CN219248445U - Kong Dianlu board in disc for industrial control software - Google Patents

Kong Dianlu board in disc for industrial control software Download PDF

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Publication number
CN219248445U
CN219248445U CN202223581539.XU CN202223581539U CN219248445U CN 219248445 U CN219248445 U CN 219248445U CN 202223581539 U CN202223581539 U CN 202223581539U CN 219248445 U CN219248445 U CN 219248445U
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China
Prior art keywords
plate
circuit board
heat dissipation
board body
control software
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CN202223581539.XU
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Chinese (zh)
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金建
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Suzhou Jinkeli Intelligent Technology Co ltd
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Suzhou Jinkeli Intelligent Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model belongs to the field of circuit boards for industrial control software, in particular to a Kong Dianlu board in a disk for industrial control software, which comprises a circuit board body, a mounting mechanism and a heat dissipation mechanism, wherein the circuit board body is arranged on a chassis backboard, the circuit board body is connected with the chassis backboard through the mounting mechanism, the heat dissipation mechanism comprises a heat dissipation plate and a heat conduction plate, the heat conduction plate is attached to the bottom surface of the circuit board body, the heat dissipation plate is fixedly arranged on the bottom surface of the heat conduction plate, a board connecting bolt, a second elastic piece and a bearing plate are arranged on the mounting mechanism, the upper end surface of the bearing plate is fixedly connected with the bottom surface of the heat dissipation plate, and the connecting bolt penetrates through the bearing plate and is connected with the chassis backboard through internal and external screw threads; through the cooperation of the structure, the clearance between the back surface of the circuit board body and the back plate of the chassis is increased, air circulation is facilitated, meanwhile, the heat dissipation efficiency of the back surface of the circuit board is improved, the gelling phenomenon of the back surface of the circuit board body is relieved as much as possible, and the service life of the circuit board body is prolonged.

Description

Kong Dianlu board in disc for industrial control software
Technical Field
The utility model relates to the field of circuit boards for industrial control software, in particular to a disk middle hole circuit board for industrial control software.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultra-thin circuit boards, printed (copper etching technology) circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The circuit board may be referred to as a printed wiring board or a printed circuit board.
Definition of holes in a disk of a disk hollow circuit board: the hole under the bonding pad, the inner diameter of the bonding pad, after the resin is plugged, a layer of copper is plated on the inner diameter base material in a copper plating mode, so that the whole surface of the copper base material looks like a large copper surface, and the hole is buried under the bonding pad.
The circuit board is used as an internal important component of the processor chassis and is usually arranged on a backboard of the chassis, a large amount of heat can be generated in the working process of the circuit board, the circuit board is directly fixed on the chassis backboard through common fasteners such as screws in the prior art, the clearance between the chassis backboard and the back of the circuit board is too small, the air circulation is affected, and therefore the heat on the back of the circuit board cannot be discharged timely, the back of the circuit board is gelled, and the use is affected.
Therefore, a disk medium-hole circuit board for industrial control software is provided for solving the problems.
Disclosure of Invention
In order to make up the deficiency of the prior art, solve the back of the circuit board and unable timely discharge of heat, lead to the back of the circuit board to gel, influence the problem used, the utility model provides a kind of industrial control software uses the circuit board of hole in the dish.
The technical scheme adopted for solving the technical problems is as follows: the Kong Dianlu board in the disk for the industrial control software comprises a circuit board body, a mounting mechanism and a heat dissipation mechanism, wherein the circuit board body is arranged on a chassis backboard, and the circuit board body is connected with the chassis backboard through the mounting mechanism.
The heat dissipation mechanism comprises a heat dissipation plate and a heat conduction plate, wherein the heat conduction plate is attached to the bottom surface of the circuit board body, and the heat dissipation plate is fixedly arranged on the bottom surface of the heat conduction plate.
The mounting mechanism comprises a connecting bolt, a second elastic piece and a bearing plate, wherein the upper end face of the bearing plate is fixedly connected with the bottom face of the heat dissipation plate, the second elastic piece is fixedly mounted on the bottom face of the bearing plate, and the connecting bolt penetrates through the bearing plate and is connected with the chassis backboard through internal and external thread matching.
Preferably, the heat dissipation plate is provided with a plurality of, and a plurality of heat dissipation plates equidistantly distribute the outer wall at the heat conduction board.
The outer wall of the heat radiation plate is detachably provided with an air duct, and the inner cavity of the air duct is provided with a rotatable exhaust fan.
Preferably, the inner cavity of the air duct is fixedly connected with a driving assembly, and the output end of the driving assembly is fixedly connected with the axial end of the exhaust fan.
Preferably, the upper end face of the circuit board body is slidably provided with a connecting shaft, one end of the connecting shaft penetrates through the circuit board body and is fixedly connected with a connecting plate, and the upper end face of the connecting plate is attached to the bottom face of the heat conducting plate.
Preferably, the outer wall of the connecting shaft is provided with a first elastic piece, one end of the first elastic piece is attached to the outer wall of the circuit board body, and the other end of the first elastic piece is attached to the outer wall of the connecting shaft.
Preferably, the outer wall fixedly connected with elastic plate of air duct, lateral wall fixedly connected with blotter and joint piece of elastic plate, the holding recess that supplies the joint piece to peg graft is seted up to the outer wall of heating panel.
The utility model has the advantages that:
according to the utility model, the heat radiating plate, the heat conducting plate, the bearing plate, the connecting bolt and the second elastic piece are arranged, and the gap between the back surface of the circuit board body and the back plate of the chassis can be increased by the cooperation of the structures, so that air circulation is facilitated, the heat radiating efficiency of the back surface of the circuit board can be improved, the back surface gelatinization phenomenon of the circuit board body can be relieved as much as possible, and the service life of the circuit board body can be prolonged.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the installation of a heat-conducting plate according to the present utility model;
FIG. 3 is a schematic view of the installation of the connection plate of the present utility model;
fig. 4 is a schematic diagram of the internal structure of the air duct in the present utility model.
In the figure: 1. a circuit board body; 2. a connecting shaft; 3. a first elastic member; 4. a connecting bolt; 5. a second elastic member; 6. a carrying plate; 7. an air duct; 8. a drive assembly; 9. an elastic plate; 10. a cushion pad; 11. an exhaust fan; 12. a heat dissipation plate; 13. a heat conductive plate; 14. a connecting plate; 15. and a clamping block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
Referring to fig. 1-4, a Kong Dianlu board in a disc for industrial control software includes a circuit board body 1 disposed on a chassis backboard, a mounting mechanism and a heat dissipation mechanism, where the circuit board body 1 is connected with the chassis backboard through the mounting mechanism.
The heat dissipation mechanism comprises a heat dissipation plate 12 and a heat conduction plate 13, wherein the heat dissipation plate 12 and the heat conduction plate 13 are preferably aluminum plates, the heat conduction plate 13 is attached to the bottom surface of the circuit board body 1, and silicone grease is uniformly coated at the contact position of the heat conduction plate 13 and the circuit board body 1.
The heat dissipation plate 12 is fixedly installed on the bottom surface of the heat conduction plate 13, and the heat dissipation plate 12 and the heat conduction plate 13 are arranged to dissipate heat for the bottom surface of the circuit board body 1, so that the bottom surface of the circuit board body 1 is prevented from being overheated and gelled as much as possible.
The mounting mechanism comprises a connecting bolt 4, a second elastic piece 5 and a bearing plate 6, wherein the upper end surface of the bearing plate 6 is fixedly connected with the bottom surface of the heat dissipation plate 12, the bearing plate 6 provides a mounting position for the heat dissipation plate 12, and the second elastic piece 5 is a common spring.
The second elastic piece 5 is fixedly installed on the bottom surface of the bearing plate 6, the connecting bolt 4 penetrates through the bearing plate 6 and is connected with the chassis backboard through internal and external thread matching, the connecting bolt 4 is matched with the bearing plate 6, the bearing plate 6 is supported by the second elastic piece 5, and a space for air circulation can be formed between the back surface of the circuit board body 1 and the chassis backboard, so that the heat dissipation efficiency of the back surface of the circuit board body 1 is further improved.
The heat dissipation plates 12 are provided with a plurality of heat dissipation plates 12, the plurality of heat dissipation plates 12 are equidistantly distributed on the outer wall of the heat conduction plate 13, and gas passes through a gap between two adjacent heat dissipation plates 12.
The outer wall of the radiating plate 12 is detachably provided with the air duct 7, the inner cavity of the air duct 7 is provided with a rotatable exhaust fan 11, air is blown by the exhaust fan 11, heat transferred by the radiating plate 12 is taken away, and the heat dissipation of the back surface of the circuit board body 1 is realized.
The inner chamber fixedly connected with drive assembly 8 of air duct 7, the output of drive assembly 8 and the axial end fixed connection of exhaust fan 11, drive assembly 8 are common servo motor, as exhaust fan 11 pivoted power supply, in addition, reserve the clearance that supplies the gas to pass through between drive assembly 8 outer wall and air duct 7 inner wall.
The upper end face of the circuit board body 1 is slidably provided with a connecting shaft 2, one end of the connecting shaft 2 penetrates through the circuit board body 1 and is fixedly connected with a connecting plate 14, the upper end face of the connecting plate 14 is attached to the bottom face of the heat conducting plate 13, the heat conducting plate 13 is propped against through the connecting plate 14, and connection between the heat conducting plate 13 and the circuit board body 1 is achieved.
The outer wall of connecting axle 2 is provided with first elastic component 3, and the one end of first elastic component 3 is laminated with the outer wall of circuit board body 1, and the other end of first elastic component 3 is laminated with the outer wall of connecting axle 2, and first elastic component 3 is common spring, presss from both sides tight heat-conducting plate 13 in real time through the elasticity of first elastic component 3, improves the stability of connecting between heat-conducting plate 13 and the circuit board body 1.
The outer wall fixedly connected with elastic plate 9 of air duct 7, the lateral wall fixedly connected with blotter 10 and joint piece 15 of elastic plate 9, joint piece 15 runs through blotter 10, and blotter 10 is common damping rubber pad.
The outer wall of the heat radiation plate 12 is provided with a containing groove for inserting the clamping block 15, the connection between the air duct 7 and the heat radiation plate 12 is realized through the clamping block 15 and the containing groove, and the buffer pad 10 is arranged to release the vibration of the heat radiation plate 12 when the driving component 8 works as far as possible.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.

