CN216982197U - Anti-interference multilayer circuit board for communication - Google Patents
Anti-interference multilayer circuit board for communication Download PDFInfo
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- CN216982197U CN216982197U CN202220436369.7U CN202220436369U CN216982197U CN 216982197 U CN216982197 U CN 216982197U CN 202220436369 U CN202220436369 U CN 202220436369U CN 216982197 U CN216982197 U CN 216982197U
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- circuit board
- multilayer circuit
- fixedly connected
- interference
- threaded rod
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Abstract
The application belongs to the technical field of circuit boards, and discloses an anti-interference multilayer circuit board for communication, which comprises a multilayer circuit board, wherein a through hole is formed in the upper surface of the multilayer circuit board, a heat dissipation aluminum sheet is fixedly connected to the lower surface of the multilayer circuit board, a threaded rod penetrates through the inner part of the through hole in a movable manner, anti-falling blocks are fixedly connected to the outer surfaces of the top end and the bottom end of the threaded rod, a threaded ring is connected to the outer surface of the threaded rod between each anti-falling block and the multilayer circuit board in a threaded manner, an upper spring is fixedly connected to one side, away from the upper surface of the multilayer circuit board, of each anti-falling block, a top plate is fixedly connected to one end, away from the anti-falling blocks, of each upper spring, a through groove is formed in the upper surface of the top plate, a fan is arranged on the inner wall of each through groove, a lower spring is fixedly connected to one side, away from the lower surface of the multilayer circuit board, and a bottom plate is fixedly connected to one end, away from the anti-falling blocks, of each lower spring; the structure can accelerate the heat dissipation speed of the multilayer circuit board, thereby improving the heat dissipation effect of the multilayer circuit board.
Description
Technical Field
The application belongs to the technical field of circuit boards, and particularly relates to an anti-interference multilayer circuit board for communication.
Background
High-tech products all need "brain" to command the operation when using, and the operation on the circuit board need be loaded to "brain" of these high-tech products, in order to make the more smooth of high-tech product operation, needs the good multilayer circuit board of radiating effect.
Most circuit boards on the market at present are simple in structure, heat dissipation is conducted on the circuit boards through the heat dissipation holes, the heat dissipation mode is single, and the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
The purpose of this application lies in: in order to improve the heat dissipation effect of the multilayer circuit board, the anti-interference multilayer circuit board for communication is provided.
The technical scheme adopted by the application is as follows: an anti-interference multilayer circuit board for communication comprises a multilayer circuit board, wherein the upper surface of the multilayer circuit board is provided with a through hole, the lower surface of the multilayer circuit board is fixedly connected with a heat dissipation aluminum sheet, a threaded rod movably penetrates through the inner part of the through hole, the outer surfaces of the top end and the bottom end of the threaded rod are fixedly connected with anti-drop blocks, the outer surface of the threaded rod between the anti-drop blocks and the multilayer circuit board is in threaded connection with threaded rings, one side of the anti-falling block, which is far away from the upper surface of the multilayer circuit board, is fixedly connected with an upper spring, one end of the upper spring, which is far away from the anti-falling block, is fixedly connected with a top plate, the upper surface of roof has seted up logical groove, the inner wall that leads to the groove is provided with the fan, the anticreep piece is kept away from one side fixedly connected with lower spring of multilayer circuit board lower surface, the lower spring is kept away from the one end fixedly connected with bottom plate of anticreep piece.
Through adopting above-mentioned technical scheme, the start-up fan can form the one-way air current of downstream, the one-way air current of downstream can dispel the higher air of gathering at multilayer circuit board upper surface temperature, the higher damage to multilayer circuit board that causes of air temperature of avoiding multilayer circuit board top, the heat that multilayer circuit board lower surface produced simultaneously can transmit on the radiating aluminum sheet, and a plurality of radiating aluminum sheet can increase multilayer circuit board's heat radiating area, can accelerate the radiating rate to multilayer circuit board through above structure, thereby improve the radiating effect to multilayer circuit board.
Optionally, the multilayer circuit board includes a circuit board body, the upper surface and the lower surface of the circuit board body are provided with anti-interference films, and one side of the anti-interference film far away from the circuit board body is provided with an anti-oxidation layer.
Optionally, the thickness of the anti-interference film is 0.01mm to 0.07mm, and the thickness of the anti-oxidation layer is 0.013mm to 0.0122 mm.
By adopting the technical scheme, the anti-interference film can prevent electromagnetic interference between an electronic system and electronic equipment, electromagnetic radiation pollution is prevented, and copper can be prevented from being exposed in air and being oxidized by virtue of the verdigris formed by the anti-oxidation layer.
Optionally, the upper surface of the bottom plate is provided with a fixing hole, and the lower surface of the bottom plate is bonded with a rubber pad.
Through adopting above-mentioned technical scheme, utilize the bolt to run through the hole groove on fixed orifices and the equipment shell and can fix the bottom plate, the rubber pad can play the cushioning effect to the bottom plate.
Optionally, a rubber ring is bonded to one side of the threaded ring close to the multilayer circuit board.
Through adopting above-mentioned technical scheme, two screw rings move on the surface of threaded rod through rotatory about to carry out the centre gripping to multilayer circuit board, and the rubber circle that screw ring and multilayer circuit board laminating department set up can prevent that the screw ring from excessively extrudeing multilayer circuit board and causing the destruction.
Optionally, the input end of the fan is electrically connected to an external power supply.
By adopting the technical scheme, the external power supply can provide electric energy for the starting of the fan.
In conclusion, due to the adoption of the technical scheme, the beneficial effects of the application are as follows:
1. in this application, the start-up fan can form the one-way air current of downstream, the one-way air current of downstream can dispel the higher air of gathering at multilayer circuit board upper surface temperature, the higher damage to multilayer circuit board that causes of air temperature of avoiding multilayer circuit board top, the heat that multilayer circuit board lower surface produced simultaneously can transmit on the radiating aluminum sheet, and a plurality of radiating aluminum sheet can increase multilayer circuit board's heat radiating area, can accelerate the radiating rate to multilayer circuit board through above structure, thereby improve the radiating effect to multilayer circuit board.
2. In this application, the cooperation that utilizes anticreep piece, upper spring and roof can cushion the impact force that comes from multilayer circuit board top, and the cooperation of anticreep piece, lower spring and bottom plate can cushion the impact force that comes from multilayer circuit board below simultaneously to improve the antidetonation resistance to compression effect to multilayer circuit board.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
FIG. 2 is a perspective view of the present invention;
fig. 3 is a perspective view of the circuit board body according to the present invention.
The labels in the figure are: 1-multilayer circuit board, 101-circuit board body, 102-anti-interference film, 103-oxidation-resistant layer, 2-through hole, 3-threaded rod, 4-anti-drop block, 5-threaded ring, 6-upper spring, 7-bottom plate, 8-fixing hole, 9-top plate, 10-through groove, 11-fan, 12-radiating aluminum sheet and 13-lower spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
A detailed description will be given below of a multilayer circuit board for interference-free communication according to an embodiment of the present application with reference to fig. 1 to 3.
Example (b):
the embodiment of the application discloses anti-interference multilayer circuit board for communication. Referring to fig. 1 and 2, an anti-interference multilayer circuit board for communication comprises a multilayer circuit board 1, wherein a through hole 2 is formed in the upper surface of the multilayer circuit board 1, a threaded rod 3 is movably inserted into the through hole 2, and the multilayer circuit board 1 can move up and down on the outer surface of the threaded rod 3 through the through hole 2 so as to adjust the multilayer circuit board 1 to a proper height; the outer surfaces of the top end and the bottom end of the threaded rod 3 are fixedly connected with anti-falling blocks 4, the outer surface of the threaded rod 3 between the anti-falling blocks 4 and the multilayer circuit board 1 is in threaded connection with threaded rings 5, and the threaded rings 5 can move up on the outer surface of the threaded rod 3 by rotating the upper threaded ring and the lower threaded ring so as to clamp the multilayer circuit board 1; one side of the threaded ring 5 close to the multilayer circuit board 1 is bonded with a rubber ring, and the rubber ring can prevent the threaded ring 5 from excessively extruding the multilayer circuit board 1 to cause damage.
The multilayer circuit board 1 comprises a circuit board body 101, wherein anti-interference films 102 are arranged on the upper surface and the lower surface of the circuit board body 101, the thickness of each anti-interference film 102 is 0.01mm-0.07mm, and each anti-interference film 102 is an electromagnetic shielding film made of a material with conductivity, so that electromagnetic interference between an electronic system and electronic equipment can be prevented, and electromagnetic radiation pollution can be prevented; an anti-oxidation layer 103 is arranged on one side surface of the anti-interference film 102, which is far away from the circuit board body 101, the thickness of the anti-oxidation layer 103 is 0.013mm-0.0122mm, the anti-oxidation layer 103 is copper with a thin layer of metal tin plated on the surface, and the tin plating can form verdigris to prevent the copper from being exposed in air and being oxidized.
One side of the anti-falling block 4, which is far away from the upper surface of the multilayer circuit board 1, is fixedly connected with an upper spring 6, one end of the upper spring 6, which is far away from the anti-falling block 4, is fixedly connected with a top plate 9, and when the top plate 9 receives impact force from the upper part of the multilayer circuit board 1, the elasticity of the upper spring 6 can buffer the impact force by taking the anti-falling block 4 as a supporting point, so that the multilayer circuit board 1 is prevented from being directly damaged by the impact force; one side fixedly connected with lower spring 13 of anticreep piece 4 away from multilayer circuit board 1 lower surface, one end fixedly connected with bottom plate 7 of anticreep piece 4 is kept away from to lower spring 13, fixed orifices 8 have been seted up to the upper surface of bottom plate 7, the lower surface of bottom plate 7 bonds and has the rubber pad, when bottom plate 7 received the impact force that comes from multilayer circuit board 1 below, the elasticity of lower spring 13 can use anticreep piece 4 to cushion the impact force as the support point to the improvement is to multilayer circuit board 1's antidetonation resistance to compression effect.
The upper surface of the top plate 9 is provided with a through groove 10, the inner wall of the through groove 10 is provided with a fan 11, the input end of the fan 11 is electrically connected with an external power supply, the fan 11 is started to form a one-way airflow moving downwards in the through groove 10, the one-way airflow moving downwards can disperse air with higher temperature gathered on the upper surface of the multilayer circuit board 1, and the damage to the multilayer circuit board 1 caused by higher air temperature above the multilayer circuit board 1 is avoided; the lower surface of the multilayer circuit board 1 is fixedly connected with the heat dissipation aluminum sheets 12, the heat dissipation area of the multilayer circuit board 1 is increased by utilizing the plurality of heat dissipation aluminum sheets 12, the heat dissipation speed of the multilayer circuit board 1 is increased, and therefore the heat dissipation effect of the multilayer circuit board 1 is improved.
The implementation principle of the anti-interference multilayer circuit board for communication in the embodiment of the application is as follows:
utilize the bolt to run through the hole groove on fixed orifices 8 and the equipment shell and can fix bottom plate 7, make multilayer circuit board 1 reciprocate at the surface of threaded rod 3 through-hole 2 after that, so that adjust multilayer circuit board 1 to suitable height, can rotate two upper and lower screw rings 5 and go on moving on the surface of threaded rod 3 after highly suitable, so that carry out the centre gripping to multilayer circuit board 1, and the rubber circle that screw ring 5 and multilayer circuit board 1 laminating department set up can prevent that screw ring 5 from excessively extrudeing multilayer circuit board 1 and causing destruction.
The anti-interference film 102 can prevent electromagnetic interference between an electronic system and electronic equipment, protect electromagnetic radiation pollution, and the copper can be prevented from being oxidized when being exposed to air by virtue of the verdigris formed by the anti-oxidation layer 103.
When the top plate 9 receives impact force from the upper part of the multilayer circuit board 1, the elasticity of the upper spring 6 can buffer the impact force by taking the anti-falling block 4 as a supporting point, so that the multilayer circuit board 1 is prevented from being directly damaged by the impact force; when the bottom plate 7 receives an impact force from the lower side of the multilayer circuit board 1, the elasticity of the lower spring 13 can buffer the impact force by using the anti-falling block 4 as a supporting point, so that the anti-seismic and anti-pressure effects on the multilayer circuit board 1 are improved.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (6)
1. A multilayer circuit board for interference-free communication, comprising a multilayer circuit board (1), characterized in that: the upper surface of the multilayer circuit board (1) is provided with a through hole (2), the lower surface of the multilayer circuit board (1) is fixedly connected with a heat radiation aluminum sheet (12), the inner part of the through hole (2) penetrates through a threaded rod (3), the outer surfaces of the top end and the bottom end of the threaded rod (3) are fixedly connected with an anti-falling block (4), the outer surface of the threaded rod (3) between the anti-falling block (4) and the multilayer circuit board (1) is in threaded connection with a threaded ring (5), one side of the anti-falling block (4) far away from the upper surface of the multilayer circuit board (1) is fixedly connected with an upper spring (6), one end of the upper spring (6) far away from the anti-falling block (4) is fixedly connected with a top plate (9), the upper surface of the top plate (9) is provided with a through groove (10), and the inner wall of the through groove (10) is provided with a fan (11), keep away from in anticreep piece (4) one side fixedly connected with lower spring (13) of multilayer circuit board (1) lower surface, lower spring (13) are kept away from the one end fixedly connected with bottom plate (7) of anticreep piece (4).
2. The multi-layer circuit board for interference-free communications of claim 1, wherein: the multilayer circuit board (1) comprises a circuit board body (101), wherein anti-interference films (102) are arranged on the upper surface and the lower surface of the circuit board body (101), and an anti-oxidation layer (103) is arranged on one side face, away from the circuit board body (101), of the anti-interference film (102).
3. The multi-layer circuit board for interference-free communications of claim 2, wherein: the thickness of the anti-interference film (102) is 0.01-0.07 mm, and the thickness of the antioxidation layer (103) is 0.013-0.0122 mm.
4. The multilayer circuit board of claim 1, further comprising: the upper surface of the bottom plate (7) is provided with a fixing hole (8), and the lower surface of the bottom plate (7) is bonded with a rubber pad.
5. The multilayer circuit board of claim 1, further comprising: and a rubber ring is adhered to one side surface of the threaded ring (5) close to the multilayer circuit board (1).
6. The multilayer circuit board of claim 1, further comprising: the input end of the fan (11) is electrically connected with an external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220436369.7U CN216982197U (en) | 2022-03-02 | 2022-03-02 | Anti-interference multilayer circuit board for communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220436369.7U CN216982197U (en) | 2022-03-02 | 2022-03-02 | Anti-interference multilayer circuit board for communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216982197U true CN216982197U (en) | 2022-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220436369.7U Active CN216982197U (en) | 2022-03-02 | 2022-03-02 | Anti-interference multilayer circuit board for communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216982197U (en) |
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- 2022-03-02 CN CN202220436369.7U patent/CN216982197U/en active Active
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