CN220173612U - Double-sided circuit board with efficient heat dissipation function - Google Patents
Double-sided circuit board with efficient heat dissipation function Download PDFInfo
- Publication number
- CN220173612U CN220173612U CN202321486920.XU CN202321486920U CN220173612U CN 220173612 U CN220173612 U CN 220173612U CN 202321486920 U CN202321486920 U CN 202321486920U CN 220173612 U CN220173612 U CN 220173612U
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- Prior art keywords
- cooling
- frame
- inner cavity
- heat dissipation
- wall
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 62
- 238000002347 injection Methods 0.000 claims abstract description 29
- 239000007924 injection Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 24
- 230000001502 supplementing effect Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 abstract description 18
- 230000000694 effects Effects 0.000 description 5
- 230000005489 elastic deformation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a double-sided circuit board with a high-efficiency heat dissipation function, which relates to the technical field of double-sided circuit boards and comprises a mounting net frame, wherein circuit substrates are arranged at the upper end and the lower end of the mounting net frame, mounting rods are arranged on the inner walls of the two sides of the mounting net frame, a cooling frame is arranged on one side, close to each other, of each mounting rod, a liquid injection component is arranged on one side of an inner cavity of the cooling frame, cooling coils attached to the outer wall of the circuit substrates are arranged at the end positions of the liquid injection component, and second liquid injection pipes extending to the inner cavity of the cooling frame are arranged at the end positions of the two cooling coils. According to the utility model, the liquid injection assembly is started to inject the cooling liquid in the inner cavity of the cooling frame into the inner cavity of the cooling coil pipe and automatically flows back to the inner cavity of the cooling frame through the second liquid injection pipe, the flowing cooling liquid is utilized to take away the heat of electronic components on the circuit substrate, and at the moment, the plurality of groups of fans are started to increase the air flow rate of the inner cavity of the mounting net frame and fully replace the cooling liquid with cold air in the external environment, so that the efficient heat dissipation is facilitated.
Description
Technical Field
The utility model relates to the technical field of double-sided circuit boards, in particular to a double-sided circuit board with an efficient heat dissipation function.
Background
The circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, and is divided into a single panel, a multi-panel and a multi-layer board. The electronic components of the double-sided board can be wired on both sides, so that the defect that the wiring of the single-sided board is difficult can be overcome, and the double-sided board is more suitable for complex circuits with higher and higher integration levels nowadays compared with the single-sided board.
However, the number of electronic components of the dual panel is large, and large heat is generated during operation, so that the temperature in the device is high. Therefore, we propose a double-sided circuit board with efficient heat dissipation function to solve the above mentioned problems.
Disclosure of Invention
This section is intended to outline some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description of the utility model and in the title of the utility model, which may not be used to limit the scope of the utility model.
Therefore, the utility model aims to provide a double-sided circuit board with an efficient heat dissipation function, which can solve the problem that the existing electronic components of a double-sided board can generate larger heat in the working process, so that the temperature in equipment can be high.
The utility model provides a double-sided circuit board with a high-efficiency heat dissipation function, which adopts the following technical scheme:
the utility model provides a two-sided circuit board with high-efficient heat dissipation function, includes the installation screen frame, the upper and lower both ends of installation screen frame all are provided with circuit substrate, the installation pole is all installed to the inner wall of installation screen frame both sides, two sets of the cooling frame is installed to one side that the installation pole is close to each other, annotate liquid subassembly is installed to cooling frame inner chamber one side position, annotate liquid subassembly tip position and all install the cooling coil pipe that laminates mutually with circuit substrate outer wall, two sets of the second annotates liquid pipe that extends to the cooling frame inner chamber is all installed to cooling coil pipe tip position, the supplementary radiating component of water that extends to the cooling frame inner chamber is installed to cooling frame diapire position, the multiunit fan is all installed to the inner wall of installation screen frame both sides.
Through adopting above-mentioned technical scheme, start annotate liquid subassembly and pour into cooling coil's inner chamber into the cooling coil's inner chamber with the coolant liquid of cooling frame inner chamber and in the inner chamber of cooling frame through the automatic backward flow of second notes liquid pipe, take away the heat of electronic components on the circuit substrate with the coolant liquid that flows, start multiunit fan increase the air flow rate of installing the frame inner chamber this moment, can make the hot air of installing the frame inner chamber and the cold air in the external environment fully change under the mesh-like structure effect of installing the frame, be convenient for high-efficient heat dissipation.
Optionally, annotate the liquid subassembly and include miniature notes liquid pump, miniature notes liquid pump is fixed in the inner chamber diapire position of cooling frame, miniature notes liquid pump output is fixed with the first notes liquid pipe that is linked together with cooling coil.
By adopting the technical scheme, the miniature liquid injection pump is started to inject the cooling liquid in the inner cavity of the cooling frame into the inner cavity of the cooling coil pipe through the first liquid injection pipe and automatically flow back into the inner cavity of the cooling frame through the second liquid injection pipe, and the flowing cooling liquid is utilized to take away the heat of electronic components on the circuit substrate.
Optionally, the water auxiliary heat dissipation assembly comprises a metal heat conduction plate, the metal heat conduction plate is fixedly inlaid on the bottom wall of the cooling frame, a plurality of groups of metal heat conduction fins are uniformly fixed on the top wall of the metal heat conduction plate, and a semiconductor refrigerating sheet is fixed on the bottom wall of the metal heat conduction plate.
By adopting the technical scheme, the cold energy generated by starting the electrification of the semiconductor refrigerating sheet is transferred to the cooling liquid in the inner cavity of the cooling frame through the metal heat-conducting plate and the metal heat-conducting fins, so that the cooling effect can be ensured, and meanwhile, the heat generated by the heating surface on the other side of the semiconductor refrigerating sheet can be taken out of the inner cavity of the mounting net frame through the air flow generated by the fan.
Optionally, the fixed liquid pipe that fills that inlays in cooling frame roof position, the outer wall thread bush of liquid pipe is equipped with the lid, lid inner chamber roof position install with liquid pipe assorted sealing washer.
By adopting the technical scheme, a proper amount of cooling liquid is injected into the inner cavity of the cooling frame through the liquid supplementing pipe, and at the moment, the cover body is screwed and the opening at the top of the liquid supplementing pipe is closed by the sealing gasket.
Optionally, the elastic expansion components are all installed to the outer wall of installation screen frame both sides, two sets of circuit substrate are close to one side lateral wall each other and all install the locating frame with elastic expansion component looks block.
Optionally, the elastic expansion assembly includes the vertical pipe, the outer wall intermediate position department at the installation screen frame is fixed to the vertical pipe, the bar hole has been seted up to the outer wall of vertical pipe, the intermediate position department of vertical pipe inner chamber is provided with the spring, the vertical pole that runs through the vertical pipe and match with the locating frame block is all installed at both ends about the spring, the connecting rod that runs through the bar hole is installed to the vertical pole outer wall.
Through adopting above-mentioned technical scheme, inwards press the connecting rod and make it remove in the inner chamber in bar hole and drive the spring shrink and produce elastic deformation, when laminating circuit substrate on the installation screen frame afterwards, loosen the connecting rod, promote vertical pole and the mutual block of locating frame under the elasticity effect of spring voluntarily to can be fixed with connecting the block between circuit substrate and the installation screen frame.
In summary, the present utility model includes at least one of the following beneficial effects:
the first step, the connecting rod is pressed inwards to drive the spring to shrink to generate elastic deformation, then when the circuit substrate is attached to the mounting net frame, the connecting rod is loosened, and the vertical rod and the positioning frame are automatically pushed to be clamped with each other under the action of the elasticity of the spring, so that the circuit substrate and the mounting net frame can be connected, clamped and fixed;
and secondly, starting a miniature liquid injection pump to inject cooling liquid in the inner cavity of the cooling frame into the inner cavity of the cooling coil through the first liquid injection pipe and automatically reflowing the cooling liquid into the inner cavity of the cooling frame through the second liquid injection pipe, taking away heat of electronic components on the circuit substrate by using flowing cooling liquid, starting a plurality of groups of fans to increase the air flow rate of the inner cavity of the mounting net frame, and fully replacing hot air in the inner cavity of the mounting net frame with cold air in the external environment under the action of a mesh-shaped structure of the mounting net frame so as to facilitate efficient heat dissipation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic elevational cross-sectional view of the present utility model;
fig. 2 is a schematic top cross-sectional view of the present utility model.
