CN218217792U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- CN218217792U CN218217792U CN202222039677.9U CN202222039677U CN218217792U CN 218217792 U CN218217792 U CN 218217792U CN 202222039677 U CN202222039677 U CN 202222039677U CN 218217792 U CN218217792 U CN 218217792U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- dissipation shell
- board body
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010521 absorption reaction Methods 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000000605 extraction Methods 0.000 claims abstract description 10
- 230000006978 adaptation Effects 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000003292 glue Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer printed circuit board, including heat dissipation shell, circuit board body and heat extraction subassembly, the inside at the heat dissipation shell is installed to the circuit board body, be provided with the heat absorption chamber in the heat dissipation shell, the inner wall all is provided with the installing port all around of heat dissipation shell, install the fin in the installing port, heat absorption chamber and heat extraction subassembly looks adaptation. The utility model discloses in, through setting up the heat dissipation shell, absorb the heat absorption chamber with circuit board body heat all around through four group's fin on the heat dissipation shell to arrange the outside through the heat in heat absorption chamber of heat extraction subassembly, and then play good radiating effect all around to the circuit board body, avoid the glue film between the base plate to be heated for a long time and lead to the stickness to descend.
Description
Technical Field
The utility model relates to a PCB multiply wood technical field, more specifically say, it relates to a multilayer printed circuit board.
Background
PCB printed boards are also called printed circuit boards, printed circuit boards. The multilayer printed board is composed of more than two layers of connecting wires on insulating substrates and bonding pads for assembling and welding electronic elements, and has the functions of conducting the circuits of all layers and insulating the circuits.
The component can produce more heat at the in-process of work on the current multilayer printed circuit board, and heat abstractor among the existing equipment can only play the radiating effect to the superiors (component face) of circuit board generally, is difficult to play good radiating effect all around to multilayer circuit board, gets off for a long time and leads to the glue film stickness between the base plate to descend easily, and then leads to multilayer circuit board not hard up, so need make the improvement to this.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a multilayer printed circuit board, including heat dissipation shell, circuit board body and heat extraction subassembly, the inside at the heat dissipation shell is installed to the circuit board body, be provided with the heat absorption chamber in the heat dissipation shell, the inner wall all is provided with the installing port all around of heat dissipation shell, install the fin in the installing port, heat absorption chamber and heat extraction subassembly looks adaptation.
In order to achieve the above purpose, the utility model provides a following technical scheme:
preferably, the heat discharging assembly comprises a fan, a plurality of heat absorbing pipes and a main air pipe, one end of the main air pipe is fixedly connected with one end of an air inlet of the fan, one end of each of the plurality of heat absorbing pipes is fixedly connected with the other end of the main air pipe, and the other end of each of the plurality of heat absorbing pipes is arranged inside the heat absorbing cavity.
Preferably, a second heat insulation coating is arranged on the inner wall of one side, close to the mounting opening, of the heat absorption cavity.
Preferably, the outer wall of the top of the circuit board body is provided with a first heat insulation coating.
Preferably, one side of the radiating fin close to the circuit board body is provided with a heat conduction silicone grease layer.
Compared with the prior art, the utility model discloses possess following beneficial effect:
the utility model discloses in, through setting up the heat dissipation shell, inhale the heat absorption chamber with circuit board body heat all around through four group's fin on the heat dissipation shell to heat through the heat extraction subassembly in with the heat absorption chamber is arranged to the outside, and then to playing good radiating effect around the circuit board body, avoid the glue film between the base plate to be heated for a long time and lead to the stickness to descend.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the heat absorption chamber of the present invention;
fig. 3 is an enlarged schematic view of the position a of the present invention.
1. A heat dissipation housing; 2. a heat absorbing tube; 3. a heat sink; 4. a circuit board body; 5. a first thermal insulation coating; 6. a main air duct; 7. a fan; 8. a heat absorption chamber; 9. a thermally conductive silicone layer; 10. a second thermal insulation coating; 11. and (7) installing a port.
Detailed Description
Referring to fig. 1 to 3, the embodiment further illustrates a multilayer printed circuit board according to the present invention.
The utility model provides a multilayer printed circuit board, including heat dissipation shell 1, circuit board body 4 is installed to the inner wall of heat dissipation shell 1, the top of heat dissipation shell 1 is provided with the heat extraction subassembly, and the heat extraction subassembly is by fan 7, main tuber pipe 6 and a plurality of heat absorption pipe 2 are constituteed, fan 7 is installed on the shell body of relevant equipment, be provided with heat absorption chamber 8 in the heat dissipation shell 1, the one end setting of a plurality of heat absorption pipe 2 is in the inside of heat absorption chamber 8, the one end of a plurality of heat absorption pipe 2 and the one end fixed connection of main tuber pipe 6, the other end of main tuber pipe 6 and the air intake one end fixed connection of fan 7, the inner wall all around of heat dissipation shell 1 all is provided with installing port 11, install fin 3 in installing port 11, produce the heat around with circuit board body 4 through four fin 3 and carry the heat absorption chamber 8 in, fan 7 carries the equipment outside through the heat in a plurality of heat absorption pipe 2 and main tuber pipe 6, and then play the radiating effect around to circuit board body 4, the glue film between the avoided being in the base plate is in high temperature state for a long time, make circuit board body 4 more stable.
Referring to fig. 1-3, the top layer of the circuit board body 4 is a component surface, the bottom layer is a ground surface, a plurality of electronic components are welded on the component surface, a first thermal insulation coating 5 is arranged on the component surface to reduce the heat permeating to the bottom layer of the circuit board body 4, a second thermal insulation coating 10 is arranged on the side, close to the circuit board body 4, of the heat sink 3, the heat sink 3 is prevented from directly contacting the circuit board body 4 through the first thermal insulation coating 9, the heat sink is prevented from interfering the normal operation of the electronic components on the circuit board body 4, and a second thermal insulation coating 10 is arranged on the side, close to the circuit board body 4, of the heat absorption cavity 8, so that the heat in the heat absorption cavity 8 is prevented from being conducted to the peripheral outer walls of the circuit board body 4.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the fan belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that modifications and embellishments within the scope of the present disclosure may be made by those skilled in the art without departing from the principles of the present disclosure.
Claims (5)
1. A multilayer printed circuit board, characterized in that: including heat dissipation shell (1), circuit board body (4) and heat extraction subassembly, the inside at heat dissipation shell (1) is installed in circuit board body (4), be provided with heat absorption chamber (8) in heat dissipation shell (1), the inner wall all is provided with installing port (11) around heat dissipation shell (1), install fin (3) in installing port (11), heat absorption chamber (8) and heat extraction subassembly looks adaptation.
2. A multilayer printed circuit board according to claim 1, wherein: the heat exhaust assembly comprises a fan (7), a plurality of heat absorption pipes (2) and a main air pipe (6), one end of the main air pipe (6) is fixedly connected with one end of an air inlet of the fan (7), one end of each heat absorption pipe (2) is fixedly connected with the other end of the main air pipe (6), and the other ends of the heat absorption pipes (2) are arranged inside a heat absorption cavity (8).
3. A multilayer printed circuit board according to claim 2, wherein: and a second heat insulation coating (10) is arranged on the inner wall of one side, close to the mounting opening (11), of the heat absorption cavity (8).
4. A multilayer printed circuit board according to claim 1, wherein: and a first heat insulation coating (5) is arranged on the outer wall of the top of the circuit board body (4).
5. A multilayer printed circuit board according to claim 1, wherein: and a heat-conducting silicone grease layer (9) is arranged on one side, close to the circuit board body (4), of the radiating fin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222039677.9U CN218217792U (en) | 2022-08-04 | 2022-08-04 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222039677.9U CN218217792U (en) | 2022-08-04 | 2022-08-04 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218217792U true CN218217792U (en) | 2023-01-03 |
Family
ID=84653144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222039677.9U Active CN218217792U (en) | 2022-08-04 | 2022-08-04 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218217792U (en) |
-
2022
- 2022-08-04 CN CN202222039677.9U patent/CN218217792U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |