CN217904724U

CN217904724U - Conductive copper foil for earphone circuit board

Info

Publication number: CN217904724U
Application number: CN202221514237.8U
Authority: CN
Inventors: 林文辉; 李明; 林晓明
Original assignee: Shenzhen Huaanxin Electronic Technology Co ltd
Current assignee: Shenzhen Huaanxin Electronic Technology Co ltd
Priority date: 2022-06-16
Filing date: 2022-06-16
Publication date: 2022-11-25
Anticipated expiration: 2032-06-16

Abstract

The utility model discloses an earphone is conductive copper foil for circuit board, include reel, conductive copper foil main part, conductive copper foil piece, viscidity face, leave type paper and supplementary radiator unit. The utility model discloses a supplementary heat abstractor has been set up, at the copper base, heat dissipation coating and louvre cooperation are down, can realize that earphone circuit board produces thermal derivation, and under oxidation resisting layer and antistatic backing cooperation, can realize anti-oxidant and the supplementary elimination of static, thereby reach and strengthen electrically conductive copper foil main part thermal diffusivity, realize the supplementary advantage of deriving of earphone circuit board heat, and set up additional strengthening in copper base inside, at first graphite fin, second graphite fin, the guide slot is mutually supported with heat conduction silica gel layer down, can carry out thermal quick absorption and derive the heat dissipation, and under graphite alkene layer and air conveying groove cooperation, can accelerate the heat absorption and derive the effect, thereby reached the radiating effect of strengthening supplementary heat abstractor, carry out the quick absorptive advantage of heat.

Description

Conductive copper foil for earphone circuit board

Technical Field

The utility model relates to an earphone circuit board field of being correlated with especially relates to an earphone circuit board is with electrically conductive copper foil.

Background

The circuit board, also known as printed circuit board, is an important electronic component, is a support body of electronic components, is a carrier for electrical interconnection of electronic components, and in the production process of the earphone circuit board, a conductive copper foil needs to be attached to the earphone circuit board to carry out electromagnetic shielding and antistatic, so as to avoid unstable hidden faults, and the copper foil is an anionic electrolytic material, is a thin and continuous metal foil deposited on a basal layer of the circuit board, has low surface oxygen characteristic, can be attached to various different base materials, such as metal, insulating materials and the like, has a wider temperature use range, and is mainly applied to electromagnetic shielding and antistatic.

At present, when the conductive copper foil for the earphone circuit board is used, although the conductive copper foil can well realize the electromagnetic shielding and antistatic activities of the earphone circuit board, the carried heat dissipation effect is insufficient, so that when parts arranged on the earphone circuit board run, efficient heat dissipation measures are lacked, the safety and stability of the whole running of the earphone circuit board are ensured, and the occurrence of a short circuit phenomenon is avoided.

SUMMERY OF THE UTILITY MODEL

Therefore, in order to solve the above insufficiency, the utility model provides a conductive copper foil for earphone circuit board.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an earphone is electrically conductive copper foil for circuit board, includes reel, electrically conductive copper foil main part, electrically conductive copper foil, viscidity face and leaves type paper, the reel outside winding is connected with electrically conductive copper foil main part, electrically conductive copper foil main part includes electrically conductive copper foil, viscidity face and leaves type paper, electrically conductive copper foil downside passes through the viscidity face and pastes from type paper and be connected, still including the supplementary radiator unit who locates the electrically conductive copper foil main part outside, supplementary radiator unit is including locating the copper base layer that electrically conductive copper foil main part outside carried out flexible installation, meet in the connection bonding wire of the copper base layer left and right sides, install the antioxidation layer in copper base layer front side, locate the antioxidation layer that the antioxidation layer inside can eliminate static, set up in the inside louvre of antioxidation layer and antistatic layer, set up in the inside reinforcing structure that sets up the inside heat dissipation conduction of copper base layer rear side middle part and locate the inside realization radiating effect of copper base layer and further improve, the copper base layer is connected with electrically conductive copper foil main part fastening through the left and right sides connection bonding wire.

Preferably, the additional strengthening is including locating the inside first graphite fin of copper-based layer, meeting in the second graphite fin on first graphite fin right side, arrange first graphite fin and second graphite fin inside heat conduction silica gel layer in both ends about, set up in guide slot at both ends about first graphite fin and the second graphite fin, set firmly in the graphite layer at second graphite fin middle part and set up the gas transmission groove at both ends about graphite layer relatively, first graphite fin left side is hugged closely with the oxidation resisting layer, second graphite fin is connected with the inside middle-end of thermal coating.

Preferably, the connection bonding wire is not less than four along the left and right sides of the copper base layer, and the connection bonding wire is integrally in a strip-shaped welding arrangement.

Preferably, the antistatic layer is provided with three layers at equal intervals along the front side of the antioxidation layer, and the antistatic layer is provided with four positions at equal intervals with radiating holes formed in the antioxidation layer.

Preferably, the first graphite radiating fin and the second graphite radiating fin are mutually inserted and arranged, and the overall thicknesses of the first graphite radiating fin and the second graphite radiating fin are consistent.

Preferably, the first graphite heat radiating fin and the second graphite heat radiating fin are both provided with semi-arc depressions at the upper and lower inner portions, and the first graphite heat radiating fin and the second graphite heat radiating fin are provided with heat conducting silica gel layers at the depressions.

Preferably, the guide grooves are oppositely arranged in two groups along the upper ends and the lower ends of the first graphite radiating fins and the second graphite radiating fins, and the guide grooves are integrally arranged in three directions.

Preferably, the gas transmission grooves are symmetrically formed in the upper portion and the lower portion of the graphene layer, and one sides, far away from the graphene layer, of the gas transmission grooves are opposite to the heat conduction silicon adhesive layer.

The utility model has the advantages that:

the method has the advantages that 1: the utility model discloses a set up supplementary heat abstractor, under copper base, heat dissipation coating and louvre cooperation, can realize the leading-out of earphone circuit board production of heat, and under oxidation resisting layer and antistatic backing cooperation, can realize antioxidation and the supplementary elimination of static to reach enhancement electrically conductive copper foil main part thermal diffusivity, realized the supplementary advantage of leading-out of earphone circuit board heat.

The method has the advantages that: the utility model discloses an at the inside additional strengthening that has set up of copper basic unit, under first graphite fin, second graphite fin, guide slot and heat conduction silica gel layer mutually supported, can carry out thermal quick absorption and derive the heat dissipation, and under graphite alkene layer and the cooperation of gas transmission groove, can accelerate the heat absorption and derive the effect to reached and strengthened supplementary heat abstractor's radiating effect, carried out the quick absorbent advantage of heat.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a front view structural schematic diagram of the auxiliary heat dissipation assembly of the present invention;

fig. 3 is a schematic view of a three-dimensional structure of the auxiliary heat dissipation assembly of the present invention;

fig. 4 is a schematic view of the right sectional structure of the auxiliary heat dissipation assembly of the present invention;

FIG. 5 is a schematic view of the right-side cross-sectional structure of the reinforcing structure of the present invention;

fig. 6 is a schematic view of the three-dimensional cross-sectional structure of the reinforced structure of the present invention.

Wherein: the heat dissipation structure comprises a winding drum-1, a conductive copper foil body-2, a conductive copper foil sheet-21, an adhesive surface-22, release paper-23, an auxiliary heat dissipation assembly-3, a copper base layer-31, a connecting welding line-32, an oxidation resistant layer-33, an anti-static layer-34, a heat dissipation hole-35, a heat dissipation coating-36, a reinforcing structure-37, a first graphite heat dissipation sheet-371, a second graphite heat dissipation sheet-372, a heat conduction silica gel layer-373, a guide groove-374, a graphene layer-375 and an air transmission groove-376.

Detailed Description

In order to further explain the technical solution of the present invention, the following is a detailed explanation through specific examples.

Referring to fig. 1, the present invention provides a conductive copper foil for an earphone circuit board, including a reel 1, a conductive copper foil main body 2, a conductive copper foil 21, an adhesive surface 22 and a release paper 23, the reel 1 is wound on the outside of the conductive copper foil main body 2, the conductive copper foil main body 2 includes the conductive copper foil 21, the adhesive surface 22 and the release paper 23, the lower side of the conductive copper foil 21 is adhered to the release paper 23 through the adhesive surface 22, and the conductive copper foil further includes an auxiliary heat dissipation assembly 3 disposed on the outside of the conductive copper foil main body 2.

Referring to fig. 2-4, the auxiliary heat dissipation assembly 3 includes a copper base 31 disposed on the outer side of the conductive copper foil body 2 for flexible installation, bonding wires 32 connected to the left and right sides of the copper base 31, an oxidation resistant layer 33 attached to the front side of the copper base 31, an antistatic layer 34 fixed inside the oxidation resistant layer 33 for eliminating static electricity, heat dissipation holes 35 formed inside the oxidation resistant layer 33 and the antistatic layer 34, a heat dissipation coating 36 disposed in the middle of the rear side of the copper base 31 for heat dissipation and conduction, and a reinforcing structure 37 disposed inside the copper base 31 for further improving heat dissipation effect, wherein the copper base 31 is fastened and connected to the conductive copper foil body 2 through the bonding wires 32 on the left and right sides; connect bonding wire 32 and set up along the copper substrate 31 left and right sides and be no less than four to connect bonding wire 32 and wholly be rectangular form welding setting, guarantee the firm of copper substrate 31 integral erection, antistatic backing 34 is provided with the three-layer along antioxidation layer 33 front side equidistance, and the inside louvre 35 equidistance of seting up of antistatic backing 34 and antioxidation layer 33 is equipped with everywhere, guarantees to destatic more abundant with the radiating effect.

Referring to fig. 5-6, the reinforcing structure 37 includes a first graphite heat sink 371 disposed inside the copper base layer 31, a second graphite heat sink 372 inserted on the right side of the first graphite heat sink 371, a heat-conducting silica gel layer 373 disposed inside the upper and lower ends of the first graphite heat sink 371 and the second graphite heat sink 372 for heat-assisted adsorption and heat dissipation, a guide groove 374 disposed on the upper and lower ends of the first graphite heat sink 371 and the second graphite heat sink 372 for heat transmission and lead-out, a graphene layer 375 fixedly disposed in the middle of the second graphite heat sink 372 for efficiently leading out heat, and an air transmission groove 376 disposed on the upper and lower ends of the graphene layer 375 for heat transmission assistance, wherein the left side of the first graphite heat sink 371 is tightly attached to the oxidation-resistant layer 33, and the second graphite heat sink 372 is connected to the inner middle end of the heat-dissipating coating 36; first graphite fin 371 and second graphite fin 372 peg graft each other and set up, and first graphite fin 371 is unanimous with the whole thickness of second graphite fin 372, it is high-efficient to guarantee first graphite fin 371 and the radiating effect of second graphite fin 372 of mutually supporting, half arc depressed part has all been seted up to both ends inside about first graphite fin 371 and the second graphite fin 372, and first graphite fin 371 and second graphite fin 372 set up the inside heat conduction silica gel layer 373 that is equipped with of depressed part, guarantee that heat conduction silica gel layer 373 is connected firmly, guide slot 374 is provided with two sets ofly along first graphite fin 371 and second graphite fin 372 both ends relatively about, and guide slot 374 is whole to be the three directions and sets up the installation, guarantee the diversified derivation of heat, air input slot 376 is seted up along graphene layer 375 upper and lower symmetry, and air input slot 376 keeps away from graphene layer 375 one side and sets up with heat conduction silica gel layer 373 relatively, guarantee the heat derivation fast.

The working principle is as follows:

firstly, when the conductive copper foil for the earphone circuit board is used, the conductive copper foil body 2 wound outside the reel 1 can be pulled out by the moving length by pulling the conductive copper foil body 2, after the length is selected and cut, the release paper 23 arranged inside the conductive copper foil body 2 can be uncovered, the adhesive surface 22 arranged on the lower side of the conductive copper foil 21 is exposed, and then the adhesive adhesion between the conductive copper foil 23 and the substrate surface of the earphone circuit board can be well realized through the adhesive action of the adhesive surface 22, and the conductive copper foil 23 has the electromagnetic shielding and antistatic functions, so that the earphone circuit board is not easily influenced by external signals and has an unstable hidden fault problem in the subsequent installation and use process;

secondly, when the conductive copper foil for the earphone circuit board is used, although the conductive copper foil can well realize the electromagnetic shielding and antistatic activities of the earphone circuit board, the carried heat dissipation effect is insufficient, so that when parts arranged on the earphone circuit board run, efficient heat dissipation measures are lacked, the safety and stability of the whole running of the earphone circuit board are ensured, and the occurrence of a short circuit phenomenon is avoided;

thirdly, the auxiliary heat dissipation device 3 is arranged outside the conductive copper foil body 2, namely after the conductive copper foil 23 is adhered to the earphone circuit board, the heat dissipation coating 36 arranged in the middle of the rear side of the copper base layer 31 can be adhered to the bottom of the earphone circuit board, when an electronic element arranged on the earphone circuit board operates, the generated heat can be conducted to the outside under the heat conduction effect of the heat dissipation coating 36 and the copper base layer 31, the earphone circuit board is prevented from being used at high temperature for a long time and from short-circuiting, and the antioxidation layer 33 attached to the front side of the copper base layer 31 and the three antistatic layers 34 arranged on the front side of the antioxidation layer 33 can be matched with each other, so that the antioxidation effect of the copper base layer 31 and the antistatic effect of the conductive copper foil 23 can be improved, and the heat dissipation holes 35 arranged inside the antioxidation layer 33 and the antistatic layers 34 can assist in conducting heat conduction and discharging, so that the heat dissipation of the conductive copper foil body 2 is strengthened, and the advantage of auxiliary heat dissipation of the earphone circuit board can be achieved;

fourthly, in order to further enhance the heat dissipation effect of the auxiliary heat dissipation device 3, the reinforcing structure 37 is further arranged inside the copper base layer 31, so as to accelerate the heat absorption and derivation effect, namely, the second graphite heat dissipation fin 372 arranged at the middle end inside the heat dissipation coating 36 can perform the rapid absorption of the heat generated by the circuit board, and the guide grooves 374 arranged at the upper end and the lower end of the second graphite heat dissipation fin 372 are matched, the heat is guided into the guide grooves 374 arranged at the upper end and the lower end of the second graphite heat dissipation fin 372 and the first graphite heat dissipation fin 371 to form half-arc depressions, so as to perform the rapid absorption with the heat conduction silicon layer 373 arranged inside the half-arc depressions, and the guide grooves 374 arranged at the upper end and the lower end of the first graphite heat dissipation fin 371 are matched, so as to be led out to the outside, the 375 arranged at the middle part of the second graphite heat dissipation fin 372 is arranged at the same time, so as to perform the efficient absorption of the heat, and the heat can be transmitted to the silicon layer 373 through the air transmission grooves 376 arranged at the upper end and the lower end of the graphene layer 375, so as to transmit the heat to the silicon layer 373, so as to perform the heat absorption again on the heat dissipation layer 373, thereby achieving the advantage of the auxiliary heat dissipation device 3 by the auxiliary heat dissipation device.

The utility model provides a conductive copper foil for headphone circuit board, through having set up supplementary heat abstractor 3, at copper base 31, heat dissipation coating 36 and louvre 35 cooperation down, can realize headphone circuit board production thermal derivation, and under antioxidation layer 33 and antistatic backing 34 cooperation, can realize antioxidation and static supplementary elimination, thereby having reached and strengthened conductive copper foil main part 2 thermal diffusivity, realize the supplementary advantage of deriving of headphone circuit board heat, and at the inside additional strengthening 37 that has set up of copper base 31, at first graphite fin 371, second graphite fin 372, under guide slot 374 and heat conduction silica gel layer 373 mutually supported, can carry out thermal quick absorption and derive the heat dissipation, and under graphite alkene layer 375 and gas transmission groove 376 cooperation, can accelerate the heat absorption and derive the effect, thereby reached the radiating effect of strengthening supplementary heat abstractor 3, carry out the quick absorptive advantage of heat.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A conductive copper foil for an earphone circuit board comprises a winding drum (1), a conductive copper foil main body (2), a conductive copper foil (21), an adhesive surface (22) and release paper (23), wherein the conductive copper foil main body (2) is wound and connected to the outer side of the winding drum (1), the conductive copper foil main body (2) comprises the conductive copper foil (21), the adhesive surface (22) and the release paper (23), and the lower side of the conductive copper foil (21) is connected with the release paper (23) in an adhesive mode through the adhesive surface (22);

the method is characterized in that: still including locating supplementary radiator unit (3) in the conductive copper foil main part (2) outside, supplementary radiator unit (3) are including locating copper base (31) that conductive copper foil main part (2) outside carried out flexible installation, meet in connection bonding wire (32) of copper base (31) left and right sides, install in oxidation resisting layer (33) of copper base (31) front side, locate inside antistatic backing (34) that can eliminate static of oxidation resisting layer (33), set up in inside louvre (35) of oxidation resisting layer (33) and antistatic backing (34), set up in heat dissipation coating (36) that carry out the heat dissipation conduction in copper base (31) rear side middle part and locate inside additional strengthening (37) that realize the radiating effect and further improve of copper base (31), copper base (31) are connected bonding wire (32) and conductive copper foil main part (2) fastening connection through the left and right sides.

2. The conductive copper foil for an earphone circuit board according to claim 1, wherein: the reinforcing structure (37) comprises a first graphite radiating fin (371) arranged inside a copper base layer (31), a second graphite radiating fin (372) connected to the right side of the first graphite radiating fin (371), a heat-conducting silica gel layer (373) arranged inside the upper end and the lower end of the first graphite radiating fin (371) and the second graphite radiating fin (372), guide grooves (374) arranged at the upper end and the lower end of the first graphite radiating fin (371) and the second graphite radiating fin (372), graphene layers (375) fixedly arranged in the middle of the second graphite radiating fin (372) and air transmission grooves (376) arranged at the upper end and the lower end of the graphene layers (375) relatively, the left side of the first graphite radiating fin (371) is tightly attached to the oxidation resisting layer (33), and the middle end inside the second graphite radiating fin (372) and a heat-radiating coating (36) are connected.

3. The conductive copper foil for an earphone circuit board according to claim 1, wherein: the connecting welding lines (32) are not less than four along the left side and the right side of the copper base layer (31), and the connecting welding lines (32) are integrally in a strip-shaped welding arrangement.

4. The conductive copper foil for an earphone circuit board according to claim 1, wherein: the anti-static layer (34) is provided with three layers at equal intervals along the front side of the anti-oxidation layer (33), and the anti-static layer (34) and the heat dissipation holes (35) formed in the anti-oxidation layer (33) are arranged at four positions at equal intervals.

5. The conductive copper foil for an earphone circuit board according to claim 2, wherein: the first graphite radiating fins (371) and the second graphite radiating fins (372) are mutually inserted and arranged, and the overall thicknesses of the first graphite radiating fins (371) and the second graphite radiating fins (372) are consistent.

6. The conductive copper foil for an earphone circuit board according to claim 2, characterized in that: the upper ends and the lower ends of the first graphite radiating fins (371) and the second graphite radiating fins (372) are respectively provided with a semi-arc sunken part, and the sunken parts of the first graphite radiating fins (371) and the second graphite radiating fins (372) are internally provided with a heat-conducting silica gel layer (373).

7. The conductive copper foil for an earphone circuit board according to claim 2, wherein: the guide grooves (374) are oppositely arranged in two groups along the upper ends and the lower ends of the first graphite radiating fins (371) and the second graphite radiating fins (372), and the guide grooves (374) are integrally arranged in three directions.

8. The conductive copper foil for an earphone circuit board according to claim 2, characterized in that: the gas transmission grooves (376) are symmetrically formed up and down along the graphene layer (375), and one side, away from the graphene layer (375), of each gas transmission groove (376) is opposite to the heat conduction silica gel layer (373).