CN213368215U - Multilayer printed circuit board capable of quickly radiating heat - Google Patents

Multilayer printed circuit board capable of quickly radiating heat Download PDF

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Publication number
CN213368215U
CN213368215U CN202022446392.8U CN202022446392U CN213368215U CN 213368215 U CN213368215 U CN 213368215U CN 202022446392 U CN202022446392 U CN 202022446392U CN 213368215 U CN213368215 U CN 213368215U
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China
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fixedly connected
plate
multilayer printed
board capable
printed wiring
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CN202022446392.8U
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Chinese (zh)
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马浩力
黄晓萍
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Shenzhen Hongchuan Technology Co ltd
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Shenzhen Hongchuan Technology Co ltd
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Abstract

The utility model belongs to the technical field of multilayer printed circuit boards, and discloses a multilayer printed circuit board capable of quickly dissipating heat, which comprises an inner layer, wherein an upper layer is arranged above the inner layer, a power supply layer is arranged above the upper layer, one end of the power supply layer, which is far away from the upper layer, is fixedly connected with an upper layer plate, the top of the upper layer plate is provided with an element surface, and the surface of the element surface is provided with a through hole, the quality of work is improved.

Description

Multilayer printed circuit board capable of quickly radiating heat
Technical Field
The utility model belongs to the technical field of the multilayer printed wiring board, concretely relates to multilayer printed wiring board that can dispel the heat fast.
Background
The printed circuit board is also called as a printed circuit board, is a provider for electrical connection of electronic components, can be divided into single-layer boards, double-layer boards, four-layer boards, six-layer and half-layer boards and other multilayer boards according to the number of layers of the circuit boards, has the advantages of high assembly density, small volume and light weight, reduces connecting wires among components, improves reliability, and has the defects of high manufacturing cost, long production period and high reliability detection means.
The existing multilayer printed circuit board is relatively strong in working performance, connection work needing to be carried out in a circuit is relatively complex, the phenomenon of heating can often occur, the circuit board can not work normally if heat dissipation treatment is not carried out timely, and damage is easily caused to a board body in the daily working process of installing and disassembling the heat dissipation board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer printed wiring board that can dispel heat fast to solve current multilayer printed wiring board and lead to the problem that inside temperature rose and do not set up corresponding buffering protection device in multilayer printed wiring board plate body outside because of long-time work in the course of the work that carries out electrical connection to electronic components.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a multilayer printed wiring board that can dispel heat fast, includes the inlayer, the top position on inlayer is provided with the upper strata, the top position on upper strata is provided with the power plane, the one end fixedly connected with upper strata on upper strata is kept away from to the power plane, the top of upper strata is provided with the component face, the through-hole has been seted up on the surface of component face.
Preferably, a lower layer is arranged below the inner layer, a lower layer plate is fixedly connected to the bottom of the lower layer, and a bottom plate is fixedly connected to one end, far away from the lower layer, of the lower layer plate.
Preferably, a connecting seat is fixedly connected to one side of the outer portion of the bottom plate in a horizontal position, a supporting rod is fixedly connected to the bottom of the connecting seat, and a protection device is fixedly connected to one end, far away from the connecting seat, of the supporting rod.
Preferably, the protection device comprises a spring seat, a telescopic rod is fixedly connected to the upper portion of the spring seat, one end, far away from the spring seat, of the telescopic rod is fixedly connected to the bottom of the supporting rod, a spring is arranged outside the telescopic rod, and one end, far away from the telescopic rod, of the spring seat is fixedly connected with a base.
Preferably, a vertical rod is fixedly connected to the bottom of the bottom plate in the vertical direction, and a loading and unloading mechanism is arranged at one end of the vertical rod, which is far away from the bottom plate.
Preferably, the loading and unloading mechanism includes the upper plate, the top fixed connection of upper plate is in the bottom of montant, the below position of upper plate is connected with the axis of rotation, the one end that the upper plate was kept away from in the axis of rotation is connected with the hypoplastron, the outside horizontal direction fixedly connected with limiting plate in one side of the axis body of axis of rotation, the top fixedly connected with rubber pad of limiting plate, be provided with the conducting strip between rubber pad and the bottom plate.
Compared with the prior art, the utility model, following beneficial effect has:
