CN221151622U - Porous heat dissipation circuit board structure - Google Patents
Porous heat dissipation circuit board structure Download PDFInfo
- Publication number
- CN221151622U CN221151622U CN202322721351.9U CN202322721351U CN221151622U CN 221151622 U CN221151622 U CN 221151622U CN 202322721351 U CN202322721351 U CN 202322721351U CN 221151622 U CN221151622 U CN 221151622U
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- China
- Prior art keywords
- circuit board
- heat
- groove
- heat dissipation
- hole
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000011090 solid board Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a porous heat dissipation circuit board structure, which comprises a substrate and a circuit board, wherein first grooves for installing the circuit board are respectively arranged on two sides of the surface of the substrate; the surface of the first groove is provided with more than one heat dissipation hole, and a heat conduction pipe is arranged in the heat dissipation hole; a shaftless pump pushing fan assembly is arranged between the heat dissipation hole and the heat conduction pipe; the surface of the circuit board is provided with more than one heat conduction column; the heat conducting pipe and the heat conducting column are beneficial to efficiently transferring heat, the heat is rapidly transferred from the circuit board to the heat radiating hole, and then the heat is discharged through the shaftless pump pushing fan assembly, so that the components on the circuit board are kept at a proper working temperature; by arranging the air inlet grooves and the netlike heat conducting grooves, the air flow can be optimized, and cooling air is ensured to enter the heat dissipation system and effectively cool the hot spot area on the circuit board. This helps to increase the heat dissipation efficiency, which may be more efficient than conventional cooling methods, reducing the cooling energy and cost required.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a porous heat dissipation circuit board structure.
Background
The names of the circuit boards are: circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etch technology) circuit boards, and the like. The circuit board is mainly composed of bonding pads, via holes, mounting holes, wires, components, connectors, filling, electrical boundaries and the like.
The existing circuit board is a solid board, only external heat dissipation can be carried out, internal ventilation heat dissipation can not be realized, heat dissipation performance is not ideal, and the working performance of the circuit board is easily influenced;
In the prior art, most of circuit boards and substrates for heat dissipation on the circuit boards are attached; in order to ensure the stability between the circuit board and the substrate, most of the circuit board and the substrate are fixed by screw connection, and when the circuit board is damaged, the substrate is more troublesome to detach.
Disclosure of utility model
The technical problem to be solved by the utility model is to provide a porous heat dissipation circuit board structure so as to solve the technical problem mentioned in the background art.
The porous heat dissipation circuit board structure is realized by the following technical scheme: the circuit board comprises a substrate and a circuit board, wherein first grooves for installing the circuit board are respectively formed in two sides of the surface of the substrate; the surface of the first groove is provided with more than one heat dissipation hole, and a heat conduction pipe is arranged in the heat dissipation hole;
A shaftless pump pushing fan assembly is arranged between the heat dissipation hole and the heat conduction pipe; the surface of the circuit board is provided with more than one heat conduction column; the circuit board is covered and arranged at the upper end of the heat dissipation hole; the heat conduction column is arranged in the heat conduction pipe;
The surface of the first groove is provided with a netlike heat conduction groove connected with the heat dissipation holes; an air inlet groove connected with the netlike heat conducting groove is arranged on the side face of the substrate.
As a preferable technical scheme, a cavity connected with the heat dissipation holes is arranged in the substrate; an exhaust groove connected with the cavity is arranged on the side face of the base plate.
As the preferable technical scheme, more than one support bracket for connecting the heat conduction pipe is arranged in the heat dissipation hole.
As the preferable technical scheme, each corner of the surface of the substrate is provided with a second groove, both sides of the second groove are provided with third grooves, and the surface of the second groove is provided with a first rotating shaft;
A stop lever is arranged on the second groove and is arranged at the upper end of the circuit board; the surface of the stop lever is provided with a first rotating shaft hole, and the first rotating shaft is arranged in the first rotating shaft hole.
As an optimal technical scheme, a limit bracket is movably arranged in the third groove up and down, and a sliding block is arranged on the side surface of the limit bracket;
The sliding block is provided with a second guide hole; the side of the third groove is provided with a guide chute, and a second rotating shaft is arranged in the guide chute.
As the preferable technical proposal, the sliding block is movably arranged in the guide chute, and the second rotating shaft is arranged in the second guide hole;
An elastic element is arranged on the second rotating shaft, and two ends of the elastic element respectively support against the sliding block and the guide sliding groove.
The beneficial effects of the utility model are as follows:
the heat conducting pipes and the heat conducting columns are beneficial to efficiently transferring heat, the heat is quickly transferred from the circuit board to the heat radiating holes, and then the heat is discharged through the shaftless pump pushing fan assembly, so that the components on the circuit board are kept at a proper working temperature;
By arranging the air inlet grooves and the netlike heat conducting grooves, the air flow can be optimized, and cooling air is ensured to enter the heat dissipation system and effectively cool the hot spot area on the circuit board. This helps to increase the heat dissipation efficiency, which may be more efficient than conventional cooling methods, reducing the cooling energy and cost required.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a substrate;
FIG. 2 is a schematic diagram of a substrate;
FIG. 3 is a schematic diagram of a porous heat dissipating circuit board structure according to the present utility model;
FIG. 4 is a schematic diagram at B;
Fig. 5 is a schematic diagram at a.
Detailed Description
All of the features disclosed in this specification, or all of the steps in a method or process disclosed, may be combined in any combination, except for mutually exclusive features and/or steps.
As shown in fig. 1-5, the porous heat dissipation circuit board structure of the present utility model comprises a substrate 1 and a circuit board 13, wherein two sides of the surface of a first groove 12 are respectively provided with a first groove 12 for installing the circuit board 13; the surface of the substrate 1 is provided with more than one radiating hole 11, and a heat conduction pipe 10 is arranged in the radiating hole 11;
A shaftless pump-pushing fan assembly 220 is arranged between the heat dissipation hole 11 and the heat conduction pipe 10; the surface of the circuit board 13 is provided with more than one heat conduction column 18; the circuit board 13 is arranged at the upper end of the heat dissipation hole 11 in a covering manner; the heat conduction column 18 is arranged in the heat conduction pipe 10;
The surface of the first groove 12 is provided with a netlike heat conduction groove 15 connected with the heat dissipation holes 11; an air inlet groove 14 connected with a reticular heat conducting groove 15 is arranged on the side surface of the base plate 1;
the heat conducting pipes and the heat conducting columns are beneficial to efficiently transferring heat, the heat is quickly transferred from the circuit board to the heat radiating holes, and then the heat is discharged through the shaftless pump pushing fan assembly, so that the components on the circuit board are kept at a proper working temperature;
By arranging the air inlet grooves and the netlike heat conducting grooves, the air flow can be optimized, and cooling air is ensured to enter the heat dissipation system and effectively cool the hot spot area on the circuit board. This helps to increase the heat dissipation efficiency, which may be more efficient than conventional cooling methods, reducing the cooling energy and cost required.
In this embodiment, a cavity 210 connected to the heat dissipation hole 11 is provided in the substrate 1; an exhaust groove 240 connected with the cavity 210 is arranged on the side surface of the base plate 1, and the exhaust groove 240 discharges hot air; more than one support bracket 230 for connecting the heat conduction pipe 10 is arranged in the heat dissipation hole 11.
In order to realize that the substrate can limit and fix the circuit board, each corner of the surface of the substrate 1 is provided with a second groove 59, both sides of the second groove 59 are provided with a third groove 551, and the surface of the second groove 59 is provided with a first rotating shaft 56;
The second groove 59 is provided with a stop lever 57, and the stop lever 57 is arranged at the upper end of the circuit board 13; the surface of the stop lever 57 is provided with a first rotating shaft hole 58, and the first rotating shaft 56 is arranged in the first rotating shaft hole 58 so as to realize the rotation of the stop lever 57;
In order to realize the limit fixing of the stop lever, a limit bracket 50 is movably arranged in the third groove 551 up and down, and a slide block 52 is arranged on the side surface of the limit bracket 50;
The slide block 52 is provided with a second guide hole 51; the side surface of the third groove 551 is provided with a guide chute 55, and a second rotating shaft 53 is arranged in the guide chute 55;
The sliding block 52 is movably arranged in the guide chute 55, and the second rotating shaft 53 is arranged in the second guide hole 51; an elastic element is mounted on the second rotating shaft 53, and two ends of the elastic element respectively support the sliding block 52 and the guiding chute 55.
