CN219351509U - Frequency converter with heat dissipation mechanism - Google Patents

Frequency converter with heat dissipation mechanism Download PDF

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Publication number
CN219351509U
CN219351509U CN202320020975.5U CN202320020975U CN219351509U CN 219351509 U CN219351509 U CN 219351509U CN 202320020975 U CN202320020975 U CN 202320020975U CN 219351509 U CN219351509 U CN 219351509U
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Prior art keywords
heat dissipation
fin
dissipation mechanism
frequency converter
hole
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CN202320020975.5U
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Chinese (zh)
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刘政
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Jiangxi Dongte Industrial Co ltd
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Jiangxi Dongte Industrial Co ltd
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Priority to CN202320020975.5U priority Critical patent/CN219351509U/en
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Abstract

The utility model relates to the technical field of frequency converters, in particular to a frequency converter with a heat dissipation mechanism, which comprises a shell and an electric element arranged in the shell, wherein at least one side wall of the shell forms a heat dissipation side, the heat dissipation side is provided with the heat dissipation mechanism, a plurality of through holes are sequentially arranged on the heat dissipation side at intervals along the transverse direction, the heat dissipation mechanism comprises a plurality of mutually independent fin monomers, the fin monomers are in one-to-one correspondence with the through holes, the fin monomers are detachably arranged in the through holes, at least part of the fin monomers extend to the outside of the heat dissipation side to form heat dissipation fins, at least part of the fin monomers extend into the through holes to form mounting parts, and at least part of the electric element is mounted on the mounting parts. The heat dissipation mechanism is composed of a plurality of independent fin units, so that when a certain fin unit is damaged and needs to be replaced, the whole heat dissipation mechanism is not required to be replaced, and only the corresponding fin unit is required to be removed for replacement.

Description

Frequency converter with heat dissipation mechanism
Technical Field
The utility model relates to the technical field of frequency converters, in particular to a frequency converter with a heat dissipation mechanism.
Background
In the existing frequency converter, the frequency converter mainly comprises a shell and an electric element encapsulated in the shell, and because the electric element generates a large amount of heat during operation, a heat dissipation mechanism is generally arranged on the existing frequency converter to assist in heat dissipation of the frequency converter.
The conventional heat dissipation mode of the frequency converter mainly uses a heat dissipation fin assembly as a heat dissipation mechanism to realize heat dissipation, specifically, two heat dissipation fin assemblies are mainly used, one heat dissipation fin assembly is assembled on a shell of the frequency converter, the other heat dissipation fin assembly is formed on the shell of the frequency converter directly in a common integrated forming mode, and the heat dissipation shell of the frequency converter can be specifically disclosed by the utility model patent with the publication number of CN 218006731U.
However, in both the above two manners, there is a common disadvantage in practical application that the fin assembly is used as a single unit in molding, and thus when a certain portion of the fin assembly is damaged, the portion cannot be replaced individually, and thus there is a need for improvement.
Disclosure of Invention
In order to solve at least one technical problem mentioned in the background art, an object of the present utility model is to provide a frequency converter with a heat dissipation mechanism.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the utility model provides a converter with cooling mechanism, includes the casing and locates the electrical component in the casing, at least one lateral wall of casing constitutes the heat dissipation side, be equipped with cooling mechanism on the heat dissipation side, be equipped with a plurality of openings along transversely spaced apart in proper order on the heat dissipation side, cooling mechanism includes a plurality of mutually independent fin monomer, fin monomer and opening one-to-one, wherein fin monomer detachably installs in the opening, fin monomer extends to the heat dissipation side outside at least partially and forms the heat dissipation wing, and fin monomer extends to in the opening at least partially and form the installation department, at least part electrical component installs on the installation department.
Compared with the prior art, the scheme has the advantages that:
in this scheme, the cooling mechanism is not an integral structure, but comprises a plurality of mutually independent fin monomer, so if damage appears in a certain fin monomer when needs to be changed, need not to change whole cooling mechanism, only need take off corresponding fin monomer and change can.
In addition, it is worth to be noted that, in the prior art, in the external installation radiating fin mode of casing, when radiating, the heat in the casing needs to be transmitted to the radiating fin through the surface wall of casing first, so heat transmission efficiency is not high, but otherwise in this scheme, the fin monomer extends to the outside of radiating side at least partially and forms the radiating fin, and the fin monomer extends to the opening at least partially and forms the installation department in, so, the heat that produces in the casing can directly transmit for the fin monomer to radiating efficiency is better.
Finally, in this scheme, at least part electrical component installs on the installation department, and the heat that so this part electrical component distributed can directly conduct to the installation department, finally is dispelled by the heat dissipation wing to be favorable to further improving the radiating effect.
Preferably, the fin unit is an integrally formed structure.
Preferably, the fin unit comprises a base plate, wherein the base plate is attached to the inner wall of the radiating side and covers the through hole, and the radiating fin is arranged at the bottom of the base plate and extends downwards to penetrate out of the through hole.
Preferably, at least one of the inner wall of the heat dissipation fin and the bottom wall of the base plate is provided with a sealing ring encircling the periphery of the through hole.
Preferably, two sides of the substrate are bent upwards to form two side plates, and ends of the two side plates are bent towards each other to form the mounting part.
Preferably, a channel is formed between the two side plates and the base plate in a surrounding manner.
Preferably, the mounting portion is provided with a plurality of butt-joint holes along a length direction thereof.
Preferably, the side of the shell opposite to the heat radiation side forms an open side with an open structure, and the open side is detachably covered with a cover plate.
Additional advantages and effects of the utility model are set forth in the detailed description and drawings.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a partial structure of a heat dissipation side of the housing;
fig. 3 is a schematic structural view of a fin unit.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present embodiment provides a frequency converter with a heat dissipation mechanism, which includes a housing 1 and an electrical element disposed in the housing 1, wherein at least one side wall of the housing 1 forms a heat dissipation side 11, and the embodiment specifically shows that the housing 1 has a rectangular structure, and a bottom wall thereof forms the heat dissipation side 11. The electrical components mainly include PCB 21, chips, etc., and these electrical components are specifically described and applied in the prior art, so that redundant descriptions are not made here.
The heat dissipation side 11 is provided with a heat dissipation mechanism, and as shown in fig. 2, the heat dissipation side 11 is provided with a plurality of through holes 111 at intervals in a transverse direction, and the transverse direction is also understood to be a length direction or a width direction of the casing 1.
The heat dissipation mechanism comprises a plurality of independent fin units 3, and the fin units 3 are in one-to-one correspondence with the through holes 111, namely one through hole 111 is used for installing one fin unit 3.
Wherein the fin unit 3 is detachably mounted in the through hole 111, specifically, the detachable mounting of the fin unit 3 can be realized by adopting a screw connection mode. Therefore, in this embodiment, the heat dissipation mechanism is not an integral structure, but is formed by a plurality of independent fin units 3, so that if a certain fin unit 3 is damaged and needs to be replaced, the whole heat dissipation mechanism is not required to be replaced, and only the corresponding fin unit 3 is required to be removed for replacement.
As shown in fig. 2, the fin unit 3 extends at least partially to the outside of the heat dissipation side 11 to form a heat dissipation fin 34, and the fin unit 3 extends at least partially to the inside of the through hole 111 to form an installation portion 33, so that heat generated in the housing 1 can be directly transferred to the fin unit 3 and then dissipated by the fin unit 3, and the heat dissipation efficiency is better.
In addition, in this embodiment, at least a part of the electrical components are mounted on the mounting portion 33, as a specific embodiment, as shown in fig. 1, the PCB 21 may be attached to the mounting portion 33 and mounted on the mounting portion 33, so that heat emitted by the PCB during operation can be directly conducted to the mounting portion 33 and finally emitted by the heat dissipation fins 34, thereby being beneficial to further improving the heat dissipation effect.
In order to improve the heat dissipation efficiency of the fin unit 3, the fin unit 3 is of an integrally formed structure.
The specific structure of the fin unit 3 is as shown in fig. 2 and 3, the fin unit 3 includes a substrate 31, the substrate 31 is attached to the inner wall of the heat dissipation side 11 and covers the through hole 111, so that the substrate 31 can directly contact with the hot air in the housing 1, and further transfer heat to the heat dissipation fins 34, and the heat is dissipated by the heat dissipation fins 34; second, the substrate 31 can block the opening 111 to form a seal with respect to the opening 111. The heat dissipation fins 34 are mounted on the bottom of the base plate 31 and extend downward to protrude from the through holes 111.
In order to further improve the sealing performance of the joint between the through hole 111 and the substrate 31, in this embodiment, a sealing ring 112 surrounding the periphery of the through hole 111 is fixedly provided on the inner wall of the heat dissipation fin 34, and in the assembled state, the sealing ring 112 is pressed between the substrate 31 and the heat dissipation side 11 to form a seal.
Of course, in other alternative embodiments, the sealing ring 112 may also be fixed to the base plate 31.
The mounting portion 33 is formed by bending the two sides of the substrate 31 upward to form two side plates 32, and the ends of the two side plates 32 are bent in opposite directions to form the mounting portion 33, so that the formed side plates 32 are positioned in the housing 1, so that the heated area of the fin unit 3 in the housing 1 can be increased, and the heat dissipation effect can be improved.
In addition, the two side plates 32 and the base plate 31 are surrounded to form a channel 35, so that hot air in the shell 1 can enter the channel 35 to be in contact with the inner side wall of the side plate 32 for heat conduction, and therefore the outer side wall and the inner side wall of the side plate 32 can be in contact with the hot air in the shell 1, and the heat conduction effect can be improved.
In order to realize the installation of the PCB 21, in this embodiment, the installation portion 33 is provided with a plurality of docking holes 331 along the length direction thereof, when the PCB 21 is installed, the PCB 21 is horizontally placed on the installation portion 33, and then the PCB 21 is fixed on the installation portion 33 by using screws to match with the holes on the PCB 21 and the docking holes 331, so as to realize the installation of the PCB 21.
In order to facilitate the installation of the fin unit 3 on the heat dissipation side 11 of the housing 1, as shown in fig. 1, the side of the housing 1 opposite to the heat dissipation side 11 forms an open side with an open structure, and the open side is detachably covered with a cover plate 12, for example, the cover plate 12 is covered on the open side by using a screw connection manner. When the fin unit 3 is installed, the cover plate 12 can be removed first, and the fin unit 3 is vertically lowered onto the heat radiation side 11 of the housing 1 from the open side of the housing 1 for assembly work.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (8)

1. The utility model provides a converter with cooling mechanism, includes the casing and locates the electrical component in the casing, at least one lateral wall of casing constitutes the heat dissipation side, be equipped with cooling mechanism on the heat dissipation side, its characterized in that, the last a plurality of through-holes that are equipped with in proper order along horizontal spacing of heat dissipation side, cooling mechanism includes a plurality of mutually independent fin monomer, fin monomer and through-hole one-to-one, wherein fin monomer detachably installs in the through-hole, fin monomer at least part extends to the heat dissipation side outside and forms the heat dissipation wing, and fin monomer at least part extends to in the through-hole and forms the installation department, at least part electrical component installs on the installation department.
2. The frequency converter with heat dissipation mechanism as recited in claim 1, wherein the fin unit is an integrally formed structure.
3. The frequency converter with heat dissipation mechanism according to claim 1, wherein the fin unit comprises a base plate, the base plate is attached to the inner wall of the heat dissipation side and covers the through hole, and the heat dissipation fin is mounted at the bottom of the base plate and extends downwards to penetrate out of the through hole.
4. A transducer with heat dissipation mechanism according to claim 3, wherein at least one of the inner wall of the heat dissipation fins and the bottom wall of the base plate is provided with a sealing ring surrounding the periphery of the through hole.
5. A transducer with a heat dissipation mechanism according to claim 3, wherein two sides of the substrate are bent upward to form two side plates, and ends of the two side plates are bent toward each other to form the mounting portion.
6. The frequency converter with heat dissipation mechanism as recited in claim 5, wherein a channel is formed between the two side plates and the base plate.
7. The frequency converter with heat dissipation mechanism according to claim 5, wherein the mounting portion is provided with a plurality of butt-joint holes along a length direction thereof.
8. A transducer with a heat dissipation mechanism as defined in claim 1, wherein the side of the housing opposite the heat dissipation side is an open side formed by an open structure, the open side being detachably covered with a cover plate.
CN202320020975.5U 2023-01-05 2023-01-05 Frequency converter with heat dissipation mechanism Active CN219351509U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320020975.5U CN219351509U (en) 2023-01-05 2023-01-05 Frequency converter with heat dissipation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320020975.5U CN219351509U (en) 2023-01-05 2023-01-05 Frequency converter with heat dissipation mechanism

Publications (1)

Publication Number Publication Date
CN219351509U true CN219351509U (en) 2023-07-14

Family

ID=87095221

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320020975.5U Active CN219351509U (en) 2023-01-05 2023-01-05 Frequency converter with heat dissipation mechanism

Country Status (1)

Country Link
CN (1) CN219351509U (en)

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