CN213126609U - High-strength circuit board - Google Patents
High-strength circuit board Download PDFInfo
- Publication number
- CN213126609U CN213126609U CN202022115664.6U CN202022115664U CN213126609U CN 213126609 U CN213126609 U CN 213126609U CN 202022115664 U CN202022115664 U CN 202022115664U CN 213126609 U CN213126609 U CN 213126609U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- fiber layer
- glass fiber
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000835 fiber Substances 0.000 claims abstract description 28
- 239000003365 glass fiber Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims 2
- 238000001125 extrusion Methods 0.000 abstract description 8
- 230000003068 static effect Effects 0.000 abstract description 7
- 210000000438 stratum basale Anatomy 0.000 abstract description 6
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 50
- 238000003466 welding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a high strength circuit board, including the substrate layer, the upper surface coating of substrate layer has antistatic coating, and the bottom coating of substrate layer has the glass fiber layer, and the bottom bonding of glass fiber layer is connected with the stratum basale, and the inside on glass fiber layer includes ceramic fiber layer and rubber fiber layer. The utility model discloses an increase at the top and prevent the influence that the static coating can resist outside static and lead to the fact the circuit board, and the glass fiber and the inside ceramic fibre of surface can strengthen the structural strength of circuit board with rubber fiber, because rubber fiber itself just has the crushing resistance, can recover fast after the circuit board produces deformation, holistic toughness has been increased, and the compression resistance of stratum basale inside can improve the compressive property of circuit board, receive the extrusion and can not produce the fracture when buckling, and the service life is prolonged, the intensity of having solved simultaneously is lower, produce the fracture easily when receiving the extrusion, the problem of the life of circuit board has been reduced.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high strength circuit board.
Background
The circuit board can be called as a printed circuit board or a printed circuit board and is a carrier for electrical connection of electronic components, manual wiring errors are avoided due to the consistency of similar printed boards, automatic insertion or mounting, automatic tin soldering and automatic detection of the electronic components can be realized, the quality of electronic equipment is ensured, however, the existing circuit board is low in strength and easy to break when being extruded, and the service life of the circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high strength circuit board possesses the advantage of high strength, and it is lower to have solved intensity, produces the fracture easily when receiving the extrusion, has reduced the life's of circuit board problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high strength circuit board, includes the substrate layer, the upper surface coating of substrate layer has antistatic coating, the bottom coating of substrate layer has the glass fiber layer, the bottom adhesive connection on glass fiber layer has the stratum basale.
Preferably, the glass fiber layer comprises a ceramic fiber layer and a rubber fiber layer on the inner part, and the rubber fiber layer is coated on the bottom of the ceramic fiber layer.
Preferably, the base layer comprises a heat insulation layer and a pressure-resistant layer inside, and the bottom of the heat insulation layer is coated with the pressure-resistant layer.
Preferably, the bottom of the substrate layer is coated with a waterproof coating layer, and the exterior of the waterproof coating layer is adhesively connected with a PE film.
Preferably, the thickness of the antistatic coating is zero three micrometers, and the thickness of the glass fiber layer is zero five micrometers.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses an increase at the top and prevent the influence that the static coating can resist outside static and lead to the fact the circuit board, and the glass fiber and the inside ceramic fibre of surface can strengthen the structural strength of circuit board with rubber fiber, because rubber fiber itself just has the crushing resistance, can recover fast after the circuit board produces deformation, holistic toughness has been increased, and the compression resistance of stratum basale inside can improve the compressive property of circuit board, receive the extrusion and can not produce the fracture when buckling, and the service life is prolonged, the intensity of having solved simultaneously is lower, produce the fracture easily when receiving the extrusion, the problem of the life of circuit board has been reduced.
2. The utility model discloses an inside insulating layer can increase the heat resistance of circuit board, receives the high temperature and toasts the surface and can not appear softening phenomenon, has guaranteed service quality.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the glass fiber layer structure of the present invention;
fig. 3 is a cross-sectional view of the structure of the substrate layer of the present invention.
In the figure: 1. a substrate layer; 2. an antistatic coating; 3. a glass fiber layer; 301. a ceramic fiber layer; 302. a rubber fiber layer; 4. a base layer; 401. a thermal insulation layer; 402. and a pressure resistant layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 1-3, a high-strength circuit board includes a substrate layer 1, an antistatic coating 2 is coated on the upper surface of the substrate layer 1, the thickness of the antistatic coating 2 is zero three micrometers, the thickness of a glass fiber layer 3 is zero five micrometers, the bottom of the substrate layer 1 is coated with the glass fiber layer 3, the inside of the glass fiber layer 3 includes a ceramic fiber layer 301 and a rubber fiber layer 302, the bottom of the ceramic fiber layer 301 is coated with the rubber fiber layer 302, the bottom of the glass fiber layer 3 is bonded with a substrate layer 4, the inside of the substrate layer 4 includes a heat insulation layer 401 and a compression-resistant layer 402, the heat resistance of the circuit board can be increased through the internal heat insulation layer 401, the surface is not softened when being baked at high temperature, the use quality is ensured, the bottom of the heat insulation layer 401 is coated with the compression-resistant layer 402, the bottom of the substrate layer 4 is coated with a, prevent the influence that static coating 2 can resist outside static and lead to the fact the circuit board through increasing at the top, and the glass fiber on surface and inside ceramic fiber can strengthen the structural strength of circuit board with rubber fiber, because rubber fiber itself just has the crushing resistance, can recover fast after the circuit board produces deformation, holistic toughness has been increased, and the crushing resistance layer 402 of stratum basale 4 inside can improve the compressive property of circuit board, can not produce the fracture when receiving the extrusion and buckling, and the service life is prolonged, simultaneously, the solved intensity is lower, produce the fracture easily when receiving the extrusion, the problem of the life of circuit board has been reduced.
The standard parts used in this document are commercially available, all the components in this document are customized according to the description of the specification and the drawings, and the connection relationship and specific structure between the layers in this document are all performed by the prior art, such as by mechanical methods, by adhesives, by various welding methods such as thermal welding, ultrasonic welding, flux, welding, and fusion crimping, and no specific description is made here.
During the use, can resist the influence that outside static caused to the circuit board through increasing at the top and prevent electrostatic coating 2, and the glass fiber and the inside ceramic fiber of surface and rubber fiber can strengthen the structural strength of circuit board, because rubber fiber itself just has compressive property, can recover fast after the circuit board produces deformation, holistic toughness has been increased, and the compressive property of circuit board can be improved to the inside compressive layer 402 of stratum basale 4, can not produce the fracture when receiving the extrusion and buckling, the service life is prolonged, inside insulating layer 401 can increase the heat resistance of circuit board, it can not appear softening phenomenon to receive the high temperature stoving surface, service quality has been guaranteed.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a high strength circuit board, includes substrate layer (1), its characterized in that: the anti-static coating (2) are coated on the upper surface of the base material layer (1), the glass fiber layer (3) is coated on the bottom of the base material layer (1), and the base layer (4) is bonded and connected to the bottom of the glass fiber layer (3).
2. A high strength circuit board according to claim 1, wherein: the glass fiber layer (3) comprises a ceramic fiber layer (301) and a rubber fiber layer (302) inside, and the rubber fiber layer (302) is coated on the bottom of the ceramic fiber layer (301).
3. A high strength circuit board according to claim 1, wherein: the inner part of the substrate layer (4) comprises a heat insulation layer (401) and a pressure-resistant layer (402), and the bottom of the heat insulation layer (401) is coated with the pressure-resistant layer (402).
4. A high strength circuit board according to claim 1, wherein: the bottom of the substrate layer (4) is coated with a waterproof coating, and the outer part of the waterproof coating is bonded with a PE film.
5. A high strength circuit board according to claim 1, wherein: the thickness of the anti-static coating (2) is zero three micrometers, and the thickness of the glass fiber layer (3) is zero five micrometers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022115664.6U CN213126609U (en) | 2020-09-24 | 2020-09-24 | High-strength circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022115664.6U CN213126609U (en) | 2020-09-24 | 2020-09-24 | High-strength circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213126609U true CN213126609U (en) | 2021-05-04 |
Family
ID=75664592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022115664.6U Expired - Fee Related CN213126609U (en) | 2020-09-24 | 2020-09-24 | High-strength circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213126609U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115474345A (en) * | 2022-09-14 | 2022-12-13 | 东华大学 | Method for manufacturing ceramic fabric circuit based on screen printing and chemical deposition |
-
2020
- 2020-09-24 CN CN202022115664.6U patent/CN213126609U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115474345A (en) * | 2022-09-14 | 2022-12-13 | 东华大学 | Method for manufacturing ceramic fabric circuit based on screen printing and chemical deposition |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210504 Termination date: 20210924 |