CN213213930U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
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- CN213213930U CN213213930U CN202021958993.0U CN202021958993U CN213213930U CN 213213930 U CN213213930 U CN 213213930U CN 202021958993 U CN202021958993 U CN 202021958993U CN 213213930 U CN213213930 U CN 213213930U
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- circuit board
- printed circuit
- multilayer printed
- protection box
- insulation board
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Abstract
The utility model provides a multilayer printed circuit board, including the circuit board main part, the upper end of circuit board main part is provided with the heating panel, the upper end of heating panel is provided with the insulation board, the upper end of insulation board is provided with the protection box, the upper end of insulation board is provided with the screw, one side of protection box is provided with the recess, one side of circuit board main part is provided with the connecting plate, the upper end of connecting plate is provided with the connecting hole, the upper end of insulation board is provided with the radiating seat, the inboard of radiating seat is provided with the foundation block, the upper end. A multilayer printed circuit board, through protection box, fixing bolt and recess, thereby can protect this multilayer printed circuit board not receive the collision damage, still can conveniently carry and carry, relatively practical, through radiating seat, heat dissipation post and louvre, this multilayer printed circuit board of being convenient for dispels the heat, makes it can normally work, the effect of use is better for traditional mode.
Description
Technical Field
The utility model relates to a printed circuit board technical field, in particular to multilayer printed circuit board.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components and are classified according to the number of layers of the circuit boardSingle panelDouble-sided board, four-layer board, six-layer board and othersMultilayer circuit board(ii) a But current printed circuit board has certain drawback when using, and at first, current printed circuit board does not have protector, can cause to collide with in handling and make the circuit board damage, and secondly, printed circuit board can generate heat when using, if be in high temperature state always, can make circuit and instrument on the circuit board inefficacy, for this reason, we provide a multilayer printed circuit board.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a multilayer printed circuit board, which can effectively solve the problems of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a multilayer printed circuit board, includes the circuit board main part, the upper end surface of circuit board main part is provided with the heating panel, the upper end surface of heating panel is provided with the insulation board, the upper end surface of insulation board is provided with the protection box, the upper end surface of insulation board is provided with the screw, one side surface of protection box is provided with the recess, one side surface of circuit board main part is provided with the connecting plate, the upper end surface of connecting plate is provided with the connecting hole, the upper end surface of insulation board is provided with the radiating seat, the inboard of radiating seat is provided with the bottom block, the upper end surface of bottom block is provided with the heat dissipation post, the.
Preferably, the outer fixed surface of one side of protection box is connected with the fixed block, and the quantity of fixed block be four groups and be the array and arrange, the upper end surface of fixed block runs through there is fixing bolt, the screw inlays in the upper end surface of insulation board, phase-match between fixing bolt and the screw, pass through fixing bolt swing joint between protection box and the insulation board, and the protection box is made for metal material.
By adopting the technical scheme, the following technical effects can be achieved: and fixing the protection box on the upper surface of the insulating plate.
Preferably, the grooves are embedded in the outer surface of one side of the protection box, the connecting plates are fixedly connected with the circuit board main body, the connecting plates are four groups and are symmetrically arranged, and connecting holes penetrate through the outer surface of the upper end of each connecting plate.
By adopting the technical scheme, the following technical effects can be achieved: the multilayer printed circuit board is convenient to carry and carry.
Preferably, be swing joint between radiating seat and the insulation board, and the radiating seat is made for metal material, be swing joint between bottom block and the radiating seat, and the bottom block is the cuboid structure and makes for rubber materials, be swing joint between radiating column and the bottom block, and the quantity of radiating column be a plurality of groups and be the array and arrange, the radiating column is made for the heat conduction material.
By adopting the technical scheme, the following technical effects can be achieved: the heat is dissipated by heat conduction of the heat dissipation column.
Preferably, be fixed connection between heating panel and the circuit board main part, and the heating panel is made for the heat conduction material, be fixed connection between insulation board and the heating panel, and the insulation board is made for resin material, the upper end surface swing joint of insulation board has electronic component, the louvre runs through in the upper end surface of insulation board, and the louvre is in electronic component's lower extreme, the quantity of louvre is a plurality of groups and is the symmetry and arranges.
By adopting the technical scheme, the following technical effects can be achieved: and heat dissipation is performed through the heat dissipation holes.
Preferably, the outer surface of the upper end of the insulating plate is movably connected with diodes, the number of the diodes is a plurality of groups and the diodes are transversely arranged, the outer surface of the lower end of the circuit board main body is movably connected with a bottom insertion pipe, and the bottom insertion pipe is made of metal materials.
