CN209824125U - High heat conduction flexible circuit board - Google Patents
High heat conduction flexible circuit board Download PDFInfo
- Publication number
- CN209824125U CN209824125U CN201920233023.5U CN201920233023U CN209824125U CN 209824125 U CN209824125 U CN 209824125U CN 201920233023 U CN201920233023 U CN 201920233023U CN 209824125 U CN209824125 U CN 209824125U
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- China
- Prior art keywords
- heat
- layer
- circuit substrate
- circuit board
- conducting adhesive
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Abstract
The utility model discloses a high heat conduction flexible circuit board, include: a circuit substrate; the heat-conducting adhesive layers are arranged on the upper surface and the lower surface of the circuit substrate; the aluminum copper foil layer is arranged on the upper surface of the heat-conducting adhesive layer on the upper surface of the circuit substrate and on the lower surface of the heat-conducting adhesive layer on the lower surface of the circuit substrate; and the resin protective layer is completely coated on the outer layers of the circuit substrate, the heat-conducting adhesive layer and the aluminum copper foil layer. The utility model discloses a flexible printed circuit board who plays lead circuit effect compares in the flexible printed circuit board of conventional the same kind, the utility model discloses an use heat-conducting glue layer to be connected aluminium copper foil layer and circuit substrate as an organic whole, then at its outer cladding one deck by high thermal conductivity polyimide resin constitution resin protective layer, the heat that the circuit substrate during operation sent can be through heat-conducting glue layer, aluminium copper foil layer, resin protective layer three layer construction heat dissipation.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to high heat conduction flexible circuit board.
Background
The flexible printed circuit board has the functional role such as lead wire, printed circuit, connector, it has the flexible printed circuit board of polytype according to the effect, play the flexible printed circuit board of lead wire effect, its skin is generally enough by glass fiber or polymer plastics, the inlayer wraps the copper line layer, forms simple two-layer structure, outer glass fiber or polymer plastics only play the protection insulating effect to the copper line layer, the phenomenon of generating heat at the in-process ubiquitous of transmission, the thermal diffusivity lacks, lead to transmission life weak point.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat conduction flexible printed circuit board to solve the problem that proposes among the above-mentioned background art.
This utility model adopts for achieving the above purpose:
a high thermal conductivity flexible wiring board comprising:
a circuit substrate;
the heat-conducting adhesive layers are arranged on the upper surface and the lower surface of the circuit substrate;
the aluminum copper foil layer is arranged on the upper surface of the heat-conducting adhesive layer on the upper surface of the circuit substrate and on the lower surface of the heat-conducting adhesive layer on the lower surface of the circuit substrate;
and the resin protective layer is completely coated on the outer layers of the circuit substrate, the heat-conducting adhesive layer and the aluminum copper foil layer.
Further, the heat-conducting adhesive layer is formed by two-component epoxy resin adhesive or organic silicon heat-conducting adhesive.
Further, the thickness of the aluminum copper foil layer is 0.035-0.050 mm.
Further, the resin protective layer is a resin molding layer formed of a polyimide resin filled with aluminum nitride or silicon carbide.
Compared with the prior art, the beneficial effects of the utility model reside in that:
the utility model discloses a flexible printed circuit board who plays lead circuit effect compares in the flexible printed circuit board of conventional the same kind, the utility model discloses an use heat-conducting glue layer to be connected aluminium copper foil layer and circuit substrate as an organic whole, then at its outer cladding one deck by high thermal conductivity polyimide resin constitution resin protective layer, the heat that the circuit substrate during operation sent can be through heat-conducting glue layer, aluminium copper foil layer, resin protective layer three layer construction heat dissipation.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the present invention;
wherein: 1. a circuit substrate; 2. a heat-conducting adhesive layer; 3. an aluminum copper foil layer; 4. and a resin protective layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides the following technical solutions:
a high thermal conductivity flexible wiring board comprising: a circuit substrate 1; the heat-conducting adhesive layers 2 are arranged on the upper surface and the lower surface of the circuit substrate 1; the aluminum copper foil layer 3 is arranged on the upper surface of the heat-conducting adhesive layer 2 on the upper surface of the circuit substrate 1 and the lower surface of the heat-conducting adhesive layer 2 on the lower surface of the circuit substrate 1; and the resin protective layer 4 is completely coated on the outer layers of the circuit substrate 1, the heat-conducting adhesive layer 2 and the aluminum copper foil layer 3.
The heat-conducting adhesive layer 2 is an adhesive layer formed by two-component epoxy resin adhesive or organic silicon heat-conducting adhesive, and the two-component epoxy resin adhesive or organic silicon heat-conducting adhesive with the heat conductivity coefficient of 2.4-3.6 w/(m.K) is selected.
The thickness of the aluminum copper foil layer 3 is 0.035-0.050 mm, and the effects of shielding, demagnetization and heat dissipation are achieved.
The resin protection layer 4 is a resin molding layer formed by polyimide resin filled with aluminum nitride or silicon carbide, the polyimide resin filled with the aluminum nitride or the silicon carbide and having a heat conductivity coefficient of 0.4-0.8 w/(m.K) is selected, and the resin protection layer 4 plays a role in protecting the internal circuit substrate 1, the heat-conducting adhesive layer 2 and the aluminum copper foil layer 3 from an external environment and also plays a certain role in conducting and radiating heat.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A high thermal conductivity flexible wiring board, comprising:
a circuit board (1);
the heat-conducting adhesive layers (2) are arranged on the upper surface and the lower surface of the circuit substrate (1);
the aluminum copper foil layer (3) is arranged on the upper surface of the heat-conducting adhesive layer (2) on the upper surface of the circuit substrate (1) and the lower surface of the heat-conducting adhesive layer (2) on the lower surface of the circuit substrate (1);
and the resin protective layer (4) is completely coated on the outer layers of the circuit substrate (1), the heat-conducting adhesive layer (2) and the aluminum copper foil layer (3).
2. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the heat-conducting adhesive layer (2) is an adhesive layer formed by bi-component epoxy resin adhesive or organic silicon heat-conducting adhesive.
3. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the thickness of the aluminum copper foil layer (3) is 0.035-0.050 mm.
4. The high thermal conductivity flexible printed circuit board of claim 1, wherein: the resin protection layer (4) is a resin molding layer formed by polyimide resin filled with aluminum nitride or silicon carbide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233023.5U CN209824125U (en) | 2019-02-22 | 2019-02-22 | High heat conduction flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920233023.5U CN209824125U (en) | 2019-02-22 | 2019-02-22 | High heat conduction flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209824125U true CN209824125U (en) | 2019-12-20 |
Family
ID=68873707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920233023.5U Expired - Fee Related CN209824125U (en) | 2019-02-22 | 2019-02-22 | High heat conduction flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209824125U (en) |
-
2019
- 2019-02-22 CN CN201920233023.5U patent/CN209824125U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191220 Termination date: 20210222 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |