CN218244213U - Heat conduction bridge structure and electronic product - Google Patents

Abstract

The utility model discloses a heat conduction bridge structure and an electronic product, wherein the heat conduction bridge structure comprises a heat dissipation shell, a cover plate and a bottom plate; the heat dissipation shell is of an upper and lower open structure and is provided with an upper opening and a lower opening, the cover plate is detachably mounted on the upper opening, and the bottom plate is detachably mounted on the lower opening; the heat dissipation device comprises a heat dissipation shell and is characterized in that a heat conduction bridge spanning the inner space of the heat dissipation shell is arranged inside the heat dissipation shell, and a heat dissipation structure corresponding to the end part of the heat conduction bridge is arranged outside the heat dissipation shell. The heat conduction bridge structure is simple in structure, good in heat dissipation performance, convenient to install and maintain.

Description

Heat conduction bridge structure and electronic product

Technical Field

The utility model relates to an electronic product technical field especially relates to be used for carrying out radiating heat conduction bridge structure to the device that generates heat in the electronic product. The utility model discloses still relate to and be equipped with the electronic product of heat conduction bridge structure.

Background

At present, the protection level of electronic products is required to be higher and higher, and because the heating devices inside the electronic products are usually in a relatively sealed environment, the heat dissipation of the products becomes a troublesome problem.

The general heat dissipation idea is still to directly mount the heating device on the heat sink, and the heat is directly conducted to the heat sink through the mounting surface for heat dissipation. However, for devices such as inductors and transformers, the devices are usually soldered on the printed board and then fixed, so that heat cannot be directly conducted to the heat sink for heat dissipation. In this case, the solution is usually achieved by glue filling, and after glue filling, heat is conducted to the heat dissipation surface through the heat conductive glue to dissipate heat.

The following problems generally exist in the heat dissipation mode: on one hand, the heat resistance of the heat-conducting glue is large, and the conduction path is long, so that the heat dissipation effect is not ideal, and on the other hand, the glue-filled product is difficult to maintain.

Therefore, how to effectively improve the heat dissipation performance of the sealing product is a technical problem to be solved urgently at present.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat conduction bridge structure. The heat conduction bridge structure is simple in structure, has better heat dissipation performance, and is convenient to install and maintain.

Another object of the present invention is to provide an electronic product.

In order to achieve the above object, the utility model provides a heat conduction bridge structure, include the heat dissipation casing and be located the inside heat conduction bridge of heat dissipation casing, the heat conduction bridge is used for carrying out heat conduction to the device that generates heat, and it stridees across the inner space of heat dissipation casing, and horizontal projection cover the horizontal projection or the horizontal projection of the device that generates heat and the horizontal projection of the device that generates heat at least partially overlap, the outside of heat dissipation casing be equipped with the corresponding heat radiation structure of tip of heat conduction bridge.

Optionally, the heat dissipation casing is an upper and lower open structure, which has an upper opening and a lower opening, the cover plate is detachably mounted on the upper opening, and the bottom plate is detachably mounted on the lower opening.

Optionally, the heat conduction bridge transversely spans the inner space of the heat dissipation housing, and the heat dissipation housing is provided with heat dissipation structures corresponding to two ends of the heat conduction bridge at outer sides of two transverse sides.

Optionally, the two ends of the heat conducting bridge are bent parts bent downwards, and heat conduction is performed between the bent parts and the inner wall of the heat dissipation shell.

Optionally, a heat conducting medium is embedded inside the heat conducting bridge.

Optionally, the heat conducting medium comprises a heat conducting tube or a soaking plate.

Optionally, the heat conducting bridge and the heat dissipation housing are of an integrated structure; and/or the heat dissipation structure and the heat dissipation shell are of an integrated structure.

Optionally, a boss structure is arranged on the inner wall of the heat dissipation shell, and the position of the boss structure is lower than the heat conduction bridge.

Optionally, the boss structures are located at four corners of the inner cavity of the heat dissipation shell.

Optionally, the heat dissipation structure is a heat dissipation fin.

Optionally, the heat dissipation fins are air-cooling heat dissipation fins or water-cooling heat dissipation fins.

In order to achieve the above another object, the present invention provides an electronic product, which comprises a housing and a heating device disposed inside the housing, wherein the housing has any one of the above heat conducting bridge structures, the heat conducting bridge is disposed above the heating device, and the top of the heating device is directly contacted or indirectly connected with the bottom of the heat conducting bridge for heat conduction.

Optionally, an insulating heat-conducting component is disposed between the heat generating device and the heat-conducting bridge.

Optionally, the insulating and heat conducting component is a heat conducting silicone grease or a heat conducting pad.

Optionally, the heat generating device is fixed to a printed board or a mounting board, and the printed board or the mounting board is fixed to the inside of the heat dissipating casing.

The utility model provides a heat conduction bridge structure is equipped with the heat conduction bridge in the inside of heat dissipation casing, and the heating device is directly contacted or indirectly connected with the heat conduction bridge to can transmit the heat of heating device to the heat dissipation structure outside the heat dissipation casing through the heat conduction bridge, because the heat conduction bridge can be designed according to the layout of heating device in a flexible way, cover the heating surface accurately, reduce the heat conduction path, therefore, need not measures such as encapsulating, just can realize high-efficient heat dissipation; moreover, the heat dissipation shell is of an upper and lower open structure, and the bottom plate and the cover plate can be detached, so that the heat dissipation shell is convenient to disassemble and assemble and can be mounted on two sides.

The utility model provides an electronic product is equipped with heat conduction bridge structure, because heat conduction bridge structure has above-mentioned technological effect, then is equipped with the electronic product of this heat conduction bridge structure, should also have corresponding technological effect.

Drawings

Fig. 1 is a schematic structural diagram of a heat conducting bridge structure according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an electronic product according to an embodiment of the present invention;

FIG. 3 is an isometric view of the electronic product of FIG. 2 after removal of the cover plate;

fig. 4 is a top view of the electronic product of fig. 2 after removing the cover plate;

fig. 5 is an exploded view of the electronic product shown in fig. 2.

In the figure:

10. radiating shell 20, cover plate 30, bottom plate 40, radiating fins 50, heat conduction bridge 51, bending part 60, heating device 70, printed board 80, boss structure 90, insulating heat conduction part

Detailed Description

In order to make the technical field better understand the solution of the present invention, the following detailed description is given with reference to the accompanying drawings and the detailed description.

In this specification, terms such as "upper, lower, inner, and outer" are established based on positional relationships shown in the drawings, and the corresponding positional relationships may vary depending on the drawings, and therefore, the terms are not to be construed as absolutely limiting the scope of protection; moreover, relational terms such as "first" and "second," and the like, may be used solely to distinguish one element from another element having the same name, without necessarily requiring or implying any actual such relationship or order between such elements.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat conducting bridge structure according to an embodiment of the present invention.

In a specific embodiment, the present invention provides a heat conducting bridge structure, which is mainly composed of a heat dissipating casing 10, a cover plate 20, a bottom plate 30, etc., wherein the heat dissipating casing 10 is made of aluminum alloy. Of course, the heat dissipation case 10 may be made of other materials with good heat conductivity.

The heat dissipating housing 10 is substantially rectangular and has an upper and lower opening structure, the top of the heat dissipating housing 10 has an upper opening which is opened upwards, the bottom of the heat dissipating housing 10 has a lower opening which is opened downwards, the cover plate 20 is detachably mounted on the upper opening of the heat dissipating housing 10, the bottom plate 30 is detachably mounted on the lower opening of the heat dissipating housing 10, and sealing measures, such as an additional sealing rubber ring and the like, are adopted between the cover plate 20 and the heat dissipating housing 10 and between the bottom plate 30 and the heat dissipating housing 10 to seal the heat dissipating housing 10, so as to ensure high protection performance after the assembly is completed.

Because the heat dissipation housing 10 has an open structure, it can be operated on the front or the back during production and debugging, and the operation space is large. For printed boards or fixing plates which are arranged on two sides and need to be welded on the front side and the back side, the structure is very convenient to operate.

The heat dissipation shell 10 is formed with heat dissipation fins 40 on the outer side of the horizontal both sides, specifically can be air-cooled heat dissipation fins or water-cooled heat dissipation fins, and the inside of the heat dissipation shell 10 is formed with a heat conduction bridge 50 that transversely strides across its inner space, and heat conduction bridge 50 and heat dissipation shell 10 formula structure as an organic whole, and heat dissipation fins 40 and heat dissipation shell 10 formula structure as an organic whole too. In operation, as shown by the arrow in fig. 2, the heat generating device 60 first transfers heat to the heat conducting bridge 50, then transfers the heat to the heat dissipating fins 40 on the outer wall of the heat dissipating housing 10 through the heat conducting bridge 50, and then carries the heat away through air cooling or water cooling.

The two ends of the heat conducting bridge 50 are bent portions 51 bent downward, and heat conduction is performed between the bent portions 51 and the inner wall of the heat dissipating housing 10, so as to increase the contact area with the inner wall of the heat dissipating fins 40 and improve the heat conducting efficiency.

The heat conduction bridge 50 mainly dissipates heat of the heating device 60 in the heat dissipation shell 10 in a heat conduction mode, and the erection position, the number and the appearance mode of the heat conduction bridge can be accurately designed according to the layout of the heating device 60, so that the heating device 60 can be in direct contact with the heat conduction bridge 50, the heat conduction path is simple, no additional thermal resistance exists, and the heat dissipation efficiency can be obviously improved.

Further, a heat conducting medium may be embedded inside the heat conducting bridge 50, for example, a heat conducting pipe, a heat soaking plate or other heat conducting media may be embedded inside the heat conducting bridge 50, so as to further improve the heat conduction and heat dissipation performance of the heat conducting bridge 50.

The electric elements such as the heating device 60 inside the heat dissipation casing 10 are mainly installed on the printed board 70 (or the mounting board), in order to fix the printed board 70 (or the mounting board), the inner wall of the heat dissipation casing 10 is provided with the boss structure 80, in this embodiment, the boss structure 80 is located at the four corners of the inner cavity of the heat dissipation casing 10, the position of the boss structure 80 is lower than the heat conduction bridge 50, the printed board 70 (or the mounting board) can be connected with the boss structure 80 by adopting a screw or welding mode, for example, the screw connection is taken as an example, the boss structure 80 is provided with a screw hole, the printed board 70 (or the mounting board) is provided with corresponding through holes at the four corners, the printed board 70 is installed from the lower opening of the heat dissipation casing 10, and is supported on the lower surface of the boss structure 80, and then is fixed by screwing in four screws.

Since the heat dissipation case 10 has an upper opening and a lower opening, when the printed board 70 (or the mounting board) is mounted, the heat dissipation case 10 can be turned over and then operated, which is very simple.

After the printed board 70 (or the mounting board) is fixed, the printed board 70 (or the mounting board) should be spaced apart from the heat conductive bridge 50 by a distance equal to or greater than the height of the heat generating device 60. If the distance between the printed board 70 (or the mounting board) and the heat conductive bridge 50 is equal to the height of the heat generating device 60, the top of the heat generating device 60 may directly contact the lower surface of the heat conductive bridge 50 for heat conduction; if the distance between the printed board 70 (or the mounting board) and the heat conducting bridge 50 is greater than the height of the heat generating device 60, the top of the heat generating device 60 may be indirectly connected to the lower surface of the heat conducting bridge 50 through the insulating heat conducting member 90, which may also conduct heat.

If the number of the heat generating devices 60 is two or more and the heights are not uniform, a part of the heat generating devices 60 may be in direct contact with the heat conductive bridge 50, and another part of the heat generating devices 60 may be indirectly connected with the heat conductive bridge 50.

Although there is only one thermally conductive bridge 50 in this embodiment, it is understood that the number of the thermally conductive bridges 50 is not limited to one, and in other embodiments, the number of the thermally conductive bridges 50 may also be two, three or more.

In other embodiments, the heat dissipating fins 40 may be located on only one side of the heat dissipating housing 10, or the heat dissipating fins 40 are located on two adjacent sides of the heat dissipating housing 10, and if the heat dissipating fins 40 are located on two adjacent sides of the heat dissipating housing 10, the heat conducting bridge 50 may be designed to have an "L" shape in horizontal projection, that is, a right-angled shape in horizontal projection, so as to be able to transfer heat to the heat dissipating fins 40 on two sides.

Referring to fig. 2 to 5, fig. 2 is a schematic structural diagram of an electronic product according to an embodiment of the present invention; FIG. 3 is an isometric view of the electronic product of FIG. 2 after removal of the cover plate; fig. 4 is a top view of the electronic product of fig. 2 after removing the cover plate; fig. 5 is an exploded view of the electronic product shown in fig. 2.

In addition to above-mentioned heat conduction bridge structure, the utility model also provides an electronic product, specifically can be ACDC power or DCDC power, it mainly comprises the casing and locates the inside electrical components of casing, one of them some electrical components are heating device 60, the casing has the heat conduction bridge structure of the above-mentioned description, heat conduction bridge 50 of heat conduction bridge structure is located heating device 60's top, heating device 60's top and heat conduction bridge 50's bottom direct contact or indirect connection, in order to carry out heat-conduction.

Specifically, the heating device 60 is fixed on the printed board 70 (or the mounting board), the fixing manner of the heating device 60 and the printed board 70 (or the mounting board) may be welding or screwing, and the like, an insulating heat-conducting component 90 may be added between the heating device 60 and the heat-conducting bridge 50, and the insulating heat-conducting component 90 may be heat-conducting silicone grease or a heat-conducting pad, and the like, and plays roles of insulation and heat conduction. If the heat generating device 60 does not need to be insulated from the heat conducting bridge 50, the insulating heat conducting member 90 can be omitted, so that the heat generating surface is directly attached to the heat conducting bridge 50 to dissipate heat.

