CN215582318U - Novel general integrated circuit board of combination formula - Google Patents

Novel general integrated circuit board of combination formula Download PDF

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Publication number
CN215582318U
CN215582318U CN202122014984.7U CN202122014984U CN215582318U CN 215582318 U CN215582318 U CN 215582318U CN 202122014984 U CN202122014984 U CN 202122014984U CN 215582318 U CN215582318 U CN 215582318U
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China
Prior art keywords
circuit board
panel
integrated circuit
heat dissipation
gomphosis
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Active
Application number
CN202122014984.7U
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Chinese (zh)
Inventor
楼云丹
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Hangzhou Suoqi Electronic Technology Co ltd
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Hangzhou Suoqi Electronic Technology Co ltd
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Priority to CN202122014984.7U priority Critical patent/CN215582318U/en
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Publication of CN215582318U publication Critical patent/CN215582318U/en
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Abstract

The utility model discloses a novel combined type universal integrated circuit board which comprises a circuit panel, wherein a heat dissipation plate is arranged on the surface of the circuit panel, a fixing clamping strip is arranged at the lower end of the heat dissipation plate, an integrally formed structure is formed between the fixing clamping strip and the heat dissipation plate, a fixing base is arranged below the heat dissipation plate, a clamping groove is formed in the surface of the fixing base, the heat dissipation plate is tightly embedded and fixed with the clamping groove through the fixing clamping strip, an embedding block is arranged at the lower end of the fixing base, an embedding groove is formed in the surface of the circuit panel, and the fixing base is tightly embedded and fixed with the embedding groove through the embedding block. The heat dissipation plate module on the circuit board is conveniently assembled and fixed, and the utility model has the advantages of convenient assembly, low installation cost and tight and stable connection, so that the circuit board is compact in overall installation layout and convenient to use.

Description

Novel general integrated circuit board of combination formula
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a novel combined type general integrated circuit board.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board may be referred to as a printed wiring board or a printed circuit board. The FPC board is also called a flexible circuit board, and is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
The current general integrated circuit board has higher assembly cost and unstable structural layout, and can not conveniently and fixedly install the heat dissipation plate assembly, so that the market needs to develop a novel combined general integrated circuit board to solve the existing problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a novel combined type universal integrated circuit board, which aims to solve the problems that the conventional universal integrated circuit board proposed in the background technology is high in assembly cost, not compact and stable in structural layout and cannot be used for conveniently and fixedly installing a heat dissipation plate assembly.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel general integrated circuit board of combination formula, includes circuit panel, circuit panel's surface mounting has the heating panel, and the lower extreme of heating panel is provided with the fixing clip strip, and fixing clip strip and heating panel between be the integrated into one piece formula structure, the below of heating panel is provided with unable adjustment base, and unable adjustment base's surface is provided with the block groove, and the heating panel passes through the fixing clip strip and closely gomphosis in block groove is fixed, the gomphosis piece is installed to unable adjustment base's lower extreme, and circuit panel's surface is provided with the gomphosis groove, and unable adjustment base is fixed through the inseparable gomphosis in gomphosis piece and gomphosis groove.
Preferably, the surface of the circuit panel is provided with a capacitor and a power supply module, and the capacitor and the power supply module are fixed with the circuit panel through spot welding.
Preferably, an integrated circuit module is mounted on the surface of the circuit panel, and a transistor is mounted on one side of the integrated circuit module.
Preferably, the cooling plates are arranged in fifteen, and the cooling plates are distributed in parallel and equidistantly.
Preferably, a chip slot is mounted on the surface of the circuit panel, and the chip slot is located on one side of the heat dissipation plate.
Preferably, the four corners of the surface of the circuit panel are provided with fixing holes.
Compared with the prior art, the utility model has the beneficial effects that:
the surface mounting of circuit panel has the heating panel, the lower extreme of heating panel is provided with the fixing clip strip, the below of heating panel is provided with unable adjustment base, unable adjustment base's surface is provided with the block groove, the heating panel passes through the fixing clip strip and is fixed with the inseparable gomphosis in block groove, the gomphosis piece is installed to unable adjustment base's lower extreme, circuit panel's surface is provided with the gomphosis groove, unable adjustment base is fixed with the inseparable gomphosis in gomphosis groove through the gomphosis piece, through adopting the fixed mode of the mutual gomphosis of fixture block and draw-in groove, it is fixed to carry out the portable equipment to the heating panel module on the circuit board, it is convenient to possess the equipment, the installation cost is low, connect the inseparable stable advantage, make the whole installation layout of circuit board compact, conveniently use.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
FIG. 3 is a schematic view of a heat sink structure according to the present invention;
FIG. 4 is a schematic view of the heat sink mounting and connecting structure of the present invention;
fig. 5 is a side view showing the installation of the heat radiating plate of the present invention.
In the figure: 1. a capacitor; 2. a power supply module; 3. an integrated circuit module; 4. a transistor; 5. a fixing hole; 6. a circuit panel; 7. a chip slot; 8. a heat dissipation plate; 9. a fitting block; 10. a fixed base; 11. a clamping groove; 12. fixing the clamping strip; 13. a fitting groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, an embodiment of the present invention is shown: the utility model provides a novel general integrated circuit board of combination formula, including circuit panel 6, circuit panel 6's surface mounting has heating panel 8, heating panel 8's lower extreme is provided with fixing clip strip 12, fixing clip strip 12 and heating panel 8 between be the integrated into one piece formula structure, heating panel 8's below is provided with unable adjustment base 10, unable adjustment base 10's surface is provided with block groove 11, heating panel 8 is fixed through the inseparable gomphosis of fixing clip strip 12 with block groove 11, gomphosis piece 9 is installed to unable adjustment base 10's lower extreme, circuit panel 6's surface is provided with gomphosis groove 13, unable adjustment base 10 is fixed through the inseparable gomphosis of gomphosis piece 9 with gomphosis groove 13.
Further, the surface of the circuit panel 6 is provided with the capacitor 1 and the power module 2, and both the capacitor 1 and the power module 2 are fixed with the circuit panel 6 by spot welding.
Further, an integrated circuit module 3 is mounted on the surface of the circuit panel 6, and a transistor 4 is mounted on one side of the integrated circuit module 3.
Further, fifteen heat dissipation plates 8 are provided, and the heat dissipation plates 8 are arranged in parallel and equidistantly.
Further, a chip slot 7 is mounted on the surface of the circuit panel 6, and the chip slot 7 is located on one side of the heat dissipation plate 8.
Further, four corners of the surface of the circuit panel 6 are provided with fixing holes 5.
The working principle is as follows: when in use, the surface of the circuit panel 6 is provided with the heat dissipation plate 8, the lower end of the heat dissipation plate 8 is provided with the fixing clamping strip 12, the fixing clamping strip 12 and the heat dissipation plate 8 are in an integrated structure, the lower part of the heat dissipation plate 8 is provided with the fixing base 10, the surface of the fixing base 10 is provided with the clamping groove 11, the heat dissipation plate 8 is tightly embedded and fixed with the clamping groove 11 through the fixing clamping strip 12, the fixing clamping strip 12 is aligned with the clamping groove 11 to slide, the heat dissipation plate 8 and the fixing base 10 can be quickly installed and fixed, the lower end of the fixing base 10 is provided with the embedding block 9, the surface of the circuit panel 6 is provided with the embedding groove 13, the fixing base 10 is tightly embedded and fixed with the embedding groove 13 through the embedding block 9, the embedding block 9 is connected with the embedding groove 13, the quick installation and fixation of the fixing base 10 and the circuit panel 6 are convenient, and the fixing mode that the clamping block and the clamping groove are mutually embedded and fixed is adopted, carry out portable equipment to the heating panel module on the circuit board and fix, possess the equipment convenience, the installation cost is low, connects inseparable stable advantage for circuit board overall installation overall arrangement is compact, conveniently uses.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a novel general integrated circuit board of combination formula, includes circuit panel (6), its characterized in that, the surface mounting of circuit panel (6) has heating panel (8), and the lower extreme of heating panel (8) is provided with fixing clip strip (12), and fixing clip strip (12) and heating panel (8) between as an organic whole formula structure, the below of heating panel (8) is provided with unable adjustment base (10), and the surface of unable adjustment base (10) is provided with block groove (11), and heating panel (8) are fixed through the inseparable gomphosis of fixing clip strip (12) with block groove (11), gomphosis piece (9) are installed to the lower extreme of unable adjustment base (10), and the surface of circuit panel (6) is provided with gomphosis groove (13), and unable adjustment base (10) are fixed through the inseparable gomphosis of gomphosis piece (9) with gomphosis groove (13).
2. A novel modular universal integrated circuit board as claimed in claim 1, wherein: the surface mounting of circuit panel (6) has condenser (1) and power module (2), and condenser (1) and power module (2) are all fixed with circuit panel (6) through spot welding.
3. A novel modular universal integrated circuit board as claimed in claim 1, wherein: the surface of the circuit panel (6) is provided with an integrated circuit module (3), and one side of the integrated circuit module (3) is provided with a transistor (4).
4. A novel modular universal integrated circuit board as claimed in claim 1, wherein: the cooling plates (8) are arranged in fifteen, and the cooling plates (8) are distributed in parallel at equal intervals.
5. A novel modular universal integrated circuit board as claimed in claim 1, wherein: the surface mounting of circuit panel (6) has chip slot (7), and chip slot (7) are located one side of heating panel (8).
6. A novel modular universal integrated circuit board as claimed in claim 1, wherein: four corners of the surface of the circuit panel (6) are provided with fixing holes (5).
CN202122014984.7U 2021-08-25 2021-08-25 Novel general integrated circuit board of combination formula Active CN215582318U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122014984.7U CN215582318U (en) 2021-08-25 2021-08-25 Novel general integrated circuit board of combination formula

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122014984.7U CN215582318U (en) 2021-08-25 2021-08-25 Novel general integrated circuit board of combination formula

Publications (1)

Publication Number Publication Date
CN215582318U true CN215582318U (en) 2022-01-18

Family

ID=79841944

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122014984.7U Active CN215582318U (en) 2021-08-25 2021-08-25 Novel general integrated circuit board of combination formula

Country Status (1)

Country Link
CN (1) CN215582318U (en)

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