CN220108506U

CN220108506U - Shielding heat dissipation device

Info

Publication number: CN220108506U
Application number: CN202320237053.XU
Authority: CN
Inventors: 段青华; 毛彩立; 周宝屏
Original assignee: Shanghai Jiangyan Intelligent Technology Co ltd
Current assignee: Shanghai Jiangyan Intelligent Technology Co ltd
Priority date: 2023-02-16
Filing date: 2023-02-16
Publication date: 2023-11-28
Anticipated expiration: 2033-02-16

Abstract

The utility model discloses a shielding heat dissipation device, which comprises a substrate, wherein a plurality of electronic components are arranged on the substrate; the metal shielding cover bracket is arranged on the substrate and is arranged around a plurality of electronic components; the shielding cover is arranged on the metal shielding cover bracket and is enclosed with the metal shielding cover bracket to form a shielding space, and a plurality of electronic components are positioned in the shielding space; the radiating piece is attached to one end of the shielding cover far away from the metal shielding cover bracket and is arranged opposite to the shielding space. The design aims to facilitate more effective improvement of shielding effect on interference electromagnetic signals and improvement of heat dissipation effect.

Description

Shielding heat dissipation device

Technical Field

The utility model relates to the field of electronic equipment, in particular to a shielding heat dissipation device.

Background

Currently, signal masks are involved in learning exams, conference sites and various fields, and many scenarios require the use of signal shielding devices. The existing 5G communication equipment is closed in internal space due to the arranged airtight shielding structure, and when an electronic element in the 5G communication equipment works, larger heat can be generated, the internal temperature of the device is increased due to the accumulation of the heat shielding structure, and the internal element is easy to damage.

Disclosure of Invention

The utility model mainly aims to provide a shielding heat dissipation device, which aims to facilitate more effective improvement of shielding effect on interference electromagnetic signals and heat dissipation effect.

In order to achieve the above object, the present utility model provides a shielding heat dissipation device, comprising:

a substrate on which a plurality of electronic components are provided;

the metal shielding cover bracket is arranged on the substrate and is arranged around a plurality of electronic components;

the shielding cover is arranged on the metal shielding cover bracket and is enclosed with the metal shielding cover bracket to form a shielding space, and a plurality of electronic components are positioned in the shielding space;

the heat dissipation piece is attached to one end, far away from the metal shielding cover bracket, of the shielding cover, and is arranged opposite to the shielding space.

In an embodiment, the shielding and heat dissipating device further includes a conductive member, where the conductive member is attached to the shielding cover and is located between the heat dissipating member and the shielding cover, and the conductive member is in conduction with the heat dissipating member, the shielding cover and the metal shielding cover bracket;

the heat dissipation piece is a metal heat dissipation piece, and a plurality of heat dissipation teeth which are distributed at intervals are arranged on the heat dissipation piece.

In an embodiment, the conductive member includes a first conductive member and a second conductive member, and the first conductive member and the second conductive member are respectively attached to two sides of the shielding cover.

In an embodiment, the shielding heat dissipation device further comprises a heat conduction member, and the heat conduction member is located between the heat dissipation member and the shielding cover.

In an embodiment, the shielding heat dissipation device further comprises a plurality of connecting bolts, wherein one of the heat dissipation piece and the substrate is provided with a positioning hole, the other one of the heat dissipation piece and the substrate is provided with a limiting hole, and the connecting bolts penetrate through the limiting hole and are in threaded connection with the positioning hole.

In an embodiment, the metal shielding cover support is provided with a plurality of shielding areas, and each shielding area encloses one or more electronic components.

In an embodiment, the electronic components at least include a plurality of heat generating chips, and the conductive member is attached to the plurality of heat generating chips.

In an embodiment, the shielding and heat dissipating device further includes a plurality of heat-conducting silica gel sheets, and the plurality of heat-conducting silica gel sheets are respectively attached to the plurality of heat-generating chips and located between the heat-generating chips and the shielding cover.

In an embodiment, the outer side wall of the shielding cover is concavely formed with a plurality of concave parts, the outer side wall of the metal shielding cover bracket is convexly provided with a plurality of bosses, and the shielding cover is installed on the metal shielding cover bracket in a matching way through the plurality of concave parts and the plurality of bosses.