(1) the utility model discloses set up the conducting strip, what the conducting strip adopted is the graphite flake, is a heat-conducting medium, set up the graphite flake and laminate in the circuit board bottom, utilize the stronger heat conductivility of graphite flake to evacuate the circuit board at the heat that the during operation produced, reach multilayer printed wiring board can quick radiating purpose at work, guaranteed that the circuit board carries out circuit connection's normal work to each electronic components, prevented because of the circuit problem that the high temperature leads to, improved the quality of work.
(2) The utility model discloses set up loading and unloading mechanism, thereby utilize loading and unloading mechanism can be fine to inject the work with the conducting strip for the position of circuit board bottom plate and make the conducting strip can utilize the characteristics of self to carry out the work of dispelling the heat to the circuit board, utilize loading and unloading mechanism can also be comparatively convenient adorn tightly and dismantle the work to the heat-conducting plate, made things convenient for the change work to the conducting strip.
(3) The utility model discloses set up protection device, thereby be provided with protection device in the below of multilayer circuit board plate body and carry out certain protection to the plate body at the in-process that dismantles the installation and remove multilayer printed wiring board, thereby utilize the spring of the inside setting of protection device can provide certain elasticity and shock attenuation effect for the plate body and alleviate the impact that comes from external force that the plate body received, provide the protection for the circuit board.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the internal structure of the plate body of the present invention;
fig. 3 is a top view of the plate body of the present invention;
FIG. 4 is a schematic structural view of the loading and unloading mechanism of the present invention;
FIG. 5 is an enlarged view taken at A in FIG. 1;
in the figure: 1. an inner layer; 2. an upper layer; 3. a power layer; 4. an upper plate; 5. an element surface; 6. a through hole; 7. a lower layer; 8. a lower layer plate; 9. a base plate; 90. a connecting seat; 10. a support bar; 11. a base; 12. A protection device; 120. a spring seat; 121. a telescopic rod; 122. a spring; 13. a vertical rod; 14. a loading and unloading mechanism; 140. an upper plate; 141. a lower plate; 142. a rotating shaft; 143. a limiting plate; 15. a rubber pad; 16. A heat conductive sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a multilayer printed wiring board that can dispel heat fast, including inlayer 1, the top position of inlayer 1 is provided with upper strata 2, the top position of upper strata 2 is provided with power layer 3, thereby power layer 3 takes place to be connected with outside line and makes the printed board can play in the circuit and connect each electrical components and carry out circuit transmission work, power layer 3 keeps away from upper strata 2's one end fixedly connected with upper plate 4, upper plate 4 has played certain guard action to upper strata 2, the top of upper plate 4 is provided with component face 5, through-hole 6 has been seted up on component face 5's surface, the inside metal copper layer that is provided with of through-hole 6, in order to accomplish the work of switching on between the layer circuit, form the through-hole circuit.
Further, the lower position of inlayer 1 is provided with lower floor 7, and lower floor 8 is connected with to the bottom fixedly of lower floor 7, and lower floor 8 has played certain guard action to lower floor 7, and lower floor 8 keeps away from the one end fixedly connected with bottom plate 9 of lower floor 7.
Furthermore, the horizontal position fixedly connected with connecting seat 90 of outside one side of bottom plate 9, connecting seat 90 are provided with two altogether, and two connecting seats 90 set up along the vertical central line symmetry of bottom plate 9, and the bottom fixedly connected with bracing piece 10 of connecting seat 90, one end fixedly connected with protection device 12 that connecting seat 90 was kept away from to bracing piece 10.
Specifically, protection device 12 includes spring holder 120, top fixedly connected with telescopic link 121 of spring holder 120, telescopic link 121 can take place to shorten the change of state under the effect that receives the external force, one end fixed connection in bracing piece 10 bottom that spring holder 120 was kept away from to telescopic link 121, the outside of telescopic link 121 is provided with spring 122, spring 122's bottom fixed connection in spring holder 120, top fixed connection is in bracing piece 10, spring 122 can cooperate telescopic link 121 telescopic state to change the elasticity that produces and provide certain shock attenuation and cushioning effect for the printing plate body of top, one end fixedly connected with base 11 of telescopic link 121 is kept away from to spring holder 120, base 11 is through protection device 12 and bracing piece 10 and bottom plate 9 looks fixed connection.
It is worth to be noted that two vertical rods 13 are fixedly connected to the bottom of the bottom plate 9 in the vertical direction, the two vertical rods 13 are symmetrically arranged along the vertical center line of the bottom plate 9, a mounting and dismounting mechanism 14 is arranged at one end of each vertical rod 13 far away from the bottom plate 9, the two mounting and dismounting mechanisms 14 are also arranged, and position limitation is performed on the two ends of the heat conducting fins 16.
Further, loading and unloading mechanism 14 includes upper plate 140, upper plate 140's top fixed connection is in the bottom of montant 13, upper plate 140's below position is connected with axis of rotation 142, the one end that axis of rotation 142 kept away from upper plate 140 is connected with hypoplastron 141, the outside one side horizontal direction fixedly connected with limiting plate 143 of axis of rotation 142, thereby limiting plate 143 can take place the rotation of certain angle in the plane through axis of rotation 142 and accomplish the dismouting work to conducting strip 16, limiting plate 143's top fixedly connected with rubber pad 15, rubber pad 15 provides certain protection for limiting plate 143 and conducting strip 16's contact, be provided with conducting strip 16 between rubber pad 15 and the bottom plate 9, what conducting strip 16 adopted is the synthetic graphite flake of manual work, be through the graphite combined material of a series of chemical treatment, have splendid radiating effect, and do not have the stickness, convenient dismantlement and change.
The utility model discloses a theory of operation and use flow: when using the utility model discloses a, at first paste tight the connection with conducting strip 16 and circuit board bottom plate 9 through handling structure 14, laminate the top of conducting strip 16 in the bottom of bottom plate 9, utilize the rotation of the inside axis of rotation 142 of handling structure 14 to connect and make limiting plate 143 drive the rubber pad 15 of its top rotate to the bottom position of conducting strip 16, thereby prescribe a limit to make its both closely laminate to make things convenient for the radiating work to the circuit board of conducting strip for the position of bottom plate 9 through limiting plate 143, when needing to change conducting strip 16 after working a certain time, utilize axis of rotation 142 to make limiting plate 143 take place to rotate equally, thereby take place the skew with the bottom of conducting strip 16 and relieve the laminating between conducting strip 16 and the bottom plate 9 and be connected can, in-process of installing the dismantlement or removal to daily printing board, protection device 12 can provide certain shock attenuation and cushioning effect for the printing board of top and carry out corresponding guarantor guarantee to the printing board And (4) protecting.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A multilayer printed wiring board capable of dissipating heat rapidly comprises an inner layer (1), and is characterized in that: the upper position of inlayer (1) is provided with upper strata (2), the top position of upper strata (2) is provided with power supply layer (3), the one end fixedly connected with upper plate (4) of upper strata (2) are kept away from in power supply layer (3), the top of upper plate (4) is provided with component face (5), through-hole (6) have been seted up on the surface of component face (5).
2. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 1, wherein: the lower position of inlayer (1) is provided with lower floor (7), bottom fixedly connected with lower plywood (8) of lower floor (7), one end fixedly connected with bottom plate (9) of lower floor (7) are kept away from in lower plywood (8).
3. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 2, wherein: the connecting base is fixedly connected to one side of the outer portion of the bottom plate (9) in the horizontal position, a connecting base (90) is fixedly connected to the bottom of the connecting base (90), a supporting rod (10) is fixedly connected to the bottom of the connecting base (90), and a protection device (12) is fixedly connected to one end, far away from the connecting base (90), of the supporting rod (10).
4. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 3, wherein: the protection device (12) comprises a spring seat (120), a telescopic rod (121) is fixedly connected to the upper portion of the spring seat (120), one end, far away from the spring seat (120), of the telescopic rod (121) is fixedly connected to the bottom of the supporting rod (10), a spring (122) is arranged outside the telescopic rod (121), and one end, far away from the telescopic rod (121), of the spring seat (120) is fixedly connected with a base (11).
5. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 2, wherein: the bottom of the bottom plate (9) is fixedly connected with a vertical rod (13) in the vertical direction, and one end, far away from the bottom plate (9), of the vertical rod (13) is provided with a loading and unloading mechanism (14).
6. The multilayer printed wiring board capable of dissipating heat rapidly according to claim 5, wherein: the loading and unloading mechanism (14) comprises an upper plate (140), the top of the upper plate (140) is fixedly connected to the bottom of a vertical rod (13), a rotating shaft (142) is connected to the position below the upper plate (140), one end, away from the upper plate (140), of the rotating shaft (142) is connected with a lower plate (141), a limiting plate (143) is fixedly connected to the horizontal direction of one side of the outer portion of a shaft body of the rotating shaft (142), a rubber pad (15) is fixedly connected to the top of the limiting plate (143), and a heat-conducting fin (16) is arranged between the rubber pad (15) and a bottom plate (9).
CN202022446392.8U 2020-10-29 2020-10-29 Multilayer printed circuit board capable of quickly radiating heat Active CN213368215U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022446392.8U CN213368215U (en) 2020-10-29 2020-10-29 Multilayer printed circuit board capable of quickly radiating heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022446392.8U CN213368215U (en) 2020-10-29 2020-10-29 Multilayer printed circuit board capable of quickly radiating heat

Publications (1)

Publication Number Publication Date
CN213368215U true CN213368215U (en) 2021-06-04

Family

ID=76133289

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022446392.8U Active CN213368215U (en) 2020-10-29 2020-10-29 Multilayer printed circuit board capable of quickly radiating heat

Country Status (1)

Country Link
CN (1) CN213368215U (en)

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