CN219802737U - Circuit board structure - Google Patents
Circuit board structure Download PDFInfo
- Publication number
- CN219802737U CN219802737U CN202320176019.6U CN202320176019U CN219802737U CN 219802737 U CN219802737 U CN 219802737U CN 202320176019 U CN202320176019 U CN 202320176019U CN 219802737 U CN219802737 U CN 219802737U
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- China
- Prior art keywords
- circuit board
- shell
- wall
- assembly shell
- conducting plate
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- 238000001816 cooling Methods 0.000 claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims description 35
- 238000013016 damping Methods 0.000 claims description 15
- 238000009423 ventilation Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 31
- 238000001914 filtration Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a circuit board structure, which comprises a circuit board, wherein an assembly shell is fixed on one side of the circuit board, a second filter plate is embedded on one side of the outer wall of the assembly shell, a first filter plate is installed on the other side of the outer wall of the assembly shell, a cooling fan is embedded on the outer wall of the first filter plate, and an instrument shell is arranged on one side of the assembly shell. The assembly shell and the instrument shell on one side of the circuit board are fixed through bolts, so that the assembly shell is convenient to disassemble, assemble, replace and maintain, meanwhile, the first filter plate and the second filter plate are embedded in the outer wall of the assembly shell, so that air can conveniently pass through the filter screen, enter the inside of the instrument shell, ventilate and dissipate heat of the circuit board, the heat dissipation efficiency of the heat dissipation equipment of the outgoing instrument is improved, meanwhile, the work of the heat dissipation fan is convenient to improve the circulation of air flow, air cooling and heat dissipation are carried out, the heat dissipation efficiency is further improved, and the problem that the heat generated by the filtration of the circuit board cannot be dispersed is avoided.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board structure.
Background
The circuit board enables the circuit to be miniaturized and visualized, plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and can be called a printed circuit board or a printed circuit board, and the English name is FPC circuit board; the FPC circuit board is also called flexible circuit board which is made of polyimide or polyester film as base material and has high reliability and excellent flexibility, so that in the circuit design of the circuit board, the FPC circuit board is connected with a power device and the like through the circuit board, thereby facilitating the normal operation of the instrument.
The circuit board with high heat dissipation structure as disclosed in publication number CN115052415a, comprising: a welding surface arranged on the front surface of the circuit board and a radiating surface arranged on the back surface of the circuit board; the welding surface is used for connecting a power device; at least one pin bonding pad part and at least two radiating fin bonding pad parts are arranged on the welding surface; the heat dissipation surface is provided with a lower copper-clad layer, and any one side and at least two sides of the lower copper-clad layer are provided with a plurality of independent bonding pads. According to the utility model, the heat dissipation mode of the power device on the circuit board is improved, so that the arrangement of each functional area is not limited by the heat dissipation requirement of the power device, the layout of the circuit board is more flexible, the heat dissipation requirement of the power device is ensured, and the overall performance of the circuit board is effectively improved.
In summary, the following technical problems exist in the prior art: in the use process of the existing circuit board, the existing circuit board lacks an independent heat dissipation structure, if only depends on heat dissipation equipment arranged by an instrument, heat dissipation is insufficient, and accordingly burden is caused on the circuit board to affect use.
Disclosure of Invention
The present utility model is directed to a circuit board structure, which solves the above-mentioned problems.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a circuit board structure, includes the circuit board, one side of circuit board is fixed with the assembly shell, and inlays on one side of the outer wall of assembly shell and be equipped with the second filter, the first filter is installed to the outer wall opposite side of assembly shell, and inlays the outer wall of first filter and be equipped with radiator fan, one side of assembly shell is provided with the instrument shell, and the outer wall of instrument shell inlays and be equipped with the filter screen.
Preferably, the circuit board is fixedly connected with the assembly shell, and the assembly shell is detachably connected with the instrument shell through bolts.
Preferably, the assembly shell is communicated with the filter screen through a first filter plate, and the first filter plate is fixedly connected with the cooling fan through bolts.
Preferably, the inside of assembly shell is provided with the refrigeration chamber, and the inner wall in refrigeration chamber inlays and is equipped with the refrigeration piece, the one end of refrigeration piece is connected with the heating panel, the below of circuit board is provided with the heat-conducting plate, and the second ventilation groove has been seted up to the inner wall of heat-conducting plate, the inside of circuit board is provided with first ventilation groove, the bottom mounting of heat-conducting plate has the ceramic pillar, and one side of ceramic pillar is provided with the ceramic block, the mounting groove has been seted up to the inside of ceramic pillar, and the internally mounted of mounting groove has damping spring.
