CN214381544U - Multilayer circuit board of easily cooling - Google Patents
Multilayer circuit board of easily cooling Download PDFInfo
- Publication number
- CN214381544U CN214381544U CN202022705183.0U CN202022705183U CN214381544U CN 214381544 U CN214381544 U CN 214381544U CN 202022705183 U CN202022705183 U CN 202022705183U CN 214381544 U CN214381544 U CN 214381544U
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- circuit board
- heat conduction
- fin
- conduction copper
- seted
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Abstract
The utility model relates to a multilayer circuit board field discloses a multilayer circuit board of easily cooling, which comprises a circuit board, the circuit board surface is equipped with the dust mask, the dust mask surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, run through in the caulking groove and be equipped with the heat conduction post that runs through the fin, the mounting groove has been seted up to circuit board four ends, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, spacing hole both ends all inlay the heat conduction copper post that is equipped with the through fin, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, heat conduction copper post one end is equipped with the stopper of contradicting with the dust mask. The heat dissipation performance of the circuit board can be improved, the board surface protection requirement of the circuit board can be effectively met, and the problem of subsequent board surface scratching of the circuit board can also be solved.
Description
Technical Field
The utility model relates to a multilayer circuit board field especially relates to a multilayer circuit board of easily cooling.
Background
The circuit board comprises a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed circuit board and the like. Multilayer circuit boards have at least three conductive layers, two of which are on the outer surface and the remaining conductive layers are combined in the board with a dielectric layer between each two conductive layers, the electrical connections between the conductive layers being typically made through plated through holes in the cross-section of the circuit board. The traditional multilayer circuit board has the problem of poor heat dissipation capability, and the use impression of the circuit board can be influenced by scratching the subsequent use board surface of the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an easy multilayer circuit board of cooling to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a multilayer circuit board of easily cooling, includes the circuit board, the circuit board surface is equipped with the dust-proof membrane, dust-proof membrane surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, run through in the caulking groove and be equipped with the heat conduction post that runs through the fin, the mounting groove has been seted up to circuit board four ends, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, spacing hole both ends are all inlayed and are equipped with the heat conduction copper post that runs through the fin, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, heat conduction copper post one end is equipped with the stopper of contradicting with the dust-proof membrane.
Furthermore, the limiting block is connected with the heat conduction copper column in an integrated forming mode.
Further, the cooling fin sets up between dust mask and circuit board, circuit board surface corresponds the cooling fin and is equipped with the holding tank.
Furthermore, the radiating fins are in a long strip shape and are adhered to the peripheral edge of the dustproof film.
Further, the radiating fin is a graphite heat conducting fin, and the radiating fin is abutted to the heat conducting copper sleeve.
Further, the dust-proof film includes a protective film and resin-impregnated heat-dissipating fibers thermally press-bonded to the protective film.
Further, the protective film is a graphite film.
The utility model has the advantages that: the heat dissipation performance of the circuit board can be improved, the board surface protection requirement of the circuit board can be effectively met, and the problem of subsequent board surface scratching of the circuit board can also be solved.
Drawings
The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic structural diagram according to an embodiment of the present invention.
The labels in the figure are: the circuit board 1, dust-proof membrane 2, fin 21, heat conduction copper sheathing 3, heat conduction copper post 4, stopper 5.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
In the present invention, unless otherwise specified, the terms of orientation such as "up, down, left, and right" used generally refer to up, down, left, and right as shown in fig. 1. "inner and outer" refer to the inner and outer portions of a particular contour. "distal and proximal" refer to distal and proximal relative to a component.
As shown in fig. 1, an embodiment of the utility model provides a multilayer circuit board 1 of easily cooling, including circuit board 1, 1 surface of circuit board is equipped with dust mask 2, 2 surface bonding of dust mask have fin 21, a plurality of caulking grooves have been seted up to circuit board 1, run through in the caulking groove and be equipped with the heat conduction post that runs through fin 21, the mounting groove has been seted up at 1 four ends of circuit board, the mounting groove endotheca is equipped with heat conduction copper sheathing 3, spacing hole has been seted up at 3 middle parts of heat conduction copper sheathing, spacing hole both ends are all inlayed and are equipped with heat conduction copper post 4 that runs through fin 21, 3 outer walls of heat conduction copper sheathing and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, 4 one ends of heat conduction copper post are equipped with stopper 5 of contradicting with dust mask 2.
The limiting block 5 is connected with the heat conducting copper column 4 in an integrated forming mode.
The radiating fins 21 are arranged between the dustproof film 2 and the circuit board 1, and the surface of the circuit board 1 is provided with accommodating grooves corresponding to the radiating fins 21.
The radiating fins 21 are long strips, and the radiating fins 21 are adhered to the peripheral edge parts of the dustproof film 2.
The radiating fins 21 are graphite heat conducting fins, and the radiating fins 21 are abutted to the heat conducting copper sleeve 3.
The dust-proof film 2 includes a protective film and resin-impregnated heat-dissipating fibers thermally press-bonded to the protective film.
The protective film is a graphite film.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (7)
1. The utility model provides an easy multilayer circuit board of cooling which characterized in that: the circuit board comprises a circuit board, the circuit board surface is equipped with the dust mask, the dust mask surface bonding has the fin, a plurality of caulking grooves have been seted up to the circuit board, run through in the caulking groove and be equipped with the heat conduction post that runs through the fin, the mounting groove has been seted up at four ends of circuit board, the mounting groove endotheca is equipped with the heat conduction copper sheathing, spacing hole has been seted up at heat conduction copper sheathing middle part, the heat conduction copper post that is equipped with the fin of running through is all inlayed at spacing hole both ends, heat conduction copper sheathing outer wall and spacing downthehole wall all are equipped with the helicla flute, the helicla flute intussuseption is filled with the adhesive linkage, heat conduction copper post one end is equipped with the stopper of contradicting with the dust mask.
2. The multilayer wiring board easy to cool according to claim 1, wherein: the limiting block is connected with the heat conduction copper column in an integrated forming mode.
3. The multilayer wiring board easy to cool according to claim 1, wherein: the cooling fin sets up between dust mask and circuit board, circuit board surface corresponds the cooling fin and is equipped with the holding tank.
4. The multilayer circuit board easy to cool according to claim 3, wherein: the radiating fins are in a strip shape and are adhered to the peripheral edge parts of the dustproof film.
5. The multilayer circuit board easy to cool according to claim 3, wherein: the radiating fin is a graphite heat conducting fin, and the radiating fin is abutted to the heat conducting copper sleeve.
6. The multilayer wiring board easy to cool according to claim 1, wherein: the dust-proof film includes a protective film and resin-impregnated heat-dissipating fibers thermally press-bonded to the protective film.
7. The multilayer circuit board easy to cool according to claim 6, wherein: the protective film is a graphite film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705183.0U CN214381544U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board of easily cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022705183.0U CN214381544U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board of easily cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214381544U true CN214381544U (en) | 2021-10-08 |
Family
ID=77977843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022705183.0U Active CN214381544U (en) | 2020-11-20 | 2020-11-20 | Multilayer circuit board of easily cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214381544U (en) |
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2020
- 2020-11-20 CN CN202022705183.0U patent/CN214381544U/en active Active
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