CN219437406U

CN219437406U - High-frequency high-density interconnection multilayer circuit board

Info

Publication number: CN219437406U
Application number: CN202223206562.0U
Authority: CN
Inventors: 李文翔; 陈卫红; 李建刚
Original assignee: Shenzhen Yuweixing Electronics Co ltd
Current assignee: Shenzhen Yuweixing Electronics Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-07-28
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses a high-frequency high-density interconnection multilayer circuit board which comprises a mounting frame, wherein fixing blocks are fixedly arranged at the lower part of the left end and the lower part of the right end of the mounting frame, a group of mounting holes penetrating up and down are formed in the front part of the upper end and the rear part of the upper end of the fixing blocks, the two groups of mounting holes are symmetrically distributed in front-back mode, each group of mounting holes are two, heat dissipation equipment is fixedly arranged in the middle of the rear end of the mounting frame, connecting assemblies are arranged at the left side and the right side inside the mounting frame, and a main body board is arranged between the connecting assemblies. According to the high-frequency high-density interconnection multilayer circuit board, the heat dissipation equipment is arranged, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame from the air inlet under the rotation of the fan blades, and the motor drives the rotating column and the fan blades to rotate, so that the wind power is conveyed into the fixing frame, and the heat generated by the main body board is convenient to process.

Description

High-frequency high-density interconnection multilayer circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-frequency high-density interconnection multilayer circuit board.

Background

Along with the continuous development of the electronic equipment industry, the circuit board manufacturing technology is greatly improved, the circuit board can be miniaturized and visualized more by using the circuit board, the circuit board plays a key role in the electric appliance layout, and along with the wide application of the circuit board, the circuit board can be divided into a ceramic circuit board, an alumina ceramic circuit board, a printed circuit board and the like.

The prior art (patent number: CN 216852486U) discloses a convenient-to-use fire water monitor, which comprises a main board, radiating holes, a radiating fin mounting frame and radiating fins, wherein the upper end and the lower end of one side of the main board are provided with the radiating holes, and the radiating holes are positioned at the two ends of the top and the bottom of the radiating fin mounting frame; the radiating fin mounting frame is positioned in the center of one side of the main board; the cooling fin is located the inside of cooling fin mounting bracket, the opposite side of mainboard is equipped with the recess all around, the inside grafting fixed block of recess, the top fixed mounting of fixed block has the installation pole, the top fixed mounting of installation pole has the dust guard. The utility model has the beneficial effects that: the main board, the radiating holes, the radiating fin mounting frame, the radiating fins and other components are arranged, and the radiating holes are formed in the upper end and the lower end of one side of the main board, so that the auxiliary radiating effect is achieved on the main board; the radiating fin mounting frames are arranged at the positions between the radiating holes, so that the radiating fins in the radiating fin mounting frames are mounted and supported through the radiating fin mounting frames; through setting up the fin to carry out high strength heat dissipation to the multilayer circuit board, and then improve the life of circuit board, reduce economic loss.

The existing high-frequency high-density interconnection multilayer circuit board has the following defects that the existing multilayer circuit board can generate a large amount of heat during operation, and the heat dissipation effect can be influenced only by the heat dissipation grooves, so that the service efficiency is reduced, and therefore, a novel high-frequency high-density interconnection multilayer circuit board is provided.

Disclosure of Invention

The utility model mainly aims to provide a high-frequency high-density interconnection multilayer circuit board which can effectively solve the problem that the multilayer circuit board is convenient for heat dissipation.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a high frequency high density interconnection multilayer circuit board, includes the mounting bracket, the equal fixed mounting of mounting bracket left end lower part and right-hand member lower part has the fixed block, two a set of mounting hole of punching through from top to bottom has all been seted up to fixed block upper end front portion and upper end rear portion, two sets of the mounting hole is front and back symmetric distribution and every group sets up to two, mounting bracket rear end middle part fixed mounting has firing equipment, the inside left side of mounting bracket and inside right side all are provided with coupling assembling, be provided with the main part board jointly between the coupling assembling.

Preferably, the mounting groove of punching through around having seted up in the middle part of the mounting bracket rear end, a set of spout has all been seted up on the inside left side of mounting bracket and inside right side, a set of perforation has all been seted up on mounting bracket left end upper portion and right-hand member upper portion.

Preferably, the two groups of sliding grooves and the two groups of perforations are distributed in a bilateral symmetry manner, and each group is two.

Preferably, the connecting assembly comprises a connecting plate, connecting grooves are formed in the upper portion of the left end of the connecting plate and the lower portion of the left end of the connecting plate, sliding blocks are fixedly connected to the front portion of the right end of the connecting plate and the rear portion of the right end of the connecting plate, limiting pins are movably inserted and connected to the upper portion of the right end of the sliding blocks, and the connecting plate is connected to the mounting frame through the sliding blocks in a sliding mode.

Preferably, the limiting pin penetrates through the through hole and is movably connected to the sliding block in a penetrating mode, the sliding block is connected in the sliding groove in a sliding mode, and the main body plate is clamped in the connecting groove in a clamping mode.

Preferably, the heat dissipating device comprises a fixing frame, a plurality of air inlets are formed in the rear end of the fixing frame, a motor is fixedly connected to the inside of the fixing frame, a rotating column is fixedly connected to the output end of the motor, fan blades are fixedly connected to the front end of the rotating column, the fixing frame is fixedly connected to the inside of the mounting groove, and a plurality of air inlets are distributed in an annular array.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the heat dissipation effect of the main body plate can be improved by arranging the heat dissipation equipment, when the heat generated by the main body plate needs to be processed, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame from the air inlet hole under the rotation of the fan blades, and the wind power is transmitted into the fixing frame under the rotation of the motor driving the rotating column and the fan blades, so that the heat generated by the main body plate is convenient to process;

2. according to the utility model, the connecting assembly is arranged, so that the main body plate is convenient to fix, when the mounting rack is used, firstly, the left side and the right side in the mounting rack are respectively provided with the sliding grooves, the sliding blocks and the connecting plates are fixedly connected together, the sliding blocks are connected in the sliding grooves in a sliding manner, the limiting pins penetrate through the through holes and are movably inserted and connected on the sliding blocks, and the main body plate is clamped between the two connecting plates, so that the main body plate is convenient to fix, and the stability is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a high frequency high density interconnect multilayer circuit board according to the present utility model;

FIG. 2 is a schematic view of the overall structure of a mounting frame for a high frequency high density interconnect multilayer circuit board according to the present utility model;

FIG. 3 is a schematic view showing the overall structure of a connection assembly of a high-frequency high-density interconnection multi-layer circuit board according to the present utility model;

fig. 4 is a schematic diagram showing the overall structure of a heat dissipating device of a high-frequency high-density interconnection multi-layer circuit board according to the present utility model.

In the figure: 1. a mounting frame; 2. a fixed block; 3. a mounting hole; 4. a connection assembly; 5. a main body plate; 6. a heat dissipating device; 7. a mounting groove; 8. a chute; 9. perforating; 41. a connecting plate; 42. a connection groove; 43. a slide block; 44. a limiting pin; 61. a fixing frame; 62. a motor; 63. rotating the column; 64. a fan blade; 65. an air inlet hole.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, a high-frequency high-density interconnection multilayer circuit board comprises a mounting frame 1, wherein fixing blocks 2 are fixedly arranged at the lower part of the left end and the lower part of the right end of the mounting frame 1, a group of mounting holes 3 penetrating up and down are formed in the front part of the upper ends and the rear part of the upper ends of the two fixing blocks 2, the two groups of mounting holes 3 are symmetrically distributed front and back and are arranged in two groups, heat dissipation equipment 6 is fixedly arranged in the middle of the rear end of the mounting frame 1, connecting assemblies 4 are arranged at the left side and the right side in the interior of the mounting frame 1, and a main body board 5 is commonly arranged between the connecting assemblies 4; the middle part of the rear end of the mounting frame 1 is provided with a mounting groove 7 which is penetrated from front to back, the left side and the right side of the inside of the mounting frame 1 are provided with a group of sliding grooves 8, and the upper part of the left end and the upper part of the right end of the mounting frame 1 are provided with a group of penetrating holes 9; the two groups of sliding grooves 8 and the two groups of perforations 9 are distributed symmetrically left and right, and each group is provided with two.

The connecting assembly 4 comprises a connecting plate 41, connecting grooves 42 are formed in the upper part of the left end and the lower part of the left end of the connecting plate 41, sliding blocks 43 are fixedly connected to the front part of the right end and the rear part of the right end of the connecting plate 41, limiting pins 44 are movably inserted and connected to the upper parts of the right ends of the two sliding blocks 43, and the connecting plate 41 is slidably connected to the mounting frame 1 through the sliding blocks 43; the limiting pin 44 penetrates through the through hole 9 and is movably inserted and connected to the sliding block 43, the sliding block 43 is slidably connected in the sliding groove 8, and the main body plate 5 is clamped in the connecting groove 42; the sliding block 43 is slidably connected in the sliding groove 8, the limiting pin 44 penetrates through the through hole 9 and is movably connected to the sliding block 43 in a penetrating mode, and the main body plate 5 is clamped between the two connecting plates 41, so that the main body plate 5 is convenient to fix, and stability is improved.

The heat dissipation device 6 comprises a fixed frame 61, a plurality of air inlets 65 are formed in the rear end of the fixed frame 61, a motor 62 is fixedly connected inside the fixed frame 61, a rotating column 63 is fixedly connected to the output end of the motor 62, fan blades 64 are fixedly connected to the front end of the rotating column 63, the fixed frame 61 is fixedly connected in the mounting groove 7, and the plurality of air inlets 65 are distributed in an annular array; the motor 62 drives the rotating column 63, the rotating column 63 drives the fan blades 64, wind power is sucked into the fixing frame 61 from the air inlet holes 65 under the rotation of the fan blades 64, and the wind power is conveyed into the mounting frame 1 under the rotation of the motor 62 driving the rotating column 63 and the fan blades 64, so that heat generated by the main body plate 5 is convenient to process.

It should be noted that, the present utility model is a high-frequency high-density interconnection multilayer circuit board, by arranging the heat dissipating device 6, the heat dissipating effect of the main board 5 can be improved, when the heat generated by the main board 5 needs to be processed in use, the motor 62 drives the rotating column 63, the rotating column 63 drives the fan blade 64, under the rotation of the fan blade 64, the wind power is sucked into the fixing frame 61 from the air inlet 65, and under the rotation of the motor 62 drives the rotating column 63 and the fan blade 64, the wind power is transmitted into the mounting frame 1, so that the heat generated by the main board 5 is convenient to process; through setting up coupling assembling 4, make main part board 5 be convenient for fixed, when using, at first at inside left side of mounting bracket 1 and inside right side all offer spout 8, with slider 43 and connecting plate 41 fixed connection together to with slider 43 sliding connection in spout 8, run through perforation 9 and activity interlude connection on slider 43 by spacer pin 44, because main part board 5 joint is between two connecting plates 41, make main part board 5 be convenient for fix, thereby improve the steadiness.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The high-frequency high-density interconnection multilayer circuit board comprises a mounting rack (1), and is characterized in that: the utility model discloses a heat radiation device for the solar cell module, including mounting bracket (1), connecting component (4), mounting bracket (1), connecting component (4), mounting bracket (1) left end lower part and right-hand member lower part equal fixed mounting have fixed block (2), two a set of mounting hole (3) of punching through from top to bottom have all been seted up to fixed block (2) upper end front portion and upper end rear portion, two sets of mounting hole (3) are front and back symmetric distribution and every group set up to two, mounting bracket (1) rear end middle part fixed mounting has radiator unit (6), inside left side and inside right side of mounting bracket (1) all are provided with coupling assembling (4), be provided with main part board (5) jointly between coupling assembling (4).

2. The high frequency high density interconnect multilayer wiring board of claim 1, wherein: mounting groove (7) of punching through around having seted up in the middle part of mounting bracket (1), a set of spout (8) have all been seted up on inside left side and inside right side of mounting bracket (1), a set of perforation (9) have all been seted up on mounting bracket (1) left end upper portion and right-hand member upper portion.

3. The high frequency high density interconnect multilayer wiring board of claim 2, wherein: the two groups of sliding grooves (8) and the two groups of perforations (9) are symmetrically distributed left and right, and each group is two.

4. A high frequency high density interconnect multilayer wiring board as claimed in claim 3, wherein: the connecting assembly (4) comprises a connecting plate (41), connecting grooves (42) are formed in the upper portion of the left end and the lower portion of the left end of the connecting plate (41), sliding blocks (43) are fixedly connected to the front portion of the right end of the connecting plate (41) and the rear portion of the right end of the connecting plate, limiting pins (44) are movably inserted and connected to the upper portion of the right end of each sliding block (43), and the connecting plate (41) is connected to the mounting frame (1) in a sliding mode through the sliding blocks (43).

5. The high frequency high density interconnect multilayer wiring board of claim 4, wherein: the limiting pin (44) penetrates through the through hole (9) and is movably connected to the sliding block (43) in a penetrating mode, the sliding block (43) is connected in the sliding groove (8) in a sliding mode, and the main body plate (5) is clamped in the connecting groove (42).

6. The high frequency high density interconnect multilayer wiring board of claim 5, wherein: the heat dissipation device (6) comprises a fixing frame (61), a plurality of air inlets (65) are formed in the rear end of the fixing frame (61), a motor (62) is fixedly connected inside the fixing frame (61), an output end of the motor (62) is fixedly connected with a rotating column (63), the front end of the rotating column (63) is fixedly connected with a fan blade (64), the fixing frame (61) is fixedly connected in a mounting groove (7), and a plurality of air inlets (65) are distributed in an annular array.