Preferably, the refrigerating sheet penetrates into the assembly shell, and the refrigerating sheet is fixedly connected with the assembly shell.
Preferably, the ceramic blocks are uniformly distributed at equal intervals with respect to the bottom end surface of the heat conducting plate, and the heat conducting plate is connected with the circuit board in an adhesive mode.
Preferably, the damping springs are uniformly distributed at equal intervals on the inner wall surface of the ceramic support, and the ceramic support is detachably connected with the heat conducting plate through bolts.
The above description shows that the technical problems to be solved by the present utility model can be solved by the above technical solutions of the present utility model.
Meanwhile, through the technical scheme, the utility model has at least the following beneficial effects:
the assembly shell and the instrument shell on one side of the circuit board are fixed through bolts, so that the assembly shell is convenient to disassemble, assemble, replace and maintain, meanwhile, the first filter plate and the second filter plate are embedded in the outer wall of the assembly shell, so that air can conveniently pass through the filter screen, enter the inside of the instrument shell, ventilate and dissipate heat of the circuit board, the heat dissipation efficiency of the heat dissipation equipment of the outgoing instrument is improved, meanwhile, the work of the heat dissipation fan is convenient to improve the circulation of air flow, air cooling and heat dissipation are carried out, the heat dissipation efficiency is further improved, and the problem that the heat generated by the filtration of the circuit board cannot be dispersed is avoided.
The utility model is convenient to cool the air entering the refrigerating cavity through the work of the refrigerating sheet, so that the temperature of the circulated air flow is reduced, thereby improving the heat dissipation efficiency, the heat dissipation plate assembled by the heat conversion of the refrigerating sheet is embedded on the outer wall of the instrument shell, the normal refrigerating work of the refrigerating sheet is convenient, and meanwhile, the bottom end of the circuit board is adhered with the heat conducting plate, thereby being convenient for heat conduction and avoiding excessive heat collection of the circuit board.
The first ventilation groove of the circuit board is communicated with the second ventilation groove of the heat conducting plate, so that air circulation is facilitated, heat dissipation efficiency is improved, meanwhile, the heat conducting plate is supported by the ceramic support posts and the ceramic blocks, excessive adhesion to an instrument is avoided, heat dissipation cannot be achieved, the ceramic material has insulation and heat conduction effects, a plurality of damping springs are arranged in the arrangement grooves formed in the ceramic support posts, and vibration is avoided when external force is applied to collide.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is a schematic view of a heat conducting plate structure according to the present utility model;
FIG. 4 is a schematic view of the damping spring of the present utility model.
In the figure: 1. a circuit board; 2. assembling a shell; 3. an instrument housing; 4. a filter screen; 5. a first filter plate; 6. a second filter plate; 7. a heat radiation fan; 8. a refrigerating chamber; 9. a cooling sheet; 10. a heat dissipation plate; 11. a heat conductive plate; 12. a first ventilation slot; 13. a second ventilation slot; 14. a ceramic pillar; 15. a ceramic block; 16. a placement groove; 17. damping spring.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Description of the preferred embodiments
As shown in fig. 1 and 2, the present utility model provides a technical solution: the utility model provides a circuit board structure, including circuit board 1, one side of circuit board 1 is fixed with assembly shell 2, the outer wall one side of assembly shell 2 is inlayed and is equipped with second filter 6, first filter 5 is installed to the outer wall opposite side of assembly shell 2, the outer wall of first filter 5 is inlayed and is equipped with radiator fan 7, one side of assembly shell 2 is provided with instrument shell 3, the outer wall of instrument shell 3 is inlayed and is equipped with filter screen 4, circuit board 1 and assembly shell 2 fixed connection, assembly shell 2 is linked together through first filter 5 and filter screen 4 through the bolt, first filter 5 passes through bolt and radiator fan 7 fixed connection, assembly shell 2 and instrument shell 3 of circuit board 1 side are fixed through the bolt, be convenient for carry out dismouting change and maintenance, first filter 5 and second filter 6 of assembly shell 2 outer wall inlaying simultaneously, be convenient for let the air pass filter screen 4, get into inside instrument shell 3, and to circuit board 1 dispel the heat, the radiating device at the instrument improves the radiating efficiency, work through radiator fan 7 simultaneously, be convenient for improve the circulation of air current, make air cooling, further improve the radiating efficiency, circuit board 1 filters and spreads out and can't send out.