Claims (6)

1. Kong Dianlu board in industrial control software uses dish, its characterized in that: the circuit board comprises a circuit board body (1) arranged on a chassis backboard, a mounting mechanism and a heat dissipation mechanism, wherein the circuit board body (1) is connected with the chassis backboard through the mounting mechanism;
the heat dissipation mechanism comprises a heat dissipation plate (12) and a heat conduction plate (13), wherein the heat conduction plate (13) is attached to the bottom surface of the circuit board body (1), and the heat dissipation plate (12) is fixedly arranged on the bottom surface of the heat conduction plate (13);
the mounting mechanism comprises a connecting bolt (4), a second elastic piece (5) and a bearing plate (6), wherein the upper end face of the bearing plate (6) is fixedly connected with the bottom face of the heat dissipation plate (12), the second elastic piece (5) is fixedly mounted on the bottom face of the bearing plate (6), and the connecting bolt (4) penetrates through the bearing plate (6) and is connected with the chassis back plate through internal and external thread matching.
2. The board Kong Dianlu in a disc for industrial control software as claimed in claim 1, wherein: the heat dissipation plates (12) are arranged in plurality, and the heat dissipation plates (12) are equidistantly distributed on the outer wall of the heat conduction plate (13);
the outer wall of the radiating plate (12) is detachably provided with an air duct (7), and the inner cavity of the air duct (7) is provided with a rotatable exhaust fan (11).
3. A board Kong Dianlu in a disc for industrial control software as claimed in claim 2, wherein: the inner cavity of the air duct (7) is fixedly connected with a driving assembly (8), and the output end of the driving assembly (8) is fixedly connected with the axial end of the exhaust fan (11).
4. A board Kong Dianlu in a disc for industrial control software according to claim 3, wherein: the circuit board comprises a circuit board body (1), wherein the upper end face of the circuit board body (1) is slidably provided with a connecting shaft (2), one end of the connecting shaft (2) penetrates through the circuit board body (1) and is fixedly connected with a connecting plate (14), and the upper end face of the connecting plate (14) is attached to the bottom face of the heat conducting plate (13).
5. The plate Kong Dianlu in the disk for industrial control software as claimed in claim 4, wherein: the outer wall of connecting axle (2) is provided with first elastic component (3), the one end of first elastic component (3) with the outer wall laminating of circuit board body (1), the other end of first elastic component (3) with the outer wall laminating of connecting axle (2).
6. A board Kong Dianlu in a disc for industrial control software as claimed in claim 2, wherein: the outer wall fixedly connected with elastic plate (9) of air duct (7), the lateral wall fixedly connected with blotter (10) and joint piece (15) of elastic plate (9), the holding recess that supplies joint piece (15) grafting is seted up to the outer wall of heating panel (12).
CN202223581539.XU 2022-12-29 2022-12-29 Kong Dianlu board in disc for industrial control software Active CN219248445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223581539.XU CN219248445U (en) 2022-12-29 2022-12-29 Kong Dianlu board in disc for industrial control software

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223581539.XU CN219248445U (en) 2022-12-29 2022-12-29 Kong Dianlu board in disc for industrial control software

Publications (1)

Publication Number Publication Date
CN219248445U true CN219248445U (en) 2023-06-23

Family

ID=86845451

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223581539.XU Active CN219248445U (en) 2022-12-29 2022-12-29 Kong Dianlu board in disc for industrial control software

Country Status (1)

Country Link
CN (1) CN219248445U (en)

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