CN210183763U - Heat dissipation device and heat dissipation wireless communication module - Google Patents
Heat dissipation device and heat dissipation wireless communication module Download PDFInfo
- Publication number
- CN210183763U CN210183763U CN201920771230.6U CN201920771230U CN210183763U CN 210183763 U CN210183763 U CN 210183763U CN 201920771230 U CN201920771230 U CN 201920771230U CN 210183763 U CN210183763 U CN 210183763U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- wireless communication
- communication module
- dissipation device
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The application provides a heat abstractor and including a heat dissipation wireless communication module of this heat abstractor, this heat abstractor includes: and the concave part of the elastic heat dissipation device is abutted against the power device arranged on the circuit board, so that the heat of the power device is conducted to the elastic heat dissipation device, and the local hot spot in the wireless communication module is eliminated. Compared with the prior art, the elastic heat dissipation device is adopted to replace an encapsulating adhesive medium, so that the circuit board arranged in the wireless communication module can be detached and maintained on the premise of eliminating local hot spots in the wireless communication module and ensuring the uniform distribution of the internal environment temperature of the wireless communication module; in addition, the cost of the elastic heat dissipation device is lower than that of the pouring sealant medium, and the weight of the elastic heat dissipation device is lighter than that of the pouring sealant medium, so that the cost and the weight of the wireless communication module are reduced.
Description
Technical Field
The utility model relates to a circuit protection technical field especially relates to a heat abstractor and heat dissipation wireless communication module.
Background
At present, a wireless communication module adopted in an inverter is a sealed cavity, as shown in fig. 1, a circuit board is arranged inside the inverter, and a power device is arranged on the circuit board; and moreover, no turbulent flow device is arranged in the sealed cavity, and only weak airflow flows, so that the sealed cavity is naturally cooled and radiated as a whole. When the power device has simple function, low loss and low heat flux density, the purpose of heat dissipation can be realized only by utilizing the natural cooling of the sealed cavity.
However, when the power device has complex functions, high loss and high heat flux density, the high-power device arranged on the circuit board is easy to generate high temperature, and the heat must be dissipated in time, so that the failure of the device caused by overhigh temperature of the local hot spot is avoided. Therefore, the prior art proposes a scheme of replacing an air medium with low thermal conductivity with an encapsulating adhesive medium with high thermal conductivity, and the scheme can conduct heat at a high-power device to a low-power device or a non-power device, so as to eliminate local hot spots inside the wireless communication module, and uniformly distribute the internal environment temperature of the wireless communication module.
However, after the wireless communication module is encapsulated, the circuit board cannot be disassembled and maintained, and the cost and the weight of the wireless communication module are greatly increased due to the fact that the encapsulating adhesive is used as a medium.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the utility model provides a heat abstractor and a heat dissipation wireless communication module solve high power density device heat dissipation problem and, adopt the scheme of potting glue medium and can't dismantle, maintain and wireless communication module's cost and the problem that weight increases by a wide margin to the circuit board among the prior art.
In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:
one aspect of the present application provides a heat dissipation apparatus applied to a wireless communication module, where the wireless communication module includes a housing, a circuit board disposed inside the housing, and a power device disposed on the circuit board; the heat dissipating device includes: an elastic heat dissipation device;
the elastic heat dissipation device includes: a recessed portion and a protruding portion;
the concave part is abutted against the power device.
Optionally, the protruding portion abuts against an interior of the housing.
Optionally, the wireless communication module further includes a fixing plate for fixing the circuit board, and a top end of the protruding portion is fixed to the fixing plate.
Optionally, the elastic heat dissipation device is an integral single elastic sheet, and the single elastic sheet is made of a metal material.
Optionally, the single elastic sheet includes:
a first protruding portion provided at a bottom of the case; the first protruding part is a U-shaped or fan-shaped ring;
two concave parts with one side elastically connected to two ends of the first protruding part;
two second protruding parts with one side elastically connected to the other sides of the two concave parts; the other side of the two second protruding parts is the top end of the protruding part.
Optionally, the elastic connection part of the single elastic sheet is further provided with a convection hole.
Optionally, the elastic heat dissipation device includes two half elastic pieces in a curve form, and both the two half elastic pieces are made of a metal material.
Optionally, the half elastic sheet includes:
a first protruding portion provided at a bottom of the case;
a recessed portion having one side elastically connected to the first protruding portion;
a second protrusion part having one side elastically connected to the other side of the recess part; the other side of the second protruding part is the top end of the protruding part.
Optionally, the elastic connection part of the half elastic sheet is further provided with a convection hole.
Another aspect of the present application provides a heat dissipation wireless communication module, including: a wireless communication module and a heat sink as described above;
the wireless communication module includes: a housing;
a fixing plate;
the circuit board is arranged in the shell and fixed on the fixing plate;
and the power device is arranged on the circuit board.
The application provides a heat abstractor, includes: and the concave part of the elastic heat dissipation device is abutted against the power device arranged on the circuit board, so that the heat of the power device is conducted to the elastic heat dissipation device, and the local hot spot in the wireless communication module is eliminated. Compared with the prior art, the elastic heat dissipation device is adopted to replace an encapsulating adhesive medium, so that the circuit board arranged in the wireless communication module can be detached and maintained on the premise of eliminating local hot spots of the internal environment of the wireless communication module and ensuring the uniform distribution of the internal environment temperature of the wireless communication module; in addition, the cost of the elastic heat dissipation device is lower than that of the pouring sealant medium, and the weight of the elastic heat dissipation device is lighter than that of the pouring sealant medium, so that the cost and the weight of the wireless communication module are reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic diagram of a wireless communication module in the prior art;
FIGS. 2a and 2b are schematic illustrations of one embodiment of a flexible heat sink device provided in another embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of the bottom of an elastic heat sink device in an embodiment of the present application;
FIGS. 4a and 4b are schematic views of another embodiment of a flexible heat sink device provided in another embodiment of the present application;
FIG. 5 is a schematic view of a first installation form of a single spring plate;
FIG. 6 is a schematic view of a first mounting form of the half dome;
fig. 7a and 7b are schematic views of a second installation form of the single elastic sheet;
fig. 8a and 8b are schematic views of a second installation form of the half elastic sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
In this application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In order to solve high heat flux device heat dissipation problem, and, adopt the scheme of potting glue medium among the prior art and can't dismantle, maintain and wireless communication module's cost and the problem that weight increases by a wide margin to the circuit board, this application provides a heat abstractor, is applied to wireless communication module, and wireless communication module's concrete structure includes as figure 1: the power device comprises a shell 01, a circuit board 02 arranged in the shell 01 and a power device 03 arranged on the circuit board 02.
The specific structure of the heat dissipation device comprises: an elastic heat dissipation device.
Wherein, elasticity heat dissipation device includes: a recessed portion (such as 12 in fig. 2a, and 22 in fig. 4 a) and a protruding portion (such as 11 and 13 in fig. 2a, and 21 and 23 in fig. 4 a), which recessed portion is against the power device 03.
Specifically, the concave part of the elastic heat dissipation device is abutted against the power device 03, heat on the power device 03 is conducted to the elastic heat dissipation device, the temperature of the power device 03 is reduced, the temperature of the internal environment of the wireless communication module is uniformly distributed, local hot spots in the wireless communication module are reduced, and even the local hot spots in the wireless communication module are eliminated.
Compared with the prior art, the elastic heat dissipation device is adopted to replace an encapsulating adhesive medium, so that the circuit board 02 arranged in the wireless communication module can be detached and maintained on the premise of eliminating local hot spots in the wireless communication module and ensuring the uniform distribution of the internal environment temperature of the wireless communication module; in addition, the cost of the elastic heat dissipation device is lower than that of the pouring sealant medium, and the weight of the elastic heat dissipation device is lighter than that of the pouring sealant medium, so that the cost and the weight of the wireless communication module are reduced.
In another embodiment of the present application, based on the above embodiments, an implementation manner of providing the elastic heat dissipation device is as follows: the elastic heat dissipation device is an integral single elastic sheet, and the single elastic sheet is made of metal materials.
It should be noted that the material of the single elastic sheet may not only be a metal material, but also be a material having elasticity and heat conductivity, and is not specifically limited herein and may be selected according to actual situations.
Specifically, the specific structure of the single elastic sheet is as shown in fig. 2a and fig. 2b, and includes:
a first protruding portion 11 provided at the bottom of the case 01; the first projection 11 is U-shaped or fan-shaped.
And two concave portions 12 having one side elastically connected to both ends of the first protruding portion 11, respectively.
Two second protruding parts 13 having one sides elastically connected to the other sides of the two recessed parts 12, respectively; the other side of the two second projections 13 is the tip of the projection thereof.
It should be noted that the first protruding portion 11 is set to be U-shaped or fan-shaped, so as to be closer to the bottom profile of the housing 01, so that the single elastic sheet is closer to the housing 01, and the single elastic sheet is more stable after being installed and is not easy to be dislocated. In practical application, the bottom outer contour of the cross section of the elastic heat dissipation device may be the same as or different from the inner contour of the bottom of the housing 01, and is not specifically limited herein; if the housing 01 is a round-bottom cylindrical cavity as shown in fig. 1, the cross-sectional bottom shape of the elastic heat dissipation device may be a sector ring as shown in fig. 3; in the sector ring, the arc of the arc is the same as the inner profile of the bottom section of the casing 01, so as to ensure better contact between the protruding part of the elastic heat dissipation device and the inside of the casing 01.
Optionally, the elastically connected portions of the single elastic sheet are further provided with convection holes 14, as shown in fig. 2a and 2 b.
The convection hole 14 may be a square hole, a triangular hole, or a circular hole, and the like, and is not limited herein, but the convection hole 14 is preferably a circular hole; preferably, the convection holes 14 are symmetrically disposed on each portion that is elastically connected to each other, so as to avoid damaging the originally weak airflow inside the wireless communication module.
The number of the convection holes 14 may be three or four, which is not limited herein and needs to be determined according to actual situations.
The rest of the structure and the working principle are the same as those of the above embodiments, and reference may be made to the above embodiments, which are not described in detail herein.
In another embodiment of the present application, based on the above embodiment, another implementation manner of providing the elastic heat dissipation device is as follows: the elastic heat dissipation device comprises two half elastic sheets in a curve form, and the two half elastic sheets are made of metal materials.
It should be noted that the material of the half elastic sheet may not only be a metal material, but also any material that has elasticity and can conduct heat, and is not specifically limited herein and may be selected according to actual situations; the curve form may be a hyperbolic curve or a parabolic curve, which is not specifically limited herein and may be determined according to actual conditions.
Specifically, the specific structure of the half elastic sheet is as shown in fig. 4a and 4b, and includes:
a first projection 21 provided at the bottom of the housing 01.
And a recess 22 having one side elastically connected to the first protrusion 21.
A second protrusion 23 having one side elastically connected to the other side of the recess 22; the other side of the second projection 23 is the tip of its projection.
Optionally, the elastically connected portions of the half elastic pieces are further provided with convection holes 24.
The convection hole 24 may be a square hole, a triangular hole, or a circular hole, and is not limited herein, but the convection hole 24 is preferably a circular hole; preferably, the convection holes 24 are symmetrically disposed on each portion that is elastically connected to each other, so as to avoid damaging the originally weak airflow inside the wireless communication module.
The number of the convection holes 24 may be three or four, which is not limited herein and needs to be determined according to actual situations.
The rest of the structure and the working principle are the same as those of the above embodiments, and reference may be made to the above embodiments, which are not described in detail herein.