In operation, heat is conducted from the heat generating device 60 to the heat conducting bridge 50 through the insulating heat conducting member 90, and then to the heat dissipating fins 40 on both sides. Since the heat conduction bridge 50 is embedded with heat conduction pipes and other structures, the heat conduction performance is excellent, the heat of the heating device 60 can be quickly conducted away, and the heat dissipation effect is excellent.

In this embodiment, the top of the heat conducting bridge 50 is flush with the inner edge of the opening of the heat dissipating housing 10, and can also support the cover plate 20 while conducting heat, and at the same time, because the heat conducting bridge 50 contacts with the cover plate 20, a part of heat can also be conducted to the cover plate 20, so as to dissipate heat together with the cover plate 20.

The above embodiments are merely preferred embodiments of the present invention, and are not limited thereto, and different embodiments can be obtained by performing targeted adjustment according to actual needs.

For example, the heat dissipation housing 10 may be provided with heat dissipation fins 40 all around, the heat conduction bridges 50 may be provided transversely or longitudinally, or, inside the same heat dissipation housing 10, there are both transverse heat conduction bridges 50 and longitudinal heat conduction bridges 50, the transverse heat conduction bridges 50 and the longitudinal heat conduction bridges 50 may intersect or partially overlap, and the horizontal projection thereof is cross-shaped or # -shaped, and so on.

This is not illustrated here, since many implementations are possible.

The utility model provides a heat conduction bridge structure and electronic product, its heat dissipation casing 10's top and bottom are uncovered formula structure, can operate by the positive and negative, and device 60 that generates heat moreover conducts the heat to radiating fin 40 through heat conduction bridge 50, and heat conduction route is simple, need not the encapsulating, is convenient for install and later maintenance.

It is right above that the utility model provides a heat conduction bridge structure and electronic product have carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the core concepts of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims (15)

1. The utility model provides a heat conduction bridge structure, its characterized in that, is located including heat dissipation casing the inside heat conduction bridge of heat dissipation casing, the heat conduction bridge is used for carrying out heat-conduction to the device that generates heat, and it stridees across the inner space of heat dissipation casing, and the horizontal projection covers the horizontal projection of the device that generates heat or horizontal projection overlaps with the horizontal projection of the device that generates heat at least partially, the outside of heat dissipation casing be equipped with the heat radiation structure corresponding to the tip of heat conduction bridge.

2. The heat-conducting bridge structure according to claim 1, wherein the heat-dissipating housing is an open-top structure having an upper opening detachably mounted with the cover plate and a lower opening detachably mounted with the bottom plate.

3. The heat conductive bridge structure according to claim 2, wherein the heat conductive bridge transversely spans the inner space of the heat dissipating housing, and the heat dissipating housing is provided at outer sides of both transverse sides with heat dissipating structures corresponding to both ends of the heat conductive bridge.

4. The structure of claim 3, wherein the two ends of the heat conducting bridge are bent portions bent downward, and the heat conducting bridge is thermally conducted to the inner wall of the heat dissipating housing through the bent portions.

5. The thermally conductive bridge structure of claim 4, wherein the thermally conductive bridge has a thermally conductive medium embedded therein.

6. The thermally conductive bridge structure of claim 5, wherein the thermally conductive medium comprises a thermally conductive tube or a thermal spreader plate.

7. The thermally conductive bridge structure of claim 6, wherein the thermally conductive bridge is a unitary structure with the heat dissipation housing; and/or the heat dissipation structure and the heat dissipation shell are of an integrated structure.

8. The heat-conducting bridge structure according to claim 1, wherein the inner wall of the heat-dissipating housing is provided with a boss structure at a position lower than the heat-conducting bridge.

9. A thermally conductive bridge structure as claimed in claim 8, wherein the boss formations are located at the four corners of the internal cavity of the heat dissipation housing.

10. The thermally conductive bridge structure according to any one of claims 1 to 9, wherein the heat dissipating structure is a heat dissipating fin.

11. The thermally conductive bridge structure of claim 10, wherein the heat fins are air-cooled heat fins or water-cooled heat fins.

12. An electronic product, comprising a casing and a heat generating device disposed inside the casing, wherein the casing has the heat conducting bridge structure of any one of claims 1 to 11, the heat conducting bridge is located above the heat generating device, and the top of the heat generating device is directly contacted with or indirectly connected to the bottom of the heat conducting bridge for heat conduction.

13. The electronic product of claim 12, wherein an insulating heat-conducting component is disposed between the heat generating device and the heat-conducting bridge.

14. The electronic product of claim 13, wherein the insulating and heat conducting member is a heat conducting silicone grease or a heat conducting pad.

15. The electronic product according to claim 14, wherein the heat generating device is fixed to a printed board or a mounting board fixed to an inside of the heat dissipating case.

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