CN220606179U - PCB board paster packaging structure - Google Patents
PCB board paster packaging structure Download PDFInfo
- Publication number
- CN220606179U CN220606179U CN202322210035.5U CN202322210035U CN220606179U CN 220606179 U CN220606179 U CN 220606179U CN 202322210035 U CN202322210035 U CN 202322210035U CN 220606179 U CN220606179 U CN 220606179U
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- CN
- China
- Prior art keywords
- heat dissipation
- packaging
- platform
- wall
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 239000013078 crystal Substances 0.000 claims abstract description 19
- 238000005538 encapsulation Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 14
- 238000013016 damping Methods 0.000 claims description 13
- 230000000087 stabilizing effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model discloses a PCB (printed circuit board) patch packaging structure, which relates to the technical field of PCB patch packaging and comprises a packaging platform, wherein a packaging shell is arranged on the upper surface of the packaging platform, mounting plates are arranged below the surfaces of the left side and the right side of the packaging shell, two mounting holes are formed in the upper surfaces of the two mounting plates, a PCB circuit board body is arranged below the inner wall of the packaging shell, the PCB circuit board body comprises a patch crystal above, a heat dissipation cavity is formed in the packaging platform, a heat dissipation plate is arranged below the inner wall of the heat dissipation cavity, and the heat dissipation plate comprises a plurality of heat dissipation fins. According to the utility model, the packaging platform and the packaging shell are respectively made of heat conducting materials by utilizing the heat conducting characteristics of metal, and the heat radiating mechanism is matched, so that heat generated by dispensing can be timely conducted and radiated, excessive heat accumulation caused by overlong working time is avoided, the chip crystals are easy to damage, and the service life of the chip crystals is prolonged.
Description
Technical Field
The utility model relates to the technical field of PCB patch packaging, in particular to a PCB patch packaging structure.
Background
The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, PCB boards, aluminum substrates, high frequency boards, thick copper plates, impedance boards, PCBs, ultrathin circuit boards, printed (copper etching technology) circuit boards and the like, the circuit boards miniaturize and visually play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and the patch refers to a manufacturing process of attaching components to the boards, so that the electronic components are fixed on the boards to form a complete electronic product.
The current when carrying out the paster encapsulation to the PCB board mostly adopts the welding, perhaps cooperates the point to glue the ware with the paster point to the paster crystal on, but like this set up when gluing at the point, can use the point to glue the rifle, can produce a large amount of heat when fixed, heat can be transmitted to the paster crystal surface through the paster, if operating time overlength can lead to the heat accumulation too much, and then make the paster crystal damage easily, reduced its life, consequently need a PCB board paster packaging structure to satisfy people's demand.
Disclosure of Invention
The utility model aims to provide a PCB (printed circuit board) patch packaging structure, which solves the problems that in the background art, when dispensing is performed, a dispensing gun is used, a large amount of heat is generated during fixing, the heat is transmitted to the surface of a patch crystal through a patch, if the working time is too long, excessive heat accumulation is caused, the patch crystal is damaged easily, and the service life of the patch crystal is shortened.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a PCB board paster packaging structure, includes encapsulation platform, encapsulation platform's upper surface is provided with encapsulation casing, the mounting panel is all installed to encapsulation casing left and right sides surface's below, two mounting holes have all been seted up to the upper surface of mounting panel, encapsulation casing inner wall's below is provided with the PCB circuit board body, the PCB circuit board body includes the paster crystal of top, the radiating chamber has been seted up to encapsulation platform's inside, the heating panel is installed to radiating chamber inner wall's below, the heating panel includes a plurality of radiating fin, a plurality of radiating fin's upper surface all contacts with radiating chamber inner wall's top, encapsulation platform and encapsulation casing all adopt the heat conduction material to make, encapsulation platform's below is provided with cooling mechanism.
Preferably, the heat dissipation mechanism comprises a plurality of supporting legs, the upper surfaces of the supporting legs are respectively fixed with four corners of the lower surface of the packaging platform, inclined plates are arranged on the left side and the right side of the lower surface of the packaging platform, two installation shells are arranged on the surface of the opposite side of each inclined plate, a plurality of heat dissipation fans are arranged in the installation shells, and a plurality of heat dissipation through holes are formed in the lower portion of the inner wall of the heat dissipation cavity.
Preferably, a plurality of heat dissipation openings are formed in the left side and the right side of the inner wall of the heat dissipation chamber.
Preferably, the packaging shell is made of copper materials, and the packaging platform is made of silver materials.
Preferably, two dampers are mounted on the left side and the right side of the inner wall of the packaging shell, damping springs are sleeved on the outer walls of the dampers, a stabilizing plate is mounted at the output end of each damper, and one end of each damping spring is fixed to one side of the corresponding stabilizing plate.
Preferably, a plurality of the damping springs are made of nylon materials.
The beneficial effects of the utility model are as follows:
according to the utility model, through the arrangement of the packaging platform, the packaging shell, the mounting plate, the mounting hole, the PCB body, the patch crystal, the heat dissipation cavity, the heat dissipation plate, the heat dissipation fins and the heat dissipation mechanism, the heat conduction characteristics of metal can be utilized, the packaging platform and the packaging shell are respectively set to be heat conduction materials, and the heat dissipation mechanism is matched, so that heat generated by dispensing can be timely conducted and dissipated, excessive heat accumulation caused by overlong working time is avoided, the patch crystal is easy to damage, and the service life of the patch crystal is prolonged.
Drawings
Fig. 1 is a schematic perspective view of a PCB board patch package structure according to the present utility model;
fig. 2 is an enlarged schematic diagram of a portion a in fig. 1 of a PCB board patch package structure according to the present utility model;
fig. 3 is a schematic diagram of a front cross-sectional structure of a PCB board patch package structure according to the present utility model;
fig. 4 is a schematic top plan view of a PCB board patch package structure according to the present utility model.
In the figure: 1. packaging the platform; 2. packaging the shell; 3. a mounting plate; 4. a mounting hole; 5. a PCB circuit board body; 501. a patch crystal; 6. a heat dissipation chamber; 7. a heat dissipation plate; 8. a heat radiation fin; 9. a heat dissipation through hole; 10. a sloping plate; 11. mounting a shell; 12. a heat radiation fan; 13. a heat dissipation opening; 14. a damper; 15. a damping spring; 16. a stabilizing plate; 17. and (5) supporting legs.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, a PCB board patch packaging structure, including packaging platform 1, packaging platform 1's upper surface is provided with packaging shell 2, packaging shell 2 both sides surface's below is all installed mounting panel 3, two mounting holes 4 have all been seted up to the upper surface of two mounting panels 3, packaging shell 2 inner wall's below is provided with PCB circuit board body 5, PCB circuit board body 5 includes the paster crystal 501 of top, packaging platform 1's inside has been seted up heat dissipation cavity 6, heat dissipation plate 7 is installed to the below of heat dissipation cavity 6 inner wall, heat dissipation plate 7 includes a plurality of radiating fins 8, the upper surface of a plurality of radiating fins 8 all contacts with the top of heat dissipation cavity 6 inner wall, packaging platform 1 and packaging shell 2 all adopt heat conduction material to make, packaging platform 1's below is provided with heat dissipation mechanism, can utilize the heat conduction characteristic of metal, packaging platform 1 and packaging shell 2 all set up heat conduction material respectively, and cooperate again mechanism, heat that can be timely with the point gum production in time conducts and dispel away, avoid operating time can lead to heat accumulation too much, and then make crystal 501 damage easily, and the life of paster 501 has been improved.
As shown in fig. 1 and 3, a plurality of heat dissipation openings 13 are formed on the left and right sides of the inner wall of the heat dissipation chamber 6, so that the heat dissipation efficiency in the heat dissipation chamber 6 can be further improved, the package housing 2 is made of copper material, the package platform 1 is made of silver material, and the heat conductivity of copper is smaller than that of silver, so that the package platform 1 can quickly absorb heat absorbed by the surface of the package housing 2 to itself, thereby facilitating the effectiveness of heat dissipation.
As shown in fig. 1 and 4, two dampers 14 are installed on the left and right sides of the inner wall of the package housing 2, damping springs 15 are sleeved on the outer walls of the dampers 14, a stabilizing plate 16 is installed at the output ends of a group of dampers 14 together, one end of a group of damping springs 15 is fixed with one side surface of the corresponding stabilizing plate 16, the PCB circuit board body 5 to be subjected to surface mounting can be stabilized, the PCB circuit board bodies 5 with different lengths can be subjected to damping fixation, the suitability is high, the stability during surface mounting is improved, the damping springs 15 are made of nylon materials, and the service life of the damping springs 15 can be prolonged.
The working principle of the utility model is as follows: when the device is used, the packaging shell 2 is fixed on the packaging platform 1 through the two mounting holes 4 on the two mounting plates 3, at the moment, the two stabilizing plates 16 are broken towards two sides, the PCB circuit board body 5 needing to be pasted is placed between the two stabilizing plates 16, the PCB circuit board body 5 is clamped and fixed between the two stabilizing plates 16 under the elasticity of the two groups of damping springs 15 by loosening the two stabilizing plates 16, at the moment, the pasting gun can be used for pasting the pasting on the pasting crystal 501, after the pasting is completed, the pasting can be manually pasted on the surface of the pasting crystal 501, and the pasting packaging is completed.
In the process of dispensing, a large amount of heat can be generated, as the packaging platform 1 and the packaging shell 2 are made of heat conducting materials, and the PCB circuit board body 5 is thinner, the packaging platform 1 and the packaging shell 2 can be rapidly led away, as the plurality of radiating fins 8 on the radiating plate 7 are in contact with the inner wall of the radiating cavity 6, the heat can be rapidly transmitted to the radiating plate 7 in the radiating cavity 6, meanwhile, the radiating fans 12 in the plurality of mounting shells 11 on the two inclined plates 10 can be opened, the air blown by the plurality of radiating fans 12 can radiate the radiating plate 7 in real time through the plurality of radiating through holes 9, and the plurality of radiating openings 13 on two sides of the packaging platform 1 also play a role in radiating.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a PCB board paster packaging structure, includes encapsulation platform (1), its characterized in that: the utility model discloses a packaging platform, including encapsulation platform (1), encapsulation platform (1) are provided with casing (2) on the upper surface, mounting panel (3) are all installed to the below of casing (2) left and right sides surface, two mounting holes (4) have all been seted up to the upper surface of mounting panel (3), the below of encapsulation casing (2) inner wall is provided with PCB circuit board body (5), PCB circuit board body (5) include paster crystal (501) of top, heat dissipation cavity (6) have been seted up to the inside of encapsulation platform (1), heating panel (7) are installed to the below of heat dissipation cavity (6) inner wall, heating panel (7) include a plurality of radiating fins (8), a plurality of the upper surface of radiating fins (8) all contacts with the top of heat dissipation cavity (6) inner wall, encapsulation platform (1) and encapsulation platform (2) all adopt heat conduction material to make, the below of encapsulation platform (1) is provided with heat dissipation mechanism.
2. The PCB board patch package structure of claim 1, wherein: the heat dissipation mechanism comprises a plurality of supporting legs (17), wherein the upper surfaces of the supporting legs (17) are respectively fixed with four corners of the lower surface of the packaging platform (1), inclined plates (10) are respectively arranged on the left side and the right side of the lower surface of the packaging platform (1), two installation shells (11) are respectively arranged on the surfaces of the opposite sides of the inclined plates (10), a plurality of heat dissipation fans (12) are respectively arranged in the installation shells (11), and a plurality of heat dissipation through holes (9) are formed in the lower portion of the inner wall of the heat dissipation cavity (6).
3. The PCB board patch package structure of claim 1, wherein: a plurality of heat dissipation openings (13) are formed in the left side and the right side of the inner wall of the heat dissipation cavity (6).
4. The PCB board patch package structure of claim 1, wherein: the packaging shell (2) is made of copper materials, and the packaging platform (1) is made of silver materials.
5. The PCB board patch package structure of claim 1, wherein: two dampers (14) are arranged on the left side and the right side of the inner wall of the packaging shell (2), damping springs (15) are sleeved on the outer walls of the dampers (14), a stabilizing plate (16) is jointly arranged at the output end of each corresponding group of dampers (14), and one end of each corresponding group of damping springs (15) is fixed with one side surface of each corresponding stabilizing plate (16).
6. The PCB board patch package structure of claim 5, wherein: the damping springs (15) are made of nylon materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322210035.5U CN220606179U (en) | 2023-08-17 | 2023-08-17 | PCB board paster packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322210035.5U CN220606179U (en) | 2023-08-17 | 2023-08-17 | PCB board paster packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220606179U true CN220606179U (en) | 2024-03-15 |
Family
ID=90168354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322210035.5U Active CN220606179U (en) | 2023-08-17 | 2023-08-17 | PCB board paster packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220606179U (en) |
-
2023
- 2023-08-17 CN CN202322210035.5U patent/CN220606179U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |