CN219834767U - Circuit structure and unmanned aerial vehicle nest - Google Patents

Abstract

The utility model provides a circuit structure and an unmanned aerial vehicle nest, and relates to the field of electronic equipment. This circuit structure is applied to unmanned aerial vehicle nest, and circuit structure includes: the heat dissipation bottom plate is provided with a heat conduction piece; the circuit board is arranged on the radiating bottom plate; and a plurality of electronic components, each electronic component is arranged on the circuit board, at least one electronic component in the plurality of electronic components is attached to the heat conducting piece, and heat generated by the electronic component attached to the heat conducting piece is conducted to the heat radiating bottom plate through the heat conducting piece. The utility model solves the problem that the working state of the circuit structure is affected by the high temperature of the circuit structure.

Description

Circuit structure and unmanned aerial vehicle nest

Technical Field

The utility model relates to the field of electronic equipment, in particular to a circuit structure and an unmanned aerial vehicle nest.

Background

The circuit structure is an important component of electronic equipment such as an unmanned aerial vehicle nest, and comprises a circuit board and a plurality of electronic elements arranged on the circuit board so as to realize electrical connection among the plurality of electronic elements through the circuit board. However, since the heat generation amount of the electronic component is large, the temperature of the circuit structure is high, thereby affecting the operation state of the circuit structure.

Disclosure of Invention

The embodiment of the utility model provides a circuit structure and an unmanned aerial vehicle nest, which are used for solving the problem that the working state of the circuit structure is affected by high temperature of the circuit structure.

The circuit structure provided by the embodiment of the utility model is applied to the unmanned aerial vehicle nest, and comprises the following components:

the heat dissipation base plate is provided with a heat conduction piece;

the circuit board is arranged on the radiating bottom plate; and

the electronic components are arranged on the circuit board, at least one of the electronic components is attached to the heat conducting piece, and heat generated by the electronic components attached to the heat conducting piece is conducted to the heat radiating bottom plate through the heat conducting piece.

Through adopting above-mentioned technical scheme, be provided with the heat conduction piece at the radiating bottom plate, and electronic component laminating in the heat conduction piece, when circuit structure is in operating condition, the produced heat of electronic component can pass through the heat conduction piece and transmit to the radiating bottom plate to play certain heat dissipation effect to electronic component through the radiating bottom plate, thereby reduced circuit structure's temperature, improved circuit structure's operating condition.

In some possible embodiments, the heat conducting member is located between the heat dissipating base plate and the circuit board.

In some possible embodiments, the circuit board has a first surface facing away from the heat sink base plate and a second surface facing toward the heat sink base plate;

the number of the electronic components is set to be a plurality, and part of the electronic components in the plurality of electronic components are arranged on the first surface of the circuit board; the rest of the electronic components are arranged on the second surface of the circuit board, and the electronic components positioned on the second surface of the circuit board are attached to the heat conducting piece.

In some possible embodiments, the heat conducting member includes a mounting portion and an extension portion connected, the mounting portion being attached to the heat dissipating base plate, and the extension portion being attached to the electronic component located on the second surface of the circuit board.

In some possible embodiments, the heat dissipation base plate is further provided with a heat conduction connecting piece, and one end of the heat conduction connecting piece, which is away from the heat dissipation base plate, is connected with the circuit board;

the number of the circuit boards is multiple, the number of the heat conduction connecting pieces is multiple, and each circuit board is connected to the heat dissipation bottom plate through the heat conduction connecting pieces.

In some possible embodiments, the circuit structure further includes a protective cover, the protective cover is disposed on the heat dissipation base plate, and the protective cover and the heat dissipation base plate form a containing cavity, and the containing cavity contains the circuit board and the electronic component.

In some possible embodiments, the circuit board is further provided with a wire, and an end of the wire facing away from the circuit board is disposed outside the accommodating cavity;

the protection casing sets up to flexible protection casing, flexible protection casing still is provided with the wire passageway, the inner wall laminating of wire passageway in the wire.

In some possible embodiments, the protective cover is provided with a connecting flange which can be movably connected to the radiating base plate;

and/or, the protection cover is further provided with a sealing element, the first surface of the sealing element is arranged on the radiating bottom plate, and the second surface of the sealing element is connected with the protection cover.

In some possible embodiments, the heat dissipation base plate is provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the surface of the heat dissipation base plate, which is away from the circuit board.

The embodiment of the utility model also provides an unmanned aerial vehicle nest, which comprises the circuit structure of any one of the above.

Since the unmanned aerial vehicle nest includes the circuit structure described in any one of the above, the unmanned aerial vehicle nest includes the advantages of the circuit structure described in any one of the above, and the description thereof will be omitted herein.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

Fig. 1 is a schematic structural diagram of a circuit structure according to an embodiment of the present utility model;

FIG. 2 is a cross-sectional view of a circuit structure provided by an embodiment of the present utility model;

fig. 3 is a cross-sectional view of a heat dissipation base, a circuit board, and an electronic component provided in an embodiment of the present utility model;

fig. 4 is a cross-sectional view of a heat dissipation base plate and a protective cover provided by an embodiment of the present utility model.

Reference numerals illustrate:

100. a heat dissipation base plate;

110. a heat radiation fin; 120. a heat conductive member; 121. a mounting part; 122. an extension; 130. a thermally conductive connection;

200. a circuit board;

210. a wire;

300. an electronic component;

400. a protective cover;

410. a connecting flange; 420. a seal; 430. a wire passage.

Specific embodiments of the present utility model have been shown by way of the above drawings and will be described in more detail below. The drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but rather to illustrate the inventive concepts to those skilled in the art by reference to the specific embodiments.

Detailed Description

As described in the background art, the circuit structure includes a circuit board and a plurality of electronic components mounted to the circuit board to realize electrical connection between the plurality of electronic components through the circuit board. However, since the circuit structure is installed inside the housing of the unmanned aerial vehicle nest and the heating value of the electronic component is large, the temperature of the circuit structure is high, thereby affecting the working state of the circuit structure.

In order to solve the technical problems, the embodiment of the utility model provides a circuit structure and an unmanned aerial vehicle nest, wherein a heat conducting piece is arranged on a heat radiating bottom plate of the circuit structure, and an electronic element is attached to the heat conducting piece.

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.

The following describes the technical scheme of the present utility model and how the technical scheme of the present utility model solves the above technical problems in detail with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Embodiments of the present utility model will be described below with reference to the accompanying drawings.

Referring to fig. 1 and 2, an embodiment of the present utility model provides a circuit structure, including a heat dissipation substrate 100, a circuit board 200, and a plurality of electronic components 300; wherein, the heat dissipation base plate 100 is provided with a circuit board 200, and the heat dissipation base plate 100 is provided with a heat conducting member 120; the electronic components 300 are disposed on the circuit board 200, at least some electronic components 300 of the plurality of electronic components 300 are attached to the heat conducting member 120, so as to transfer heat to the heat dissipation base plate 100 through the heat conducting member 120, thereby playing a certain role in dissipating heat to the electronic components 300 mounted on the circuit board 200 through the heat dissipation base plate 100.

In some possible embodiments, the heat dissipation base plate 100 is provided with a plurality of heat dissipation fins 110, the plurality of heat dissipation fins 110 are sequentially disposed on the surface of the heat dissipation base plate 100 facing away from the circuit board 200 at intervals, and the plurality of heat dissipation fins 110 can be integrally disposed on the heat dissipation base plate 100, so that the heat dissipation base plate 100 can dissipate heat through the plurality of heat dissipation fins 110, thereby increasing the heat dissipation area of the heat dissipation base plate 100 and improving the heat dissipation effect of the heat dissipation base plate 100.

Alternatively, the heat dissipation base plate 100 may be a water-cooled heat dissipation base plate 100, for example, a plurality of heat dissipation channels are provided in the heat dissipation base plate 100, and the heat dissipation channels are filled with a cooling liquid such as liquid water, so that the cooling liquid flows in the heat dissipation channels, and the temperature of the water-cooled heat dissipation base plate 100 is reduced by the cooling liquid, so as to further improve the heat dissipation effect of the heat dissipation base plate 100.

Referring to fig. 1-3, in some possible embodiments, the heat dissipating base plate 100 may be spaced apart from the circuit board 200 along a first direction, the first direction being perpendicular to the heat dissipating base plate 100; and the heat conducting member 120 is accommodated between the heat dissipating base plate 100 and the circuit board 200, so that the electronic component 300 mounted on the circuit board 200 is connected to the heat dissipating base plate 100 through the heat conducting member 120.