Compared with the prior art, the utility model discloses following beneficial effect has: this multilayer printed circuit board, when needs transport and carry, through fixing bolt and screw, can fix the fixed block at the insulation board upper surface, can fix the protection box at the insulation board upper surface, can reach the guard action to the circuit board main part, rethread recess can be carried and carry, therefore high convenience, high practicality, when this multilayer printed circuit board uses, because the heat dissipation post is made by the heat conduction material, can be with the inside heat transfer of circuit board main part to the external world, thereby dispel the heat through contacting with the air, the louvre through electron device lower extreme can be with the inside heat transfer of electron device to the heating panel, thereby dispel the heat, high practicality, the effect of use is better for traditional mode.
Drawings
Fig. 1 is a schematic view of an overall structure of a multilayer printed circuit board according to the present invention;
fig. 2 is a schematic view of a partial structure of a multilayer printed circuit board according to the present invention;
fig. 3 is a schematic diagram of an internal structure of a multilayer printed circuit board according to the present invention;
fig. 4 is an enlarged view of a in fig. 3 of a multilayer printed circuit board according to the present invention;
fig. 5 is a front view of a multilayer printed circuit board of the present invention;
fig. 6 is a partial front sectional view of a multilayer printed circuit board according to the present invention.
In the figure: 1. a circuit board main body; 2. a heat dissipation plate; 3. an insulating plate; 4. a protection box; 5. a fixed block; 6. Fixing the bolt; 7. a screw hole; 8. a groove; 9. a connecting plate; 10. connecting holes; 11. a heat dissipation base; 12. A bottom block; 13. a heat-dissipating column; 14. heat dissipation holes; 15. an electronic device; 16. a diode; 17. a bottom cannula.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1 to 6, a multilayer printed circuit board includes a circuit board body 1, a heat sink 2 is disposed on an upper outer surface of the circuit board body 1, an insulating plate 3 is disposed on an upper outer surface of the heat sink 2, a protection box 4 is disposed on an upper outer surface of the insulating plate 3, a screw hole 7 is disposed on an upper outer surface of the insulating plate 3, a groove 8 is disposed on an outer surface of one side of the protection box 4, a connecting plate 9 is disposed on an outer surface of one side of the circuit board body 1, a connecting hole 10 is disposed on an upper outer surface of the connecting plate 9, a heat sink 11 is disposed on an upper outer surface of the insulating plate 3, a bottom block 12 is disposed on an inner side of the heat sink.
One side outer fixed surface of protection box 4 is connected with fixed block 5, and the quantity of fixed block 5 is four groups and is the array and arranges, fixing bolt 6 has been run through to the upper end surface of fixed block 5, screw 7 inlays in the upper end surface of insulation board 3, phase-match between fixing bolt 6 and the screw 7, through fixing bolt 6 swing joint between protection box 4 and the insulation board 3, and protection box 4 is made for metal material, through fixing bolt 6 and screw 7, can fix fixed block 5 at 3 upper surfaces of insulation board, can fix protection box 4 at 3 upper surfaces of insulation board.
The groove 8 is embedded in the outer surface of one side of the protection box 4, the connection plates 9 are fixedly connected with the circuit board main body 1, the connection plates 9 are four groups and are symmetrically arranged, the outer surface of the upper end of each connection plate 9 penetrates through the connection hole 10, the multilayer printed circuit board can be carried and carried through the groove 8, and the connection plates 9 and the connection holes 10 are convenient for the multilayer printed circuit board to be connected.
Be swing joint between radiating seat 11 and the insulation board 3, and radiating seat 11 is made for metal material, be swing joint between bottom block 12 and the radiating seat 11, and bottom block 12 is the cuboid structure and makes for rubber materials, be swing joint between radiating column 13 and the bottom block 12, and radiating column 13's quantity is a plurality of groups and is the array and arranges, radiating column 13 is made for the heat conduction material, because radiating column 13 is made by the heat conduction material, can come out the heat transfer of 1 inside of circuit board main part, thereby reach radiating purpose with atmospheric contact.
Be fixed connection between heating panel 2 and the circuit board main part 1, and heating panel 2 is made for the heat conduction material, be fixed connection between insulation board 3 and the heating panel 2, and insulation board 3 is made for resin material, the upper end surface swing joint of insulation board 3 has electron device 15, louvre 14 runs through in insulation board 3's upper end surface, and louvre 14 is in electron device 15's lower extreme, the quantity of louvre 14 is a plurality of groups and is the symmetry and arranges, louvre 14 through electron device 15 lower extreme can be with on the inside heat transfer of electron device 15 reaches heating panel 2, thereby dispel the heat.
The outer surface of the upper end of the insulating plate 3 is movably connected with diodes 16, the number of the diodes 16 is a plurality of groups and is transversely arranged, the outer surface of the lower end of the circuit board main body 1 is movably connected with a bottom inserting pipe 17, and the bottom inserting pipe 17 is made of metal materials.
It should be noted that, the utility model relates to a multilayer printed circuit board, the user can fix the fixed block 5 on the upper surface of the insulating board 3 through the fixing bolt 6 and the screw hole 7 when needing to transport and carry, the protection box 4 can be fixed on the upper surface of the insulating board 3 through the fixing bolt 6 and the screw hole 7, the protection function can be achieved on the circuit board main body 1, and then the transportation and carrying can be achieved through the groove 8, which is very convenient, the connection of the multilayer printed circuit board can be facilitated through the connecting plate 9 and the connecting hole 10 on the side of the circuit board main body 1, the multilayer printed circuit board is practical, the user can use the multilayer printed circuit board by arranging the heat dissipation seat 11, the bottom block 12, the heat dissipation column 13 and the heat dissipation hole 14, when the multilayer printed circuit board is used, because the heat dissipation column 13 is made of heat conduction material, can be with the inside heat transfer of circuit board main part 1 to the external world, heat-dissipating seat 11 is also made by the heat conduction material, thereby also can be through the heat dissipation with the air contact, in addition through the louvre 14 of electron device 15 lower extreme also can be with the inside heat transfer of electron device 15 to heating panel 2 on to dispel the heat, relatively practical, better for traditional mode.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A multilayer printed circuit board comprising a circuit board main body (1), characterized in that: the outer surface of the upper end of the circuit board main body (1) is provided with a heat dissipation plate (2), the outer surface of the upper end of the heat dissipation plate (2) is provided with an insulation plate (3), a protection box (4) is arranged on the outer surface of the upper end of the insulating plate (3), a screw hole (7) is arranged on the outer surface of the upper end of the insulating plate (3), a groove (8) is arranged on the outer surface of one side of the protection box (4), a connecting plate (9) is arranged on the outer surface of one side of the circuit board main body (1), the outer surface of the upper end of the connecting plate (9) is provided with a connecting hole (10), the outer surface of the upper end of the insulating plate (3) is provided with a heat radiating seat (11), a bottom block (12) is arranged on the inner side of the heat radiating seat (11), a heat radiating column (13) is arranged on the outer surface of the upper end of the bottom block (12), the outer surface of the upper end of the insulating plate (3) is provided with heat dissipation holes (14).
2. A multilayer printed circuit board according to claim 1, wherein: the utility model discloses a protection box, including protection box (4), the outer fixed surface in one side of protection box (4) is connected with fixed block (5), and the quantity of fixed block (5) is four groups and is the array and arranges, fixing bolt (6) have been run through to the upper end surface of fixed block (5), screw (7) inlay in the upper end surface of insulation board (3), phase-match between fixing bolt (6) and screw (7), through fixing bolt (6) swing joint between protection box (4) and insulation board (3), and protection box (4) are made for metal material.
3. A multilayer printed circuit board according to claim 1, wherein: the groove (8) is embedded in the outer surface of one side of the protection box (4), the connecting plates (9) are fixedly connected with the circuit board main body (1), the connecting plates (9) are four groups and are symmetrically arranged, and the outer surface of the upper end of each connecting plate (9) penetrates through a connecting hole (10).
4. A multilayer printed circuit board according to claim 1, wherein: be swing joint between radiating seat (11) and insulation board (3), and radiating seat (11) make for metal material, be swing joint between bottom block (12) and radiating seat (11), and bottom block (12) are the cuboid structure and make for rubber materials, be swing joint between heat dissipation post (13) and bottom block (12), and the quantity of heat dissipation post (13) be a plurality of groups and be array arrangement, heat dissipation post (13) are made for the heat conduction material.
5. A multilayer printed circuit board according to claim 1, wherein: be fixed connection between heating panel (2) and circuit board main part (1), and heating panel (2) are made for the heat conduction material, be fixed connection between insulation board (3) and heating panel (2), and insulation board (3) are made for resin material, the upper end surface swing joint of insulation board (3) has electronic component (15), louvre (14) run through in the upper end surface of insulation board (3), and louvre (14) are in the lower extreme of electronic component (15), the quantity of louvre (14) is a plurality of groups and is the symmetry and arranges.
6. A multilayer printed circuit board according to claim 1, wherein: the outer surface of the upper end of the insulating plate (3) is movably connected with diodes (16), the number of the diodes (16) is a plurality of groups and the diodes are transversely arranged, the outer surface of the lower end of the circuit board main body (1) is movably connected with a bottom inserting pipe (17), and the bottom inserting pipe (17) is made of metal materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021958993.0U CN213213930U (en) | 2020-09-09 | 2020-09-09 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021958993.0U CN213213930U (en) | 2020-09-09 | 2020-09-09 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213213930U true CN213213930U (en) | 2021-05-14 |
Family
ID=75844869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021958993.0U Active CN213213930U (en) | 2020-09-09 | 2020-09-09 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213213930U (en) |
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2020
- 2020-09-09 CN CN202021958993.0U patent/CN213213930U/en active Active
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