CN216488051U - Chip for vehicle-mounted camera - Google Patents
Chip for vehicle-mounted camera Download PDFInfo
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- CN216488051U CN216488051U CN202123120658.0U CN202123120658U CN216488051U CN 216488051 U CN216488051 U CN 216488051U CN 202123120658 U CN202123120658 U CN 202123120658U CN 216488051 U CN216488051 U CN 216488051U
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- circuit board
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Abstract
The utility model discloses a chip for on-vehicle camera, including circuit board and chip, the circuit board be equipped with on the surface and be used for the installation the mounting groove of chip, the fixed first conducting strip that is equipped with in bottom of mounting groove, the fixed second conducting strip that is equipped with of lateral wall of mounting groove simultaneously, the circuit board still is equipped with the static elimination module and overvoltage protection module, the chip respectively with static elimination module and overvoltage protection module electric connection, the circuit board still be equipped with a detachable protection component on the surface, the protection component includes the mounting panel and locates a set of connecting block of mounting panel bottom, the mounting panel be equipped with equidistant distribution's a plurality of radiating fin on the surface.
Description
Technical Field
The utility model relates to a chip technical field specifically is a chip for on-vehicle camera.
Background
The camera shooting principle is reflection imaging of light with different colors, the camera needs to be welded and assembled by using a plurality of electric elements for shooting, at present, the electric elements mainly use a tin soldering mode, the tin soldering process causes the surface of the element to have obvious reflection phenomenon, when the camera shoots, external light enters a lens, the scattered light directly reflects from passive elements such as a capacitance resistor and the like to return to a photosensitive chip to form scattered light imaging, and the imaging effect of the camera is influenced, in order to solve the problem, the prior art mainly has two schemes, one is to arrange an accommodating cavity on a camera base, the passive elements are enclosed in the accommodating cavity after assembly, namely the surface of the passive elements does not receive light and reflected light, but the base with the accommodating cavity only can aim at the passive elements with fixed positions, when the design of a circuit board is changed, namely the base needs to be redesigned and the mold is opened after the position of the passive elements is changed, the universality can not be met, and the periphery of the photosensitive chip of the circuit board is additionally provided with packaging plastic so as to directly package the passive element in the plastic part and reduce the stray light reflection influence through the light scattering effect of the plastic part;
because peripheral circuit of sensitization chip and passive component can generate heat at the during operation, and the sealed messenger of plastic part heat can not in time distribute out and lead to electronic component to damage easily, influence its life, in addition, the on-vehicle camera chip among the traditional art lacks the protective structure to its setting.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a chip for vehicle-mounted camera.
The utility model provides a technical scheme that its technical problem adopted is: a chip for a vehicle-mounted camera comprises a circuit board and a chip, wherein a mounting groove for mounting the chip is formed in the surface of the circuit board, a first heat-conducting fin is fixedly arranged at the bottom of the mounting groove, and a second heat-conducting fin is fixedly arranged on the side wall of the mounting groove;
the circuit board is also provided with a static elimination module and an overvoltage protection module, and the chip is electrically connected with the static elimination module and the overvoltage protection module respectively;
the circuit board still is equipped with a detachable protection component on the surface, the protection component includes the mounting panel and locates a set of connecting block of mounting panel bottom, the mounting panel be equipped with a plurality of radiating fin of equidistant distribution on the surface.
Preferably, a plurality of pins are arranged on two sides of the chip, a plurality of limiting holes are arranged at the bottom of the mounting groove, and the limiting holes are matched with the lower ends of the pins in shape.
Preferably, a slot for mounting the protection component is arranged on the surface of the circuit board, and the connecting block is in interference connection with the slot.
Preferably, the bottom surface of the chip and the surface of the first heat-conducting sheet are in contact with each other, and the second heat-conducting sheet and the pin are in contact with each other.
Preferably, the bottom of mounting groove is equipped with the radiating groove, first conducting strip erects on the mounting groove, the radiating groove is located first conducting strip under.
Compared with the prior art, the beneficial effects of the utility model are that:
the circuit board is provided with an electrostatic elimination module and an overvoltage protection module, the electrostatic elimination module comprises a first insulating membrane, a conductive adhesive tape, a second insulating membrane, a virtual earth wire and a conductive coil, the conductive adhesive tape is arranged on the circuit board through the first insulating membrane and the second insulating membrane, so that static electricity on the conductive adhesive tape is introduced to the virtual earth wire of the circuit, and meanwhile, when the voltage of the circuit exceeds a preset maximum value, the overvoltage protection module is started and reduces the voltage to a safe value;
and the surface of the circuit board is also provided with a protection component, on one hand, the mounting plate has good heat-conducting property, so that heat radiation emitted by the chip in the working process is absorbed by the mounting plate in a large amount, and the heat absorbed by the mounting plate is efficiently radiated by a plurality of radiating fins on the surface of the mounting plate, and on the other hand, the protection component can effectively prevent the chip from being damaged due to extrusion;
the bottom surface of chip and the surface of first conducting strip contact each other, second conducting strip and pin contact each other, the bottom of mounting groove is equipped with the radiating groove, the heat part that the chip gived off in the course of the work is absorbed by first conducting strip, and set up the radiating groove and can increase the area of contact of first conducting strip and air, thereby improve the radiating efficiency of chip, thereby play the purpose of protection on-vehicle camera chip, and then realize prolonging the life of on-vehicle camera chip.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is another schematic structural diagram of the present invention.
Reference numbers in the figures:
the circuit board comprises a circuit board 1, a chip 2, a protection component 3, a connecting block 4, a limiting hole 5, a pin 6, a first heat-conducting fin 7, a radiating fin 8, a second heat-conducting fin 9, a mounting groove 10, a radiating groove 11 and a mounting plate 12.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-2, the utility model provides a chip for a vehicle-mounted camera, which comprises a circuit board 1 and a chip 2, wherein the surface of the circuit board 1 is provided with a mounting groove 10 for mounting the chip 2, the bottom of the mounting groove 10 is fixedly provided with a first heat-conducting fin 7, and the side wall of the mounting groove 10 is fixedly provided with a second heat-conducting fin 9;
the circuit board 1 is also provided with a static elimination module and an overvoltage protection module, the chip 2 is respectively electrically connected with the static elimination module and the overvoltage protection module, the static elimination module comprises a first insulating membrane, a conductive adhesive tape, a second insulating membrane, a virtual earth wire and a conductive coil, the conductive adhesive tape is arranged on the circuit board through the first insulating membrane and the second insulating membrane, so that static electricity on the conductive adhesive tape is introduced to the virtual earth wire of the circuit, and meanwhile, when the voltage of the circuit exceeds a preset maximum value, the overvoltage protection module is started and reduces the voltage to a safe value;
the surface of the circuit board 1 is also provided with a detachable protection component 3, the protection component 3 comprises a mounting plate 12 and a group of connecting blocks 4 arranged at the bottom of the mounting plate 12, the surface of the mounting plate 12 is provided with a plurality of radiating fins 8 distributed at equal intervals, on one hand, the mounting plate 12 has good heat conducting performance, so that heat radiation emitted by the chip 2 in the working process is greatly absorbed by the mounting plate 12, and the heat absorbed by the mounting plate 12 is efficiently radiated through the plurality of radiating fins 8 on the surface of the mounting plate, on the other hand, the protection component 3 can effectively prevent the chip 2 from being damaged due to extrusion;
the two sides of the chip 2 are provided with a plurality of pins 6, the bottom of the mounting groove 10 is provided with a plurality of limiting holes 5, the shapes of the limiting holes 5 are matched with the shapes of the lower ends of the pins 6, and the aperture of each limiting hole 5 is larger than that of each pin 6, so that a worker can weld the limiting holes conveniently.
The surface of the circuit board 1 is provided with a slot for installing the protection component 3, the connecting block 4 is in interference connection with the slot, the protection component 3 is detachably connected through the slot, and the protection component 3 is assembled on the circuit board 1 after the chip 2 is installed.