Illustratively, the heat dissipating base plate 100 is further provided with a heat conducting connecting member 130, and an end of the heat conducting connecting member 130 facing away from the heat dissipating base plate 100 is connected to the circuit board 200, so that the circuit board 200 transfers heat to the heat dissipating base plate 100 through the heat conducting connecting member 130. The heat conductive connection member 130 may be made of metal copper to improve the heat conductive effect of the heat conductive connection member 130, and the number of the heat conductive connection members 130 may be set to be plural, and the heat conductive connection member 130 may extend along the first direction, so that the circuit board 200 is connected to the heat dissipation base plate 100 through the plurality of heat conductive connection members 130, thereby improving the heat dissipation effect of the circuit board 200.

The first end of the heat conducting connecting piece 130 may be rotatably disposed on the circuit board 200 along the first direction, the second end of the heat conducting connecting piece 130 is provided with an external thread, the heat dissipating bottom plate 100 is correspondingly provided with a plurality of threaded holes with internal threads, and each threaded hole is correspondingly disposed on one heat conducting connecting piece 130, so that each heat conducting connecting piece 130 can be disposed on the heat dissipating bottom plate 100 in a penetrating manner and be in threaded connection with the heat dissipating bottom plate 100, thereby realizing a connection process between the heat conducting connecting pieces 130 and the heat dissipating bottom plate 100.

For example, when the circuit board 200 is mounted on the heat dissipation substrate 100 by using the heat conduction connecting piece 130, the second end of the heat conduction connecting piece 130 is inserted into the corresponding threaded hole, and the heat conduction connecting piece 130 is rotated around the first direction, so that the second end of the heat conduction connecting piece 130 is screwed to the heat dissipation substrate 100; the length of each heat conductive connection 130 is then adjusted so that the circuit boards 200 are disposed parallel and opposite to the heat dissipation base plate 100.

In the first direction, the circuit board 200 has a first surface and a second surface, the first surface of the circuit board 200 facing away from the heat dissipation substrate 100, and the second surface of the circuit board 200 facing toward the heat dissipation substrate 100, at least one of the first surface and the second surface of the circuit board 200 being for mounting the electronic component 300.

It is to be understood that the number of the electronic components 300 may be adjusted according to the actual situation, and a part of the electronic components 300 in the plurality of electronic components 300 are disposed on the first surface of the circuit board 200; the rest of the electronic components 300 of the plurality of electronic components 300 are disposed on the second surface of the circuit board 200, and the electronic components 300 disposed on the second surface of the circuit board 200 are attached to the heat conductive member 120.

It is easy to understand that, among the plurality of electronic components 300, a portion of the electronic components 300 having a larger heat generation amount may be disposed on the second surface of the circuit board 200, and a portion of the electronic components 300 having a smaller heat generation amount may be disposed on the first surface of the circuit board 200, so that all of the portions of the electronic components 300 having a larger heat generation amount can transfer heat to the heat dissipation base plate 100 through the heat conductive member 120, thereby improving the heat dissipation efficiency of the electronic components 300 and reducing the temperature of the circuit structure.

Alternatively, when the number of the electronic components 300 is small, the plurality of electronic components 300 may be disposed on the second surface of the heat dissipation substrate 100, so that the heat transfer function is performed to the plurality of electronic components 300 through the heat conductive member 120.

Referring to fig. 1-3, in some possible embodiments, the heat conductive member 120 includes a mounting portion 121 and an extension portion 122 connected, wherein the mounting portion 121 is attached to the heat dissipation substrate 100, and the extension portion 122 is attached to the electronic component 300 located on the second surface of the circuit board 200, so that the electronic component 300 located on the second surface of the circuit board 200 transfers heat to the heat dissipation substrate 100 sequentially through the extension portion 122 and the mounting portion 121.

Illustratively, the mounting portion 121 and the extending portion 122 may be made of metallic copper; in addition, the mounting portion 121 and the extension portion 122 may be integrally formed, for example, the metal plate may be bent by laser bending or the like to form the mounting portion 121 and the extension portion 122, and the mounting portion 121 is vertically disposed on the extension portion 122, so that the forming process of the mounting portion 121 and the extension portion 122 is more convenient.

It is easy to understand that, when the heat conducting member 120 is mounted on the surface of the heat dissipating base plate 100, the mounting portion 121 is attached to the heat dissipating base plate 100, so as to increase the contact area between the mounting portion 121 and the surface of the heat dissipating base plate 100; the extension portion 122 extends along the first direction, and the extension portion 122 is attached to the surface of the electronic component 300, so as to increase the contact area between the extension portion 122 and the surface of the electronic component 300, thereby improving the heat conduction effect of the heat conduction member 120.

Referring to fig. 1 to 3, on the heat dissipation substrate 100, a plurality of circuit boards 200 are provided, and a plurality of heat conductive connectors 130 are provided, and each circuit board 200 is connected to the heat dissipation substrate 100 through a plurality of heat conductive connectors 130. For example, the number of the circuit boards 200 may be two, the two circuit boards 200 are arranged in parallel, and the two circuit boards 200 are each arranged at a distance from the heat dissipation base plate 100, thereby implementing the heat dissipation process of the two circuit boards 200 through one heat dissipation base plate 100.

Through adopting above-mentioned technical scheme, through being provided with the heat-conducting piece 120 including extension 122 and installation department 121 at radiating bottom plate 100, and installation department 121 laminating in radiating bottom plate 100's surface for electronic component 300 laminating in extension 122, when circuit structure is in operating condition, the produced heat of electronic component 300 can pass through extension 122 and installation department 121 and transmit radiating bottom plate 100 to dispel the heat through a plurality of radiating fins 110, in order to play certain radiating effect to electronic component 300 through radiating bottom plate 100, thereby reduced circuit structure's temperature, and then improved circuit structure's operating condition.

Referring to fig. 1 to 4, in some possible embodiments, the circuit structure further includes a protective cover 400 for protecting the circuit board 200 and the electronic component 300, the protective cover 400 is disposed on the heat dissipation substrate 100, and the protective cover 400 and the heat dissipation substrate 100 form a receiving cavity, and the receiving cavity receives the circuit board 200 and the at least one electronic component 300, so that the protective cover 400 can be used to protect the circuit board 200 and the electronic component 300 to a certain extent, and the possibility of damage to the circuit board 200 and the electronic component 300 is reduced.

The protection cover may extend along the first direction, and the protection cover is provided with an opening, where the opening of the protection cover faces the heat dissipation base plate 100 to close the opening through the heat dissipation base plate 100, so that the heat dissipation base plate 100 and the protection cover 400 together form a containing cavity, and the plurality of heat dissipation fins 110 of the heat dissipation base plate 100 are disposed on a side of the heat dissipation base plate 100 away from the protection cover 400, so that the electronic component 300 can dissipate heat to the outside of the containing cavity through the heat conducting member 120 and the heat dissipation base plate 100 in sequence, so as to improve the heat dissipation effect of the electronic component 300.

It should be noted that, due to different use conditions of the circuit structure, part of the circuit board 200 and the electronic component 300 are suitable for use in a closed condition, so as to reduce the possibility that the circuit structure is affected by external conditions; alternatively, portions of the circuit board 200 and the electronic component 300 are adapted for use in semi-closed or open conditions to enable the circuit structure to be in contact with air, thereby improving the heat dissipation of the circuit structure.

In the related art, when the shield cover 400 is disposed on the heat dissipation base plate 100, the circuit board 200 and the electronic component 300 are disposed in the accommodating cavity formed by the shield cover 400 and the heat dissipation base plate 100, and the heat generated by the electronic component 300 is collected in the accommodating cavity, so that the temperature of the accommodating cavity is easy to rise, the temperature of the circuit board 200 and the temperature of the electronic component 300 are increased, and the operating state of the circuit structure is poor.

In the embodiment of the utility model, when the circuit structure is in the working state, the heat generated by the electronic component 300 in the accommodating cavity can be transferred to the heat dissipation base plate 100 through the extension part 122 and the mounting part 121, and dissipated by the plurality of heat dissipation fins 110 arranged outside the accommodating cavity, so that a certain heat dissipation effect is exerted on the electronic component 300 through the heat dissipation base plate 100, and the possibility of heat accumulation in the accommodating cavity can be reduced.

The protection cover 400 is provided with a connection flange 410, and the connection flange 410 may be integrally provided to the protection cover 400, and the connection flange 410 may be movably connected to the heat dissipation base plate 100, so that the protection cover 400 can be mounted and fixed to the heat dissipation base plate 100 through the connection flange 410, thereby facilitating the mounting process of the protection cover 400.

The connection flange 410 may be connected to the heat dissipation base plate 100 in various manners, for example, the connection flange 410 may be adhesively fixed to the surface of the heat dissipation base plate 100 by means of adhesion or the like; alternatively, the connection flange 410 may be fixed to the heat dissipation base plate 100 by screw fixation or the like to fix the connection flange 410 to the heat dissipation base plate 100.

When it is necessary to replace or repair the circuit board 200 and the electronic component 300 in the receiving cavity, the screws are unscrewed so that the screws are separated from the heat dissipation plate 100, and then the shield 400 is removed from the surface of the heat dissipation plate 100, thereby accomplishing the replacement or repair process of the circuit board 200 and the electronic component 300.

The heat radiation base plate 100 may be provided in various shapes, for example, the heat radiation base plate 100 may be provided as a square heat radiation base plate 100, and when the shield 400 is mounted to the heat radiation base plate 100 through the connection flange 410, the outer edge of the connection flange 410 may be flush with the edge of the heat radiation base plate 100, or the outer edge of the connection flange 410 may be provided on the surface of the heat radiation base plate 100 to reduce interference of the connection flange 410 with the mounting process of the heat radiation base plate 100.

Illustratively, the protective cover 400 is further provided with a sealing member 420, a first surface of the sealing member 420 is disposed on the heat dissipation base plate 100, and a second surface of the sealing member 420 is connected to the protective cover 400 to improve the tightness of the receiving chamber through the sealing member 420.

When the shield 400 is provided with the connection flange 410, the sealing member 420 may be provided as an annular sealing member 420, and the annular sealing member 420 is disposed between the connection flange 410 and the heat dissipation base plate 100, and the first surface of the annular sealing member 420 is fitted to the heat dissipation base plate 100, and the second surface of the annular sealing member 420 is fitted to the connection flange 410, so as to reduce a gap between the connection flange 410 and the heat dissipation base plate 100, thereby improving the sealing property of the receiving chamber.

Alternatively, when the shield 400 is not provided with the connection flange 410, the shield 400 may be mounted and fixed to the surface of the heat dissipation base plate 100 by means of bonding or clamping, etc., and the sealing member 420 may be provided at the inner side or the outer side of the shield 400 to reduce a gap between the shield 400 and the heat dissipation base plate 100 by the sealing member 420.

In some possible embodiments, the protective cover 400 is provided as a flexible protective cover 400, and the flexible protective cover 400 may be made of elastic materials such as rubber or silica gel, for example, so that the flexible protective cover 400 has a certain elasticity, and the possibility of plastic deformation of the flexible protective cover 400 is reduced.

When the circuit board 200 and the electronic components 300 in the accommodating cavity are in a working state, the electronic components 300 emit heat, so that the temperature in the flexible protective cover 400 is increased, and the gas in the accommodating cavity is expanded by heating; by providing the shield 400 as the flexible shield 400, when the gas in the accommodating chamber is expanded by heat, the flexible shield 400 is deformed, so that the variation of the gas pressure in the accommodating chamber can be reduced;

also, when the circuit board 200 and the plurality of electronic components 300 are in the non-operating state in the accommodating chamber, the deformed flexible boot 400 can be restored to the original shape, thereby reducing the variation of the air pressure in the accommodating chamber.

It is easy to understand that the circuit board 200 is further provided with a wire 210, the wire 210 passes through the protective cover 400, and one end of the wire 210 facing away from the circuit board 200 is disposed outside the accommodating cavity; the wires 210 may be provided as signal wires 210 or power wires 210 to enable the circuit board 200 and the electronic component 300 within the accommodating chamber to receive or transmit signals through the signal wires 210 or to supply power to the circuit board 200 and the electronic component 300 within the accommodating chamber through the power wires 210.

Illustratively, the flexible boot 400 is further provided with a wire channel 430, and an inner wall of the wire channel 430 is attached to the wire 210 to reduce a gap between the wire 210 and the inner wall of the wire channel 430, thereby improving the tightness in the accommodating cavity;

also, the wire passage 430 may be disposed inside the receiving chamber, or the wire passage 430 may be disposed outside the receiving chamber, so that the wire 210 can be penetrated through the shield 400 by the wire passage 430; the wire channel 430 may be disposed on a surface of the shield 400 facing away from the heat sink base plate 100, or the wire channel 430 may be disposed on a sidewall of the shield 400, which is not further limited in the embodiment of the present utility model.

By adopting the above technical scheme, when the circuit board 200 and the electronic component 300 are suitable for being used under the closed condition, the protective cover 400 is arranged on the surface of the heat dissipation bottom plate 100, and the protective cover 400 and the heat dissipation bottom plate 100 can jointly form a containing cavity, so that the protective cover 400 plays a certain role in protecting the circuit board 200 and the electronic component 300; and the protective cover 400 is provided as a flexible protective cover 400, and when the gas in the accommodating cavity is expanded by heating, the flexible protective cover 400 is deformed, so that the change of the gas pressure in the accommodating cavity can be reduced.

In summary, the embodiment of the utility model provides a circuit structure and an unmanned aerial vehicle nest, in the circuit structure, the protective cover 400 is disposed on the surface of the heat dissipation bottom plate 100, and the protective cover 400 and the heat dissipation bottom plate 100 can form a containing cavity together, so that the protective cover 400 plays a certain role in protecting the circuit board 200 and the electronic component 300; in addition, the heat conducting member 120 is disposed on the heat dissipating base plate 100, and the electronic component 300 is attached to the heat conducting member 120, so that when the circuit structure is in a working state, heat generated by the electronic component 300 can be transferred to the heat dissipating base plate 100 through the heat conducting member 120, so that a certain heat dissipating effect is achieved on the electronic component 300 through the heat dissipating base plate 100, and therefore, the temperature of the circuit structure is reduced, and the working state of the circuit structure is improved.

The embodiment of the utility model also provides an unmanned aerial vehicle nest, which comprises the circuit structure of any one of the embodiments. Since the unmanned aerial vehicle nest includes the circuit structure of any of the above embodiments, the unmanned aerial vehicle nest includes the advantages of the circuit structure of any of the above embodiments, and the detailed description thereof will be omitted herein.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, it should be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can lead the connection between the two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. A circuit structure for use in an unmanned aerial vehicle nest, the circuit structure comprising:

the heat dissipation base plate is provided with a heat conduction piece;

the circuit board is arranged on the radiating bottom plate; and

the electronic components are arranged on the circuit board, at least one of the electronic components is attached to the heat conducting piece, and heat generated by the electronic components attached to the heat conducting piece is conducted to the heat radiating bottom plate through the heat conducting piece.

2. The circuit structure of claim 1, wherein the thermally conductive member is located between the heat sink base plate and the circuit board.

3. The circuit structure of claim 2, wherein the circuit board has a first surface facing away from the heat sink base and a second surface facing toward the heat sink base;

some of the electronic components are disposed on the first surface of the circuit board; the rest of the electronic components are arranged on the second surface of the circuit board, and the electronic components positioned on the second surface of the circuit board are attached to the heat conducting piece.

4. A circuit structure according to claim 3, wherein the heat conducting member includes a mounting portion and an extension portion connected thereto, the mounting portion being attached to the heat dissipating base plate, the extension portion being attached to the electronic component located on the second surface of the circuit board.

5. The circuit structure of claim 1, wherein the heat dissipation base plate is further provided with a heat conduction connecting piece, and one end of the heat conduction connecting piece, which is away from the heat dissipation base plate, is connected with the circuit board;

the number of the circuit boards is multiple, the number of the heat conduction connecting pieces is multiple, and each circuit board is connected to the heat dissipation bottom plate through the heat conduction connecting pieces.

6. The circuit structure of any one of claims 1-5, further comprising a protective cover disposed on the heat sink base plate, and wherein the protective cover and the heat sink base plate form a receiving cavity that receives the circuit board and the electronic component.

7. The circuit structure of claim 6, wherein the circuit board is further provided with a wire, and an end of the wire facing away from the circuit board is disposed outside the accommodating cavity;

the protection casing sets up to flexible protection casing, flexible protection casing still is provided with the wire passageway, the inner wall laminating of wire passageway in the wire.

8. The circuit structure of claim 6, wherein the shield is provided with a connection flange that is movably connected to the heat sink base;

and/or, the protection cover is further provided with a sealing element, the first surface of the sealing element is arranged on the radiating bottom plate, and the second surface of the sealing element is connected with the protection cover.

9. The circuit structure of claim 1, wherein the heat sink base plate is provided with a plurality of heat sink fins disposed on a surface of the heat sink base plate facing away from the circuit board.

10. A drone nest comprising a circuit structure according to any one of claims 1 to 9.