CN217509100U

CN217509100U - Printed circuit board with blind hole buried hole

Info

Publication number: CN217509100U
Application number: CN202123369970.3U
Authority: CN
Inventors: 黄晓玲; 杨俊四; 龙海平
Original assignee: Shenzhen Shenheda Electronic Co ltd
Current assignee: Shenzhen Shenheda Electronic Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-09-27
Anticipated expiration: 2031-12-28

Abstract

The utility model relates to a printed circuit board technical field, concretely relates to take printed circuit board of blind hole buried via hole, including first guard plate, the quantity of first guard plate is two, two the middle part of first guard plate is provided with circuit board assembly, the lateral wall of first guard plate is provided with protector, protector includes dustproof subassembly and radiator unit, dustproof subassembly sets up the both sides at first guard plate, radiator unit sets up the both sides at first guard plate, the beneficial effects of the utility model are that: the lateral wall of device is provided with dust screen and protection network, and the dust screen can avoid the dust to get into the circuit board effectively to influence the normal work of circuit board, and the protection network then can avoid the dust to get into radiator fan in, thereby influence radiator fan's normal work, can prolong circuit board life, convenient and fast effectively through radiator unit and dustproof subassembly.

Description

Printed circuit board with blind hole buried hole

Technical Field

The utility model relates to a printed circuit board technical field, concretely relates to take printed circuit board of blind hole buried via hole.

Background

The printed circuit board is a physical entity and a support body for connecting electronic components in electronic products such as modern communication equipment, computers, consumer electronics and the like, plays a key role in signal transmission and energy supply, and is an essential basic component in the electronic equipment. With the rapid development of electronic technology, electronic products are rapidly developed in the light, thin and short-sized directions, which promotes the progress of printed circuit boards in the high-precision, high-density and fine-line directions, and the high-density interconnection technology is vigorously developed on the background. The printed circuit board, also called PCB, is the basic part of all electronic products, is the carrier of all electronic components, and is the main support body for electronic components during installation and interconnection.

Printed circuit board is the basic condition that present electronic product used, but some have blind holes and buried via's printed circuit board when using, inconvenient firm and heat dissipation, consequently reduced electronic product's life, some printed circuit boards in addition have the dust to enter into when using easily and adsorb on the circuit board, consequently reduced the heat dissipation of circuit board for electronic component high efficiency generates heat for a long time and damages, and then can not guarantee electronic product life-span.

Therefore, it is necessary to design a printed circuit board with blind-hole buried holes.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model provides a take blind hole to bury printed circuit board in hole, through circuit board components and protector, in order to solve present printed circuit board and be the basic condition that present electronic product used, but some printed circuit boards that have the blind hole and bury the hole are when using, inconvenient firm and heat dissipation, consequently, the life of electronic product has been reduced, some printed circuit boards are when using in addition, it adsorbs on the circuit board to have the dust to enter into easily, consequently, the heat dissipation of circuit board has been reduced, make electronic component high-efficient generate heat for a long time and damage, and then can not guarantee electronic product life scheduling problem.

In order to achieve the above object, the present invention provides the following technical solutions: a printed circuit board with blind hole buried holes comprises two first protection plates, wherein a circuit board assembly is arranged in the middle of each of the two first protection plates, and a protection device is arranged on the side wall of each first protection plate;

the protection device comprises a dustproof assembly and heat dissipation assemblies, wherein the dustproof assembly is arranged on two sides of the first protection plate, and the heat dissipation assemblies are arranged on two sides of the first protection plate.

Preferably, the circuit board assembly includes the circuit board, the quantity of circuit board is three, and is three the circuit board sets up between two first guard plates, and is three the equal fixedly connected with conducting layer in both sides of circuit board, two fixedly connected with insulating layer between the conducting layer, it is three the lateral wall of circuit board runs through and is provided with the through-hole, the quantity of through-hole is four.

Preferably, two run through between the circuit board and be provided with the blind hole, the quantity of blind hole is two, the blind hole runs through the middle part that sets up at two conducting layers and insulating layer, two be provided with signal layer preformed hole between the circuit board, the quantity of signal layer preformed hole is two, two be provided with the signal circuit hole between the circuit board, the quantity of signal circuit hole is two, two run through between the circuit board and be provided with the buried via, the quantity of buried via is two.

Preferably, radiator unit includes the third heat-conducting plate, the quantity of third heat-conducting plate is two, one side fixed connection of third heat-conducting plate is on the lateral wall of circuit board, the opposite side fixed connection of third heat-conducting plate is on the lateral wall of first guard plate, pin interface has evenly been seted up to the lateral wall of first guard plate and third heat-conducting plate.

Preferably, the one end setting of pin interface is on the lateral wall of circuit board, two fixedly connected with radiator-grid is run through at the middle part of first guard plate, the lateral wall setting of radiator-grid is on the lateral wall of third heat-conducting plate, two fixedly connected with second heat-conducting plate between the first guard plate, the quantity of second heat-conducting plate is two.

Preferably, the two second heat conduction plates are fixedly connected to two sides of the circuit board, the conducting layer and the insulating layer, the side walls of the second heat conduction plates on the two sides are fixedly connected with a fan box, and a radiating fan is mounted in the middle of the fan box.

Preferably, the dustproof assembly comprises two protective nets, the protective nets are fixedly connected to the side wall of the fan box, the two protective nets are fixedly connected to second protective plates fixedly connected to the two sides of the first protective plate, and the two protective plates are fixedly connected to first heat-conducting plates fixedly connected to one sides of the second protective plates.

Preferably, one side of the first heat-conducting plate is fixedly connected to the side walls of the circuit board, the conducting layer and the insulating layer, radiating holes are uniformly formed in the side walls of the second protection plates, and the side walls of the second protection plates are fixedly connected with dust screens.

The utility model has the advantages that: the lateral wall of device is provided with dust screen and protection network, and the dust screen can avoid the dust to get into the circuit board effectively to influence the normal work of circuit board, and the protection network then can avoid the dust to get into radiator fan in, thereby influence radiator fan's normal work, can prolong circuit board life, convenient and fast effectively through radiator unit and dustproof subassembly.

Drawings

Fig. 1 is a top view of a printed circuit board with blind holes and buried holes according to the present invention;

fig. 2 is a side view of a printed circuit board with blind-hole buried holes according to the present invention;

fig. 3 is a three-dimensional schematic view of a printed circuit board with blind holes and buried holes according to the present invention;

fig. 4 is a cross-sectional view of a printed circuit board with blind holes and buried holes provided by the present invention.

In the figure: 1. a first guard plate; 2. a pin interface; 3. a heat-dissipating web; 4. heat dissipation holes; 5. a first heat-conducting plate; 6. a dust screen; 7. a protective net; 8. a fan case; 9. a heat radiation fan; 10. a second heat-conducting plate; 11. A third heat-conducting plate; 12. a through hole; 13. an insulating layer; 14. a conductive layer; 15. blind holes; 16. a circuit board; 17. burying a hole; 18. a signal circuit hole; 19. reserving holes in the signal layer; 20. and a second protection plate.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to the attached drawings 1-4, the utility model provides a printed circuit board with blind hole buried hole, including first guard plate 1, first guard plate 1 can play the guard effect, is made by the metal, the quantity of first guard plate 1 is two, the middle part of two first guard plates 1 is provided with the circuit board subassembly, the lateral wall of first guard plate 1 is provided with protector, protector includes dustproof subassembly and radiator unit, dustproof subassembly sets up in the both sides of first guard plate 1, radiator unit sets up in the both sides of first guard plate 1, the circuit board subassembly includes circuit board 16, circuit board 16 is the current patent technology product of disclosing, the quantity of circuit board 16 is three, three circuit board 16 sets up between two first guard plates 1, the both sides of three circuit board 16 all fixedly connected with conducting layer 14, conducting layer 14 can play the electrically conductive effect, the transmission of electricity is facilitated, for the existing patent and technology product, an insulating layer 13 is fixedly connected between two conducting layers 14, the insulating layer 13 can play a role in isolating the transmission of electricity, for the existing patent and technology product, through holes 12 are arranged on the side walls of three circuit boards 16 in a penetrating manner, the through holes 12 facilitate the installation and the fixation of the circuit boards 16, the number of the through holes 12 is four, blind holes 15 are arranged between the two circuit boards 16 in a penetrating manner, the blind holes 15 facilitate the installation and the fixation of the circuit boards 16, the number of the blind holes 15 is two, the blind holes 15 are arranged in the middle of the two conducting layers 14 and the insulating layer 13 in a penetrating manner, a signal layer reserved hole 19 is arranged between the two circuit boards 16, the number of the signal layer reserved holes 19 is two, a signal circuit hole 18 is arranged between the two circuit boards 16, the number of the signal circuit holes 18 is two, and a buried hole 17 is arranged between the two circuit boards 16 in a penetrating manner, the buried holes 17 can play a role in installation and fixation, the number of the buried holes 17 is two, the heat dissipation assembly comprises a third heat conduction plate 11, the third heat conduction plate 11 can play a role in heat conduction, and is a product of the prior published patent technology, the number of the third heat conduction plate 11 is two, one side of the third heat conduction plate 11 is fixedly connected on the side wall of the circuit board 16, the other side of the third heat conduction plate 11 is fixedly connected on the side wall of the first protection plate 1, the side walls of the first protection plate 1 and the third heat conduction plate 11 are uniformly provided with pin interfaces 2, the pin interfaces 2 facilitate the installation and fixation of circuit elements, one end of each pin interface 2 is arranged on the side wall of the circuit board 16, the middle parts of the two first protection plates 1 are fixedly connected with a heat dissipation net 3 in a penetrating way, the heat dissipation net 3 facilitates the volatilization and heat dissipation of heat and is made of metal, the side wall of the heat dissipation net 3 is arranged on the side wall of the third heat conduction plate 11, the two heat conduction plates 10 are fixedly connected between the two first protection plates 1, the second heat conduction plates 10 can play a role of heat conduction, the number of the second heat conduction plates 10 is two, the two second heat conduction plates 10 are fixedly connected to two sides of the circuit board 16, the conductive layer 14 and the insulating layer 13, the side walls of the two second heat conduction plates 10 are fixedly connected with the fan box 8, the fan box 8 can play a role of protection and is made of metal, the middle part of the fan box 8 is provided with the heat radiation fan 9, the work of the heat radiation fan 9 can play a role of heat radiation, for the existing product of the patent technology, the dustproof assembly comprises a protection net 7, the protection net 7 can play a role of protection and prevent dust from entering, the protection net 7 is made of metal, the number of the protection nets 7 is two, the two protection nets 7 are fixedly connected to the side walls of the fan box 8, the two sides of the two first protection plates 1 are both fixedly connected with the second protection plates 20, the second protection plates 20 can play a role in protection and are made of metal, one sides of the two second protection plates 20 are fixedly connected with the first heat conduction plates 5, the first heat conduction plates 5 facilitate heat transfer, and for the existing products of the patent technology, one sides of the two first heat conduction plates 5 are fixedly connected to the side walls of the circuit board 16, the conductive layer 14 and the insulating layer 13, the side walls of the two second protection plates 20 are uniformly provided with heat dissipation holes 4, the side walls of the two second protection plates 20 are fixedly connected with the dust screens 6, and the dust screens 6 can play a role in protection and prevent dust from entering and are made of metal;

the utility model discloses a use as follows: the technical personnel in the field can insert the electrical element into one side of the circuit board 16 for use through the pin interface 2, the blind hole 15, the through hole 12 and the buried hole 17 in the middle can play a role in installation and fixation, so that the circuit board layer can be better fixed, the circuit board 16 can generate heat during operation, the heat can be transmitted to one side of the heat dissipation net 3 through the third heat conduction plate 11, then the heat is discharged through flowing, the heat can be discharged through the second heat conduction plates 10 on the two sides, the heat dissipation fan 9 works to discharge the heat discharged from the second heat conduction plates 10 to play a role in heat dissipation, the protection net 7 is provided with one side of the fan to prevent dust from entering and influence the work of the fan, the heat can be slowly discharged through the heat dissipation holes 4 on one side of the first heat conduction plate 5, the dust prevention net 6 plays a role in dust prevention and commonly dissipates heat for the circuit board 16 all around, thereby ensuring that the circuit board 16 operates under normal operation and thus extending the service life of the circuit board 16.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.

Claims

1. The utility model provides a take printed circuit board of blind hole buried via hole, includes first guard plate (1), the quantity of first guard plate (1) is two, two the middle part of first guard plate (1) is provided with circuit board subassembly, its characterized in that: the side wall of the first protection plate (1) is provided with a protection device;

the protection device comprises a dustproof assembly and heat dissipation assemblies, wherein the dustproof assembly is arranged on two sides of the first protection plate (1), and the heat dissipation assemblies are arranged on two sides of the first protection plate (1).

2. The printed circuit board with blind buried vias of claim 1, wherein: the circuit board assembly comprises a circuit board (16), the number of the circuit board (16) is three, the circuit board (16) is arranged between two first protection plates (1) and is three, conducting layers (14) are fixedly connected to two sides of the circuit board (16) respectively, an insulating layer (13) is fixedly connected between the conducting layers (14) respectively, the insulating layers are three, through holes (12) are formed in the side wall of the circuit board (16) in a penetrating mode, and the number of the through holes (12) is four.

3. The printed circuit board with blind buried vias of claim 2, wherein: two run through between circuit board (16) and be provided with blind hole (15), the quantity of blind hole (15) is two, blind hole (15) run through the middle part that sets up at two conducting layers (14) and insulating layer (13), two be provided with signal layer preformed hole (19) between circuit board (16), the quantity of signal layer preformed hole (19) is two, two be provided with signal circuit hole (18) between circuit board (16), the quantity of signal circuit hole (18) is two, two run through between circuit board (16) and be provided with buried via (17), the quantity of buried via (17) is two.

4. The printed circuit board with the blind hole and the buried hole as claimed in claim 3, wherein: the radiator unit includes third heat-conducting plate (11), the quantity of third heat-conducting plate (11) is two, one side fixed connection of third heat-conducting plate (11) is on the lateral wall of circuit board (16), the opposite side fixed connection of third heat-conducting plate (11) is on the lateral wall of first guard plate (1), pin interface (2) have evenly been seted up to the lateral wall of first guard plate (1) and third heat-conducting plate (11).

5. The printed circuit board with the blind hole and the buried hole as claimed in claim 4, wherein: the one end setting of pin interface (2) is on the lateral wall of circuit board (16), two fixedly connected with radiator-grid (3) is run through at the middle part of first guard plate (1), the lateral wall setting of radiator-grid (3) is on the lateral wall of third heat-conducting plate (11), two fixedly connected with second heat-conducting plate (10) between first guard plate (1), the quantity of second heat-conducting plate (10) is two.

6. The printed circuit board with blind buried vias of claim 5, wherein: the two second heat-conducting plates (10) are fixedly connected to two sides of the circuit board (16), the conducting layer (14) and the insulating layer (13), the side walls of the second heat-conducting plates (10) on the two sides are fixedly connected with the fan box (8), and the middle of the fan box (8) is provided with the radiating fan (9).

7. The printed circuit board with blind buried vias of claim 6, wherein: the dustproof assembly comprises a protective net (7), the number of the protective net (7) is two, the protective net (7) is fixedly connected to the side wall of the fan box (8) in two, two second protective plates (20) are fixedly connected to the two sides of the first protective plate (1) in two, and a first heat conduction plate (5) is fixedly connected to one side of each second protective plate (20).

8. The printed circuit board with blind buried vias of claim 7, wherein: two one side fixed connection of first heat-conducting plate (5) is on the lateral wall of circuit board (16), conducting layer (14) and insulating layer (13), two louvre (4) have evenly been seted up to the lateral wall of second guard plate (20), two lateral wall fixedly connected with dust screen (6) of second guard plate (20).