The bottom surface of the chip 2 is in contact with the surface of the first heat-conducting strip 7, the second heat-conducting strip 9 is in contact with the pins 6, the bottom of the mounting groove 10 is provided with a heat dissipation groove 11, the first heat-conducting strip 7 is erected on the mounting groove 10, the heat dissipation groove 11 is located under the first heat-conducting strip 7, the heat emitted by the chip 2 in the working process is partially absorbed by the first heat-conducting strip 7, and the heat dissipation groove 11 is arranged to increase the contact area between the first heat-conducting strip 7 and the air, so that the heat dissipation efficiency of the chip 2 is improved.
The circuit board is provided with an electrostatic elimination module and an overvoltage protection module, the electrostatic elimination module comprises a first insulating membrane, a conductive adhesive tape, a second insulating membrane, a virtual earth wire and a conductive coil, the conductive adhesive tape is arranged on the circuit board through the first insulating membrane and the second insulating membrane, so that static electricity on the conductive adhesive tape is introduced to the virtual earth wire of the circuit, meanwhile, when the voltage of the circuit exceeds a preset maximum value, the overvoltage protection module is started to reduce the voltage to a safe value, and the surface of the circuit board is also provided with a protection component, on one hand, the mounting board has good heat conduction performance, so that heat radiation emitted by a chip in the working process is greatly absorbed by the mounting board, and heat absorbed by the mounting board is efficiently radiated through a plurality of radiating fins on the surface of the mounting board, on the other hand, the protection component can effectively avoid the chip from being damaged by extrusion, the bottom surface of chip and the surface of first conducting strip contact each other, and second conducting strip and pin contact each other, and the bottom of mounting groove is equipped with the radiating groove, and the heat portion that the chip gived off in the course of the work is absorbed by first conducting strip, and sets up the radiating groove and can increase the area of contact of first conducting strip and air to improve the radiating efficiency of chip.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. A chip for a vehicle-mounted camera is characterized by comprising a circuit board and a chip, wherein the surface of the circuit board is provided with a mounting groove for mounting the chip, the bottom of the mounting groove is fixedly provided with a first heat-conducting fin, and the side wall of the mounting groove is fixedly provided with a second heat-conducting fin;
the circuit board is also provided with a static elimination module and an overvoltage protection module, and the chip is electrically connected with the static elimination module and the overvoltage protection module respectively;
the circuit board still is equipped with a detachable protection component on the surface, the protection component includes the mounting panel and locates a set of connecting block of mounting panel bottom, the mounting panel be equipped with a plurality of radiating fin of equidistant distribution on the surface.
2. The chip for the vehicle-mounted camera according to claim 1, wherein a plurality of pins are arranged on two sides of the chip, a plurality of limiting holes are arranged at the bottom of the mounting groove, and the limiting holes are matched with the lower ends of the pins in shape.
3. The chip for the vehicle-mounted camera according to claim 1, wherein a slot for mounting the protection component is provided on a surface of the circuit board, and the connection block is in interference connection with the slot.
4. The chip for the vehicle-mounted camera according to claim 1, wherein a bottom surface of the chip is in contact with a surface of the first heat-conducting sheet, and the second heat-conducting sheet is in contact with the pin.
5. The chip for the vehicle-mounted camera according to claim 1, wherein a heat sink is disposed at a bottom of the mounting groove, the first heat conducting strip is mounted on the mounting groove, and the heat sink is located directly below the first heat conducting strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123120658.0U CN216488051U (en) | 2021-12-13 | 2021-12-13 | Chip for vehicle-mounted camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123120658.0U CN216488051U (en) | 2021-12-13 | 2021-12-13 | Chip for vehicle-mounted camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216488051U true CN216488051U (en) | 2022-05-10 |
Family
ID=81422011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123120658.0U Active CN216488051U (en) | 2021-12-13 | 2021-12-13 | Chip for vehicle-mounted camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216488051U (en) |
-
2021
- 2021-12-13 CN CN202123120658.0U patent/CN216488051U/en active Active
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