Reference numerals illustrate: 1. a positioning frame; 2. a bar-shaped hole; 3. a vertical pipe; 4. a vertical rod; 5. a fan; 6. a first liquid injection pipe; 7. a miniature liquid injection pump; 8. a metal heat-conducting plate; 9. a metal heat conducting fin; 10. a semiconductor refrigeration sheet; 11. a second liquid injection pipe; 12. a cooling coil; 13. a connecting rod; 14. a spring; 15. installing a net frame; 16. a circuit substrate; 17. a fluid supplementing pipe; 18. a sealing gasket; 19. a cover body; 20. a cooling frame; 21. and (5) mounting a rod.
Detailed Description
The utility model is described in further detail below with reference to fig. 1-2.
Referring to fig. 1 and 2 of the drawings, one embodiment of the present utility model is provided: the utility model provides a two-sided circuit board with high-efficient heat dissipation function, including installation screen frame 15, the cross section of installation screen frame 15 sets up to the shape of returning, and the upper and lower both ends of installation screen frame 15 all are provided with circuit substrate 16, and installation pole 21 is all installed to the inner wall of installation screen frame 15 both sides, and cooling frame 20 is installed to one side that two sets of installation poles 21 are close to each other, and annotate the liquid subassembly is installed to cooling frame 20 inner chamber one side position, annotates the liquid subassembly and includes miniature annotate liquid pump 7, and miniature annotate liquid pump 7 is fixed in cooling frame 20's inner chamber diapire position.
Referring to fig. 1 and 2 of the drawings, a first liquid injection pipe 6 is fixed at the output end of a micro liquid injection pump 7, cooling coils 12 attached to the outer wall of a circuit substrate 16 are installed at the end positions of the first liquid injection pipe 6, second liquid injection pipes 11 extending to the inner cavity of a cooling frame 20 are installed at the end positions of two groups of cooling coils 12, and a plurality of groups of fans 5 are installed at the inner walls of two sides of an installation screen frame 15.
The miniature liquid injection pump 7 is started to inject the cooling liquid in the inner cavity of the cooling frame 20 into the inner cavity of the cooling coil 12 through the first liquid injection pipe 6 and automatically flow back into the inner cavity of the cooling frame 20 through the second liquid injection pipe 11, the flowing cooling liquid is utilized to take away the heat of electronic components on the circuit substrate 16, at the moment, the air flow rate of the inner cavity of the installation net frame 15 is increased by starting the plurality of groups of fans 5, and the hot air in the inner cavity of the installation net frame 15 and the cold air in the external environment can be fully replaced under the action of the mesh-shaped structure of the installation net frame 15, so that efficient heat dissipation is facilitated.
Referring to fig. 1 and 2 in the drawings of the specification, a water auxiliary heat dissipation component is mounted at the bottom wall of the cooling frame 20, the water auxiliary heat dissipation component comprises a metal heat conduction plate 8, the metal heat conduction plate 8 is fixedly embedded on the bottom wall of the cooling frame 20, a plurality of groups of metal heat conduction fins 9 are uniformly fixed at the top wall of the metal heat conduction plate 8, the longitudinal section of the metal heat conduction fins 9 is in a wave shape, and a semiconductor refrigerating sheet 10 is fixed at the bottom wall of the metal heat conduction plate 8.
The cold energy generated by starting the semiconductor refrigerating sheet 10 to electrify is transferred to the cooling liquid in the inner cavity of the cooling frame 20 through the metal heat conducting plate 8 and the metal heat conducting fins 9, so that the cooling effect can be ensured, and meanwhile, the heat generated by the heating surface on the other side of the semiconductor refrigerating sheet 10 can be taken out of the inner cavity of the installation net frame 15 through the air flow generated by the fan 5.
Referring to fig. 1 and 2 in the drawings, a liquid supplementing pipe 17 is fixedly embedded in the top wall of a cooling frame 20, both the upper end and the lower end of the liquid supplementing pipe 17 are opened, a cover 19 is sleeved on the outer wall of the liquid supplementing pipe 17 in a threaded manner, the bottom of the cover 19 is opened, and a sealing gasket 18 matched with the liquid supplementing pipe 17 is arranged on the top wall of the inner cavity of the cover 19. A proper amount of cooling liquid is injected into the inner cavity of the cooling frame 20 through the liquid supplementing pipe 17, at the moment, the cover 19 is screwed and the opening at the top of the liquid supplementing pipe 17 is closed by the sealing gasket 18.
Please refer to fig. 1 and 2 in the attached drawings of the specification, the elastic telescopic components are all installed on the outer walls of two sides of the installation net frame 15, the elastic telescopic components comprise a vertical pipe 3, the vertical pipe 3 is fixed at the middle position of the outer wall of the installation net frame 15, a strip-shaped hole 2 is formed in the outer wall of the vertical pipe 3, a spring 14 is arranged at the middle position of the inner cavity of the vertical pipe 3, vertical rods 4 penetrating through the vertical pipe 3 are all installed at the upper end and the lower end of the spring 14, connecting rods 13 penetrating through the strip-shaped holes 2 are installed on the outer walls of the vertical rods 4, and positioning frames 1 which are clamped with the vertical rods 4 are all installed on the side walls of two groups of circuit substrates 16 close to each other.
When the circuit substrate 16 is installed, the connecting rod 13 is pressed inwards to move in the inner cavity of the strip-shaped hole 2 and drive the spring 14 to shrink to generate elastic deformation, then when the circuit substrate 16 is attached to the installation screen frame 15, the connecting rod 13 is loosened, and the vertical rod 4 and the positioning frame 1 are automatically pushed to be mutually clamped under the action of the elastic force of the spring 14, so that the circuit substrate 16 and the installation screen frame 15 can be connected and clamped and fixed.
Working principle: when the double-sided circuit board with the efficient heat dissipation function is used, a proper amount of cooling liquid is injected into the inner cavity of the cooling frame 20 through the liquid supplementing pipe 17, at the moment, the cover 19 is screwed, the opening at the top of the liquid supplementing pipe 17 is closed by the sealing gasket 18, two groups of circuit substrates 16 are attached to the upper end and the lower end of the mounting net frame 15, when the circuit substrates 16 are mounted, the connecting rods 13 are firstly pressed inwards to enable the connecting rods to move in the inner cavity of the strip-shaped holes 2 and drive the springs 14 to shrink so as to generate elastic deformation, then when the circuit substrates 16 are attached to the mounting net frame 15, the connecting rods 13 are loosened, the vertical rods 4 are automatically pushed to be mutually clamped with the positioning frame 1 under the elastic force of the springs 14, and therefore the circuit substrates 16 and the mounting net frame 15 can be connected and clamped.
The miniature liquid injection pump 7 is started to inject the cooling liquid in the inner cavity of the cooling frame 20 into the inner cavity of the cooling coil 12 through the first liquid injection pipe 6 and automatically flow back into the inner cavity of the cooling frame 20 through the second liquid injection pipe 11, the flowing cooling liquid is utilized to take away the heat of electronic components on the circuit substrate 16, at the moment, the air flow rate of the inner cavity of the installation net frame 15 is increased by starting the plurality of groups of fans 5, and the hot air in the inner cavity of the installation net frame 15 and the cold air in the external environment can be fully replaced under the action of the mesh-shaped structure of the installation net frame 15, so that efficient heat dissipation is facilitated.
The cold energy generated by starting the semiconductor refrigerating sheet 10 to electrify is transferred to the cooling liquid in the inner cavity of the cooling frame 20 through the metal heat conducting plate 8 and the metal heat conducting fins 9, so that the cooling effect can be ensured, and meanwhile, the heat generated by the heating surface on the other side of the semiconductor refrigerating sheet 10 can be taken out of the inner cavity of the installation net frame 15 through the air flow generated by the fan 5.
The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (6)
1. The utility model provides a two-sided circuit board with high-efficient heat dissipation function, includes installation net frame (15), its characterized in that: the utility model discloses a cooling frame, including installation net frame (15), cooling frame (20), cooling coil (12) that laminates mutually with circuit substrate (16) are all installed at the upper and lower both ends of installation net frame (15), installation pole (21) are all installed to the inner wall of installation net frame (15) both sides, two sets of cooling frame (20) diapire position is installed and is extended to the water auxiliary heat dissipation subassembly in cooling frame (20) inner chamber, multiunit fan (5) are all installed to the inner wall of installation net frame (15) both sides to the cooling coil (12) tip position all install cooling coil (12) that laminates mutually with circuit substrate (16) outer wall, two sets of cooling coil (12) tip position all install second notes liquid pipe (11) that extend to cooling frame (20) inner chamber.
2. The double-sided circuit board with efficient heat dissipation function according to claim 1, wherein: the liquid injection assembly comprises a miniature liquid injection pump (7), the miniature liquid injection pump (7) is fixed at the bottom wall of the inner cavity of the cooling frame (20), and a first liquid injection pipe (6) communicated with the cooling coil pipe (12) is fixed at the output end of the miniature liquid injection pump (7).
3. The double-sided circuit board with efficient heat dissipation function according to claim 1, wherein: the water auxiliary heat dissipation assembly comprises a metal heat conduction plate (8), wherein the metal heat conduction plate (8) is fixedly inlaid on the bottom wall of the cooling frame (20), a plurality of groups of metal heat conduction fins (9) are uniformly fixed on the top wall of the metal heat conduction plate (8), and a semiconductor refrigerating sheet (10) is fixed on the bottom wall of the metal heat conduction plate (8).
4. A double-sided circuit board with efficient heat dissipation as defined in claim 3, wherein: the cooling frame is characterized in that a liquid supplementing pipe (17) is fixedly inlaid at the top wall of the cooling frame (20), a cover body (19) is sleeved on the outer wall of the liquid supplementing pipe (17) in a threaded mode, and a sealing gasket (18) matched with the liquid supplementing pipe (17) is arranged at the top wall of an inner cavity of the cover body (19).
5. The double-sided circuit board with efficient heat dissipation function as defined in claim 4, wherein: elastic telescopic components are mounted on the outer walls of two sides of the mounting net frame (15), and positioning frames (1) clamped with the elastic telescopic components are mounted on the side walls of two groups of circuit substrates (16) close to one side of each other.
6. The dual-sided circuit board with efficient heat dissipation as defined in claim 5, wherein: the elastic telescopic assembly comprises a vertical pipe (3), the vertical pipe (3) is fixed at the middle position of the outer wall of an installation net frame (15), a strip-shaped hole (2) is formed in the outer wall of the vertical pipe (3), a spring (14) is arranged at the middle position of an inner cavity of the vertical pipe (3), vertical rods (4) penetrating through the vertical pipe (3) and matched with the positioning frame (1) in a clamping mode are arranged at the upper end and the lower end of the spring (14), and connecting rods (13) penetrating through the strip-shaped hole (2) are arranged on the outer wall of the vertical rods (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321486920.XU CN220173612U (en) | 2023-06-12 | 2023-06-12 | Double-sided circuit board with efficient heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321486920.XU CN220173612U (en) | 2023-06-12 | 2023-06-12 | Double-sided circuit board with efficient heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220173612U true CN220173612U (en) | 2023-12-12 |
Family
ID=89062336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321486920.XU Active CN220173612U (en) | 2023-06-12 | 2023-06-12 | Double-sided circuit board with efficient heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220173612U (en) |
-
2023
- 2023-06-12 CN CN202321486920.XU patent/CN220173612U/en active Active
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