In the above embodiment, the elastic heat dissipation device is added to replace the potting adhesive medium, so that the temperature of the internal environment of the wireless communication module is uniformly distributed, but the internal space of the wireless communication module and the area of the circuit board 02 arranged inside the wireless communication module are limited, and if the elastic heat dissipation device is installed according to the installation form under the normal condition, the difficulty of installation of the elastic heat dissipation device is increased.
Wherein, the first installation form of elasticity heat dissipation device is: the protruding portion of the elastic heat sink device abuts against the inside of the housing 01 (as shown in fig. 5 and 6).
Specifically, the elasticity of the elastic heat dissipation device is utilized, and the elastic heat dissipation device is extruded by the inside of the shell 01 and the power device 03 through the fact that the concave part of the elastic heat dissipation device abuts against the power device 03, the protruding part of the elastic heat dissipation device abuts against the inside of the shell 01, and the distance between the two abutting parts is smaller than the original distance between the corresponding parts when the elastic heat dissipation device is not stressed; due to the existence of extrusion, friction force is generated at the abutted part of the concave part of the elastic heat dissipation device and the power device 03 and the abutted part of the convex part of the elastic heat dissipation device and the inside of the shell 01, so that the sliding of the elastic heat dissipation device and the displacement of the elastic heat dissipation device after the wireless communication module is vibrated are overcome, and the elastic heat dissipation device can be kept unchanged after being installed at an installation position; wherein, the installation position is determined according to the position of the power device 03 arranged on the circuit board 02 in practical application; in addition, due to the existence of extrusion, the concave part of the elastic heat dissipation device is contacted with the power device 03 more tightly, the contact area is increased, and the heat on the power device 03 can be better conducted to the elastic heat dissipation device.
When the elastic heat dissipation device is an integral single spring plate, the specific manner of installing the single spring plate inside the wireless communication module may be as shown in fig. 5, specifically: the first protruding portion 11 and the two second protruding portions 13 of the single elastic sheet are both abutted against the inside of the housing 01, and the first protruding portion 11 of the single elastic sheet is arranged at the bottom of the housing 01.
When the elastic heat dissipation device includes two half elastic pieces in a curved form, a specific manner in which the two half elastic pieces are installed inside the wireless communication module may be as shown in fig. 6, specifically: the first protruding portion 21 of each half elastic sheet and the second protruding portion 23 of each half elastic sheet are both abutted against the inside of the housing 01, and the first protruding portion 21 of each half elastic sheet is arranged at the bottom of the housing 01.
In addition, the second installation form of the elastic heat dissipation device is as follows: when the wireless communication module further includes a fixing plate 04 to which the circuit board 02 is fixed, the tip of the protruding portion of the elastic heat dissipating device is fixed to the fixing plate 04 (as shown in fig. 7a, 7b, 8a, and 8 b).
Specifically, the concave part of the elastic heat dissipation device abuts against the power device 03, the top end of the protruding part of the elastic heat dissipation device is fixed on the fixing plate 04, and the elastic heat dissipation device has elasticity, so that the elastic heat dissipation device is extruded by the fixing plate 04 and the power device 03; due to the extrusion, the concave part of the elastic heat dissipation device is contacted with the power device 03 more tightly, the contact area is increased, and the heat on the power device 03 can be better conducted to the elastic heat dissipation device; in addition, the elastic heat dissipation device is fixed on the fixing plate 04 in the mounting mode, so that the position of the elastic heat dissipation device can be kept unchanged after the elastic heat dissipation device is mounted at the mounting position; the mounting position is determined according to the position of the power device 03 disposed on the circuit board 02 in practical use.
When the elastic heat dissipation device is an integral single elastic sheet, the specific manner of installing the single elastic sheet inside the wireless communication module may be as shown in fig. 7a and 7b, specifically: the other side of the second protruding part 13 of the single elastic sheet is fixed on the fixing plate 04 as the top end of the protruding part of the elastic heat-insulating device.
When the elastic heat dissipation device includes two half elastic pieces in a curved form, a specific manner in which the two half elastic pieces are installed inside the wireless communication module may be as shown in fig. 8a and 8b, specifically: the other side of the second protruding part 23 of the two half-elastic pieces is used as the top end of the protruding part of the elastic heat dissipation device and fixed on the fixing plate 04.
It should be noted that, when the elastic heat dissipation device is an integral single spring plate or includes two half spring plates in a curved form, in order to facilitate the detachment and installation of the elastic heat dissipation device, a slot 05 is disposed on the fixing plate 04, as shown in fig. 7a and 7b, or as shown in fig. 8a and 8 b; when the elastic heat dissipation device is installed, the top end of the protruding part in the elastic heat dissipation device is inserted into the clamping groove 05, and when the elastic heat dissipation device is disassembled, the elastic heat dissipation device is pulled out; the cross section of the clamping groove 05 can be rectangular or a fan ring, which is not limited and needs to be selected according to the cross section shape of the elastic heat dissipation device.
Further, it should be noted that, in the actual use process, in order to prevent the elastic heat dissipation device from falling off, a threaded connection may be provided on the side surface of the slot 05, a pin connection may also be provided on the side surface of the slot 05, the connection between the elastic heat dissipation device and the fixing plate 04 is strengthened through the pin connection, and other connection forms may also be used, which are not shown one by one here, and different connection forms may be selected according to different actual application situations, so as to strengthen the connection between the elastic heat dissipation device and the fixing plate 04.
It is worth to be noted that, compared with the elastic heat dissipation device using a single elastic sheet, when power devices 03 are disposed on both sides of the circuit board 02, the single elastic sheet mounting scheme needs to consider the mounting positions of the power devices 03 on both sides of the circuit board 02, and thus the two power devices cannot be independently mounted, so that the mounting difficulty is high. And the installation of two half shell fragments can not influence each other, can independently install, and then makes the installation degree of difficulty lower, does benefit to the application.
In this embodiment, only two installation modes with lower installation difficulty are provided in which the elastic heat dissipation device is installed inside the wireless communication module, and other installation modes are also within the protection scope of the present application.
The specific structure of the elastic heat dissipation device is the same as that of the above embodiments, and is not described in detail here.
In another embodiment of the present application, on the basis of the above embodiment and fig. 1, a heat dissipation wireless communication module is provided, which includes: wireless communication module and heat abstractor in the above-mentioned embodiment.
As shown in fig. 1, the wireless communication module includes: the power device comprises a shell 01, a fixing plate 04, a circuit board 02 which is arranged in the shell 01 and fixed on the fixing plate 04, and a power device 03 which is arranged on the circuit board 02.
The specific structure and the working principle of the heat dissipation device can be found in the above embodiments, and are not described in detail herein.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the system or system embodiments are substantially similar to the method embodiments and therefore are described in a relatively simple manner, and reference may be made to some of the descriptions of the method embodiments for related points. The above-described system and system embodiments are only illustrative, wherein the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present teachings.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the novel teachings. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A heat dissipation device is applied to a wireless communication module, wherein the wireless communication module comprises a shell, a circuit board arranged in the shell and a power device arranged on the circuit board; the heat dissipating device includes: an elastic heat dissipation device;
the elastic heat dissipation device includes: a recessed portion and a protruding portion;
the concave part is abutted against the power device.
2. The heat dissipating device of claim 1, wherein the protruding portion abuts an interior of the housing.
3. The heat dissipating device of claim 1, wherein the wireless communication module further comprises a fixing plate to which the circuit board is fixed, and a top end of the protruding portion is fixed to the fixing plate.
4. The heat dissipating device of any of claims 1-3, wherein the resilient heat dissipating device is an integral single spring, and the single spring is made of a metal material.
5. The heat dissipating device of claim 4, wherein the single spring plate comprises:
a first protruding portion provided at a bottom of the case; the first protruding part is a U-shaped or fan-shaped ring;
two concave parts with one side elastically connected to two ends of the first protruding part;
two second protruding parts with one side elastically connected to the other sides of the two concave parts; the other side of the two second protruding parts is the top end of the protruding part.
6. The heat dissipating device of claim 5, wherein the resilient connecting portion of the single spring piece is further provided with a convection hole.
7. The heat dissipating device of any of claims 1-3, wherein the resilient heat dissipating means comprises two half-springs in a curvilinear form, both of the half-springs being of a metallic material.
8. The heat dissipating device of claim 7, wherein said half-dome comprises:
a first protruding portion provided at a bottom of the case;
a recessed portion having one side elastically connected to the first protruding portion;
a second protrusion part having one side elastically connected to the other side of the recess part; the other side of the second protruding part is the top end of the protruding part.
9. The heat dissipating device of claim 8, wherein the resilient connecting portions of the half spring plates are further provided with convection holes.
10. A heat-dissipating wireless communication module, comprising: a wireless communication module and the heat dissipation device of any of claims 1-9;
the wireless communication module includes: a housing;
a fixing plate;
the circuit board is arranged in the shell and fixed on the fixing plate;
and the power device is arranged on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920771230.6U CN210183763U (en) | 2019-05-27 | 2019-05-27 | Heat dissipation device and heat dissipation wireless communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920771230.6U CN210183763U (en) | 2019-05-27 | 2019-05-27 | Heat dissipation device and heat dissipation wireless communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210183763U true CN210183763U (en) | 2020-03-24 |
Family
ID=69834917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920771230.6U Active CN210183763U (en) | 2019-05-27 | 2019-05-27 | Heat dissipation device and heat dissipation wireless communication module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210183763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023231657A1 (en) * | 2022-06-01 | 2023-12-07 | 苏州旭创科技有限公司 | Optical module |
-
2019
- 2019-05-27 CN CN201920771230.6U patent/CN210183763U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023231657A1 (en) * | 2022-06-01 | 2023-12-07 | 苏州旭创科技有限公司 | Optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108151187B (en) | Electrical apparatus box refrigerant heat radiation structure and air condensing units | |
| WO2022077734A1 (en) | Radar device, radar installation device, and mobile apparatus | |
| CN205232671U (en) | Heat conduction shell fragment and install heat -generating body of this heat conduction shell fragment | |
| CN210183763U (en) | Heat dissipation device and heat dissipation wireless communication module | |
| US10790215B1 (en) | Heat dissipation device | |
| KR20100039719A (en) | Heat sink for electric and electronic products with propagation heat | |
| CN107509365B (en) | Ultrathin microwave assembly and heat pipe radiating device | |
| CN216437872U (en) | Improved heat dissipation type variable frequency controller | |
| JP3209591U (en) | Heat dissipation device assembly structure | |
| CN207282486U (en) | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor | |
| JP2012146828A (en) | Heat radiation structure and heat radiation member | |
| CN210157562U (en) | Quick heat abstractor is used to electronic product | |
| CN212081181U (en) | LED lamp heat dissipation device | |
| CN219812395U (en) | Heat dissipation mechanism and energy storage equipment | |
| CN220359599U (en) | Heat radiation structure applied to EHC controller | |
| CN205880805U (en) | Computer machine case forced -air cooling heat dissipation structure | |
| CN112787027A (en) | Heat dissipation bottom plate and battery box | |
| CN209199912U (en) | A kind of radiation shell and metal-oxide-semiconductor component | |
| CN214592534U (en) | Frequency converter with heat pipe air-cooled radiator | |
| CN219674155U (en) | Explosion-proof light source module | |
| CN220730761U (en) | Industrial computer heat radiation structure | |
| CN216218469U (en) | Heat dissipation device and vehicle-mounted system | |
| CN217283363U (en) | Loudspeaker with cooling function | |
| CN206993577U (en) | A kind of controller heat-radiation fixed structure | |
| CN216871167U (en) | Auxiliary heat radiator and computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |