CN209806163U - Novel circuit board structure convenient to heat dissipation - Google Patents
Novel circuit board structure convenient to heat dissipation Download PDFInfo
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- CN209806163U CN209806163U CN201920389533.1U CN201920389533U CN209806163U CN 209806163 U CN209806163 U CN 209806163U CN 201920389533 U CN201920389533 U CN 201920389533U CN 209806163 U CN209806163 U CN 209806163U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 35
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- 238000001125 extrusion Methods 0.000 abstract description 3
- 238000007664 blowing Methods 0.000 abstract description 2
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- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种电路板结构,具体是一种新型便于散热的电路板结构,属于电路板应用技术领域。The utility model relates to a circuit board structure, in particular to a novel circuit board structure convenient for heat dissipation, and belongs to the technical field of circuit board applications.
背景技术Background technique
电路板的名称有:陶瓷电路板,氧化铝陶瓷电路板,氮化铝陶瓷电路板,线路板,PCB板,铝基板,高频板,厚铜板,阻抗板,PCB,超薄线路板,超薄电路板和印刷电路板等;电路板使电路迷你化、直观化,对于固定电路的批量生产和优化用电器布局起重要作用,电路板可称为印刷线路板或印刷电路板,英文名称为FPC线路板;线路板又称柔性线路板柔性电路板是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性,绝佳的可挠性印刷电路板。The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards and printed circuit boards, etc.; circuit boards make circuits miniaturized and intuitive, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Circuit boards can be called printed circuit boards or printed circuit boards. The English name is FPC circuit board; circuit board, also known as flexible circuit board, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material.
在现有技术中,电路板安装在机箱内部时都较为简单,电路板表面延伸的引线一般都自由放置的,在机箱受到震动时引线会与电路板之间发生相对晃动,容易使得引线与电路板的接触点产生脱落的现象,且电路板在使用时,其表面的元器件会产生较大的热量,当热量过大时可能会对元器件产生损害,降低了其使用寿命。因此,针对上述问题提出一种新型便于散热的电路板结构。In the prior art, when the circuit board is installed inside the case, it is relatively simple, and the lead wires extending on the surface of the circuit board are generally placed freely. The contact point of the board will fall off, and when the circuit board is in use, the components on its surface will generate a lot of heat. When the heat is too large, it may cause damage to the components and reduce its service life. Therefore, in view of the above problems, a novel circuit board structure that facilitates heat dissipation is proposed.
实用新型内容Utility model content
本实用新型的目的就在于为了解决上述问题而提供一种新型便于散热的电路板结构。The purpose of this utility model is to provide a new circuit board structure that is convenient for heat dissipation in order to solve the above problems.
本实用新型通过以下技术方案来实现上述目的,一种新型便于散热的电路板结构,包括从外到内依次安装的固定结构、电路板本体、支撑座和散热结构;The utility model achieves the above object through the following technical solutions, a novel circuit board structure that is convenient for heat dissipation, including a fixed structure, a circuit board body, a support seat and a heat dissipation structure installed sequentially from outside to inside;
所述支撑座的两侧侧面均固接有固定板,且所述固定板的上表面开有固定孔;所述电路板本体设在所述支撑座的顶部,且所述电路板本体通过固定螺栓与所述支撑座顶端固接;Both sides of the support seat are fixedly connected with fixing plates, and the upper surface of the fixing plate is provided with fixing holes; the circuit board body is arranged on the top of the support seat, and the circuit board body is fixed by Bolts are fixedly connected to the top of the support seat;
所述固定结构包括连接块、第一卡槽、卡块和第二卡槽,所述连接块固接在所述支撑座的一侧侧面,所述连接块的上表面开有连接孔,所述第一卡槽开设在所述连接块的外侧侧面,且所述连接孔与所述第一卡槽内部相互连通;所述第一卡槽的内壁上开有螺纹孔,所述卡块的一侧侧面开有所述第二卡槽,所述第二卡槽的内部固接有橡胶垫,所述卡块的一侧两端均开有通孔,且所述卡块与所述连接块通过螺栓固定连接;The fixing structure includes a connecting block, a first clamping slot, a clamping block and a second clamping slot, the connecting block is fixedly connected to one side of the support seat, and a connecting hole is opened on the upper surface of the connecting block, so that The first card slot is opened on the outer side of the connecting block, and the connecting hole communicates with the inside of the first card slot; the inner wall of the first card slot is provided with a threaded hole, and the card block The second card slot is opened on one side, and a rubber pad is fixed inside the second card slot, through holes are opened at both ends of one side of the card block, and the card block is connected to the The blocks are fixedly connected by bolts;