Example two
The scheme in the first embodiment is further described below in conjunction with a specific working manner, and the details are described below:
as shown in fig. 1, fig. 2 and fig. 3, as a preferred embodiment, based on the above manner, a cooling cavity 8 is further provided in the assembly shell 2, a cooling plate 9 is embedded in the inner wall of the cooling cavity 8, one end of the cooling plate 9 is connected with a heat dissipation plate 10, a heat conducting plate 11 is provided below the circuit board 1, the cooling plate 9 penetrates into the assembly shell 2, the cooling plate 9 is fixedly connected with the assembly shell 2, the air entering the cooling cavity 8 is cooled conveniently through the operation of the cooling plate 9, the circulating air flow temperature is reduced, so that the heat dissipation efficiency is improved, the cooling plate 10 assembled through the heat conversion of the cooling plate 9 is embedded in the outer wall of the instrument shell 3, the normal cooling operation of the cooling plate 9 is facilitated, and meanwhile, the bottom end of the circuit board 1 is adhered with the heat conducting plate 11, so that the heat conduction is facilitated, and excessive heat collection of the circuit board 1 is avoided.
As shown in fig. 1-4, as a preferred embodiment, further, on the basis of the above manner, the inner wall of the heat conducting plate 11 is provided with the second ventilation groove 13, the inside of the circuit board 1 is provided with the first ventilation groove 12, the bottom end of the heat conducting plate 11 is fixed with the ceramic pillar 14, one side of the ceramic pillar 14 is provided with the ceramic block 15, the inside of the ceramic pillar 14 is provided with the mounting groove 16, the inside of the mounting groove 16 is provided with the damping spring 17, the ceramic block 15 is uniformly distributed at equal intervals with respect to the bottom end of the heat conducting plate 11, the heat conducting plate 11 is in adhesive connection with the circuit board 1, the damping spring 17 is uniformly distributed at equal intervals with respect to the inner wall of the ceramic pillar 14, the ceramic pillar 14 is detachably connected with the heat conducting plate 11 through bolts, the first ventilation groove 12 of the circuit board 1 is communicated with the second ventilation groove 13 of the heat conducting plate 11 so as to facilitate air circulation, the heat radiating efficiency is improved, meanwhile, the heat conducting plate 11 is supported by the ceramic pillar 14 and the ceramic block 15, the excessive adhesion with an instrument is avoided, the ceramic material has insulation and heat conducting effect, a plurality of damping springs 17 are arranged inside the mounting groove 16, which is provided with the mounting groove 16, and is protected by an external force.
From the above, it can be seen that:
the utility model aims at the technical problems that: in the using process of the existing circuit board, the existing circuit board lacks an independent heat dissipation structure, and if the existing circuit board only depends on heat dissipation equipment arranged by an instrument, insufficient heat dissipation is caused, so that the burden on the circuit board is caused to influence the use; the technical scheme of each embodiment is adopted. Meanwhile, the implementation process of the technical scheme is as follows:
firstly, fixing an assembly shell 2 on one side of a circuit board 1, attaching the assembly shell 2 to a required instrument shell 3, simultaneously, respectively embedding a first filter plate 5 and a second filter plate 6 on two sides of the outer wall of the assembly shell 2, embedding a filter screen 4 on the instrument shell 3, conveniently ventilating and radiating, simultaneously filtering dust impurities, installing a cooling fan 7 on the first filter plate 5, accelerating air flow to improve cooling efficiency, fixing a ceramic support column 14 and a ceramic block 15 at the bottom end of the heat conducting plate 11 respectively, conveniently supporting the heat conducting plate 11 and the circuit board 1 to attach to each other, and the like, penetrating a heat-exchange hot end heat radiation plate 10 out of the instrument shell 3, conveniently radiating, reducing the temperature of the cooling cavity 8 through the cooling plate 9, so that air flow driven by the cooling fan 7 is low-temperature air flow, further improving cooling efficiency, attaching the bottom end of the circuit board 1 to a heat conducting plate 11 made of graphite material or metal heat conducting material, conveniently transmitting heat to play a cooling effect, arranging a first ventilating slot 12 corresponding to a second ventilating slot 13 arranged on the heat conducting plate 11, conveniently ventilating the air flow, respectively fixing the ceramic support column 14 and the ceramic block 15 at the bottom end of the heat conducting plate 11, conveniently supporting the heat conducting plate 11 and the circuit board 1 to attach to each other, attaching the heat conducting plate 1, and the heat conducting plate 14 to each other, and the damping spring 17 cannot be arranged in the damping spring 17, and the damping device cannot be prevented from being impacted by the vibration, and the damping device.
Through the arrangement, the utility model can solve the technical problems, and simultaneously realize the following technical effects:
the utility model is convenient to cool the air entering the refrigerating cavity 8 through the work of the refrigerating sheet 9, so that the temperature of the circulated air flow is reduced, thereby improving the heat dissipation efficiency, the heat dissipation plate 10 assembled by the heat conversion of the refrigerating sheet 9 is embedded on the outer wall of the instrument shell 3, the normal refrigerating work of the refrigerating sheet 9 is convenient, and meanwhile, the bottom end of the circuit board 1 is adhered with the heat conducting plate 11, and the heat conduction is convenient, so that the excessive heat collection of the circuit board 1 is avoided;
the first ventilation groove 12 of the circuit board 1 is communicated with the second ventilation groove 13 of the heat conducting plate 11, so that air circulation is facilitated, heat dissipation efficiency is improved, meanwhile, the heat conducting plate 11 is supported by the ceramic support posts 14 and the ceramic blocks 15, the situation that heat cannot be dissipated due to excessive adhesion with an instrument is avoided, the ceramic material has insulation and heat conduction effects, a plurality of damping springs 17 are arranged in the arrangement grooves 16 formed in the ceramic support posts 14, and vibration is avoided when external force is applied to collide.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A circuit board structure, comprising
The circuit board (1), one side of circuit board (1) is fixed with assembly shell (2), and inlays on one side of the outer wall of assembly shell (2) and be equipped with second filter (6), first filter (5) are installed to the outer wall opposite side of assembly shell (2), and the outer wall of first filter (5) is inlayed and is equipped with radiator fan (7), one side of assembly shell (2) is provided with instrument shell (3), and the outer wall of instrument shell (3) is inlayed and is equipped with filter screen (4).
2. A circuit board structure according to claim 1, characterized in that the circuit board (1) is fixedly connected to the assembly housing (2), and that the assembly housing (2) is detachably connected to the instrument housing (3) by means of bolts.
3. A circuit board structure according to claim 1, characterized in that the assembly housing (2) is in communication with the filter screen (4) via the first filter plate (5), and that the first filter plate (5) is fixedly connected with the radiator fan (7) via bolts.
4. The circuit board structure according to claim 1, characterized in that the inside of the assembly shell (2) is provided with a refrigerating cavity (8), and the inner wall of the refrigerating cavity (8) is embedded with a refrigerating sheet (9), one end of the refrigerating sheet (9) is connected with a radiating plate (10), the lower side of the circuit board (1) is provided with a heat conducting plate (11), and the inner wall of the heat conducting plate (11) is provided with a second ventilation groove (13), the inside of the circuit board (1) is provided with a first ventilation groove (12), the bottom end of the heat conducting plate (11) is fixed with a ceramic support column (14), one side of the ceramic support column (14) is provided with a ceramic block (15), the inside of the ceramic support column (14) is provided with a setting groove (16), and the inside of the setting groove (16) is provided with a damping spring (17).
5. A circuit board structure according to claim 4, characterized in that the cooling fin (9) extends through the interior of the assembly housing (2), and that the cooling fin (9) is fixedly connected to the assembly housing (2).
6. A circuit board structure according to claim 4, characterized in that the ceramic blocks (15) are equally distributed with respect to the bottom surface of the heat conducting plate (11), and that the heat conducting plate (11) is adhesively connected to the circuit board (1).
7. A circuit board structure according to claim 4, characterized in that the damping springs (17) are equally distributed with respect to the inner wall surface of the ceramic support (14), and that the ceramic support (14) is detachably connected to the heat conducting plate (11) by means of bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320176019.6U CN219802737U (en) | 2023-02-10 | 2023-02-10 | Circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320176019.6U CN219802737U (en) | 2023-02-10 | 2023-02-10 | Circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802737U true CN219802737U (en) | 2023-10-03 |
Family
ID=88157294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320176019.6U Active CN219802737U (en) | 2023-02-10 | 2023-02-10 | Circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802737U (en) |
-
2023
- 2023-02-10 CN CN202320176019.6U patent/CN219802737U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |