CN219068465U - Multi-layer circuit board convenient for heat dissipation - Google Patents
Multi-layer circuit board convenient for heat dissipation Download PDFInfo
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- CN219068465U CN219068465U CN202223174734.0U CN202223174734U CN219068465U CN 219068465 U CN219068465 U CN 219068465U CN 202223174734 U CN202223174734 U CN 202223174734U CN 219068465 U CN219068465 U CN 219068465U
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- circuit board
- multilayer circuit
- heat dissipation
- fan
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model provides a multilayer circuit board convenient for heat dissipation, wherein a convenient heat dissipation mechanism is arranged at the top end of a multilayer circuit board main body, and a damping mechanism is arranged at the bottom end of the multilayer circuit board main body. This convenient cooling mechanism, through the louvre, the first backup pad of fan, the fan, fan second support frame, the conducting strip, the setting of threaded rod and telescopic link, at convenient to use cooling mechanism, the staff can rotatory threaded rod, the control threaded rod is at the inside lift of telescopic link, thereby control multilayer circuit board bottom reserved space, the threaded rod is higher then multilayer circuit board bottom reserved space is bigger, the threaded rod is lower then multilayer circuit board bottom reserved space is less, multilayer circuit board top is provided with the louvre, the fan is installed to the bottom of louvre, the wind of fan can dispel the heat multilayer circuit board through the louvre, and the conducting strip has been placed to multilayer circuit board bottom reserved space inside, can assist multilayer circuit board heat dissipation.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board convenient for heat dissipation.
Background
The circuit board refers to a printed circuit board, a printed element or a conductive pattern formed by combining the printed circuit board and the printed element on an insulating material according to a preset design, wherein the multi-layer circuit board is one of the circuit boards, the multi-layer circuit board refers to a medium layer in the middle, wiring layers are arranged on two sides, the multi-layer board is a multi-layer wiring layer, the medium layer can be made to be very thin between every two layers, the multi-layer circuit board is at least provided with three conductive layers, two layers are arranged on the outer surface, the rest one layer is combined in the insulating board, and the electrical connection between the two layers is usually realized through a plated through hole on the cross section of the circuit board, so that the multi-layer circuit board convenient for heat dissipation is particularly needed.
However, when the conventional multilayer circuit board is used, the wiring layers are arranged on both sides of the circuit board, and the multilayer board is just the multilayer wiring layers, so that the multilayer circuit board is operated during working, the workload of a required load is large, the temperature of the circuit board is high, a strong heat dissipation function is required, otherwise, the working efficiency of the multilayer circuit board is low, and the service life of the multilayer circuit board is short.
Disclosure of Invention
The utility model aims to provide a multilayer circuit board convenient for heat dissipation, which solves the problems that in the background technology, as the wiring layers are arranged on two sides of the circuit board and the multilayer board is a multilayer wiring layer, the multilayer circuit board works when in work, the workload of load is large, the temperature of the circuit board is high, and a strong heat dissipation function is required, otherwise, the working efficiency of the multilayer circuit board is low and the service life is short.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a make things convenient for radiating multilayer circuit board, includes multilayer circuit board main part and makes things convenient for heat dissipation mechanism, makes things convenient for heat dissipation mechanism to include louvre, fan first backup pad, fan second support frame, conducting strip, threaded rod, telescopic link and fixed fagging, its characterized in that: the top of multilayer circuit board main part is provided with convenient heat dissipation mechanism, the bottom of multilayer circuit board main part is provided with damper.
Preferably, the convenient heat dissipation mechanism includes louvre, fan first backup pad, fan second support frame, heat conducting strip, threaded rod, telescopic link and fixed fagging, the top of multilayer circuit board main part is provided with the louvre, the bottom of louvre is connected with fan first backup pad, the bottom of fan first backup pad is connected with the fan, the bottom of fan is connected with fan second support frame, the bottom of multilayer circuit board main part is connected with the heat conducting strip, the bottom of multilayer circuit board main part is connected with the threaded rod, the lateral surface of threaded rod is provided with the telescopic link, the bottom of telescopic link is connected with fixed fagging.
Preferably, the heat dissipation holes are welded with the multi-layer circuit board main body, and 2 groups of heat dissipation holes are arranged at the top end of the multi-layer circuit board main body.
Preferably, the heat conducting fin is in screw connection with the multi-layer circuit board main body, and the heat conducting fin is provided with 2 groups at the bottom end of the multi-layer circuit board main body.
Preferably, the threaded rod and the fixed supporting plate form a lifting structure through a telescopic rod, and welding is performed between the threaded rod and the main body of the multilayer circuit board.
Preferably, the damping mechanism comprises damping sponge, damping springs and a supporting plate, the damping sponge is arranged at the bottom end of the multilayer circuit board main body, the damping springs are arranged on the side face of the damping sponge, and the supporting plate is connected with the bottom end of the damping springs.