所述散热结构包括散热孔、进液口、电机、冷却管和出液口,所述散热孔开设在所述支撑座的一端端面,所述进液口与所述出液口分别固接在所述支撑座的两端端面,所述冷却管固接在所述支撑座的内部,且所述进液口、所述出液口均与所述冷却管内部相互连通;所述电机固接在所述支撑座的侧壁上,且所述电机的输出轴末端套接有扇叶;The heat dissipation structure includes a heat dissipation hole, a liquid inlet, a motor, a cooling pipe, and a liquid outlet. The two ends of the support seat, the cooling pipe is fixed inside the support seat, and the liquid inlet and the liquid outlet are connected to the inside of the cooling pipe; the motor is fixed On the side wall of the support seat, and the end of the output shaft of the motor is sleeved with fan blades;
通过所述电机、所述冷却管与所述散热孔的相互配合使用实现了使用送给装置将冷却液从所述进液口与所述出液口向所述冷却管内部循环输出,再通过所述电机驱动所述扇叶转动将所述电路板本体产生的热量从所述散热孔排放至外界,以此来达到了散热的目的。Through the mutual cooperation of the motor, the cooling pipe and the heat dissipation hole, the cooling liquid is circulated and output from the liquid inlet and the liquid outlet to the inside of the cooling pipe by using the delivery device, and then passed through The motor drives the fan blades to rotate to discharge the heat generated by the circuit board body from the cooling holes to the outside, thereby achieving the purpose of heat dissipation.
优选的,所述固定板的数目为两个,且对称分布在所述支撑座的两侧。Preferably, there are two fixing plates, which are symmetrically distributed on both sides of the support seat.
优选的,所述支撑座内部为中空结构,且所述散热孔均匀分布在所述支撑座的一侧侧面。Preferably, the inside of the support base is a hollow structure, and the heat dissipation holes are evenly distributed on one side of the support base.
优选的,所述冷却管为环形结构,且其顶部与所述电路板本体底部相互贴合。Preferably, the cooling pipe is in an annular structure, and its top is attached to the bottom of the circuit board body.
优选的,所述第一卡槽与所述卡块均为矩形结构,且两者之间的尺寸相匹配。Preferably, both the first clamping slot and the clamping block have a rectangular structure, and the dimensions between them match.
优选的,所述第二卡槽为弧形结构,且等距离分布在所述卡块的侧面。Preferably, the second clamping slots are arc-shaped and equidistantly distributed on the sides of the clamping block.
本实用新型的有益效果是:The beneficial effects of the utility model are:
1、本实用新型在支撑座的内部设置有冷却管,通过使用冷却液供给设备将冷却液从进液口、冷却管和出液口形成流动的循环方式,使得电路板本体产生的热量部分能够被冷却管内部的冷却液所吸收,再配合扇叶鼓风来将其内部热量通过散热孔排至外界,增强了散热效果;1. The utility model is provided with a cooling pipe inside the support seat, and the cooling liquid is formed into a circulating mode of flow from the liquid inlet, the cooling pipe and the liquid outlet by using the cooling liquid supply equipment, so that the heat generated by the circuit board body can be partially It is absorbed by the cooling liquid inside the cooling pipe, and then cooperates with the blowing of the fan blades to discharge the internal heat to the outside through the cooling holes, which enhances the cooling effect;
2、本实用新型在支撑座的表面设有连接块,可将引线穿过连接孔的内部,再将卡块卡合在第一卡槽的内部,通过使用螺丝将卡块与连接块进行固定,由于卡块表面上的第二卡槽内部安装有橡胶垫,在橡胶垫的挤压作用下,能够将穿过连接孔的引线进行固定,避免了引线与电路板本体的接触点容易产生松动和脱落的现象。2. The utility model is provided with a connection block on the surface of the support seat, the lead wire can be passed through the inside of the connection hole, and then the block is engaged in the first slot, and the block and the connection block are fixed by using screws , because the rubber pad is installed inside the second slot on the surface of the block, under the extrusion of the rubber pad, the lead wire passing through the connection hole can be fixed, avoiding the easy loosening of the contact point between the lead wire and the circuit board body and shedding phenomenon.
附图说明Description of drawings
为了更清楚地说明本实用新型实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其它的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the present utility model, and those skilled in the art can also obtain other drawings according to these drawings without any creative effort.
图1为本实用新型整体结构示意图;Fig. 1 is a schematic diagram of the overall structure of the utility model;
图2为本实用新型局部剖视图;Fig. 2 is a partial sectional view of the utility model;
图3为图1中A处结构放大示意图;Fig. 3 is the enlarged schematic view of the structure at A in Fig. 1;
图4为本实用新型卡块结构示意图。Fig. 4 is a schematic diagram of the block structure of the utility model.
图中:1、固定板,2、固定孔,3、散热孔,4、支撑座,5、电路板本体,6、固定螺栓,7、连接块,8、进液口,9、电机,10、冷却管,11、出液口,12、扇叶,13、连接孔,14、第一卡槽,15、螺纹孔,16、卡块,17、复位腔,18、橡胶垫,19、通孔。In the figure: 1. Fixing plate, 2. Fixing hole, 3. Cooling hole, 4. Support seat, 5. Circuit board body, 6. Fixing bolt, 7. Connection block, 8. Liquid inlet, 9. Motor, 10 , cooling pipe, 11, liquid outlet, 12, fan blade, 13, connection hole, 14, first slot, 15, threaded hole, 16, block, 17, reset chamber, 18, rubber pad, 19, through hole.
具体实施方式Detailed ways
为使得本实用新型的实用新型目的、特征、优点能够更加的明显和易懂,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,下面所描述的实施例仅仅是本实用新型一部分实施例,而非全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本实用新型保护的范围。In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical solutions in the utility model embodiment will be clearly and completely described below in conjunction with the accompanying drawings in the utility model embodiment, Apparently, the embodiments described below are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
下面结合附图并通过具体实施方式来进一步说明本实用新型的技术方案。The technical scheme of the utility model will be further described below in conjunction with the accompanying drawings and through specific embodiments.
在本实用新型的描述中,需要理解的是,术语“上”、“下”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner" and "outer" are based on the The orientation or positional relationship is only for the convenience of describing the utility model and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a reference to the utility model. limits.
请参阅图1-4所示,一种新型便于散热的电路板结构,包括从外到内依次安装的固定结构、电路板本体5、支撑座4和散热结构;Please refer to Figure 1-4, a new type of circuit board structure that is convenient for heat dissipation, including a fixed structure, a circuit board body 5, a support seat 4 and a heat dissipation structure installed sequentially from outside to inside;
所述支撑座4的两侧侧面均固接有固定板1,且所述固定板1的上表面开有固定孔2;所述电路板本体5设在所述支撑座4的顶部,且所述电路板本体5通过固定螺栓6与所述支撑座4顶端固接;Both sides of the support seat 4 are fixedly connected with a fixed plate 1, and the upper surface of the fixed plate 1 has a fixed hole 2; the circuit board body 5 is arranged on the top of the support seat 4, and the The circuit board body 5 is affixed to the top of the support seat 4 through a fixing bolt 6;
所述固定结构包括连接块7、第一卡槽14、卡块16和第二卡槽17,所述连接块7固接在所述支撑座4的一侧侧面,所述连接块7的上表面开有连接孔13,所述第一卡槽14开设在所述连接块7的外侧侧面,且所述连接孔13与所述第一卡槽14内部相互连通;所述第一卡槽14的内壁上开有螺纹孔15,所述卡块16的一侧侧面开有所述第二卡槽17,所述第二卡槽17的内部固接有橡胶垫18,所述卡块16的一侧两端均开有通孔19,且所述卡块16与所述连接块7通过螺栓固定连接;The fixing structure includes a connecting block 7, a first clamping slot 14, a clamping block 16 and a second clamping slot 17, and the connecting block 7 is fixedly connected to one side of the supporting base 4, and the top of the connecting block 7 There is a connection hole 13 on the surface, and the first card slot 14 is set on the outer side of the connection block 7, and the connection hole 13 and the first card slot 14 communicate with each other; the first card slot 14 There is a threaded hole 15 on the inner wall of the block 16, and the second card slot 17 is opened on one side of the block 16, and a rubber pad 18 is fixed inside the second block 17, and the block 16 Both ends of one side are provided with through holes 19, and the clamping block 16 and the connecting block 7 are fixedly connected by bolts;
所述散热结构包括散热孔3、进液口8、电机9、冷却管10和出液口11,所述散热孔3开设在所述支撑座4的一端端面,所述进液口8与所述出液口11分别固接在所述支撑座4的两端端面,所述冷却管10固接在所述支撑座4的内部,且所述进液口8、所述出液口11均与所述冷却管10内部相互连通;所述电机9固接在所述支撑座4的侧壁上,且所述电机9的输出轴末端套接有扇叶12;The heat dissipation structure includes a heat dissipation hole 3, a liquid inlet 8, a motor 9, a cooling pipe 10, and a liquid outlet 11. The liquid outlets 11 are respectively affixed to the two ends of the support base 4, the cooling pipe 10 is affixed to the inside of the support base 4, and the liquid inlet 8 and the liquid outlet 11 are both It communicates with the inside of the cooling pipe 10; the motor 9 is fixed on the side wall of the support base 4, and the end of the output shaft of the motor 9 is sleeved with a fan blade 12;
通过所述电机9、所述冷却管10与所述散热孔3的相互配合使用实现了使用送给装置将冷却液从所述进液口8与所述出液口11向所述冷却管10内部循环输出,再通过所述电机9驱动所述扇叶12转动将所述电路板本体5产生的热量从所述散热孔3排放至外界,以此来达到了散热的目的。Through the mutual cooperation of the motor 9, the cooling pipe 10 and the heat dissipation hole 3, the cooling liquid is sent from the liquid inlet 8 and the liquid outlet 11 to the cooling pipe 10 using a feeding device. The internal circulation is output, and then the fan blade 12 is driven to rotate by the motor 9 to discharge the heat generated by the circuit board body 5 from the heat dissipation hole 3 to the outside, thereby achieving the purpose of heat dissipation.
所述固定板1的数目为两个,且对称分布在所述支撑座4的两侧,便于将所述支撑座4固定在机箱内部;所述支撑座4内部为中空结构,且所述散热孔3均匀分布在所述支撑座4的一侧侧面,便于其内部结构的安装;所述冷却管10为环形结构,且其顶部与所述电路板本体5底部相互贴合,便于所述电路板本体5表面的热量倒导入所述冷却管10内部;所述第一卡槽14与所述卡块16均为矩形结构,且两者之间的尺寸相匹配,便于将所述卡块16通过螺丝固定在所述第一卡槽14的内部,使得所述橡胶垫18对引线进行固定;所述第二卡槽17为弧形结构,且等距离分布在所述卡块16的侧面,便于将所述第二卡槽17卡合在引线的表面。The number of the fixing plates 1 is two, and they are symmetrically distributed on both sides of the support base 4, which is convenient for fixing the support base 4 inside the chassis; the inside of the support base 4 is a hollow structure, and the heat dissipation The holes 3 are evenly distributed on one side of the support seat 4, which is convenient for the installation of its internal structure; the cooling pipe 10 is a ring structure, and its top and the bottom of the circuit board body 5 are attached to each other, which is convenient for the circuit board. The heat on the surface of the plate body 5 is poured into the inside of the cooling pipe 10; the first clamping groove 14 and the clamping block 16 are both rectangular structures, and the dimensions between the two are matched to facilitate the clamping block 16 It is fixed inside the first clamping slot 14 by screws, so that the rubber pad 18 fixes the lead wires; the second clamping slot 17 is an arc-shaped structure, and is equidistantly distributed on the side of the clamping block 16, It is convenient to engage the second locking groove 17 on the surface of the lead wire.
本实用新型在使用时,本申请中出现的电器元件在使用时均外接连通电源和控制开关,首先将支撑座4通过固定板1固定在机箱内部的安装位置,然后将电路板本体5通过固定螺丝固定在支撑座4的顶部,在支撑座4的侧面设有连接块7,可将引线穿过连接孔13的内部,再将卡块16卡合在第一卡槽14的内部,通过使用螺丝将卡块16与连接块7进行固定,由于卡块16表面上的第二卡槽17内部安装有橡胶垫18,在橡胶垫18的挤压作用下,能够将穿过连接孔13的引线进行挤压固定,避免了引线与电路板本体5的接触点容易产生松动和脱落的现象;When the utility model is in use, the electrical components appearing in the application are all externally connected to the power supply and the control switch. First, the support base 4 is fixed at the installation position inside the cabinet by the fixing plate 1, and then the circuit board body 5 is fixed by The screw is fixed on the top of the support base 4, and the side of the support base 4 is provided with a connection block 7, the lead wire can be passed through the inside of the connection hole 13, and then the clamp block 16 is engaged in the inside of the first clamping groove 14. By using The screw fixes the clamping block 16 and the connecting block 7. Since the rubber pad 18 is installed inside the second draw-in groove 17 on the surface of the clamping block 16, under the extrusion of the rubber pad 18, the lead wire passing through the connecting hole 13 can be Squeeze and fix, avoiding the phenomenon that the contact point between the lead wire and the circuit board body 5 is prone to loosening and falling off;
通过使用冷却液供给设备使得冷却液从进液口8、冷却管10和出液口11形成流动的循环方式,电路板本体5产生的热量部分能够被冷却管10内部的冷却液所吸收,再配合电机9驱动扇叶12鼓风来将其内部热量通过散热孔3排至外界,增强了散热效果。By using the cooling liquid supply equipment to make the cooling liquid flow from the liquid inlet 8, the cooling pipe 10 and the liquid outlet 11, the heat generated by the circuit board body 5 can be partially absorbed by the cooling liquid inside the cooling pipe 10, and then Cooperate with the motor 9 to drive the fan blades 12 to blow air to discharge the internal heat to the outside through the cooling holes 3, thereby enhancing the cooling effect.
电机9采用的是秀唯尔家居建材专营店提供的DK12C型号及其相关的配套电源和电路。What motor 9 adopts is the DK12C model provided by Xiuweier home building materials franchise store and its related supporting power supply and circuit.
涉及到电路和电子元器件和模块均为现有技术,本领域技术人员完全可以实现,无需赘言,本实用新型保护的内容也不涉及对于软件和方法的改进。The circuits, electronic components and modules involved are all existing technologies, which can be realized by those skilled in the art. Needless to say, the content protected by the utility model does not involve the improvement of software and methods.
对于本领域技术人员而言,显然本实用新型不限于上述示范性实施例的细节,而且在不背离本实用新型的精神或基本特征的情况下,能够以其他的具体形式实现本实用新型。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本实用新型的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的得同要件的含义和范围内的所有变化囊括在本实用新型内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, no matter from all points of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to fall within the scope of the claims All changes within the meaning and range of the required equivalent requirements are included in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.
以上所述,以上实施例仅用以说明本实用新型的技术方案,而非对其限制;尽管参照前述实施例对本实用新型进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本实用新型各实施例技术方案的精神和范围。As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it still can Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present utility model .
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216668A (en) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | A lead frame of a high-power drive circuit and its production method |
| CN112259513A (en) * | 2020-10-22 | 2021-01-22 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216668A (en) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | A lead frame of a high-power drive circuit and its production method |
| CN112216668B (en) * | 2020-09-10 | 2022-08-02 | 安徽龙芯微科技有限公司 | Lead frame of high-power drive circuit and production method |
| CN112259513A (en) * | 2020-10-22 | 2021-01-22 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
| CN112259513B (en) * | 2020-10-22 | 2023-09-26 | 湖南国芯半导体科技有限公司 | Double-sided heat dissipation power module and packaging method thereof |
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