CN209964366U - Enhanced composite circuit board - Google Patents
Enhanced composite circuit board Download PDFInfo
- Publication number
- CN209964366U CN209964366U CN201920460863.5U CN201920460863U CN209964366U CN 209964366 U CN209964366 U CN 209964366U CN 201920460863 U CN201920460863 U CN 201920460863U CN 209964366 U CN209964366 U CN 209964366U
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- enhancement layer
- enhancement
- insulating heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a compound circuit board of enhancement mode, including the circuit board main part, the circuit board main part comprises circuit layer base plate, insulating heat-conducting glue film, first enhancement layer, second enhancement layer, first resin protective layer, second resin protective layer pressfitting, top surface, the bottom surface of circuit layer base plate are connected with first enhancement layer, second enhancement layer through insulating heat-conducting glue film respectively, the top surface of first enhancement layer is connected with first resin protective layer through insulating heat-conducting glue film, the underrun insulating heat-conducting glue film of second enhancement layer is connected with second resin protective layer. The utility model discloses in form first enhancement layer and second enhancement layer through being provided with epoxy glass fiber in the circuit board main part, form five layer structure, first enhancement layer and second enhancement layer have higher mechanical strength and good insulating and heat-proof properties, and the circuit board main part that the complex formed has better mechanical strength, has improved the ability that circuit board main part resisted stress failure.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to compound circuit board of enhancement mode.
Background
The circuit board with the single-layer circuit layer is generally formed by laminating a circuit substrate and resin protection layers arranged on the upper surface and the lower surface of the circuit substrate, and only formed by compounding three layers of structures.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an enhancement mode composite line board to solve the problem that proposes in the above-mentioned background art.
This utility model adopts for achieving the above purpose:
the reinforced composite circuit board comprises a circuit board main body, wherein the circuit board main body is formed by pressing a circuit layer substrate, an insulating heat-conducting adhesive layer, a first reinforcing layer, a second reinforcing layer, a first resin protective layer and a second resin protective layer, the top surface and the bottom surface of the circuit layer substrate are respectively connected with the first reinforcing layer and the second reinforcing layer through the insulating heat-conducting adhesive layer, the top surface of the first reinforcing layer is connected with the first resin protective layer through the insulating heat-conducting adhesive layer, the bottom surface of the second reinforcing layer is connected with the second resin protective layer through the insulating heat-conducting adhesive layer, a plurality of blind hole positions are formed in the upper portion of the circuit board main body, the blind holes extend from the top of the first reinforcing layer to the top surface of the circuit layer substrate, and copper plating layers.
It is further explained that the first reinforced layer and the second reinforced layer are plates formed by epoxy glass fibers.
Further, the insulating and heat conducting adhesive layer is a colloid layer formed by insulating and heat conducting adhesive.
It is further explained that the first reinforcement layer is formed with through holes with the same hole diameter and distribution as the blind holes.
Further, the blind hole site on the circuit board main body is formed by a numerical control drilling process.
The copper plating layer in the blind hole position is formed through an electroless copper plating process, and the copper plating layer and the circuit layer substrate are connected into a whole.
Compared with the prior art, the beneficial effects of the utility model reside in that:
compare with the circuit board on conventional individual layer circuit layer, the utility model discloses in form first enhancement layer and second enhancement layer through being provided with epoxy glass fiber in the circuit board main part, form five layer structure, first enhancement layer and second enhancement layer have higher mechanical strength and good insulating and heat-proof quality, and the circuit board main part that the complex formed has better mechanical strength, has improved the ability that the circuit board main part resisted stress failure.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the present invention;
figure 2 is a schematic top view of a first reinforcement layer of the present invention;
wherein: 1. a circuit layer substrate; 2. an insulating heat-conducting adhesive layer; 3. a first enhancement layer; 4. a second enhancement layer; 5. a first resin protective layer; 6. a second resin protective layer; 7. blind hole sites; 8. plating a copper layer; 9. and a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides the following technical solutions:
an enhanced composite circuit board comprises a circuit board main body, wherein the circuit board main body is formed by pressing a circuit layer substrate 1, an insulating heat-conducting adhesive layer 2, a first enhancement layer 3, a second enhancement layer 4, a first resin protection layer 5 and a second resin protection layer 6, the top surface and the bottom surface of the circuit layer substrate 1 are respectively connected with the first enhancement layer 3 and the second enhancement layer 4 through the insulating heat-conducting adhesive layer 2, the top surface of the first enhancement layer 3 is connected with the first resin protection layer 5 through the insulating heat-conducting adhesive layer 2, the bottom surface of the second enhancement layer 4 is connected with the second resin protection layer 6 through the insulating heat-conducting adhesive layer 2, a plurality of blind hole positions 7 are formed at the upper part of the circuit board main body, blind hole positions 7 on the circuit board main body are formed through a numerical control drilling process, the blind hole positions 7 extend from the top of the first enhancement layer 3 to the top surface of the circuit layer substrate 1, copper plating layers 8, the copper plating layer 8 is integrally connected to the wiring layer substrate 1.
The first reinforcing layer 3 and the second reinforcing layer 4 are plates formed by epoxy glass fibers, have good mechanical strength and heat-resistant insulating property, and play a role in supporting and reinforcing in the circuit board main body; the insulating heat-conducting glue layer 2 is a glue layer formed by insulating heat-conducting glue and plays a role in fixed connection of each layer structure.
The through holes 9 with the same aperture and the same distribution as the blind hole sites 7 are formed in the first enhancement layer 3, the through holes 9 in the first enhancement layer 3 are pre-drilled instead of being drilled together when the blind hole sites 7 are formed in the circuit board main body in a compounding mode, and therefore epoxy glass fiber particles with fine particle sizes are prevented from being generated in a numerical control drilling process, and the epoxy glass fiber particles with fine particle sizes are difficult to clean and block between layers.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides an enhancement mode composite circuit board, includes circuit board main part, its characterized in that: the circuit board main body is formed by pressing a circuit layer substrate (1), an insulating heat-conducting adhesive layer (2), a first enhancement layer (3), a second enhancement layer (4), a first resin protection layer (5) and a second resin protection layer (6), the top surface and the bottom surface of the circuit layer substrate (1) are respectively connected with the first enhancement layer (3) and the second enhancement layer (4) through the insulating heat-conducting adhesive layer (2), the top surface of the first enhancement layer (3) is connected with the first resin protection layer (5) through the insulating heat-conducting adhesive layer (2), the bottom surface of the second enhancement layer (4) is connected with the second resin protection layer (6) through the insulating heat-conducting adhesive layer (2), the upper portion of circuit board main part is formed with a plurality of blind hole position (7), blind hole position (7) extend to circuit layer base plate (1) top surface from first enhancement layer (3) top, form copper plate layer (8) on blind hole position (7).
2. The reinforced composite wiring board defined in claim 1, wherein: the first reinforcing layer (3) and the second reinforcing layer (4) are plates formed by epoxy glass fibers.
3. The reinforced composite wiring board defined in claim 1, wherein: the insulating heat-conducting adhesive layer (2) is a colloid layer formed by insulating heat-conducting adhesive.
4. The reinforced composite wiring board defined in claim 1, wherein: through holes (9) which have the same aperture as the blind hole positions (7) and are distributed in the same manner are formed in the first reinforcing layer (3).
5. The reinforced composite wiring board defined in claim 1, wherein: the blind hole position (7) on the circuit board main body is formed through a numerical control drilling process.
6. The reinforced composite wiring board defined in claim 1, wherein: the copper plating layer (8) in the blind hole position (7) is formed through an electroless copper plating process, and the copper plating layer (8) and the circuit layer substrate (1) are connected into a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920460863.5U CN209964366U (en) | 2019-04-04 | 2019-04-04 | Enhanced composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920460863.5U CN209964366U (en) | 2019-04-04 | 2019-04-04 | Enhanced composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209964366U true CN209964366U (en) | 2020-01-17 |
Family
ID=69241025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920460863.5U Expired - Fee Related CN209964366U (en) | 2019-04-04 | 2019-04-04 | Enhanced composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209964366U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465180A (en) * | 2020-06-09 | 2020-07-28 | 京东方科技集团股份有限公司 | Stiffening plate for flexible circuit board, flexible circuit board assembly and display device |
-
2019
- 2019-04-04 CN CN201920460863.5U patent/CN209964366U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465180A (en) * | 2020-06-09 | 2020-07-28 | 京东方科技集团股份有限公司 | Stiffening plate for flexible circuit board, flexible circuit board assembly and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102395249B (en) | Manufacturing method of four-layer copper-based metal plate | |
| CN209964366U (en) | Enhanced composite circuit board | |
| CN109068504A (en) | A kind of production method and PCB of the stepped groove that side wall is non-metallic | |
| CN102029746A (en) | Copper-clad board and production method thereof | |
| TW201933963A (en) | Embedded flexible circuit board and manufacturing method for same | |
| CN108235602A (en) | The processing method that second order buries copper billet circuit board | |
| CN202030694U (en) | High peel strength conductive glue film with through holes | |
| CN201718114U (en) | Z-direction connecting structure of printed circuit board | |
| CN202750332U (en) | PCB circuit board | |
| TW201032998A (en) | Copper clad laminate and method of manufacturing the same | |
| CN101861057A (en) | Method for manufacturing printed circuit board | |
| CN214727056U (en) | High-punching-shearing phenolic paper-based copper-clad laminate | |
| CN213126609U (en) | High-strength circuit board | |
| CN206100611U (en) | Printed circuit board of two blind holes in area | |
| CN210579421U (en) | Flexible circuit board | |
| CN202998646U (en) | HDI printed circuit board | |
| CN211880713U (en) | Dustproof circuit board for embedded software | |
| CN208675596U (en) | A kind of multilayer circuit board of high intensity | |
| CN207954843U (en) | A kind of novel clip board | |
| CN210042361U (en) | PCB circuit board of resistance to deformation | |
| CN207321633U (en) | A kind of Novel single-face circuit board | |
| CN209845433U (en) | Copper-clad plate with high-toughness structure | |
| CN218634404U (en) | Cross-layer mechanical blind hole high-rise plate structure | |
| CN214592120U (en) | Anti-drop prevents multilayer circuit board structure of off normal | |
| CN214046156U (en) | Copper-clad plate with die-casting forming structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200117 Termination date: 20210404 |