CN218071917U - Multilayer HDI circuit board of inlayer interconnection - Google Patents
Multilayer HDI circuit board of inlayer interconnection Download PDFInfo
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- CN218071917U CN218071917U CN202221850102.9U CN202221850102U CN218071917U CN 218071917 U CN218071917 U CN 218071917U CN 202221850102 U CN202221850102 U CN 202221850102U CN 218071917 U CN218071917 U CN 218071917U
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Abstract
The utility model discloses a belong to circuit board technical field, specifically be a multilayer HDI circuit board of inlayer interconnection, including the circuit board body, circuit board body bottom can be dismantled and be connected with circuit board body support shell, first through-hole has been seted up on the circuit board body, the grafting of first through-hole inner wall has the cylindricality pad, cylindricality pad one end is inserted in the first inner chamber of circuit board body support shell, be equipped with the coolant liquid in the circuit board body support shell, the beneficial effects of the utility model are that: utilize the coolant liquid in the circuit board body support shell to dispel the heat to the cylindricality pad to avoided the high temperature, played fine radiating effect, owing to set up integrated into one piece's first heat dissipation wave piece, first cylindricality heat dissipation stick, second heat dissipation wave piece, second cylindricality heat dissipation stick, third heat dissipation wave piece on the cylindricality pad, greatly increased the surface area of cylindricality pad, thereby improved the radiating efficiency.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a multilayer HDI circuit board of inlayer interconnection.
Background
The circuit board has the name: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, printed circuit boards, and the like; HDI is one area of fastest growing development in the printed circuit board industry for High Density Interconnect (HDI) manufacturing. From the first 32-bit computer introduced by hewlett-packard in 1985, to today's large client servers using 36 sequentially laminated multilayer printed boards and stacked micro vias, HDI/micro via technology is undoubtedly a future PCB architecture; larger ASICs and FPGAs with smaller device pitch, more I/O pins and embedded passive devices, with shorter and shorter rise times and higher frequencies, all require smaller PCB feature sizes, which drives a strong demand for HDI/micro vias.
The existing HDI circuit board is poor in heat dissipation effect, when the HDI circuit board is installed in a shell and used, the heat dissipation must be carried out by a fan with large power (namely large size), and the fan can occupy a large amount of shell volumes, so that the size of the shell can be correspondingly enlarged, the cost is increased, and the shell is not convenient to place and transport.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a problem that exists in the multilayer HDI circuit board of a kind of inlayer interconnection has now been provided.
Therefore, the utility model aims at providing a multilayer HDI circuit board of inlayer interconnection has solved current HDI circuit board, and its radiating effect itself is poor, when installing and use in the casing, must dispel the heat with the help of the fan of great power (great size promptly), and the fan can occupy a large amount of casing volumes to make the corresponding meeting grow of volume of casing, when having increased the cost, also make things convenient for the casing to put and the problem of transportation.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a multilayer HDI circuit board with interconnected inner layers comprises a circuit board body, wherein a circuit board body supporting shell is detachably connected to the bottom of the circuit board body, a first through hole is formed in the circuit board body, a cylindrical bonding pad is inserted into the inner wall of the first through hole, one end of the cylindrical bonding pad is inserted into a first inner cavity of the circuit board body supporting shell, and cooling liquid is arranged in the circuit board body supporting shell;
integrated into one piece is equipped with the grafting sleeve on the circuit board body support shell, be equipped with the second cavity on the grafting sleeve, first inner chamber and second cavity are linked together, be equipped with first sealed section of thick bamboo between cylindricality pad and the first through-hole inner wall, be equipped with the sealed section of thick bamboo of second between cylindricality pad and the second cavity inner wall, be equipped with first heat dissipation wave piece on the outer wall of cylindricality pad one end, cylindricality pad bottom is equipped with first cylindricality heat dissipation stick, be equipped with second cylindricality heat dissipation stick and second heat dissipation wave piece on the first cylindricality heat dissipation stick outer wall, be equipped with third heat dissipation wave piece on the second cylindricality heat dissipation stick outer wall.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: the first sealing cylinder and the second sealing cylinder are both made of gel materials or rubber materials.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: and a support ring is integrally formed on the inner wall of the second cavity, and the bottom end of the second sealing cylinder is contacted with the support ring.
As an inner layer interconnected's an optimal selection scheme of multilayer HDI circuit board, wherein: the first heat dissipation wavy sheet and the cylindrical bonding pad are of an integrally formed structure, and the first heat dissipation wavy sheet is formed by cutting the cylindrical bonding pad through a nicking tool.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: first cylindricality heat dissipation stick and cylindricality pad are integrated into one piece structure, second cylindricality heat dissipation stick and first cylindricality heat dissipation stick are integrated into one piece structure.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: the circuit board comprises a circuit board body and is characterized in that a nut groove and a first internal thread hole are formed in the circuit board body, a second internal thread hole is formed in a circuit board body supporting shell, the circuit board body and the circuit board body supporting shell are connected through a bolt, and a nut of the bolt is located in the nut groove.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: the second heat dissipation wave piece and the first cylindrical heat dissipation rod are of an integrated structure, and the second heat dissipation wave piece is formed by cutting the first cylindrical heat dissipation rod through a nicking tool.
As an inner layer interconnected's an optimal selection scheme of multilayer HDI circuit board, wherein: the third heat dissipation wave piece and the second cylindrical heat dissipation rod are of an integrated structure, and the third heat dissipation wave piece is formed by cutting the second cylindrical heat dissipation rod through a graver.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: the circuit board body is provided with a second through hole and a third through hole, the second through hole and the third through hole form an L shape which is communicated, the third through hole is communicated with the first through hole, the first sealing barrel is provided with a fourth through hole, and the fourth through hole is communicated with the third through hole.
As an optimized scheme of multilayer HDI circuit board of inlayer interconnection, wherein: the circuit board body supports the shell both ends and is equipped with the installation piece, seted up the mounting hole on the installation piece.
Compared with the prior art:
1. through the arrangement of the circuit board body supporting shell, the columnar welding disc is radiated by using the cooling liquid in the circuit board body supporting shell, so that the overhigh temperature is avoided, and a good radiating effect is achieved;
2. the first radiating wavy sheet, the first cylindrical radiating rod, the second radiating wavy sheet, the second cylindrical radiating rod and the third radiating wavy sheet which are integrally formed are arranged on the cylindrical bonding pad, so that the surface area of the cylindrical bonding pad is greatly increased, and the radiating efficiency is improved;
3. due to the arrangement of the first sealing cylinder and the second sealing cylinder, cooling liquid in the circuit board body supporting shell cannot leak, and the use is safer and more reliable; and because pass through bolted connection between circuit board body support shell and the circuit board body to easy dismounting between the two, be convenient for later maintenance.
Drawings
Fig. 1 is a schematic structural diagram provided by the present invention;
FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of a first cylindrical heat-dissipating bar according to the present invention;
FIG. 4 is an enlarged view 1 at B in the drawing provided by the present invention;
fig. 5 is an appearance schematic diagram of fig. 1 provided by the present invention.
In the figure: the circuit board body 1, the nut groove 11, the second through hole 12, the third through hole 13, the first sealed cylinder 14, the fourth through hole 141, the first through hole 15, the first internal threaded hole 16, the circuit board body supports the shell 2, the mounting plate 21, the mounting hole 211, the second internal threaded hole 22, the second sealed cylinder 23, the support ring 24, the first inner chamber 25, the plug-in sleeve 26, the second cavity 261, the bolt 3, the nut 31, the cylindrical pad 4, the first heat dissipation wave piece 41, the first cylindrical heat dissipation rod 42, the second heat dissipation wave piece 421, the second cylindrical heat dissipation rod 43, the third heat dissipation wave piece 431.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
The utility model provides a multilayer HDI circuit board of inlayer interconnection please refer to fig. 1-5, including circuit board body 1, circuit board body support shell 2 can be dismantled and connected to circuit board body 1 bottom, has seted up first through-hole 15 on circuit board body 1, and the grafting of first through-hole 15 inner wall has cylindricality pad 4, and the first inner chamber 25 of circuit board body support shell 2 is inserted to cylindricality pad 4 one end, is equipped with the coolant liquid in circuit board body support shell 2, and the coolant liquid selects for use non-conductive liquid, for example glycerine;
an inserting sleeve 26 is integrally formed on the circuit board body supporting shell 2, a second cavity 261 is formed in the inserting sleeve 26, a first inner cavity 25 is communicated with the second cavity 261, a first sealing barrel 14 is arranged between the inner wall of the cylindrical pad 4 and the inner wall of the first through hole 15, a second sealing barrel 23 is arranged between the inner wall of the cylindrical pad 4 and the inner wall of the second cavity 261, the second sealing barrel 23 is used for sealing a gap between the second cavity 261 and the cylindrical pad 4, leakage of cooling liquid in the first inner cavity 25 is avoided, a first heat dissipation wave piece 41 is arranged on the outer wall of one end of the cylindrical pad 4, a first cylindrical heat dissipation rod 42 is arranged at the bottom end of the cylindrical pad 4, a first cylindrical heat dissipation rod 43 and a second heat dissipation wave piece 421 are arranged on the outer wall of the first cylindrical heat dissipation rod 42, a third heat dissipation wave piece 431 is arranged on the outer wall of the second cylindrical heat dissipation rod 43, and the first sealing barrel 14 and the second sealing barrel 23 are both made of gel materials or rubber materials.
A support ring 24 is integrally formed on the inner wall of the second cavity 261, and the bottom end of the second sealing cylinder 23 contacts the support ring 24; the first heat dissipation wavy sheet 41 and the cylindrical pad 4 are integrally formed, and the first heat dissipation wavy sheet 41 is formed by cutting the cylindrical pad 4 by a nicking tool.
The first cylindrical heat dissipation rod 42 and the cylindrical pad 4 are of an integrated structure, and the second cylindrical heat dissipation rod 43 and the first cylindrical heat dissipation rod 42 are of an integrated structure; the second heat dissipation wave plate 421 and the first cylindrical heat dissipation rod 42 are integrally formed, and the second heat dissipation wave plate 421 is formed by cutting the first cylindrical heat dissipation rod 42 by a nicking tool; the third heat dissipation wave piece 431 and the second cylindrical heat dissipation rod 43 are of an integrally formed structure, and the third heat dissipation wave piece 431 is formed by cutting the second cylindrical heat dissipation rod 43 through a graver; under the action of the first heat dissipation wavy sheet 41, the first cylindrical heat dissipation rod 42, the second heat dissipation wavy sheet 421, the second cylindrical heat dissipation rod 43, and the third heat dissipation wavy sheet 431, the surface area of the cylindrical pad 4 is increased, so that heat dissipation is accelerated.
The circuit board body 1 is provided with a second through hole 12 and a third through hole 13, the second through hole 12 and the third through hole 13 form an L shape communicated with each other, the third through hole 13 is communicated with the first through hole 15, the first sealing barrel 14 is provided with a fourth through hole 141, and the fourth through hole 141 is communicated with the third through hole 13.
Circuit board body supports 2 both ends of shell and is equipped with installation piece 21, has seted up mounting hole 211 on the installation piece 21.
When the heat dissipation structure is used specifically, the circuit board body support shell 2 is installed at the bottom of the circuit board body 1 through the first internal thread hole 16 and the second internal thread hole 22 by using the bolt 3, the cylindrical pad 4 is inserted into the first through hole 15 and the second cavity 261, the molten gel is poured into a gap between the cylindrical pad 4 and the inner wall of the second cavity 261 to form the second sealing cylinder 23, the first sealing cylinder 14 is formed in the gap between the cylindrical pad 4 and the inner wall of the first through hole 15, and the fourth through hole 141 is formed in the first sealing cylinder 14, so that the first through hole 12, the third through hole 13 and the fourth through hole 141 are integrally communicated with the first through hole 15, and the cylindrical pad 4 can exchange heat with the outside through the first through hole 12, the third through hole 13 and the fourth through hole 141, thereby achieving a heat dissipation effect; meanwhile, the cylindrical pad 4, the first heat dissipation wavy sheet 41, the first cylindrical heat dissipation rod 42, the second heat dissipation wavy sheet 421, the second cylindrical heat dissipation rod 43 and the third heat dissipation wavy sheet 431 are in the cooling liquid, and heat dissipation is performed by the cooling liquid, so that overhigh temperature is avoided.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. The utility model provides an multilayer HDI circuit board of inlayer interconnection, includes circuit board body (1), its characterized in that: the bottom of the circuit board body (1) is detachably connected with a circuit board body supporting shell (2), a first through hole (15) is formed in the circuit board body (1), a cylindrical bonding pad (4) is inserted into the inner wall of the first through hole (15), one end of the cylindrical bonding pad (4) is inserted into a first inner cavity (25) of the circuit board body supporting shell (2), and cooling liquid is arranged in the circuit board body supporting shell (2);
integrated into one piece is equipped with grafting sleeve (26) on circuit board body support shell (2), be equipped with second cavity (261) on grafting sleeve (26), first inner chamber (25) and second cavity (261) are linked together, be equipped with first sealed section of thick bamboo (14) between cylindricality pad (4) and first through-hole (15) inner wall, be equipped with the sealed section of thick bamboo of second (23) between cylindricality pad (4) and second cavity (261) inner wall, be equipped with first heat dissipation wave piece (41) on cylindricality pad (4) one end outer wall, cylindricality pad (4) bottom is equipped with first cylindricality radiating rod (42), be equipped with on first cylindricality radiating rod (42) outer wall second heat dissipation rod (43) and second heat dissipation wave piece (421), be equipped with third heat dissipation wave piece (431) on second cylindricality radiating rod (43) outer wall.
2. An inner layer interconnected multilayer HDI circuit board according to claim 1, wherein the first sealing cylinder (14) and the second sealing cylinder (23) are both made of gel material or rubber material.
3. An inner layer interconnected multilayer HDI circuit board according to claim 2, characterized in that a support ring (24) is integrally formed on the inner wall of the second cavity (261), and the bottom end of the second sealing cylinder (23) contacts the support ring (24).
4. An inner-layer-interconnected multilayer HDI circuit board according to claim 1, wherein the first heat dissipation wavy sheet (41) and the cylindrical bonding pad (4) are of an integral molding structure, and the first heat dissipation wavy sheet (41) is cut on the cylindrical bonding pad (4) by a nicking tool.
5. An inner layer interconnected multilayer HDI circuit board according to claim 3 or 4, characterized in that the first cylindrical heat dissipation bar (42) and the cylindrical bonding pad (4) are of an integrated structure, and the second cylindrical heat dissipation bar (43) and the first cylindrical heat dissipation bar (42) are of an integrated structure.
6. An inner-layer-interconnected multilayer HDI circuit board according to claim 1, characterized in that a nut groove (11) and a first internal threaded hole (16) are formed in the circuit board body (1), a second internal threaded hole (22) is formed in the circuit board body supporting shell (2), the circuit board body (1) and the circuit board body supporting shell (2) are connected through a bolt (3), and a nut (31) of the bolt (3) is located in the nut groove (11).
7. An inner-layer-interconnected multilayer HDI circuit board according to claim 5, wherein the second heat dissipation wavy sheet (421) is of an integral structure with the first cylindrical heat dissipation rod (42), and the second heat dissipation wavy sheet (421) is formed by cutting on the first cylindrical heat dissipation rod (42) through a nicking tool.
8. An inner-layer-interconnected multilayer HDI circuit board according to claim 1, wherein the third radiating wavy sheet (431) and the second cylindrical radiating rod (43) are of an integrally-molded structure, and the third radiating wavy sheet (431) is cut on the second cylindrical radiating rod (43) by a nicking tool.
9. An inner-layer-interconnected multilayer HDI circuit board according to claim 7, wherein the circuit board body (1) is provided with a second through hole (12) and a third through hole (13), the second through hole (12) and the third through hole (13) form an L shape communicated with each other, the third through hole (13) is communicated with the first through hole (15), the first sealing barrel (14) is provided with a fourth through hole (141), and the fourth through hole (141) is communicated with the third through hole (13).
10. An inner-layer-interconnected multilayer HDI circuit board as claimed in claim 9, wherein, mounting pieces (21) are arranged at two ends of the circuit board body supporting shell (2), and mounting holes (211) are arranged on the mounting pieces (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221850102.9U CN218071917U (en) | 2022-07-18 | 2022-07-18 | Multilayer HDI circuit board of inlayer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221850102.9U CN218071917U (en) | 2022-07-18 | 2022-07-18 | Multilayer HDI circuit board of inlayer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218071917U true CN218071917U (en) | 2022-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221850102.9U Active CN218071917U (en) | 2022-07-18 | 2022-07-18 | Multilayer HDI circuit board of inlayer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218071917U (en) |
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2022
- 2022-07-18 CN CN202221850102.9U patent/CN218071917U/en active Active
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