CN208210420U - A kind of radiator structure of pcb board - Google Patents
A kind of radiator structure of pcb board Download PDFInfo
- Publication number
- CN208210420U CN208210420U CN201820606777.6U CN201820606777U CN208210420U CN 208210420 U CN208210420 U CN 208210420U CN 201820606777 U CN201820606777 U CN 201820606777U CN 208210420 U CN208210420 U CN 208210420U
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- CN
- China
- Prior art keywords
- substrate
- shielding case
- electronic component
- cooling fin
- thermal conductive
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a kind of radiator structures of pcb board, belong to technical field of PCB board, it is intended to solve the bad technical problem of pcb board heat dissipation effect, be characterized in that include: substrate equipped with the shielding case for covering electronic component；The first thermal conductive silicon rubber mat is bonded between shielding case and electronic component；Cooling fin is bonded with by the second heat-conducting glue silicon pad on shielding case；Cooling fin is equipped with multiple radiation tooths being intervally arranged, the heat that electronic component generates is directed on cooling fin by the first thermal conductive silicon rubber mat and the second heat conductive silica gel dig pass, then it is distributed by the radiation tooth on cooling fin, so that the heat for generating electronic component dissipates, shielding case, cooling fin and electronic component are vertically arranged simultaneously, to save the space for installing fan, so that the utility model radiator structure has the advantages that good heat dissipation effect, installation space are small, so that the operating accuracy of PCB be effectively ensured.
Description
Technical field
The utility model relates to technical field of PCB board, especially a kind of radiator structure of PCB plate.
Background technique
PCB plate, that is, printed circuit board, insulation board are substrate, realize the electrical connection of electronic component.
It is well known that electronic component can generate heat in use, it will be significantly if the thermal diffusivity of pcb board is bad
Reduce the service life of electronic component.
It radiates currently, PCB plate generally passes through the additional radiator of connection to electronic component, such as fan, still
The installation of fan needs certain space, to cause dimensional footprint big, and fan can only be to the upper of electronic component
Surface progress is air-cooled, and external hot gas can not be prevented to blow to pcb board, cause heat dissipation effect bad.
Utility model content
The purpose of this utility model is to provide a kind of radiator structure of pcb board, have occupy little space, good heat dissipation effect
The advantages of.
The above-mentioned purpose of the utility model has the technical scheme that a kind of radiator structure of pcb board,
It include: substrate and several electronic components on the substrate；The substrate is equipped with for by the electronic component
The shielding case covered；The first thermal conductive silicon rubber mat is bonded between the shielding case and the electronic component；On the shielding case
Cooling fin is bonded with by the second heat-conducting glue silicon pad；The cooling fin is equipped with multiple radiation tooths being intervally arranged.
By using above scheme, the electronic component on substrate is covered by shielding case, to effectively avoid hot around
The influence to electronic component is measured, while there is protective effect to electronic component, electronic component is effectively avoided the occurrence of and is dissipated
The phenomenon that backing damages by pressure, and the heat that electronic component generates is directed at by the first thermal conductive silicon rubber mat and the second heat conductive silica gel dig pass
It on cooling fin, is then distributed by the radiation tooth on cooling fin, so that the heat for generating electronic component dissipates, together
When shielding case, cooling fin and electronic component be vertically arranged, to save the space for installing fan, so that this is practical new
Type radiator structure has the advantages that good heat dissipation effect, installation space are small.
It is preferred: multiple mounting holes to be offered on the substrate, the bottom area of the cooling fin is greater than the shielding case
Area, the cooling fin is equipped with several with the one-to-one spliced eye of the mounting hole, is plugged on the spliced eye, simultaneously
The pendant mounted after the mounting hole with the substrate.
By using above scheme, the area of cooling fin is greater than the area of shielding case, to increase the heat dissipation of cooling fin
Performance.
Preferred: the pendant is spring nail.
By using above scheme, spring nail on the one hand can by cooling fin it is stable be installed on substrate and have installation side
Just the advantages of, on the other hand, spring nail, have certain elastic force, to also have the wind for preventing cooling fin from damaging shielding case by pressure
Danger.
Preferred: the cross section of the radiation tooth assumes diamond in shape.
By using above scheme, the rank street face of radiation tooth is in prismatic, so that the radiating groove four sides formed between radiation tooth
It communicates, to improve the heat dissipation effect of radiation tooth.
Preferred: the shielding case is made of aluminum alloy materials.
By using above scheme, shielding case is made of aluminum alloy materials, to have good conductive force.
It is preferred: third thermal conductive silicon rubber mat, the third are bonded between the arris of the shielding case and the substrate
Thermal conductive silicon rubber mat is equipped with annular groove, and the arris of the shielding case is plugged in the annular groove.
By using above scheme, on the one hand third thermal conductive silicon rubber mat avoids shielding for separating substrate and shielding case
Cover causes to wear to substrate, on the other hand conducts for generating heat to electronic component, improves conduction efficiency, shield simultaneously
It covers cover to be plugged in the annular groove of third thermal conductive silicon rubber mat, has the advantages that shielding case easy for installation.
Preferred: the substrate is bonded with the 4th thermal conductive silicon rubber mat away from the side of the electronic component.
By using above scheme, the 4th thermal conductive silicon rubber mat is used to carry out substrate away from the side of electronic component scattered
Heat, to improve the heat dissipation effect to electronic component.
Preferred: the radiation tooth is far from being bonded with the 5th thermal conductive silicon rubber mat on one end of substrate.
By using above scheme, the 5th thermal conductive silicon rubber mat is used to conduct the heat on radiation tooth to being used to be located at
On upper casing on pcb board, to accelerate the lost effect of heat.
Preferred: the substrate uses epoxy glass-fiber-fabric substrate.
It is epoxy glass-fiber-fabric substrate mechanical performance with higher and dielectric properties, preferable resistance to by using above scheme
Hot and moisture resistivity and good machining property.
In conclusion the utility model has the following beneficial effects:
1, the heat that electronic component generates on pcb board passes through shielding case, the first thermal conductive silicon rubber mat, the second thermal conductive silicon rubber mat
And cooling fin carries out lost, carries out without additional fan air-cooled, and shielding case, cooling fin are vertical with electronic component simultaneously sets
It sets, to both have good heat dissipation effect, while also having the advantages that occupancy installation space is small；
2, by the 4th thermal conductive silicon rubber mat and the 5th thermal conductive silicon rubber mat be used to conduct the heat that electronic component generates to
On lower casing and shell, to increase radiating efficiency.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the radiator structure of the pcb board of the utility model embodiment；
Fig. 2 is the enlarged drawing in Fig. 1 at A.
Appended drawing reference: 1, lower casing；2, upper casing；3, substrate；4, electronic component；5, shielding case；6, the first thermal conductive silicon rubber mat；
7, cooling fin；71, radiation tooth；8, spring nail；9, the second heat-conducting glue silicon pad；10, third thermal conductive silicon rubber mat；11, the 4th thermal conductive silicon
Rubber mat；12, the 5th thermal conductive silicon rubber mat.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.The wherein identical attached drawing of identical components
Label indicates.It should be noted that word "front", "rear" used in the following description, "left", "right", "up" and "down" refer to
It is the direction in attached drawing, word " bottom surface " and " top surface ", "inner" and "outside" are referred respectively to towards or away from particular elements geometry
The direction at center.
A kind of radiator structure of pcb board, as shown in Figures 1 and 2, the pcb board of the present embodiment are arranged in upper casing 2 and lower casing 1
Between cavity in, pcb board includes: substrate 3, and setting several electronic components 4 on the substrate 3, the heat dissipation of the present embodiment
Structure includes: shielding case 5, the first thermal conductive silicon rubber mat 6, the second thermal conductive silicon rubber mat and cooling fin 7, and wherein shielding case 5 is located at substrate 3
On, shielding case 5 is for covering electronic component 4, and 6 one end of the first thermal conductive silicon rubber mat is bonded in the upper of electronic component 4, separately
One side is bonded on shielding case 5, and cooling fin 7 is bonded on shielding case 5 by the second thermal conductive silicon rubber mat, separate on cooling fin 7
The side of substrate 3 is equipped with several radiation tooths 71 being intervally arranged.
Electronic component 4 on substrate 3 is covered by shielding case 5, to effectively avoid ambient heat to electronic component 4
Influence, while to electronic component 4 have protective effect, effectively avoid the occurrence of electronic component 4 and showed by what cooling fin 7 damaged by pressure
As, and the heat that electronic component 4 generates is directed on cooling fin 7 by the first thermal conductive silicon rubber mat 6 and the second heat conductive silica gel dig pass,
Then it is distributed by the radiation tooth 71 on cooling fin 7, so that the heat for generating electronic component 4 dissipates, is shielded simultaneously
It covers cover 5, cooling fin 7 and electronic component 4 to be vertically arranged, so that installation space has been saved, so that the heat dissipation knot of the utility model
Structure has the advantages that good heat dissipation effect, installation space are small.
Specifically, offering multiple mounting holes on the substrate 3, the bottom area of cooling fin 7 is greater than the area of shielding case 5,
Be equipped on cooling fin 7 it is several with the one-to-one spliced eye of mounting hole, be plugged on spliced eye and pass through after mounting hole with
The pendant that substrate 3 mounts, pendant are spring nail 8, and the area of cooling fin 7 is greater than the area of shielding case 5, to increase cooling fin
7 heat dissipation performance, and spring nail 8 on the one hand can be by the stable installation of cooling fin 7 on the substrate 3, and has easy for installation
Advantage, on the other hand, spring nail 8 have certain elastic force, to also have the risk for preventing cooling fin 7 from damaging shielding case 5 by pressure.
In other embodiments, cooling fin 7 is fixed on lower casing 1 by way of locking screw.
Specifically, the rank street face of radiation tooth 71 be in rectangle, it is easy to produce, in other embodiments, radiation tooth 71 it is transversal
Face assumes diamond in shape, for communicating the radiating groove formed between radiation tooth 71 four sides, to improve the heat dissipation effect of radiation tooth 71.
Specifically, in the present embodiment, shielding case 5 is made of aluminum alloy materials, shielding case 5 uses aluminum alloy materials system
At with good conductive force；In other embodiments, shielding case 5 is made of stainless steel, to make shielding case 5
With good non-deformability.
Specifically, being bonded with third thermal conductive silicon rubber mat 10, third thermal conductive silicon between the arris and substrate 3 of shielding case 5
Rubber mat 10 is bonded on the substrate 3, and is equipped with annular groove close to one end of shielding case 5 on third thermal conductive silicon rubber mat 10, shielding case 5
Arris is plugged in annular groove, on the one hand third thermal conductive silicon rubber mat 10 avoids shielding case 5 right for separating substrate 3 and shielding case 5
Substrate 3 causes to wear, and on the other hand conducts for generating heat to electronic component 4, improves conduction efficiency, shield simultaneously
Cover 5 is plugged in the annular groove of third thermal conductive silicon rubber mat 10, has the advantages that shielding case 5 easy for installation.
Specifically, being bonded with the 4th thermal conductive silicon rubber mat 11, the 4th thermal conductive silicon away from the side of electronic component 4 in substrate 3
11 one end of rubber mat is bonded on the substrate 3, and the other end is bonded on lower casing 1, and the 4th thermal conductive silicon rubber mat 11 is used for substrate 3 away from electricity
The side of sub- component 4 is radiated, and is conducted heat on lower casing 1, to improve the heat dissipation effect to electronic component 4.
Specifically, being bonded with the 5th thermal conductive silicon rubber mat 12, the 5th heat conductive silica gel on the one end of radiation tooth 71 far from substrate 3
It pads 12 one end to be bonded on radiation tooth 71, the other end is bonded on upper casing 2, and the 5th leads silicagel pad for heat to be driven to upper casing
On 2, to improve the heat dissipation effect to electronic component 4.
Specifically, substrate 3 uses epoxy glass-fiber-fabric substrate 3 in the present embodiment, epoxy glass-fiber-fabric substrate 3 is with higher
Mechanical performance and dielectric properties, preferable heat resistance and moisture resistivity and good machining property；In other embodiments, base
Plate 3 uses ceramic substrate 3.
In the present embodiment, the first thermal conductive silicon rubber mat 6, the second thermal conductive silicon rubber mat, third thermal conductive silicon rubber mat the 10, the 4th are thermally conductive
Silicagel pad 11 and the 5th thermal conductive silicon rubber mat 12 are 0.1mm-0.3mm by decrement.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Claims (9)
1. a kind of radiator structure of pcb board, characterized in that include:
Substrate (3) and several electronic components (4) being set on the substrate (3)；
The substrate (3) is equipped with the shielding case (5) for covering the electronic component (4)；
The first thermal conductive silicon rubber mat (6) is bonded between the shielding case (5) and the electronic component (4)；
Cooling fin (7) are bonded with by the second heat-conducting glue silicon pad (9) on the shielding case (5)；
The cooling fin (7) is equipped with multiple radiation tooths (71) being intervally arranged.
2. radiator structure according to claim 1, characterized in that multiple mounting holes are offered on the substrate (3), it is described
The bottom area of cooling fin (7) is greater than the area of the shielding case (5), and the cooling fin (7) is equipped with several and installation
The one-to-one spliced eye in hole is plugged on the spliced eye and passes through the extension after the mounting hole with the substrate (3) mounting
Part.
3. radiator structure according to claim 2, characterized in that the pendant is spring nail (8).
4. radiator structure according to claim 1, characterized in that the cross section of the radiation tooth (71) assumes diamond in shape.
5. radiator structure according to claim 1, characterized in that the shielding case (5) is made of aluminum alloy materials.
6. radiator structure according to claim 5, characterized in that the arris of the shielding case (5) and the substrate (3)
Between be bonded with third thermal conductive silicon rubber mat (10), the third thermal conductive silicon rubber mat (10) is equipped with annular groove, the shielding case (5)
Arris is plugged in the annular groove.
7. radiator structure according to claim 1, characterized in that the substrate (3) is away from the electronic component (4)
Side is bonded with the 4th thermal conductive silicon rubber mat (11).
8. radiator structure according to claim 1, characterized in that the radiation tooth (71) is far from the one end of substrate (3)
It is bonded with the 5th thermal conductive silicon rubber mat (12).
9. radiator structure described in any one of -8 according to claim 1, characterized in that the substrate (3) uses epoxy glass
Fine cloth substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820606777.6U CN208210420U (en) | 2018-04-25 | 2018-04-25 | A kind of radiator structure of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820606777.6U CN208210420U (en) | 2018-04-25 | 2018-04-25 | A kind of radiator structure of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208210420U true CN208210420U (en) | 2018-12-07 |
Family
ID=64521044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820606777.6U Expired - Fee Related CN208210420U (en) | 2018-04-25 | 2018-04-25 | A kind of radiator structure of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208210420U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
-
2018
- 2018-04-25 CN CN201820606777.6U patent/CN208210420U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181207 Termination date: 20210425 |
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| CF01 | Termination of patent right due to non-payment of annual fee |