CN214491847U

CN214491847U - High-heat-resistance copper-clad plate

Info

Publication number: CN214491847U
Application number: CN202023255844.0U
Authority: CN
Inventors: 张元锋; 方元春; 沈杰; 贺元英; 贺荣财; 王汉红
Original assignee: ZHEJIANG JIGAO INDUSTRY CO LTD
Current assignee: ZHEJIANG JIGAO INDUSTRY CO LTD
Priority date: 2020-12-29
Filing date: 2020-12-29
Publication date: 2021-10-26
Anticipated expiration: 2030-12-29

Abstract

The utility model discloses a copper-clad plate of high heat resistance, comprising a base plate, the rubber cushion is installed through the screw in the bottom plate top, semiconductor refrigeration piece is installed through seting up the groove in rubber cushion top surface, the copper-clad plate body is installed through the screw in rubber cushion top, copper-clad plate body top surface is provided with the waterproof layer, waterproof layer top surface is provided with the ceramic fibre layer, the copper-clad plate body comprises antistatic backing, the SMD layer of inhaling and high heat conduction glue film, the SMD layer of inhaling is located copper-clad plate body top surface, prevent that the antistatic backing is located the SMD layer top surface of inhaling, high heat conduction glue film is located copper-clad plate body bottom surface. The utility model relates to a high heat-resistant copper-clad plate, it is rational in infrastructure, it is convenient to use, is fit for being extensively promoted and used.

Description

High-heat-resistance copper-clad plate

Technical Field

The utility model relates to a copper-clad plate technical field, in particular to high heat-resistant copper-clad plate.

Background

The copper clad laminate is a plate material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin, covering one side or two sides with copper foil and hot pressing, which is called copper clad laminate for short, and various printed circuit boards with different forms and different functions are all prepared by selectively processing, etching, drilling, copper plating and other procedures on the copper clad laminate to prepare different printed circuits, mainly play the roles of interconnection, insulation and support for the printed circuit boards, and have great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuits, therefore, the performance, quality, processability, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit boards are greatly dependent on the copper clad laminate.

The copper-clad plates in the current market are various in types and rich in functions, but have the following defects: 1. the copper-clad plate needs to be waterproof and antistatic, 2, the copper-clad plate is poor in heat conducting performance, 3, the copper-clad plate is high in long-time working temperature and needs to dissipate heat, and therefore the copper-clad plate with high heat resistance is provided.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a high heat-resistant copper-clad plate, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high heat-resistant copper-clad plate, includes the bottom plate, the rubber cushion is installed through the screw in the bottom plate top, semiconductor refrigeration piece is installed through seting up the groove to rubber cushion top surface, the copper-clad plate body is installed through the screw in rubber cushion top, copper-clad plate body top surface is provided with the waterproof layer, waterproof layer top surface is provided with the ceramic fibre layer, the copper-clad plate body comprises antistatic backing, ripples-absorbing paster layer and high heat conduction glue film, ripples-absorbing paster layer is located copper-clad plate body top surface, antistatic backing is located ripples-absorbing paster layer top surface, high heat conduction glue film is located copper-clad plate body bottom surface.

Further, the heat dissipation end of the semiconductor refrigeration piece is located outside the rubber soft cushion.

Further, the waterproof layer is made of polyethylene materials, and the antistatic layer is made of conductive fibers.

Furthermore, copper foil is installed on the periphery of the copper-clad plate body through screws.

Further, the high thermal conductive adhesive layer is made of high thermal conductive filler aluminum nitride material.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. through setting up waterproof layer and antistatic backing, the waterproof layer is made for the polyethylene material, can promote the waterproof performance of copper-clad plate body, and the material of antistatic backing is conductive fiber, can avoid copper-clad plate body surface to produce static, influences follow-up use.

2. Through setting up high heat conduction glue film and copper foil, high heat conduction glue film can promote the inside heat conductivility of copper-clad plate body, and the copper foil can distribute away the inside heat energy of copper-clad plate body, and the convenience is to the holistic heat conduction of copper-clad plate body.

3. Through setting up the semiconductor refrigeration piece, and the heat dissipation end of semiconductor refrigeration piece is located the rubber cushion outside, can cool down to the copper-clad plate body, avoids the follow-up use of copper-clad plate body high temperature influence, through setting up the rubber cushion, can promote the damping performance of copper-clad plate body, avoids vibrating the influence circuit, through setting up the SMD layer of ripples of inhaling, can promote the radiation protection of copper-clad plate body, anti-electromagnetic interference performance.

Drawings

Fig. 1 is the utility model relates to an overall structure schematic diagram of a copper-clad plate with high heat resistance.

Fig. 2 is the utility model relates to a rubber cushion structural schematic diagram of high heat-resistant copper-clad plate.

Fig. 3 is the utility model relates to a section structure schematic diagram of high heat-resistant copper-clad plate.

In the figure: 1. a base plate; 2. a rubber cushion; 3. a copper-clad plate body; 4. copper foil; 5. a waterproof layer; 6. a ceramic fiber layer; 7. a semiconductor refrigeration sheet; 8. an antistatic layer; 9. a wave-absorbing patch layer; 10. high heat conduction glue film.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-3, a high heat-resistant copper-clad plate, including bottom plate 1, rubber cushion 2 is installed through the screw at 1 top of bottom plate, semiconductor refrigeration piece 7 is installed through seting up the groove to 2 top surfaces of rubber cushion, copper-clad plate body 3 is installed through the screw at 2 tops of rubber cushion, 3 top surfaces of copper-clad plate body are provided with

waterproof layer

5, 5 top surfaces of waterproof layer are provided with ceramic fiber layer 6, copper-clad plate body 3 comprises antistatic backing 8, ripples-absorbing paster layer 9 and high heat conduction glue film 10, ripples-absorbing paster layer 9 is located 3 top surfaces of copper-clad plate body, antistatic backing 8 is located ripples-absorbing paster layer 9 top surfaces, high heat conduction glue film 10 is located 3 bottom surfaces of copper-clad plate body.

Wherein, the heat dissipation end of the semiconductor refrigeration sheet 7 is positioned outside the rubber soft cushion 2.

In this embodiment, as shown in fig. 2, the heat dissipation end of the semiconductor refrigeration piece 7 is located outside the rubber cushion 2, so that the copper-clad plate body 3 can be cooled, and the subsequent use of the copper-clad plate body 3 due to the overhigh temperature can be avoided.

The waterproof layer 5 is made of polyethylene materials, and the anti-static layer 8 is made of conductive fibers.

In this embodiment, as shown in fig. 1 and 3, the waterproof layer 5 is made of polyethylene material, which can improve the waterproof performance of the copper-clad plate body 3, and the antistatic layer 8 is made of conductive fiber, which can prevent the surface of the copper-clad plate body 3 from generating static electricity to affect the subsequent use.

Wherein, copper foil 4 is installed through the screw in copper-clad plate body 3 periphery.

In this embodiment, as shown in fig. 1, the copper foil 4 can dissipate heat energy inside the copper-clad plate body 3, thereby facilitating heat conduction of the whole copper-clad plate body 3.

The high thermal conductive adhesive layer 10 is made of an aluminum nitride material as a high thermal conductive filler.

In this embodiment, as shown in fig. 3, the high thermal conductive adhesive layer 10 can improve the thermal conductivity inside the copper-clad plate body 3, thereby facilitating the thermal conductivity of the copper-clad plate body 3.

It should be noted that the utility model relates to a high heat-resistant copper-clad plate, during operation, the staff need first connect the semiconductor refrigeration sheet 7 with the external power supply and manually start the work, the surface of the copper-clad plate body 3 is provided with the waterproof layer 5, and the waterproof layer 5 is made of polyethylene material, which can improve the waterproof performance of the copper-clad plate body 3, the top surface of the waterproof layer 5 is provided with the ceramic fiber layer 6, which can improve the heat-resistant and open fire-resistant performance of the copper-clad plate body 3, the rubber cushion 2 can improve the shock absorption performance of the copper-clad plate body 3, which avoids the circuit from being influenced by vibration, the antistatic layer 8 is made of conductive fiber, which can avoid the surface of the copper-clad plate body 3 from generating static electricity and influencing the subsequent use, the patch layer 9 can improve the radiation-resistant and electromagnetic interference-resistant performance of the copper-clad plate body 3, when the temperature of the copper-clad plate body 3 is higher, the high heat-conductive adhesive layer 10 can conduct heat to the inside of the copper-clad plate body 3, copper foil 4 can distribute away the inside heat energy of copper-clad plate body 3, and the staff needs the manual work to open semiconductor refrigeration piece 7 this moment, and the heat dissipation end of semiconductor refrigeration piece 7 is located 2 outsides of rubber cushion, can cool down copper-clad plate body 3, avoids the follow-up use of the too high temperature influence of copper-clad plate body 3, and the convenience is to the holistic heat conduction of copper-clad plate body 3, and the function is practical.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The copper-clad plate with high heat resistance comprises a bottom plate (1), and is characterized in that: rubber cushion (2) are installed through the screw in bottom plate (1) top, semiconductor refrigeration piece (7) are installed through seting up the groove to rubber cushion (2) top, copper-clad plate body (3) are installed through the screw in rubber cushion (2) top, copper-clad plate body (3) top surface is provided with waterproof layer (5), waterproof layer (5) top surface is provided with ceramic fiber layer (6), copper-clad plate body (3) comprise antistatic backing (8), inhale ripples layer (9) and high heat conduction glue film (10), inhale ripples layer (9) and be located copper-clad plate body (3) top surface, antistatic backing (8) are located SMD layer (9) top surface, high heat conduction glue film (10) are located copper-clad plate body (3) bottom surface.

2. The copper-clad plate with high heat resistance according to claim 1, characterized in that: the heat dissipation end of the semiconductor refrigeration sheet (7) is positioned outside the rubber soft cushion (2).

3. The copper-clad plate with high heat resistance according to claim 1, characterized in that: the waterproof layer (5) is made of polyethylene materials, and the anti-static layer (8) is made of conductive fibers.

4. The copper-clad plate with high heat resistance according to claim 1, characterized in that: and a copper foil (4) is arranged on the periphery of the copper-clad plate body (3) through screws.

5. The copper-clad plate with high heat resistance according to claim 1, characterized in that: the high-thermal-conductivity adhesive layer (10) is made of high-thermal-conductivity filler aluminum nitride material.