CN212305762U - PCB circuit board of stable performance - Google Patents
PCB circuit board of stable performance Download PDFInfo
- Publication number
- CN212305762U CN212305762U CN202021353053.9U CN202021353053U CN212305762U CN 212305762 U CN212305762 U CN 212305762U CN 202021353053 U CN202021353053 U CN 202021353053U CN 212305762 U CN212305762 U CN 212305762U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- heat dissipation
- glue layer
- board main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a PCB circuit board of stable performance, including circuit board main part, circuit board main part bottom is provided with heat dissipation mechanism, the circuit board main part outside is provided with the frame, shock attenuation supporting mechanism is installed to the frame bottom, shock attenuation supporting mechanism comprises upper fixed plate, upper limit lid, damper, lower limit lid and bottom plate, spacing lid and lower limit lid are installed respectively to the damper both ends, the bottom plate is installed on lower limit lid top, upper fixed plate is installed on the top of going up spacing lid, upper fixed plate installs in the frame bottom. The utility model discloses, through setting up the heat dissipation mechanism, improved the heat dispersion of circuit board, avoid the high temperature to produce the influence to the work of limiting plate; the circuit board main body is provided with the heat conducting adhesive layer, so that heat can be quickly led out, and the heat dissipation efficiency of the heat dissipation mechanism is improved; through setting up shock attenuation supporting mechanism, avoid because vibrations lead to the damage of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a PCB circuit board of stable performance.
Background
The printed board is characterized in that an insulating board is used as a base material, is cut into a certain size, is provided with at least one conductive pattern, and is provided with holes (such as element holes, fastening holes, metalized holes and the like) for replacing a chassis of an electronic component of the conventional device and realizing the mutual connection of the electronic component. Such boards are known as "printed" circuit boards because they are made using electronic printing. It is not exact to custom refer to a "printed wiring board" as a "printed circuit" because there are no "printed components" on the printed board, but only wiring.
The heat dissipation performance and the anti-seismic performance of the existing circuit board are poor, so that the stability of the circuit board is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCB circuit board of stable performance to solve the problem among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PCB circuit board of stable performance, includes circuit board main part, circuit board main part bottom is provided with heat dissipation mechanism, the circuit board main part outside is provided with the frame, shock attenuation supporting mechanism is installed to the frame bottom, shock attenuation supporting mechanism comprises upper fixed plate, upper limit lid, damping member, lower limit lid and bottom plate, spacing lid and lower limit lid are installed respectively to the damping member both ends, the bottom plate is installed on lower limit lid top, upper fixed plate is installed on the top of upper limit lid, upper fixed plate installs in the frame bottom.
Preferably, the heat dissipation mechanism is provided as one or both of a heat dissipation fin and a heat dissipation fan.
Preferably, the circuit board main part comprises rete, glue layer, copper foil layer, heat-conducting glue layer and PCB base plate, PCB base plate upper surface is provided with heat-conducting glue layer, heat-conducting glue layer upper surface is provided with the copper foil layer, copper foil layer upper surface is provided with the glue layer, glue layer upper surface is provided with the rete.
Preferably, the heat-conducting glue layer is a ceramic heat-conducting glue layer.
Preferably, bolt holes for fixing are formed in the upper fixing plate and the lower fixing plate, and two ends of the damping piece are fixed to the upper limiting cover and the lower limiting cover through bolts.
Preferably, the damping piece is a rubber piece or a silica gel piece.
Preferably, a shock pad is arranged at the contact position of the circuit board main body and the frame.
Compared with the prior art, the beneficial effects of the utility model are that:
1. by arranging the heat dissipation mechanism, the heat dissipation performance of the circuit board is improved, and the influence of overhigh temperature on the work of the limiting plate is avoided; the circuit board main body is provided with the heat conducting adhesive layer, so that heat can be quickly led out, and the heat dissipation efficiency of the heat dissipation mechanism is improved;
2. by arranging the damping support mechanism, the anti-seismic performance of the circuit board can be improved, and the damage of the circuit board caused by vibration is avoided; the damping piece adopts rubber spare or silica gel spare, and the shock attenuation effect is better.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the circuit board main body of the present invention.
Fig. 3 is a schematic structural view of the damping support mechanism of the present invention.
In the figure: 1. a frame; 2. a circuit board main body; 3. a heat dissipation mechanism; 4. a shock-absorbing support mechanism; 201. a film layer; 202. a glue layer; 203. a copper foil layer; 204. a heat-conducting adhesive layer; 205. a PCB substrate; 401. an upper fixing plate; 402. an upper limit cover; 403. a shock absorbing member; 404. a lower limit cover; 405. and a lower fixing plate.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, in an embodiment of the present invention, a PCB circuit board with stable performance includes a circuit board main body 2, a heat dissipation mechanism 3 is disposed at the bottom end of the circuit board main body 2, a frame 1 is disposed at the outer side of the circuit board main body 2, a shock absorption supporting mechanism 4 is mounted at the bottom end of the frame 1, the shock absorption supporting mechanism 4 is composed of an upper fixing plate 401, an upper limiting cover 402, a shock absorption member 403, a lower limiting cover 404 and a lower fixing plate 405, the upper limiting cover 402 and the lower limiting cover 404 are respectively mounted at two ends of the shock absorption member 403, the lower fixing plate 405 is mounted at the top end of the lower limiting cover 404, the upper fixing plate 401 is mounted at the top end of the upper limiting cover 402, the upper fixing plate 401 is mounted at the bottom end of the frame 1, the heat dissipation mechanism 3 is set to be one or two, The PCB comprises a copper foil layer 203, a heat-conducting adhesive layer 204 and a PCB substrate 205, wherein the upper surface of the PCB substrate 205 is provided with the heat-conducting adhesive layer 204, the upper surface of the heat-conducting adhesive layer 204 is provided with the copper foil layer 203, the upper surface of the copper foil layer 203 is provided with a glue layer 202, the upper surface of the glue layer 202 is provided with a film layer 201, the heat-conducting adhesive layer 204 is a ceramic heat-conducting adhesive layer, bolt holes for fixing are respectively formed in an upper fixing plate 401 and a lower fixing plate 405, two ends of a shock-absorbing piece 403 are fixed on an upper limiting cover 402 and a lower limiting cover 404 through bolts, the shock-absorbing piece 403 is a rubber piece or a silica gel piece, and a shock; by arranging the heat dissipation mechanism 3, the heat dissipation performance of the circuit board is improved, and the influence of overhigh temperature on the work of the limiting plate is avoided; the circuit board main body 2 is provided with the heat conducting adhesive layer 204, so that heat can be quickly led out, and the heat dissipation efficiency of the heat dissipation mechanism 3 is improved; by arranging the damping support mechanism 4, the anti-seismic performance of the circuit board can be improved, and the damage of the circuit board caused by vibration is avoided; the shock-absorbing member 403 is made of rubber or silica gel, so that the shock-absorbing effect is better.
The utility model discloses a theory of operation is: by arranging the heat dissipation mechanism 3, the heat dissipation performance of the circuit board is improved, and the influence of overhigh temperature on the work of the limiting plate is avoided; the circuit board main body 2 is provided with the heat conducting adhesive layer 204, so that heat can be quickly led out, and the heat dissipation efficiency of the heat dissipation mechanism 3 is improved; by arranging the damping support mechanism 4, the anti-seismic performance of the circuit board can be improved, and the damage of the circuit board caused by vibration is avoided; the shock-absorbing member 403 is made of rubber or silica gel, so that the shock-absorbing effect is better.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a PCB circuit board of stable performance, includes circuit board main part (2), its characterized in that: the circuit board main part (2) bottom is provided with heat dissipation mechanism (3), circuit board main part (2) outside is provided with frame (1), shock attenuation supporting mechanism (4) are installed to frame (1) bottom, shock attenuation supporting mechanism (4) are by upper fixed plate (401), go up spacing lid (402), damper (403), lower spacing lid (404) and bottom plate (405) are constituteed, upper spacing lid (402) and lower spacing lid (404) are installed respectively to damper (403) both ends, bottom plate (405) are installed on lower spacing lid (404) top, upper fixed plate (401) are installed on the top of upper spacing lid (402), upper fixed plate (401) are installed in frame (1) bottom in upper fixed plate (401).
2. The PCB circuit board of claim 1, wherein: the heat dissipation mechanism (3) is one or two of a heat dissipation fin and a heat dissipation fan.
3. A PCB circuit board with stable performance according to claim 1 or 2, wherein: the circuit board main part (2) comprises rete (201), glue layer (202), copper foil layer (203), heat-conducting glue layer (204) and PCB base plate (205), PCB base plate (205) upper surface is provided with heat-conducting glue layer (204), heat-conducting glue layer (204) upper surface is provided with copper foil layer (203), copper foil layer (203) upper surface is provided with glue layer (202), glue layer (202) upper surface is provided with rete (201).
4. The PCB circuit board of claim 3, wherein: the heat-conducting glue layer (204) is a ceramic heat-conducting glue layer.
5. The PCB circuit board of claim 1, wherein: bolt holes for fixing are formed in the upper fixing plate (401) and the lower fixing plate (405), and two ends of the shock absorption piece (403) are fixed to the upper limiting cover (402) and the lower limiting cover (404) through bolts.
6. The PCB circuit board of claim 1, wherein: the shock absorption piece (403) is a rubber piece or a silica gel piece.
7. The PCB circuit board of claim 1, wherein: and a shock pad is arranged at the contact position of the circuit board main body (2) and the frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021353053.9U CN212305762U (en) | 2020-07-10 | 2020-07-10 | PCB circuit board of stable performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021353053.9U CN212305762U (en) | 2020-07-10 | 2020-07-10 | PCB circuit board of stable performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212305762U true CN212305762U (en) | 2021-01-05 |
Family
ID=73936575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021353053.9U Active CN212305762U (en) | 2020-07-10 | 2020-07-10 | PCB circuit board of stable performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212305762U (en) |
-
2020
- 2020-07-10 CN CN202021353053.9U patent/CN212305762U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111246660B (en) | Dampproofing dehumidification type PCB board | |
| CN212305762U (en) | PCB circuit board of stable performance | |
| CN210868494U (en) | Printed circuit board assembly convenient to mount | |
| CN212544336U (en) | Same plane matter is different prevents circuit board that splits | |
| TWI669601B (en) | Thermal buffered conductive composite forming structure of mobile electronic device (4) | |
| CN207995595U (en) | A kind of circuit board with elastic protection device | |
| CN213547915U (en) | Novel PCB module board of plastic envelope structure | |
| CN220874784U (en) | Embedded double-layer circuit board | |
| CN207884962U (en) | A kind of high heat conduction printed circuit board | |
| CN212278542U (en) | Multilayer high-precision printed circuit board | |
| CN220606179U (en) | PCB board paster packaging structure | |
| CN213718317U (en) | Multilayer HDI circuit board of inlayer interconnection | |
| CN218483003U (en) | High-density multilayer gold-plating printed PCB (printed circuit board) | |
| CN214627464U (en) | Flexible circuit board | |
| CN212752729U (en) | PCBA's heat radiation structure | |
| CN215073125U (en) | Steel sheet reinforcement spare of convenient heat dissipation | |
| CN217064101U (en) | Environment-friendly HDI circuit board | |
| CN220798608U (en) | Novel high temperature resistant double-sided circuit board | |
| CN210272333U (en) | Integrated circuit board with improved impact resistance | |
| CN217883958U (en) | Multilayer printed wiring board with thermal-insulated function | |
| CN211352823U (en) | Anti-seismic copper-clad plate easy to install | |
| CN220273936U (en) | Printed circuit board structure | |
| CN210928388U (en) | Detachable structure of electronic ceramic substrate | |
| CN216531896U (en) | Heat dissipation type circuit board | |
| CN220422103U (en) | Composite PCB circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |