CN213991130U - Multilayer circuit board with heat dissipation function - Google Patents
Multilayer circuit board with heat dissipation function Download PDFInfo
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- CN213991130U CN213991130U CN202022705186.4U CN202022705186U CN213991130U CN 213991130 U CN213991130 U CN 213991130U CN 202022705186 U CN202022705186 U CN 202022705186U CN 213991130 U CN213991130 U CN 213991130U
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- circuit board
- heat conduction
- heat
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Abstract
The utility model relates to a multilayer circuit board field discloses a multilayer circuit board with heat dissipation function, which comprises a circuit board, the circuit board both sides are equipped with the protection film, protection film surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, the embedded heat conduction copper post that is equipped with of caulking groove, the mounting groove has been seted up to circuit board four ends, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, spacing pot head is equipped with the heat conduction post that runs through the fin, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, the spacing cover that is equipped with and contradicts with the protection film all can be dismantled at heat conduction post both ends. The heat dissipation performance of the circuit board can be improved, the board surface protection requirement of the circuit board can be effectively met, and the problem of subsequent board surface scratching of the circuit board can also be solved.
Description
Technical Field
The utility model relates to a multilayer circuit board field especially relates to a multilayer circuit board with heat dissipation function.
Background
The circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed circuit board and the like. Multilayer circuit boards have at least three conductive layers, two of which are on the outer surface and the remaining conductive layers are combined in the board with a dielectric layer between each two conductive layers, the electrical connections between the conductive layers being typically made through plated through holes in the cross-section of the circuit board. The traditional multilayer circuit board has the problem of poor heat dissipation capability, and the use impression of the circuit board can be influenced by scratching the subsequent use board surface of the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer circuit board with heat dissipation function to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a multilayer circuit board with heat dissipation function, includes the circuit board, the circuit board both sides are equipped with the protection film, protection film surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, the embedded heat conduction copper post that is equipped with of caulking groove, the mounting groove has been seted up to the circuit board four ends, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, spacing pot head is equipped with the heat conduction post that runs through the fin, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, the spacing cover that is equipped with and contradicts with the protection film all can be dismantled at heat conduction post both ends.
Furthermore, the stop collar is a soft rubber piece, and a clamping groove in interference fit with the heat conducting column is formed in the stop collar.
Furthermore, an annular convex rib is fixedly arranged at one end of the side wall of the heat conduction column, and an annular groove is formed in the clamping groove.
Further, the radiating fin is a heat-conducting silica gel sheet, and the radiating fin is provided with a through hole in interference fit with the heat-conducting column.
Furthermore, the radiating fin is circular, and the radiating fin is adhered to the edge part of the protective film.
Further, the protective film includes a protective film and a resin-impregnated heat-dissipating fiber thermally press-bonded to the protective film.
Further, the protective film is a graphite film.
Further, the heat conduction column is a copper column.
The utility model has the advantages that: the heat dissipation performance of the circuit board can be improved, the board surface protection requirement of the circuit board can be effectively met, and the problem of subsequent board surface scratching of the circuit board can also be solved.
Drawings
The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic structural diagram according to an embodiment of the present invention.
The labels in the figure are: the circuit board comprises a circuit board 1, a protective film 2, a radiating fin 21, a heat conducting copper sleeve 3, a heat conducting column 4 and a limiting sleeve 5.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
In the present invention, unless otherwise specified, the terms of orientation such as "up, down, left, and right" used generally refer to up, down, left, and right as shown in fig. 1. "inner and outer" refer to the inner and outer portions of a particular contour. "distal and proximal" refer to distal and proximal relative to a component.
As shown in fig. 1, an embodiment of the utility model provides a multilayer circuit board 1 with heat dissipation function, including circuit board 1, 1 both sides of circuit board are equipped with protection film 2, 2 surface bonding of protection film have fin 21, a plurality of caulking grooves have been seted up to circuit board 1, the embedded heat conduction copper post that is equipped with of caulking groove, the mounting groove has been seted up to 1 four ends of circuit board, the mounting groove endotheca is equipped with heat conduction copper sheathing 3, spacing hole has been seted up at 3 middle parts of heat conduction copper sheathing, spacing pot head is equipped with heat conduction post 4 that runs through fin 21, 3 outer walls of heat conduction copper sheathing and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, the stop collar 5 that is equipped with 2 conflicts of protection film all can be dismantled at 4 both ends of heat conduction post.
The stop collar 5 is a soft rubber part, and a clamping groove in interference fit with the heat conducting column 4 is formed in the stop collar 5.
An annular convex rib is fixedly arranged at one end of the side wall of the heat conducting column 4, and an annular groove is arranged in the clamping groove.
The radiating fin 21 is a heat-conducting silica gel sheet, and the radiating fin 21 is provided with a through hole in interference fit with the heat-conducting column 4.
The radiating fin 21 is circular, and the radiating fin 21 is adhered to the edge part of the protective film 2.
The protective film 2 includes a protective film 2 and resin-impregnated heat-dissipating fibers thermally press-bonded to the protective film 2.
The protective film 2 is a graphite film.
The heat conduction column 4 is a copper column.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. The utility model provides a multilayer circuit board with heat dissipation function which characterized in that: the circuit board comprises a circuit board, the circuit board both sides are equipped with the protection film, protection film surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, and the caulking groove is embedded to be equipped with the heat conduction copper post, the mounting groove has four ends to be seted up the mounting groove, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, spacing pot head is equipped with the heat conduction post that runs through the fin, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, the spacing cover that is equipped with the conflict with the protection film all can be dismantled at heat conduction post both ends.
2. The multilayer wiring board with a heat dissipating function according to claim 1, characterized in that: the stop collar is soft rubber spare, set up the draw-in groove with heat conduction post interference fit on the stop collar.
3. The multilayer wiring board with a heat dissipating function according to claim 2, characterized in that: an annular convex rib is fixedly arranged at one end of the side wall of the heat conduction column, and an annular groove is formed in the clamping groove.
4. The multilayer wiring board with a heat dissipating function according to claim 1, characterized in that: the radiating fin is a heat-conducting silica gel sheet, and is provided with a through hole in interference fit with the heat-conducting column.
5. The multilayer wiring board with a heat dissipation function according to claim 4, characterized in that: the radiating fin is circular and is adhered to the edge of the protective film.
6. The multilayer wiring board with a heat dissipating function according to claim 1, characterized in that: the protective film includes a protective film and resin-impregnated heat dissipating fibers that are heat-pressed to the protective film.
7. The multilayer wiring board with a heat dissipating function according to claim 1, characterized in that: the protective film is a graphite film.
8. The multilayer wiring board with a heat dissipating function according to claim 1, characterized in that: the heat conduction column is a copper column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705186.4U CN213991130U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705186.4U CN213991130U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213991130U true CN213991130U (en) | 2021-08-17 |
Family
ID=77265554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022705186.4U Active CN213991130U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213991130U (en) |
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2020
- 2020-11-20 CN CN202022705186.4U patent/CN213991130U/en active Active
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