In an initial state, under the tension of the elastic element, the limiting support and the stop lever are oppositely extruded, so that the stop lever cannot rotate; when the stop lever is required to be rotated, the elastic element is pressed by downwards extruding the stop lever, the limiting support and the stop lever are arranged in a staggered mode, and the limiting between the limiting support and the stop lever is relieved.
The foregoing is merely illustrative of specific embodiments of the present utility model, and the scope of the utility model is not limited thereto, but any changes or substitutions that do not undergo the inventive effort should be construed as falling within the scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope defined by the claims.
Claims (6)
1. A porous heat dissipation circuit board structure comprises a substrate (1) and a circuit board (13), wherein first grooves (12) for installing the circuit board (13) are respectively arranged on two sides of the surface of the substrate (1); the method is characterized in that: more than one radiating hole (11) is formed in the surface of the first groove (12), and a heat conduction pipe (10) is arranged in the radiating hole (11);
a shaftless pump pushing fan assembly (220) is arranged between the heat dissipation hole (11) and the heat conduction pipe (10); the surface of the circuit board (13) is provided with more than one heat conduction column (18); the circuit board (13) is covered and arranged at the upper end of the heat dissipation hole (11); the heat conduction column (18) is arranged in the heat conduction pipe (10);
The surface of the first groove (12) is provided with a netlike heat conduction groove (15) connected with the heat dissipation holes (11); an air inlet groove (14) connected with the reticular heat conduction groove (15) is arranged on the side surface of the base plate (1).
2. The porous heat dissipating circuit board structure of claim 1, wherein: a cavity (210) connected with the heat dissipation holes (11) is arranged in the substrate (1); an exhaust groove (240) connected with the cavity (210) is arranged on the side surface of the base plate (1).
3. The porous heat dissipating circuit board structure of claim 1, wherein: more than one support bracket (230) for connecting the heat conduction pipe (10) is arranged in the heat dissipation hole (11).
4. The porous heat dissipating circuit board structure of claim 1, wherein: each corner of the surface of the base plate (1) is provided with a second groove (59), both sides of the second groove (59) are provided with a third groove (551), and the surface of the second groove (59) is provided with a first rotating shaft (56);
A stop lever (57) is arranged on the second groove (59), and the stop lever (57) is arranged at the upper end of the circuit board (13); the surface of the stop lever (57) is provided with a first rotating shaft hole (58), and the first rotating shaft (56) is arranged in the first rotating shaft hole (58).
5. The porous heat dissipating circuit board structure of claim 1, wherein: a limiting bracket (50) is movably arranged in the third groove (551) up and down, and a sliding block (52) is arranged on the side surface of the limiting bracket (50);
The sliding block (52) is provided with a second guide hole (51); the side of the third groove (551) is provided with a guide chute (55), and a second rotating shaft (53) is arranged in the guide chute (55).
6. The porous heat dissipating circuit board structure of claim 1, wherein: the sliding block (52) is movably arranged in the guide chute (55), and the second rotating shaft (53) is arranged in the second guide hole (51);
An elastic element is arranged on the second rotating shaft (53), and two ends of the elastic element respectively support against the sliding block (52) and the guide sliding groove (55).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322721351.9U CN221151622U (en) | 2023-10-10 | 2023-10-10 | Porous heat dissipation circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322721351.9U CN221151622U (en) | 2023-10-10 | 2023-10-10 | Porous heat dissipation circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221151622U true CN221151622U (en) | 2024-06-14 |
Family
ID=91421238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322721351.9U Active CN221151622U (en) | 2023-10-10 | 2023-10-10 | Porous heat dissipation circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221151622U (en) |
-
2023
- 2023-10-10 CN CN202322721351.9U patent/CN221151622U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |