air inlets are formed in the rear end of the mounting frame, a motor is fixedly connected to the inside of the mounting frame, a rotating column is fixedly connected to the output end of the motor, fan blades are fixedly connected to the front end of the rotating column, and the mounting frame is fixedly connected to the inside of the mounting groove.

Preferably, the plurality of air inlets are distributed in an annular array, and the plurality of fan blades are distributed in an annular array.

Preferably, the connecting assembly comprises a connecting plate, connecting grooves are formed in the upper portion of the right end of the connecting plate and the lower portion of the right end of the connecting plate, a sliding block is fixedly connected to the rear end of the connecting plate, a limit bolt is movably inserted and connected to the upper portion of the rear end of the sliding block, and the connecting plate is connected to the base through the sliding block in a sliding mode.

Preferably, the sliding block is slidably connected in the sliding groove, and the limiting bolt penetrates through the connecting hole and is movably inserted and connected on the sliding block.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the heat dissipation effect of the multilayer circuit board can be improved by arranging the heat dissipation assembly, when the heat generated by the multilayer circuit board needs to be processed in use, the motor drives the rotating column, the rotating column drives the fan blade, so that wind power is sucked into the mounting frame from the air inlet hole, the wind power is conveyed forwards under the action of the motor and the fan blade, and the heat dissipation effect of the main body board can be improved under the cooperation of the heat dissipation plate, thereby improving the use efficiency;

2. according to the utility model, the installation effect of the main body plate can be improved by arranging the connecting assembly, when the device is used, firstly, the sliding grooves are formed in the left side and the right side of the inside of the base, the sliding blocks and the connecting plates are connected to the base in a sliding manner, the main body plate is clamped between the two connecting plates, the limiting bolts penetrate through the connecting holes and are connected to the sliding blocks in a threaded penetrating manner, so that the main body plate is convenient to fix, and the main body plate is convenient to install.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a multi-layer bump laminate circuit board according to the present utility model;

FIG. 2 is a schematic view of the whole structure of a base of a multi-layer bump laminated circuit board according to the present utility model;

FIG. 3 is a schematic diagram of a heat dissipating assembly of a multi-layer bump laminate circuit board according to the present utility model;

fig. 4 is a schematic diagram of the overall structure of a connection assembly of a multi-layer bump laminate circuit board according to the present utility model.

In the figure: 1. a base; 2. a fixing plate; 3. perforating; 4. a heat dissipation assembly; 5. a connection assembly; 6. a main body plate; 7. a heat sink; 8. a mounting groove; 9. a connection hole; 10. a chute; 11. a heat sink; 41. a mounting frame; 42. an air inlet hole; 43. a motor; 44. rotating the column; 45. a fan blade; 51. a connecting plate; 52. a slide block; 53. a limit bolt; 54. and a connection groove.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a multilayer bump laminated circuit board comprises a base 1, wherein a fixed plate 2 is fixedly arranged at the lower part of the left end and the lower part of the right end of the base 1, a group of through holes 3 are formed in the front part of the upper ends and the rear part of the upper ends of the two fixed plates 2, the two groups of through holes 3 are symmetrically distributed front and back and are respectively arranged in two, a heat dissipation component 4 is fixedly arranged in the middle of the rear end of the base 1, a connecting component 5 is arranged at the left side and the right side inside the base 1, and a main body board 6 is jointly clamped between the two connecting components 5; a plurality of heat dissipation grooves 7 have been seted up to the inside up end of base 1, and spout 10 has all been seted up on inside left side and inside right side of base 1, and mounting groove 8 of front and back break-through has been seted up at base 1 rear end middle part, and connecting hole 9 of controlling the break-through has all been seted up on base 1 left end upper portion and right-hand member upper portion, and main part board 6 lower extreme fixedly connected with fin 11.

The heat dissipation assembly 4 comprises a mounting frame 41, a plurality of front-back penetrating air inlets 42 are formed in the rear end of the mounting frame 41, a motor 43 is fixedly connected inside the mounting frame 41, a rotating column 44 is fixedly connected to the output end of the motor 43, fan blades 45 are fixedly connected to the front end of the rotating column 44, and the mounting frame 41 is fixedly connected to the mounting groove 8; the air inlets 42 are distributed in an annular array, and the fan blades 45 are arranged in a plurality and distributed in an annular array; the motor 43 drives the rotating column 44, and then the rotating column 44 drives the fan blades 45, so that wind force is sucked into the mounting frame 41 from the air inlet hole 42, and the wind force is conveyed forwards under the action of the motor 43 and the fan blades 45, and the heat dissipation effect of the main body plate 6 can be improved under the cooperation of the heat dissipation fins 11.

The connecting assembly 5 comprises a connecting plate 51, the upper part of the right end of the connecting plate 51 and the lower part of the right end are respectively provided with a connecting groove 54, the rear end of the connecting plate 51 is fixedly connected with a sliding block 52, the upper part of the rear end of the sliding block 52 is movably connected with a limiting bolt 53 in a penetrating way, and the connecting plate 51 is connected to the base 1 in a sliding way through the sliding block 52; the sliding block 52 is connected in the sliding chute 10 in a sliding way, and the limiting bolt 53 penetrates through the connecting hole 9 and is movably inserted and connected on the sliding block 52; the sliding block 52 and the connecting plates 51 are connected to the base 1 in a sliding manner, the main body plate 6 is clamped between the two connecting plates 51, and the limiting plug 53 penetrates through the connecting hole 9 and is connected to the sliding block 52 in a threaded penetrating manner, so that the main body plate 6 is convenient to fix.

It should be noted that, the present utility model is a multilayer bump laminated circuit board, by arranging the heat dissipation component 4, the heat dissipation effect of the multilayer circuit board can be improved, when the heat generated by the multilayer circuit board needs to be processed in use, the motor 43 drives the rotating column 44, then the rotating column 44 drives the fan blade 45, so that the wind force is sucked into the mounting frame 41 from the air inlet hole 42, and the wind force is conveyed forward under the action of the motor 43 and the fan blade 45, and the heat dissipation effect of the main body board 6 can be improved under the cooperation of the heat dissipation sheet 11, thereby improving the use efficiency; through setting up coupling assembling 5, can improve the installation effect of body board 6, when using, at first all offered spout 10 in the inside left side of base 1 and inside right side to with slider 52 and connecting plate 51 sliding connection on base 1, and with body board 6 joint between two connecting plates 51, improve spacing bolt 53 and run through connecting hole 9 and threaded the interlude connection on slider 52, make body board 6 be convenient for fix, thereby make body board 6 be convenient for install.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A multilayer bump laminate circuit board comprising a base (1), characterized in that: the novel solar cell module is characterized in that fixing plates (2) are fixedly installed at the lower part of the left end and the lower part of the right end of the base (1), a group of perforations (3) are formed in the front part of the upper end of the fixing plates (2) and the rear part of the upper end of the fixing plates, the two groups of perforations (3) are symmetrically distributed front and back and are arranged in two groups, a heat radiating component (4) is fixedly installed at the middle part of the rear end of the base (1), a connecting component (5) is installed at the left side and the right side of the inside of the base (1), and a main body plate (6) is clamped between the connecting components (5) together.

2. The multilayer bump laminate circuit board of claim 1, wherein: the novel heat dissipation device is characterized in that a plurality of heat dissipation grooves (7) are formed in the upper end face of the inside of the base (1), sliding grooves (10) are formed in the left side and the right side of the inside of the base (1), mounting grooves (8) penetrating through the middle of the rear end of the base (1) are formed in the middle of the rear end of the base (1), connecting holes (9) penetrating through the left side and the right side of the upper portion of the left end of the base (1) are formed in the upper portion of the right end of the base (1), and heat dissipation fins (11) are fixedly connected to the lower end of the main body plate (6).

3. The multilayer bump laminate circuit board of claim 2, wherein: the heat dissipation assembly (4) comprises a mounting frame (41), a plurality of front and back through air inlets (42) are formed in the rear end of the mounting frame (41), a motor (43) is fixedly connected inside the mounting frame (41), a rotating column (44) is fixedly connected to the output end of the motor (43), fan blades (45) are fixedly connected to the front end of the rotating column (44), and the mounting frame (41) is fixedly connected to the inside of the mounting groove (8).

4. A multi-layer bump laminate wiring board according to claim 3, wherein: the air inlets (42) are distributed in an annular array, and the fan blades (45) are arranged in a plurality and distributed in an annular array.

5. The multilayer bump laminate circuit board according to claim 4, wherein: the connecting assembly (5) comprises a connecting plate (51), connecting grooves (54) are formed in the upper portion of the right end of the connecting plate (51) and the lower portion of the right end of the connecting plate, a sliding block (52) is fixedly connected to the rear end of the connecting plate (51), a limiting bolt (53) is movably inserted and connected to the upper portion of the rear end of the sliding block (52), and the connecting plate (51) is connected to the base (1) in a sliding mode through the sliding block (52).

6. The multilayer bump laminate circuit board according to claim 5, wherein: the sliding block (52) is connected in the sliding groove (10) in a sliding mode, and the limiting bolt (53) penetrates through the connecting hole (9) and is movably inserted and connected on the sliding block (52).