In one embodiment, the substrate includes a grounded metal layer, and the metal shield cover holder is in contact with the metal layer.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a shielding heat dissipation device according to an embodiment of the utility model;

FIG. 2 is an exploded view of an embodiment of a shielded heat dissipating device according to the present utility model;

FIG. 3 is a schematic view of a shielding heat dissipation device according to another embodiment of the present utility model;

FIG. 4 is a cross-sectional view A of FIG. 3;

FIG. 5 is a partial view B of FIG. 4;

fig. 6 is a partial view C of fig. 4.

Reference numerals illustrate:

reference numerals	Name of the name	Reference numerals	Name of the name
				10	Substrate board	20	Electronic component 20
30	Metal shielding cover bracket	40	Shielding cover
				50	Heat dissipation piece	60	Conductive member
61	First conductive member	62	Second conductive member
				70	Heat conducting piece	80	Heat conduction silica gel piece

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if a directional indication (such as up, down, left, right, front, and rear … …) is involved in the embodiment of the present utility model, the directional indication is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional indication is correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The utility model provides a shielding heat dissipation device.

Referring to fig. 1 to 6, in an embodiment of the present utility model, a shielding heat sink includes:

a substrate 10, wherein a plurality of electronic components 20 are arranged on the substrate 10;

a metal shielding cover bracket 30, wherein the metal shielding cover bracket 30 is arranged on the substrate 10 and is arranged around a plurality of the electronic components 20;

a shielding cover 40, wherein the shielding cover 40 is disposed on the metal shielding cover bracket 30, and forms a shielding space with the metal shielding cover bracket 30, and a plurality of electronic components 20 are located in the shielding space;

and a heat sink 50, wherein the heat sink 50 is attached to an end of the shielding cover 40 away from the metal shielding cover bracket 30, and is disposed opposite to the shielding space.

Through adopting above-mentioned scheme, the electronic components on the base plate 10 is covered through the shielding space cage that shielding lid 40 and metal shielding lid support 30 formed, shielding external electromagnetic wave outwards radiates to the influence of internal circuit and the electromagnetic wave that inside produced, thereby effectively avoid the influence of heat around to the electronic components, simultaneously have the guard action to the electronic components, can also effectively avoid appearing the electronic components by the phenomenon that the fin is crushed, wherein, specifically, the shielding space can be surrounded electronic components 20 on the mainboard, circuit, sub-assembly, cable or the interference source of entire system, prevent the external diffusion of interference electromagnetic field, because the shielding space all plays absorbed energy to the outside interference electromagnetic wave and internal electromagnetic wave that come from wire, cable, electronic components 20, circuit or system, thereby prevent the external diffusion of interference electromagnetic field. The shielding space can be divided into a plurality of shielding areas, the shielding areas are in one-to-one correspondence to surround the plurality of electronic components 20, the circuit, the assembly and the cable so as to realize shielding respectively, so that the interference electromagnetic field is prevented from diffusing outwards, the metal shielding cover bracket 30 is made of metal materials, the shielding blocking effect on the interference electromagnetic signals can be effectively improved, the performance of the electronic components is effectively ensured, and the heat generated by the electronic components is dissipated through the heat dissipation piece 50, so that the heat generated by the electronic components is dissipated.

In the embodiment of the utility model, the metal shielding cover bracket is made of aluminum alloy.

Referring to fig. 1 to 4, in the embodiment of the utility model, the heat dissipation member 50 is a heat dissipation fin, and the heat dissipation fin pitch is disposed on the outer side surface of the shielding cover 40. The heat dissipation fins are classified as "passive heat dissipation elements" in the field of electronic engineering design, and are attached to the heat-generating surface by using metal (most of aluminum or copper, silver is too expensive and generally not used) with good heat conductivity and light weight, and dissipate heat in a composite heat exchange mode, or the heat dissipation fins are sheet-shaped or column-shaped and regularly arranged on the outer side surface of the shielding cover 40, so that space positions are saved and heat dissipation efficiency is improved.

Referring to fig. 1 to 6, in the embodiment of the present utility model, the shielding and heat dissipating device further includes a conductive member 60, where the conductive member 60 is attached to the shielding cover 40 and is located between the heat dissipating member 50 and the shielding cover 40, and the conductive member 60 is in conduction with the heat dissipating member 50, the shielding cover 40 and the metal shielding cover bracket 30;

the heat dissipation member 50 is a metal heat dissipation member, and a plurality of heat dissipation teeth arranged at intervals are arranged on the heat dissipation member 50.

The conductive piece 60 is arranged between the heat dissipation piece 50 and the shielding cover 40, the electric conduction is carried out in the electronic component through the effect of the conductive piece 60, meanwhile, the metal shielding cover bracket 30 and the shielding cover 40 play a dual shielding protection role, the conductive piece 60, the heat dissipation piece 50, the shielding cover 40 and the metal shielding cover bracket 30 form conduction and are communicated with the base plate 10, when the bonding pad of the base plate 10 is arranged on the ground, interference signals can be transmitted to the ground inside of the main plate through the shielding frame, so that interference is eliminated, the interference electromagnetic signals can be effectively eliminated, the shielding effect of the whole structure can be effectively improved, the maximized electromagnetic interference is effectively shielded, the electronic component is not influenced by electromagnetic waves, meanwhile, the heat dissipation teeth arranged on the heat dissipation piece 50 improve the heat dissipation performance, the shielding effect is prevented from being reduced due to overheat of the metal heat dissipation piece 50, the conductive function of the electronic component is realized through the structure, meanwhile, the electromagnetic interference shielding effect is improved, the effective operation of the electronic component 20 is maximized, and the structure is simple, the application range is wide, and the application is convenient.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the conductive member 60 is conductive foam, and the conductive foam can be filled between the heat dissipation member 50 and the shielding cover 40, which means that the conductive foam is wrapped with a conductive cloth on a flame-retardant sponge, and after a series of treatments, the conductive cloth has good surface conductivity, and can be easily fixed on a device to be shielded by using an adhesive tape. The shielding materials with different sectional shapes, installation methods, UL grades and shielding effectiveness can be selected, and due to the softness of the conductive foam material, the structure space can be saved to a great extent, the buffer clearance of the whole structure is larger due to the use of the conductive foam, and due to the conductivity of the conductive foam, sufficient grounding can be realized, so that the ESD problem is solved.

In the embodiment of the utility model, the metal heat dissipation part is made of aluminum alloy.

Referring to fig. 1 to 6, in the embodiment of the present utility model, the conductive member 60 includes a first conductive member 61 and a second conductive member 62, and the first conductive member 61 and the second conductive member 62 are respectively attached to two sides of the shielding cover 20.

The first conductive piece 61 and the second conductive piece 62 are respectively attached to two sides of the shielding cover 20, so that interference electromagnetic signals can be effectively eliminated through grounding, the shielding effect of the whole structure can be effectively improved, and meanwhile, the cost is saved.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the shielding and heat dissipating device further includes a heat conducting member 70, and the heat conducting member 70 is located between the heat dissipating member 50 and the shielding cover 40.

The heat conducting member 70 can effectively improve the heat dissipation effect, and can effectively transfer heat from the electronic component 20 to the shielding cover 40, and then the heat is dissipated through the heat dissipating member 50.

In the embodiment of the present utility model, the heat conducting member 70 is a metal heat conducting silica gel layer.

In the embodiment of the present utility model, the metal heat-conducting silica gel layer 70 is an aluminum alloy.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the shielding and heat dissipating device further includes a plurality of connecting bolts, one of the heat dissipating member 50 and the substrate 10 is provided with a positioning hole, and the other is provided with a limiting hole, and the connecting bolts pass through the limiting hole and are in threaded connection with the positioning hole.

Through having set up connecting bolt and having carried out threaded connection through locating hole and spacing hole, can carry out better spacing to the installation of radiating piece 50 on base plate 10, the radiating piece 50 of assurance that can be better is difficult to rock after base plate 10 assembly, reinforcing radiating piece 50 is at the fixed strength between the base plate 10, simultaneously, radiating piece 50 adopts spacing complex mounting means at base plate 10, and the assembly is simple and convenient, improves shielding heat abstractor's production efficiency.

Referring to fig. 1 to 4, in the embodiment of the present utility model, a plurality of shielding areas are disposed on the metal shielding cover bracket 30, and each shielding area encloses one or more electronic components 20.

Which facilitates shielding between individual electronic components 20. Specifically, the upper surface of the circuit board on the metal shielding cover bracket 30 is at least divided into three shielding areas, the three shielding areas are respectively used for accommodating three electronic components 20 on the circuit board, the three electronic components 20 can be heating chips, and the structure can effectively improve the structural strength of the metal shielding cover bracket 30; the contact area between the metal shield cover holder 30 and the substrate 10 can be reduced, and the structural strength between the substrate 10 and the metal shield cover holder 30 can be improved.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the plurality of electronic components 20 at least includes a plurality of heat generating chips, and the conductive member 60 is attached to the plurality of heat generating chips.

The heat emitted by the heat generating chip can be discharged in time through the heat sink 50 as well. The heat in the heating chip can be discharged in time, so that the performance, the safety and the service life of the heating chip are improved.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the shielding and heat dissipating device further includes a plurality of heat conducting silica gel sheets 80, where the plurality of heat conducting silica gel sheets 80 are respectively attached to the plurality of heat generating chips and located between the heat generating chips and the shielding cover 40.

The both sides face of heat conduction silica gel piece 80 is supported respectively and is set up at the lateral surface of chip that generates heat and the medial surface of shield cover 40, can avoid electrically conductive shield cover 40 to cause the short circuit to electronic components 20, can be effectively with the heat by the chip transfer that generates heat to shield cover 40 on, then distribute through the heat dissipation to so that distribute away the heat that electronic components produced. The heat-conducting silica gel sheet is a heat-conducting medium material synthesized by a special process by taking silica gel as a base material and adding various auxiliary materials such as metal oxide, is also called a heat-conducting silica gel pad, a heat-conducting silica gel sheet, a soft heat-conducting pad, a heat-conducting silica gel pad and the like in the industry, is specially produced by using a design scheme of heat transfer of gaps, can fill the gaps, can finish heat transfer between a heating part and a heat dissipation part, also has the functions of insulation, shock absorption, sealing and the like, can meet the design requirements of miniaturization and ultra-thinning of equipment, has manufacturability and usability, and has wide thickness application range.

Referring to fig. 1 to 4, in the embodiment of the present utility model, a plurality of recesses are concavely formed on the outer side wall of the shielding cover 40, a plurality of bosses are convexly formed on the outer side wall of the metal shielding cover bracket 30, and the shielding cover 40 is mounted on the metal shielding cover bracket 30 by matching a plurality of recesses with a plurality of bosses.

The shielding cover 40 is mounted on the metal shielding cover bracket 30 through the plurality of concave parts and the plurality of convex plates in an adapting way, so that the mounting of the shielding cover on the metal shielding cover bracket 30 can be more conveniently limited, the assembly is convenient, and the production efficiency of the shielding heat radiator is improved.

Referring to fig. 1 to 4, in the embodiment of the present utility model, the substrate 10 includes a metal layer grounded, and the metal shield cover holder 30 is in contact with the metal layer.

The substrate 10 is provided with a grounded metal layer, the metal shielding cover bracket 30 is fixed on the substrate 10 and is contacted with the metal layer, static electricity on the metal shielding cover bracket 30 is led out through the metal layer, the shielding effect of the whole structure can be effectively improved, and meanwhile, the cost is saved.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A shielded heat sink comprising:

a substrate on which a plurality of electronic components are provided;

2. The shielded heat sink of claim 1 wherein,

the shielding heat dissipation device further comprises a conductive piece, wherein the conductive piece is attached to the shielding cover and is positioned between the heat dissipation piece and the shielding cover, and the conductive piece is communicated with the heat dissipation piece, the shielding cover and the metal shielding cover bracket;

3. The shielding and heat dissipating device of claim 2, wherein the conductive member comprises a first conductive member and a second conductive member, and wherein the first conductive member and the second conductive member are respectively attached to two sides of the shielding cover.

4. The shielded heat sink of claim 2 further comprising a thermally conductive member positioned between the heat sink and the shielding cover.

5. The shielding heat sink as set forth in claim 2 further comprising a plurality of connecting bolts, one of the heat sink and the base plate being provided with a locating hole and the other being provided with a spacing hole, the connecting bolts being threaded through the spacing holes with the locating holes.

6. The shielding and heat dissipating device of claim 2, wherein the metallic shielding cover support is provided with a plurality of shielding areas, each shielding area enclosing one or more of the electronic components.

7. The shielding and heat dissipating apparatus of claim 6, wherein the plurality of electronic components comprises at least a plurality of heat generating chips, and wherein the conductive member is attached to the plurality of heat generating chips.

8. The shielding and heat dissipating device of claim 7, further comprising a plurality of thermally conductive silicone sheets, wherein a plurality of the thermally conductive silicone sheets are respectively attached to the plurality of heat generating chips and located between the heat generating chips and the shielding cover.

9. The shielding and heat dissipating device according to claim 1, wherein a plurality of concave portions are concavely formed on an outer side wall of the shielding cover, a plurality of convex portions are convexly formed on an outer side wall of the metal shielding cover bracket, and the shielding cover is mounted on the metal shielding cover bracket in a manner of being matched with the convex portions through the concave portions.

10. The shielded heat sink of claim 1 wherein the substrate comprises a grounded metal layer, the metal shield cover support being in contact with the metal layer.