Preferably, the damping sponge is connected with the multilayer circuit board main body in an adhesion manner, and 2 groups of damping sponge are arranged at the bottom end of the multilayer circuit board main body
Compared with the prior art, the utility model has the beneficial effects that: this convenient cooling mechanism, through the louvre, the first backup pad of fan, the fan, fan second support frame, the conducting strip, the threaded rod, telescopic link and fixed fagging's setting, at convenient to use cooling mechanism, the staff can rotatory threaded rod, the control threaded rod is at the inside lift of telescopic link, thereby control multilayer circuit board bottom reserved space, the threaded rod is higher then multilayer circuit board bottom reserved space is bigger, the threaded rod is lower then multilayer circuit board bottom reserved space is smaller, multilayer circuit board top is provided with the louvre, the fan is installed to the bottom of louvre, the wind of fan can dispel the heat multilayer circuit board through the louvre, and the conducting strip has been placed to multilayer circuit board bottom reserved space inside, can assist multilayer circuit board heat dissipation, thereby accomplish the effect to the convenient heat dissipation of multilayer circuit board main part.
Drawings
FIG. 1 is a schematic view of the overall appearance structure of the present utility model;
FIG. 2 is a schematic view showing the structure of the first support plate of the fan, the fan and the second support frame of the fan according to the present utility model;
FIG. 3 is a schematic view of the structure of the threaded rod, the telescopic rod and the fixed stay plate of the present utility model in cooperation with each other;
FIG. 4 is a schematic view showing the mutual cooperation structure of the damping sponge, the damping spring and the supporting plate.
Reference numerals in the drawings: 1. a multilayer wiring board main body; 2. the heat dissipation mechanism is convenient; 201. a heat radiation hole; 202. a fan first support plate; 203. a fan; 204. a second support frame of the fan; 205. a heat conductive sheet; 206. a threaded rod; 207. a telescopic rod; 208. fixing the supporting plate; 3. a damping mechanism; 301. damping sponge; 302. a damping spring; 303. and a support plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a make things convenient for radiating multilayer circuit board, includes multilayer circuit board main part 1 and makes things convenient for heat dissipation mechanism 2, makes things convenient for heat dissipation mechanism 2 to include louvre 201, fan first backup pad 202, fan 203, fan second support frame 204, conducting strip 205, threaded rod 206, telescopic link 207 and fixed fagging 208, and the top of multilayer circuit board main part 1 is provided with makes things convenient for heat dissipation mechanism 2, and the bottom of multilayer circuit board main part 1 is provided with damper 3.
Further, make things convenient for cooling mechanism 2 to include louvre 201, fan first backup pad 202, fan 203, fan second support frame 204, the conducting strip 205, threaded rod 206, telescopic link 207 and fixed fagging 208, the top of multilayer circuit board main part 1 is provided with louvre 201, the bottom of louvre 201 is connected with fan first backup pad 202, the bottom of fan first backup pad 202 is connected with fan 203, the bottom of fan 203 is connected with fan second support frame 204, the bottom of multilayer circuit board main part 1 is connected with conducting strip 205, the bottom of multilayer circuit board main part 1 is connected with threaded rod 206, the lateral surface of threaded rod 206 is provided with telescopic link 207, the bottom of telescopic link 207 is connected with fixed fagging 208, at convenient to use cooling mechanism 2, the staff can rotate threaded rod 206, control threaded rod 207 is at the inside lift of telescopic link 207, thereby control multilayer circuit board bottom space reservation, the higher then multilayer circuit board bottom space reservation is big, the lower then multilayer circuit board bottom space reservation is little, the multilayer circuit board top is provided with louvre 201, the bottom of louvre 201 is installed to the bottom of fan 203, the fan 203 can be installed through the fan 203, can carry out the effect of multilayer circuit board inside the multilayer circuit board, can be placed to the inside the multilayer circuit board, the effect of multilayer circuit board can be accomplished, and the multilayer circuit board can be cooled down by the inside the effect of the multilayer circuit board, cooling is convenient.
Further, the heat dissipation holes 201 are welded to the multilayer circuit board body 1, and the heat dissipation holes 201 are arranged in 2 groups at the top end of the multilayer circuit board body 1, so that heat dissipation of the multilayer circuit board body 1 can be enhanced.
Further, the heat conducting fin 205 is in screw connection with the multilayer circuit board body 1, and the heat conducting fin 205 is provided with 2 groups at the bottom end of the multilayer circuit board body 1 to assist in heat dissipation of the multilayer circuit board body 1.
Further, the threaded rod 206 forms a lifting structure with the fixed supporting plate 208 through the telescopic rod 207, and the reserved space at the bottom of the multi-layer circuit board main body 1 can be adjusted for welding between the threaded rod 206 and the multi-layer circuit board main body 1, so that air circulation is enhanced.
Further, the damping mechanism 3 includes a damping sponge 301, a damping spring 302 and a supporting plate 303, the damping sponge 301 is arranged at the bottom end of the multilayer circuit board main body 1, the damping spring 302 is arranged on the side face of the damping sponge 301, the supporting plate 303 is connected to the bottom end of the damping spring 302, and when the multilayer circuit board is used, stability of the multi-layer circuit board can be enhanced through the damping sponge 301 and the damping spring 302.
Further, be the adhesion between shock attenuation sponge 301 and the multilayer circuit board main part 1 and be connected, shock attenuation sponge 301 is provided with 2 groups in the bottom of multilayer circuit board main part 1, reinforcing stability.
Working principle: when the multilayer circuit board is needed, firstly, the multilayer circuit board main body 1 is moved to a required position, a first step of staff can rotate the threaded rod 206, the threaded rod 207 is controlled to lift inside the telescopic rod 207, therefore, the reserved space at the bottom end of the multilayer circuit board is controlled, the reserved space at the bottom end of the multilayer circuit board is larger when the threaded rod 207 is higher, the reserved space at the bottom end of the multilayer circuit board is smaller when the threaded rod 206 is lower, the top end of the multilayer circuit board is provided with the heat dissipation holes 201, the bottom end of the heat dissipation holes 201 is provided with the fans 203, the heat of the fans 203 can be dissipated through the heat dissipation holes 201, the heat conducting fins 205 are placed inside the reserved space at the bottom end of the multilayer circuit board, the heat dissipation of the multilayer circuit board can be assisted, and the stability of the multi-channel circuit board can be enhanced through the damping sponge 301 and the damping springs 302, so that the use process of the multilayer circuit board convenient to dissipate heat is completed.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a make things convenient for radiating multilayer circuit board, includes multilayer circuit board main part (1) and makes things convenient for heat dissipation mechanism (2), makes things convenient for heat dissipation mechanism (2) to include louvre (201), fan first backup pad (202), fan (203), fan second support frame (204), conducting strip (205), threaded rod (206), telescopic link (207) and fixed fagging (208), its characterized in that: the top of multilayer circuit board main part (1) is provided with convenient heat dissipation mechanism (2), the bottom of multilayer circuit board main part (1) is provided with damper (3).
2. The multi-layer circuit board convenient for heat dissipation according to claim 1, wherein the convenient heat dissipation mechanism (2) comprises a heat dissipation hole (201), a fan first support plate (202), a fan (203), a fan second support frame (204), a heat conducting sheet (205), a threaded rod (206), a telescopic rod (207) and a fixed support plate (208), the top end of the multi-layer circuit board main body (1) is provided with the heat dissipation hole (201), the bottom end of the heat dissipation hole (201) is connected with the fan first support plate (202), the bottom end of the fan first support plate (202) is connected with the fan (203), the bottom end of the fan (203) is connected with the fan second support frame (204), the bottom end of the multi-layer circuit board main body (1) is connected with the heat conducting sheet (205), the bottom end of the multi-layer circuit board main body (1) is connected with the threaded rod (206), the outer side surface of the threaded rod (206) is provided with the telescopic rod (207), and the bottom end of the telescopic rod (207) is connected with the fixed support plate (208).
3. The multi-layer circuit board with convenient heat dissipation according to claim 2, wherein the heat dissipation holes (201) are welded with the multi-layer circuit board main body (1), and the heat dissipation holes (201) are arranged at 2 groups at the top end of the multi-layer circuit board main body (1).
4. The multilayer circuit board convenient for heat dissipation according to claim 2, wherein the heat conducting fin (205) is in screw connection with the multilayer circuit board main body (1), and the heat conducting fin (205) is provided with 2 groups at the bottom end of the multilayer circuit board main body (1).
5. The multi-layer circuit board with convenient heat dissipation according to claim 2, wherein the threaded rod (206) and the fixed supporting plate (208) form a lifting structure through the telescopic rod (207), and welding is performed between the threaded rod (206) and the multi-layer circuit board main body (1).
6. The multilayer circuit board convenient for heat dissipation according to claim 1, wherein the damping mechanism (3) comprises a damping sponge (301), a damping spring (302) and a supporting plate (303), the damping sponge (301) is arranged at the bottom end of the multilayer circuit board main body (1), the damping spring (302) is arranged on the side face of the damping sponge (301), and the supporting plate (303) is connected to the bottom end of the damping spring (302).
7. The multilayer circuit board convenient for heat dissipation according to claim 6, wherein the damping sponge (301) is in adhesion connection with the multilayer circuit board main body (1), and the damping sponge (301) is provided with 2 groups at the bottom end of the multilayer circuit board main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223174734.0U CN219068465U (en) | 2022-11-29 | 2022-11-29 | Multi-layer circuit board convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223174734.0U CN219068465U (en) | 2022-11-29 | 2022-11-29 | Multi-layer circuit board convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219068465U true CN219068465U (en) | 2023-05-23 |
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ID=86342357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223174734.0U Active CN219068465U (en) | 2022-11-29 | 2022-11-29 | Multi-layer circuit board convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219068465U (en) |
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2022
- 2022-11-29 CN CN202223174734.0U patent/CN219068465U/en active Active
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