CN220653907U - Floating equipment chip shielding cover - Google Patents

Abstract

The utility model relates to the field of electronic communication products, in particular to a chip shielding cover of floating equipment; the floating equipment comprises a PCB (printed circuit board) on which the chip is mounted; a circle of gold plating layer is attached to the periphery of the chip on the surface of the PCB; the lower end of the shielding cover is provided with an opening, and the opening is attached to the gold plating layer; a plurality of radiating blades are arranged at one end of the shielding cover, which is far away from the opening; a heat conduction gasket is arranged between the inner cavity bottom of the shielding cover and the chip; because the gold plating layer is attached to the surface of the PCB around the chip, and the lower end opening of the shielding cover is attached to the gold plating layer, the interference of the chip and the circuit with the external environment can be effectively shielded; the influence of external electromagnetic interference on the chip is reduced, the anti-interference performance of the equipment is improved, and the equipment works more stably and reliably in a complex electromagnetic environment.

Description

Floating equipment chip shielding cover

Technical Field

The utility model relates to the field of electronic communication products, in particular to a chip shielding cover of floating equipment.

Background

The shield and heat sink designs of conventional floating devices are designed in several ways:

1. the design of two parts, the bottom has a support, welds the support on the PCB earlier, covers the upper cover on the support again, then passes through the white glue with the fin to be fixed to the shield cover on, and this kind of design thermal resistance is great, does not reach fine heat dissipation purpose.

2. The plug-in type shielding cover is designed, the shielding cover is provided with a PIN PIN, the shielding cover can be inserted into the PCB, the shielding cover is fixed on the PCB in a welding mode, and then the radiating fins are fixed on the shielding cover in a white glue mode, so that the shielding effect and the radiating effect can be reduced along with the increase of time, and the replacement is inconvenient.

3. The radiating fin is directly attached to the chip and then fixed to the PCB or the shell through screws and the like, and the radiating effect is poor although the radiating effect is good.

Disclosure of Invention

Aiming at the technical problems in the prior art, the utility model provides a chip shielding cover of floating equipment to solve the problem of low matching degree of the shielding cover and a radiating fin of the traditional floating equipment.

The technical scheme for solving the technical problems is as follows:

providing a floating equipment chip shielding cover, wherein the floating equipment comprises a PCB (printed circuit board) on which a chip is mounted;

a circle of gold plating layer is attached to the periphery of the chip on the surface of the PCB;

the lower end of the shielding cover is provided with an opening, and the opening is attached to the gold plating layer;

a plurality of radiating blades are arranged at one end of the shielding cover, which is far away from the opening;

and a heat conduction gasket is arranged between the inner cavity bottom of the shielding cover and the chip.

Further, a conductive adhesive tape is arranged between the opening and the gold-plating layer.

And further, the opening is provided with a containing groove with the same shape as the gold-plating layer, and the conductive adhesive tape is arranged in the containing groove.

Further, the heat conducting gasket is fixed at the bottom of the inner cavity of the shielding cover.

Further, both end surfaces of the heat conduction gasket are coated with silicone grease.

Further, at least two bolt columns are arranged on the side face of the shielding cover, and corresponding bolt holes are formed in the PCB.

Compared with the traditional shielding cover and cooling fins, the shielding cover has the following beneficial effects that:

electromagnetic shielding effect promotes: because the gold plating layer is attached to the surface of the PCB around the chip, and the lower end opening of the shielding cover is attached to the gold plating layer, the interference of the chip and the circuit with the external environment can be effectively shielded; the influence of external electromagnetic interference on the chip is reduced, the anti-interference performance of the equipment is improved, and the equipment works more stably and reliably in a complex electromagnetic environment.

Optimizing heat radiation performance: the other end of the shielding cover is provided with a plurality of radiating blades, and the radiating blades provide larger radiating surface area, so that the radiating efficiency of the chip is improved; meanwhile, a heat conduction gasket is arranged between the bottom of the inner cavity of the shielding cover and the chip, so that the heat conduction performance between the chip and the shielding cover is optimized; the design enables the chip to transfer heat to the shielding cover more quickly and effectively radiate the heat through the radiating blades, so that the chip is kept to work in a proper temperature range, the heat radiation performance of the equipment is improved, the temperature of the chip is reduced, and the stability and the reliability of the equipment are improved.

Simplified installation and replacement: compared with the traditional two-piece design and the plug-in type shielding case design, the floating equipment chip shielding case is of an integrated design, and the lower end opening is attached to the gold plating layer without additional support and welding steps; therefore, the design simplifies the installation process of the shielding cover and improves the production efficiency; in addition, because the shielding cover is of an integrated design, the whole shielding cover is only required to be taken down during replacement, a plurality of parts are not required to be disassembled, and the replacement convenience is improved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a shield can assembled with a PCB board;

FIG. 2 is a schematic view of a portion of the structure of the present utility model, wherein the heat-conducting pad is in a transparent state;

FIG. 3 is a partially exploded view of the present utility model;

fig. 4 is a side view of the shield can assembled with a PCB board;

in the drawings, the list of parts represented by the reference numerals is as follows:

100. a PCB board; 101. a gold plating layer; 102. bolt holes;

200. a chip;

300. a shield; 301. a heat radiation blade; 302. a receiving groove; 303. a bolt post;

400. a thermally conductive gasket;

500. and (5) a conductive adhesive tape.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize applications of other processes and/or usage scenarios for other materials.

The present utility model provides the following preferred embodiments:

example 1

Referring to fig. 1 and 2, embodiment 1 provides a chip shield of a floating device for mounting on a PCB board 100 of the floating device, the floating device including the PCB board 100, further, a gold plating layer 101 is attached around the periphery of the chip 200 on the surface of the PCB board 100, the gold plating layer 101 is used for providing electromagnetic shielding function and ensuring good grounding connection; the shielding cover 300 has an opening at the lower end, and the opening is attached to the gold plating layer 101, so that the interference of the chip 200 and the circuit with the external environment is effectively shielded; the other end of the shielding case 300 is provided with a plurality of heat dissipation blades 301, and the heat dissipation blades 301 are used for increasing the heat dissipation surface area and improving the heat dissipation efficiency; a heat-conducting spacer 400 is disposed between the bottom of the inner cavity of the shielding can 300 and the chip 200, and the heat-conducting spacer 400 helps to optimize the heat-conducting performance between the chip 200 and the shielding can 300, so that the chip 200 can transfer heat to the shielding can 300 more quickly, and then dissipate heat through the heat-dissipating fins 301.

The floating equipment chip shielding cover designed by the embodiment combines good electromagnetic shielding effect and effective heat dissipation performance, can protect the chip 200 from external interference, ensures that the chip 200 maintains a proper temperature range in the working process, and improves the stability and reliability of equipment.

Example 2

Referring to fig. 2, on the basis of the technical solution of the floating equipment chip shielding case described in embodiment 1, an optimization solution is further proposed, namely: a conductive adhesive tape 500 is provided between the opening and the gold plating layer 101 to further enhance the shielding effect.

The conductive adhesive tape 500 is an adhesive tape made of a conductive material, and a material with high conductivity, such as conductive rubber or conductive silica gel, is generally used; the conductive adhesive tape 500 may have a certain elasticity and plasticity so that it can be completely adhered between the opening and the gold plating layer 101; the conductive adhesive tape 500 is placed at the edge of the opening during the mounting of the shield can 300 so that it is closely adhered to the surface of the gold plating layer 101 and ensures good contact between the conductive adhesive tape 500 and the gold plating layer 101. Such a design can effectively fill the gap between the opening and the gold plating layer 101, and prevent electromagnetic leakage and external interference from entering the inside of the shield can 300, thereby increasing the shielding effect.

The conductive adhesive tape 500 has good conductive performance, and can effectively guide electromagnetic interference signals to the surface of the shielding case 300, and disperse and dissipate the electromagnetic interference signals through the gold-plating layer 101; such a design helps to further reduce external interference experienced by the chip 200 and the circuit, and improve the anti-interference performance of the device, thereby better protecting the stable operation of the chip 200.

In summary, in this embodiment, the conductive adhesive tape 500 is disposed between the opening of the shielded cover of the floating device chip and the gold plating layer 101, so as to enhance the shielding effect, and make the shielded cover 300 perform better in terms of electromagnetic shielding; the use of the conductive adhesive tape 500 allows the shield can 300 to protect the chip 200 from external interference while also improving the stability and reliability of the device.

Example 3

Referring to fig. 2 and 3, in embodiment 2, it has been described that a conductive adhesive tape 500 is provided between the opening of the shield can 300 and the gold plating layer 101 to enhance the shielding effect; the installation mode of the conductive adhesive tape 500 is further optimized in this embodiment, namely: by providing the opening with a receiving groove 302, the shape of the receiving groove 302 is identical to the shape of the gold plating layer 101, so that the conductive adhesive tape 500 can be accurately installed in the receiving groove 302.

The provision of the receiving groove 302 provides the following benefits:

defining the position of the strip 500: the existence of the accommodating groove 302 ensures that the conductive adhesive tape 500 is accurately positioned between the opening and the gold-plating layer 101, so that offset and instability during adhesive tape installation are avoided; this can maintain the close contact between the conductive adhesive tape 500 and the gold plating layer 101, and can exert the shielding effect to the maximum.

The assembly is tighter: the conductive adhesive tape 500 is installed in the receiving groove 302 so that contact between the adhesive tape and the opening and the gold plating layer 101 is tighter, the possibility of generating gaps is reduced, and electromagnetic leakage and external interference are effectively prevented from entering the shield can 300.

The conductive adhesive tape 500 is not easy to slip: since the conductive adhesive tape 500 is inserted into the receiving groove 302, its position is well fixed, and it is not easy to slip due to vibration or other external force during the assembly of the shield can 300, ensuring the stability and durability of the shielding effect.

According to the embodiment, the accommodating groove 302 which is consistent with the shape of the gold-plating layer 101 is formed in the opening of the chip shielding cover of the floating equipment, and the conductive adhesive tape 500 is arranged in the accommodating groove 302, so that the position of the conductive adhesive tape 500 is limited, the assembly is more compact, and the conductive adhesive tape 500 is not easy to slip; such a design further improves the shielding effectiveness, enhances the resistance of the shield 300 to external interference, and ensures that the chip 200 operates in a good operating environment.

Example 4

Referring to fig. 2 and 3, in embodiment 1, it has been described that a heat conductive spacer 400 is provided between the bottom of the inner cavity of the shield can 300 and the chip 200 for optimizing the heat conductive property between the chip 200 and the shield can 300; in this embodiment, the installation manner of the heat conductive pad 400 is further optimized, that is: the thermally conductive gasket 400 is secured to the bottom of the interior cavity of the shield 300.

The benefits of the thermal pad 400 being secured to the bottom of the interior cavity of the shield 300 are as follows:

simplifying assembly: because the thermal pad 400 is fixed at the bottom of the cavity of the shielding case 300, the thermal pad 400 does not need to be aligned with the chip 200 when the shielding case 300 is assembled, and the assembly steps are greatly simplified. Such a modular design allows for more convenient and quick installation of the shield 300 and increases production efficiency.

Ensure the heat conduction effect: the thermal pad 400 is fixed at the bottom of the inner cavity, ensuring that good contact is always maintained between the thermal pad 400 and the chip 200. This effectively improves the heat conduction efficiency, so that the chip 200 can transfer heat to the shielding case 300 more quickly, and then dissipate heat through the heat dissipation fins 301, thereby ensuring that the chip 200 operates in a proper temperature range.

Stability is improved: since the heat conductive pad 400 is fixed at the bottom of the inner cavity of the shielding case 300, the heat conductive effect is not affected due to the movement or loosening of the position. This ensures the stability of the thermal pad 400 and ensures that good thermal conductivity is maintained over long periods of use.

In this embodiment, the heat-conducting pad 400 is fixed at the bottom of the inner cavity of the chip shielding case of the floating device, so that the heat-conducting pad 400 is not required to be aligned with the chip 200 when the shielding case 300 is assembled, and the modular design is convenient for installation. The stable fixation of the heat conductive pad 400 ensures the optimization of the heat conductive effect, so that the shielding case 300 can better provide heat dissipation protection for the chip 200, and the stability and reliability of the device are improved.

Example 5

Referring to fig. 2, in embodiment 1, it has been described that a heat conductive gasket 400 is provided between the bottom of the inner cavity of the shield can 300 and the chip 200 for optimizing the heat conductive property between the chip 200 and the shield can 300, and the mounting manner of the heat conductive gasket 400 is optimized in embodiment 4; in this embodiment, the performance of the thermal pad 400 is further optimized, namely: by coating both ends of the heat conductive pad 400 with silicone grease.

The advantages of applying silicone grease to the two end surfaces of the thermal pad 400 are as follows:

improving the heat conduction efficiency: the silicone grease has better heat conduction performance, and the heat conduction efficiency can be effectively improved by coating the silicone grease on the two end surfaces of the heat conduction gasket 400; the silicone grease fills the tiny gaps between the heat conduction gasket 400 and the chip 200 and the shielding case 300, reduces the thermal contact resistance between the heat conduction gasket 400 and the contact surface, enables heat to be transferred more rapidly, and improves the heat conduction effect.

Oxidation corrosion prevention: the silicone grease forms a protective film on both end surfaces of the heat-conducting gasket 400 to prevent the heat-conducting gasket 400 from contacting with oxygen in the environment, thereby reducing oxidation corrosion of the heat-conducting gasket 400; helping to maintain stable performance and extend the useful life of the thermal pad 400.

Improve the equipment convenience: after the silicone grease is coated on the two end surfaces of the heat conduction gasket 400, the heat conduction gasket 400 can be more conveniently placed at the bottom of the inner cavity of the shielding cover 300, the heat conduction gasket 400 is ensured to be tightly contacted with the chip 200 and the shielding cover 300, gaps are not easy to generate, and the convenience and the efficiency of assembly are further improved.

Example 6

Referring to fig. 1 to 4, in embodiment 1, it has been described that a shield can 300 is mounted on a PCB board 100; in this embodiment, the structure of the shielding case 300 is further improved, and by arranging the bolt column 303 on the side surface of the shielding case 300 and forming the corresponding bolt hole 102 on the PCB board 100, the assembly convenience and reliability of the shielding case 300 are improved, which has the following specific advantages:

assembly convenience: the side surface of the shielding case 300 is provided with a bolt column 303, and the PCB 100 is correspondingly provided with a corresponding bolt hole 102; the shield can 300 thus designed may be securely fastened to the PCB board 100 by aligning the bolt posts 303 with the bolt holes 102 and then by bolts; the assembly mode is more convenient and quick, and assembly time and labor cost are saved.

Reliability is improved: because the shielding cover 300 and the PCB 100 are fixed by bolts, compared with the method of using adhesive modes such as white glue, the bolt fixation is more firm and reliable; in the operation process of the device, external forces such as vibration and impact are difficult to loosen the shielding case 300, so that the close contact of the heat conduction gasket 400 between the chip 200 and the shielding case 300 is ensured, and the heat conduction efficiency and the shielding effect are improved.

Flexibility: providing at least two bolt posts 303 and corresponding bolt holes 102 provides sufficient firm support for the shield can 300 to ensure planarity and verticality between the shield can 300 and the PCB 100 after assembly; at the same time, the number and location of the studs 303 may also be increased as the case may be to further enhance the stability of the shield 300.

In summary, in this embodiment, by arranging at least two bolt posts 303 on the side surface of the floating equipment chip shielding case and arranging corresponding bolt holes 102 on the PCB board 100, the convenience and reliability of assembling the shielding case 300 are improved; the bolt fixing manner can ensure firm connection between the shield can 300 and the PCB board 100, thereby effectively ensuring tight contact of the heat conductive pad 400 and improving stability and reliability of the apparatus.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the utility model.

Claims (6)

1. A floating device chip shield, the floating device comprising a PCB board (100), the chip (200) being mounted on the PCB board (100), characterized in that:

a circle of gold-plating layer (101) is attached to the surface of the PCB (100) around the chip (200);

the lower end of the shielding cover (300) is opened, and the opening is attached to the gold-plating layer (101);

one end of the shielding cover (300) far away from the opening is provided with a plurality of radiating blades (301);

a heat conduction gasket (400) is arranged between the inner cavity bottom of the shielding cover (300) and the chip (200).

2. The floating device chip shield according to claim 1, wherein a conductive adhesive strip (500) is provided between the opening and the gold plating layer (101).

3. The floating equipment chip shielding case according to claim 2, wherein a containing groove (302) which is consistent with the shape of the gold plating layer (101) is formed on the opening, and the conductive adhesive tape (500) is installed in the containing groove (302).

4. The floating device chip shield of claim 1 wherein the thermally conductive gasket (400) is secured to the bottom of the interior cavity of the shield (300).

5. The floating device chip shield according to claim 1 or 4, wherein both end surfaces of the heat conductive pad (400) are coated with silicone grease.

6. The floating equipment chip shielding cover according to claim 1, wherein at least two bolt posts (303) are arranged on the side surface of the shielding cover (300), and corresponding bolt holes (102) are formed in the PCB (100).